CN115256963A - Film attaching method and electronic device - Google Patents
Film attaching method and electronic device Download PDFInfo
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- CN115256963A CN115256963A CN202210887620.6A CN202210887620A CN115256963A CN 115256963 A CN115256963 A CN 115256963A CN 202210887620 A CN202210887620 A CN 202210887620A CN 115256963 A CN115256963 A CN 115256963A
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- film
- working surface
- hard tool
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
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- Mechanical Engineering (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
The present disclosure relates to electronic devices, and particularly to a method for attaching a film and an electronic device. The method comprises the following steps: providing a hard tool, a film and an accessory to be attached, wherein the hard tool comprises a working surface; bonding the film to the working surface; moving the working surface of the hard tool towards an accessory to be attached so as to enable the film adhered to the working surface to be adhered to the accessory to be attached; peeling the working surface of the hard tool from the film. Compared with an attaching mode of directly attaching a film with softer texture to an accessory to be attached, the attaching mode can reduce attaching difficulty of the film and improve attaching yield of the film.
Description
Technical Field
The present disclosure relates to electronic devices, and particularly to a method for attaching a film and an electronic device.
Background
With the development of thinning and thinning of notebook computers, attaching plastic on bezel (the frame around the display screen) of a notebook computer is changed into attaching mylar (polyester film), and because mylar is relatively soft, the attaching difficulty is large and the attaching yield is low during attaching operation.
Disclosure of Invention
The application discloses a film attaching method and electronic equipment, which can reduce the attaching difficulty of a film and improve the attaching yield of the film.
In order to achieve the above object, in a first aspect, the present application discloses a method of attaching a film, the method including:
providing a hard tool, a film and an accessory to be attached, wherein the hard tool comprises a working surface;
bonding the film to the working surface;
moving the working surface of the hard tool towards an accessory to be attached so that the film adhered to the working surface is adhered to the accessory to be attached;
peeling the working surface of the hard tool from the film.
When the film is attached to the accessory to be attached, firstly, the film is adhered to the working surface of the hard tool, then, the working surface of the hard tool moves towards the accessory to be attached to drive the film to move towards the accessory to be attached until the film adhered to the working surface is adhered to the accessory to be attached, and after the film adhered to the working surface is adhered to the accessory to be attached, the hard tool is peeled off from the film, so that the purpose of attaching the film to the accessory to be attached is achieved.
It can be seen that in the process of attaching the film to the accessory to be attached, the film is firstly adhered to the working surface of the hard tool, and then the film is attached to the accessory to be attached through the working surface of the hard tool. In the whole attached in-process, the working face of stereoplasm instrument can play the effect of supporting the film, can be so that the softer film of texture is difficult to warp, compares in the direct attached mode to waiting to paste the annex with the softer film of texture, and this kind of attached mode can reduce attached degree of difficulty, improve attached yield.
Based on this, when the accessory to be attached is a bezel (frame around the display screen) of the notebook computer and the film is mylar (polyester film), mylar and the working surface of the hard tool can be firstly adhered, and then mylar is attached to the bezel of the notebook computer through the working surface of the hard tool.
Optionally, said adhering said film to said work surface comprises:
providing a limiting jig, wherein the limiting jig comprises a film placing position and a limiting part;
placing the film on the film placement location;
and moving the working surface of the hard tool towards the film until the working surface is adhered to the film, wherein the limiting part is used for guiding the working surface to be aligned with the film when the working surface of the hard tool moves towards the film.
When bonding film and working face together, owing to place the film at first on the film of spacing tool places the position, then move the working face of stereoplasm instrument towards the film until working face and film bonding, when the working face of stereoplasm instrument moved towards the film, spacing portion can also guide the working face and adjust well with the film, consequently, can make film and working face bond together better, and can make the more accurate of adhesive position of film on the working face.
Optionally, an adsorption hole is formed in the limiting jig, after the film is placed on the film placing position, the working surface of the hard tool is moved towards the film until the working surface is bonded to the film, and the bonding of the film to the working surface further includes:
the adsorption holes start to suck air so as to adsorb the film at the film placement position.
