CN115243505A - Assembled electronic radiator - Google Patents

Abstract

The invention relates to an assembled electronic radiator, which comprises a main air-cooled radiator, a main fixing frame is fixed on the rear side of the main air-cooled radiator, and a main heat dissipation fin plate is fixed inside the main fixing frame. The rear side of the main fixing frame is also fixed with an auxiliary air-cooled radiator, the rear side of the auxiliary air-cooled radiator is fixed with an auxiliary fixing frame, and an auxiliary cooling fin plate is fixed inside the auxiliary fixing frame, and the main fixing frame is A heat-conducting pipe group is fixed between it and the sub-fixing frame. The assembled electronic radiator uses the auxiliary heat dissipation fins for heat conduction by the heat conduction plate, and cooperates with the heat conduction tube group to transfer the heat of the heat source from the auxiliary heat dissipation fins to the main heat dissipation fins, and then the main heat dissipation fins pass through conduction and radiation. The heat is dissipated in the atmospheric environment. In addition, the water-cooling ducts run through the main cooling fins and the auxiliary cooling fins. The heat on the board is taken away.

Description

An assembled electronic radiator

technical field

The invention relates to the technical field of radiators, in particular to an assembled electronic radiator.

Background technique

The radiator is divided into radiation radiator and convection radiator according to the heat exchange method. The convection heat dissipation of a convection radiator accounts for almost 100%, and it is sometimes called a "convection radiator"; other radiators dissipate heat by both convection and radiation, sometimes called a "radiator".

The heat dissipation performance of the radiator can be used for efficient heat dissipation of the heating components. For game lovers, a good heat dissipation system can improve the excellent game experience. It is widely used in the heat dissipation system of electronic appliances. The accommodation space of electrical appliances is limited, and the cooling system will be inconvenient to use due to the large space occupied. In addition, the independent cooling system cannot guarantee a good cooling foundation, and multiple cooling devices are required to be assembled, which further increases the space and makes it easier to use. Reduced air flow inside the chassis.

SUMMARY OF THE INVENTION

(1) Technical problems solved

In view of the deficiencies of the prior art, the present invention provides an assembled electronic heat sink, which has the advantages of small occupied space and strong heat dissipation performance, and solves the problem of the heat dissipation system commonly used in electronic appliances, which has its own defect of being large in size, because the electronic The accommodation space of electrical appliances is limited, and the cooling system will be inconvenient to use due to the large space occupied. In addition, the independent cooling system cannot guarantee a good cooling foundation, and multiple cooling devices are required to be assembled, which further increases the space and makes it easier to use. The problem of reduced air flow inside the case.

(2) Technical solutions

In order to achieve the above purpose, the present invention provides the following technical solutions: an assembled electronic radiator, comprising a main air-cooling radiator, a main fixing frame is fixed on the rear side of the main air-cooling radiator, and the interior of the main fixing frame is The main heat dissipation fin plate is fixed, the rear side of the main fixing frame is also fixed with an auxiliary air-cooled radiator, the rear side of the auxiliary air-cooled radiator is fixed with an auxiliary fixing frame, and the interior of the auxiliary fixing frame is fixed with a secondary air-cooled radiator. A heat-dissipating fin plate, a heat-conducting pipe group is fixed between the main fixing frame and the auxiliary fixing frame, a water-cooling duct is assembled on the main radiating fin plate, and a cold row is fixed on the side of the water-cooling duct away from the main heat-dissipating fin plate, A water-cooled head is fixed on the front side of the cold row, a water pump is fixed on the top of the water-cooled head, and a heat conduction plate is also fixed on the bottom of the cold row.

Further, the inner four corners of the main