After the film is adsorbed on the film through adsorbing the hole and placing the position, can be so that film and film place the condition that relative movement can not appear between the position, and then make placing that the film can be more stable place and place the position at the film.
Optionally, after moving the working surface of the hard tool toward the film until the working surface is bonded to the film, the bonding the film to the working surface further comprises:
the adsorption hole stops the air suction.
By stopping the suction through the suction holes, the working face can take away the film from the film placement position.
Optionally, the limiting jig comprises a groove matched with the film, the groove forms the film placing position, and the adsorption hole is formed in the groove bottom of the groove.
When the film place the position by with the recess formation that the film matches, the recess can play spacing effect to the film for more stable the placing of film is on the film place the position.
Through the tank bottom that will adsorb the hole setting at the recess, the effect that adsorbs the film can be played in the absorption hole, consequently, can be so that the more stable placing of film places the position at the film.
Optionally, the film includes an adhesive surface and a smooth surface which are opposite to each other, a release paper is disposed on the adhesive surface, the smooth surface of the film is adhered to the working surface, after the film is adhered to the working surface, and before the working surface of the hard tool is moved toward the accessory to be attached, the method further includes:
and peeling the release paper from the adhesive surface.
The release paper is peeled off from the adhesive surface, so that the adhesive surface is exposed, and the film is convenient to adhere to the accessory to be attached.
Optionally, the working surface is a non-setting adhesive working surface.
The adhesive sticker has good viscosity and low cost and can be recycled, so that the manufacturing cost of the hard tool can be reduced while the viscosity of the hard tool is improved.
Optionally, the adhesive force of the adhesive surface is greater than that of the adhesive sticker working surface.
The film adhered to the to-be-attached accessory through the adhesive surface can be prevented from falling off from the to-be-attached accessory.
Optionally, a handle is disposed on a side of the hard tool opposite the working surface.
Through set up the handle on the one side that carries on the back with the working face at stereoplasm instrument, can be so that stereoplasm instrument is convenient for take, and then make the more humanized of use of stereoplasm instrument.
In a second aspect, the present application discloses an electronic device made according to the method of any of the first aspects described above.
When the film is attached to the accessory to be attached, the attachment difficulty can be reduced, and the attachment yield can be improved. Therefore, the yield of the electronic device manufactured by the attaching method is higher.
Compared with the prior art, the beneficial effect of this application lies in:
when the film is attached to the accessory to be attached, firstly, the film is adhered to the working surface of the hard tool, then, the working surface of the hard tool moves towards the accessory to be attached to drive the film to move towards the accessory to be attached until the film adhered to the working surface is adhered to the accessory to be attached, and after the film adhered to the working surface is adhered to the accessory to be attached, the hard tool is peeled from the film, so that the purpose of attaching the film to the accessory to be attached is achieved.
It can be seen that in the process of attaching the film to the accessory to be attached, the film is firstly adhered to the working surface of the hard tool, and then the film is attached to the accessory to be attached through the working surface of the hard tool. In the whole attached in-process, the working face of stereoplasm instrument can play the effect of supporting the film, can be so that the softer film of texture is difficult to warp, compares in the direct attached mode to waiting to paste the annex with the softer film of texture, and this kind of attached mode can reduce attached degree of difficulty, improve attached yield.
Based on this, when the accessory to be attached is a bezel (frame around the display screen) of the notebook computer and the film is mylar (polyester film), mylar and the working surface of the hard tool can be firstly adhered, and then mylar is attached to the bezel of the notebook computer through the working surface of the hard tool.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a flowchart of a method for attaching a film according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of a method for attaching a film according to an embodiment of the present disclosure;
FIG. 3 is a flow chart of another method for attaching a film according to an embodiment of the present disclosure;
FIG. 4 is a schematic structural diagram of another film attaching method according to an embodiment of the present disclosure;
FIG. 5 is a schematic structural diagram of a hard tool according to an embodiment of the present disclosure;
fig. 6 is a schematic structural view of a limiting jig provided in the embodiment of the present application;
fig. 7 is a diagram illustrating a positional relationship among a positioning jig, a film, a release paper, and an accessory to be attached according to an embodiment of the present disclosure;
fig. 8 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
Description of the main reference numerals
1-a hard tool; 11-a working surface; 12-a handle;
2-a film; 21-gluing surface; 211-release paper; 22-smooth surface;
3-an accessory to be attached;
4-limiting the jig; 41-film placing position; 42-a limiting part; 43-adsorption holes; 44-a groove;
100-an electronic device.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In this application, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.
Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meaning of these terms in this application will be understood by those of ordinary skill in the art as appropriate.
Furthermore, the terms "mounted," "disposed," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
Furthermore, the terms "first," "second," and the like, are used primarily to distinguish one device, element, or component from another (the specific nature and configuration may be the same or different), and are not used to indicate or imply the relative importance or number of the indicated devices, elements, or components. "plurality" means two or more unless otherwise specified.
The technical solution of the present application will be further described with reference to the following embodiments and accompanying drawings.
Example one
Fig. 1 is a flowchart of a film attaching method according to an embodiment of the present disclosure, and fig. 2 is a schematic structural diagram of the film attaching method according to the embodiment of the present disclosure.
Referring to fig. 1 and 2, the method includes:
step 101: a hard tool 1, a film 2 and an accessory 3 to be attached are provided, the hard tool 1 comprising a working surface 11.
Step 102: the film 2 is bonded to the work surface 11.
Step 103: the working surface 11 of the hard tool 1 is moved toward the to-be-affixed part 3 so that the film 2 adhered to the working surface 11 is adhered to the to-be-affixed part 3.
Step 104: the working surface 11 of the hard tool 1 is peeled off from the film 2.
In the embodiment of the application, when the film 2 is attached to the to-be-attached accessory 3, firstly, the film 2 is adhered to the working surface 11 of the hard tool 1, then, the working surface 11 of the hard tool 1 is moved towards the to-be-attached accessory 3 to drive the film 2 to move towards the to-be-attached accessory 3 until the film 2 adhered to the working surface 11 is adhered to the to-be-attached accessory 3, and after the film 2 adhered to the working surface 11 is adhered to the to-be-attached accessory 3, the hard tool 1 is peeled off from the film 2, so that the purpose of attaching the film 2 to the to-be-attached accessory 3 can be achieved.
It can be seen that in the process of attaching the film 2 to the accessory 3 to be attached, since the film 2 is first adhered to the working surface 11 of the hard tool 1, and then the film 2 is attached to the accessory 3 to be attached through the working surface 11 of the hard tool 1. In the whole attached process, the working face 11 of the hard tool 1 can play a role in supporting the film 2, so that the film 2 with soft texture is not easy to deform, and compared with an attaching mode of directly attaching the film 2 with soft texture to the accessory 3 to be attached, the attaching mode can reduce the attaching difficulty and improve the attaching yield.
Based on this, when the accessory 3 to be attached is a bezel (frame around the display screen) of the notebook computer and the film 2 is a mylar (polyester film), the mylar can be firstly adhered to the working surface 11 of the hard tool 1, and then the mylar is attached to the bezel of the notebook computer through the working surface 11 of the hard tool 1.
Fig. 3 is a flowchart of another method for attaching a film according to an embodiment of the present disclosure. Fig. 4 is a schematic structural diagram of another attachment method provided in the embodiment of the present application.
Referring to fig. 3 and 4, the method includes:
step 201: a hard tool 1, a film 2 and an accessory 3 to be attached are provided, the hard tool 1 comprising a working surface 11.
The hard tool 1 refers to a hard tool, for example, the hard tool may be a plastic plate or a stainless steel plate, and the embodiment of the present invention is not limited thereto.
The film 2 may be mylar (polyester film), but the film 2 may also be other soft and easily deformable films, which is not limited in the embodiment of the present application.
The accessory 3 to be attached may be a bezel (a frame around a display screen) of a notebook computer. Of course, the accessory 3 to be attached may also have other possible structures, for example, bezel of a mobile phone, and the like, which is not limited in this embodiment of the application.
In some embodiments, referring to fig. 5, a handle 12 is provided on the side of the hard tool 1 opposite the working surface 11. Through set up handle 12 on the one side that is carried on the back with working face 11 at stereoplasm instrument 1, can be so that stereoplasm instrument 1 is convenient for take, and then make the more humanized of use of stereoplasm instrument 1.
Step 202: the film 2 is bonded to the work surface 11.
There are various ways to adhere the film 2 to the working surface 11, which can be realized in one possible implementation by the following steps a2021-a 2023:
step A2021: a limiting jig 4 is provided, and the limiting jig 4 includes a film placing position 41 and a limiting portion 42.
Step A2022: the film 2 is placed on the film placing position 41.
Step a2023: the working surface 11 of the hard tool 1 is moved toward the film 2 until the working surface 11 is bonded to the film 2, and the stopper 42 is used to guide the working surface 11 of the hard tool 1 to be aligned with the film 2 when the working surface 11 is moved toward the film 2.
In this kind of implementation manner of adhering the film 2 and the working surface 11, when adhering the film 2 and the working surface 11, because the film 2 is firstly placed on the film placing position 41 of the limiting jig 4, and then the working surface 11 of the hard tool 1 is moved towards the film 2 until the working surface 11 is adhered to the film 2, when the working surface 11 of the hard tool 1 is moved towards the film 2, the limiting part 42 can also guide the working surface 11 to be aligned with the film 2, therefore, the film 2 and the working surface 11 can be better adhered to each other, and the adhering position of the film 2 on the working surface 11 can be more accurate.
It should be noted that, in the case where the limiting jig 4 is provided with the suction holes 43, the adhesion between the film 2 and the working surface 11 can be achieved through the following steps B2021 to B2025:
step B2021: a limiting jig 4 is provided, and referring to fig. 6, the limiting jig 4 includes a film placing position 41 and a limiting portion 42.
Wherein, spacing tool 4 can be formed by the bakelite preparation, because the mechanical strength of bakelite is higher, and has performances such as heat-resisting, corrosion-resistant, consequently, can be so that spacing tool 4 durable degree is higher.
Step B2022: the film 2 is placed on the film placing position 41.
The film 2 may be placed on the film placing position 41 in various ways, for example, the film 2 may be manually placed on the film placing position 41, or the film 2 may be placed on the film placing position 41 by a mechanical device, etc., which is not limited in this embodiment of the application.
In some embodiments, referring to fig. 6, the position limiting jig 4 comprises a groove 44 matched with the film 2, the groove 44 forms the film placing position 41, and when the film placing position 41 is formed by the groove 44 matched with the film 2, the groove 44 can limit the film 2, so that the film 2 is placed on the film placing position 41 more stably.
When the limiting jig 4 comprises a groove 44, in some embodiments, referring to fig. 6, the suction holes 43 are disposed at the bottom of the groove 44. Through setting up adsorption hole 43 at the tank bottom of recess 44, adsorption hole 43 can play the effect of adsorbing film 2, consequently, can be so that more stable placing of film 2 is at film place position 41.
The shape of the suction hole 43 may be circular or rectangular, and the like, which is not limited in the embodiments of the present application.
In addition, the number of the adsorption holes 43 can be multiple, and the adsorption holes 43 can be uniformly arranged at the bottom of the groove 44 in an array manner, so that the adsorption force of the adsorption holes 43 on the film 2 is more uniform, on one hand, the film 2 can be more stably placed at the film placing position 41, and on the other hand, the situation that the film 2 is partially tilted can be avoided.
Step B2023: the suction holes 43 start suction to suck the film 2 to the film placing site 41.
Wherein, the adsorption hole 43 can be connected with the air pump, and the air pump can provide the negative pressure for adsorption hole 43 begins to breathe in, when adsorption hole 43 begins to breathe in, can realize placing the purpose on the position 41 with film 2 absorption on the film. After the film 2 is adsorbed on the film placing position 41 through the adsorption holes 43, the film 2 and the film placing position 41 can be prevented from moving relatively, and the film 2 can be placed on the film placing position 41 more stably.
Step B2024: the working surface 11 of the hard tool 1 is moved toward the film 2 until the working surface 11 is bonded to the film 2, and the stopper 42 is used to guide the working surface 11 of the hard tool 1 to be aligned with the film 2 when the working surface 11 is moved toward the film 2.
The user can manually move the working surface 11 of the hard tool 1 towards the film 2 until the working surface 11 is bonded to the film 2, thereby bonding the film 2 to the working surface 11.
Since the position-limiting jig 4 includes the position-limiting portion 42, when the working surface 11 of the hard tool 1 moves toward the film 2, the movement track of the hard tool 1 can be guided by the position-limiting portion 42 so that the working surface 11 is aligned with the film 2, and thus, the film 2 can be more favorably adhered to the working surface 11.
In particular, referring to fig. 6, the stop portion 42 may be two oppositely disposed right angle guide angles that match the profile of the hard tool 1, such that the working surface 11 of the hard tool 1 is guided into alignment with the film 2 as the working surface 11 moves toward the film 2.
Of course, the limiting portion 42 may have other possible structures, which is not limited in the embodiments of the present application.
It is to be noted that, in order to allow the working surface 11 to adhere to the film 2, in a possible implementation, the aforementioned working surface 11 is a non-drying adhesive working surface. When the working surface 11 is a non-drying adhesive working surface, the working surface 11 can be bonded with the film 2, and the non-drying adhesive working surface can be recycled, in a popular way, the non-drying adhesive working surface still has adhesive force after being bonded with the film 2 for many times, so that the manufacturing cost of the hard tool 1 can be reduced.
It should be noted that the above-mentioned non-drying adhesive working surface is the working surface 11 with non-drying adhesive on the working surface 11, wherein, because the non-drying adhesive has good adhesiveness and low cost and can be recycled, the manufacturing cost of the hard tool 1 can be reduced while the adhesiveness of the hard tool 1 is improved.
Step B2025: the suction hole 43 stops the suction.
In the case where the adsorption holes 43 are connected to the air pump, the effect of stopping the suction of the adsorption holes 43 can be achieved by closing the air pump, and after the suction of the adsorption holes 43 is stopped, the film 2 will not be adsorbed again on the film placing position 41.
By stopping the suction through the suction holes 43, the working surface 11 can easily remove the film 2 from the film placing position 41.
In this way, when the film 2 is bonded to the work surface 11, since the film 2 is placed on the film placing position 41 of the position restricting jig 4 and then the film 2 is adsorbed to the film placing position 41 through the adsorption hole 43 after the film 2 is placed on the film placing position 41, the work surface 11 of the hard tool 1 is moved toward the film 2 until the work surface 11 is bonded to the film 2, and finally the adsorption hole 43 stops sucking air. Also even, after placing film 2 on the film placement position 41 of spacing tool 4, moving working face 11 towards film 2 of stereoplasm instrument 1 until working face 11 and film 2 are bonded before, through adsorbing hole 43 with film 2 and placing position 41 in the film, like this, can avoid film 2 and film to place the condition that appears relative movement between the position 41, and then make film 2 can more stable place and place position 41 in the film, thereby can guarantee the more accurate of the bonding position of film 2 on working face 11.
Step 203: the release paper 211 is peeled off from the adhesive surface 21.
Referring to fig. 7, the film 2 includes an adhesive surface 21 and a smooth surface 22 which are opposite to each other, a release paper 211 is disposed on the adhesive surface 21, and the smooth surface 22 of the film 2 is adhered to the working surface 11.
The release paper 211 is peeled off from the adhesive surface 21 so that the adhesive surface 21 is exposed, thereby facilitating the adhesion of the film 2 to the to-be-attached component 3.
Step 204: the working surface 11 of the hard tool 1 is moved toward the to-be-affixed part 3 so that the film 2 adhered to the working surface 11 is adhered to the to-be-affixed part 3.
The user can manually move the working surface 11 of the hard tool 1 toward the accessory 3 to be attached until the film 2 adhered to the working surface 11 comes into contact with the accessory 3 to be attached, and after the film 2 adhered to the working surface 11 comes into contact with the accessory 3 to be attached, the purpose of adhering the film 2 adhered to the working surface 11 to the accessory 3 to be attached can be achieved.
Step 205: the working surface 11 of the hard tool 1 is peeled off from the film 2.
In this case, the hard tool 1 can be moved away from the film 2, so that the hard tool 1 can be peeled off from the film 2.
It is to be noted that in order to prevent the film 2 adhered to the to-be-attached component 3 by the adhesive surface 21 from falling off the to-be-attached component 3 when the hard tool 1 is peeled off the film 2, in some embodiments, the adhesive force of the adhesive surface 21 is larger than that of the adhesive working surface, so that the film 2 adhered to the to-be-attached component 3 by the adhesive surface 21 can be prevented from falling off the to-be-attached component 3.
In the embodiment of the application, when the film 2 is attached to the to-be-attached component 3, firstly, the film 2 is adhered to the working surface 11 of the hard tool 1, then, the working surface 11 of the hard tool 1 is moved towards the to-be-attached component 3 to drive the film 2 to move towards the to-be-attached component 3 until the film 2 adhered to the working surface 11 is adhered to the to-be-attached component 3, and after the film 2 adhered to the working surface 11 is adhered to the to-be-attached component 3, the hard tool 1 is peeled off from the film 2, so that the purpose of attaching the film 2 to the to-be-attached component 3 can be achieved.
It can be seen that in the process of attaching the film 2 to the accessory 3 to be attached, the film 2 is firstly adhered to the working surface 11 of the hard tool 1, and then the film 2 is attached to the accessory 3 to be attached through the working surface 11 of the hard tool 1. In the whole attaching process, the working surface 11 of the hard tool 1 can play a role of supporting the film 2, so that the film 2 with soft texture is not easy to deform, and compared with an attaching mode of directly attaching the film 2 with soft texture to the accessory 3 to be attached, the attaching mode can reduce the attaching difficulty and improve the attaching yield.
In addition, because place film 2 on the film of spacing tool 4 places the position 41 after, moving working face 11 towards film 2 with stereoplasm instrument 1 until working face 11 and film 2 are bonded before, place position 41 with film 2 absorption through absorption hole 43, thus, can avoid film 2 and film to place the condition that relative movement appears between the position 41, and then make film 2 can more stable place and place position 41 in the film, thereby can guarantee film 2 more accurate in the bonding position on working face 11, and then make film 2 more accurate in the bonding position on waiting to paste annex 3, thereby make the attached yield of film 2 higher.
Example two
Fig. 8 is a schematic structural diagram of an electronic device 100 according to an embodiment of the present application. Referring to fig. 8, the electronic device 100 is made according to any of the methods of the first aspect described above.
In the embodiment of the application, when the film 2 is attached to the to-be-attached accessory 3, the attaching difficulty can be reduced, and the attaching yield can be improved. Therefore, the yield of the electronic device manufactured by the attaching method is higher.
The electronic device 100 may be a notebook computer, a desktop computer, or a mobile phone, which is not limited in this embodiment of the present invention.
Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.
Claims (10)
1. A method of attaching a film, the method comprising:
providing a hard tool, a film and an accessory to be attached, wherein the hard tool comprises a working surface;
bonding the film to the work surface;
moving the working surface of the hard tool towards an accessory to be attached so as to enable the film adhered to the working surface to be adhered to the accessory to be attached;
peeling the working surface of the hard tool from the film.
2. The method of claim 1, wherein said adhering said film to said work surface comprises:
providing a limiting jig, wherein the limiting jig comprises a film placing position and a limiting part;
placing the film on the film placement location;
and moving the working surface of the hard tool towards the film until the working surface is adhered to the film, wherein the limiting part is used for guiding the working surface to be aligned with the film when the working surface of the hard tool moves towards the film.
3. The method according to claim 2, wherein the limiting jig is provided with an adsorption hole, and after the film is placed on the film placing position, the working surface of the hard tool is moved towards the film until the working surface is bonded with the film, and the bonding of the film with the working surface further comprises:
the adsorption holes start to suck air to adsorb the film at the film placement position.
4. The method of claim 3, wherein the moving a working surface of the hard tool toward the film until after the working surface is bonded to the film further comprises:
the adsorption hole stops the air suction.
5. The method according to claim 4, wherein the limiting jig comprises a groove matched with the thin film, the groove forms the thin film placing position, and the adsorption hole is formed in the bottom of the groove.
6. The method of any of claims 1-5, wherein the film comprises opposing adhesive sides and a glossy side, the adhesive sides having a release paper disposed thereon, the glossy side of the film being adhered to the working side, the method further comprising, after adhering the film to the working side and before moving the working side of the hard tool toward the accessory to be attached:
and peeling the release paper from the adhesive surface.
7. The method of claim 6, wherein the working surface is a non-drying adhesive working surface.
8. The method of claim 7, wherein the adhesive force of the adhesive surface is greater than the adhesive force of the non-setting adhesive working surface.
9. The method of any of claims 1-5, wherein a handle is provided on a side of the hard tool opposite the working surface.
10. An electronic device made according to the method of any one of claims 1-9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210887620.6A CN115256963A (en) | 2022-07-26 | 2022-07-26 | Film attaching method and electronic device |
| PCT/CN2022/139388 WO2024021447A1 (en) | 2022-07-26 | 2022-12-15 | Method for adhering thin film, and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210887620.6A CN115256963A (en) | 2022-07-26 | 2022-07-26 | Film attaching method and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115256963A true CN115256963A (en) | 2022-11-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210887620.6A Pending CN115256963A (en) | 2022-07-26 | 2022-07-26 | Film attaching method and electronic device |
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| Country | Link |
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| CN (1) | CN115256963A (en) |
| WO (1) | WO2024021447A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024021447A1 (en) * | 2022-07-26 | 2024-02-01 | 无锡闻泰信息技术有限公司 | Method for adhering thin film, and electronic device |
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| CN212556964U (en) * | 2020-06-09 | 2021-02-19 | 歌尔科技有限公司 | Protective film pasting tool |
| CN113207246A (en) * | 2021-05-14 | 2021-08-03 | 昆山松沅电子有限公司 | Full-automatic film laminating and assembling machine |
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| CN202464192U (en) * | 2012-01-16 | 2012-10-03 | 捷荣模具工业(东莞)有限公司 | A fixture for attaching a protective film |
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| CN216102985U (en) * | 2021-10-18 | 2022-03-22 | 宁德时代新能源科技股份有限公司 | Laminating device and laminating machine |
| CN114083790A (en) * | 2021-11-26 | 2022-02-25 | 深圳市深科达智能装备股份有限公司 | Film attaching mechanism and film attaching equipment |
| CN115256963A (en) * | 2022-07-26 | 2022-11-01 | 无锡闻泰信息技术有限公司 | Film attaching method and electronic device |
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2022
- 2022-07-26 CN CN202210887620.6A patent/CN115256963A/en active Pending
- 2022-12-15 WO PCT/CN2022/139388 patent/WO2024021447A1/en not_active Ceased
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| CN207773577U (en) * | 2018-01-03 | 2018-08-28 | 合肥京东方显示技术有限公司 | Auxiliary paster device |
| CN209889891U (en) * | 2019-04-30 | 2020-01-03 | 马鞍山甬兴模塑有限公司 | Washing machine control panel's pad pasting moves gets mechanism |
| CN111572920A (en) * | 2020-05-06 | 2020-08-25 | 深圳市承熹机电设备有限公司 | Automatic film sticking machine and film sticking method |
| CN212556964U (en) * | 2020-06-09 | 2021-02-19 | 歌尔科技有限公司 | Protective film pasting tool |
| CN113207246A (en) * | 2021-05-14 | 2021-08-03 | 昆山松沅电子有限公司 | Full-automatic film laminating and assembling machine |
| CN216764334U (en) * | 2021-11-30 | 2022-06-17 | 苏州固锝电子股份有限公司 | High-quality film pasting device |
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| WO2024021447A1 (en) * | 2022-07-26 | 2024-02-01 | 无锡闻泰信息技术有限公司 | Method for adhering thin film, and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024021447A1 (en) | 2024-02-01 |
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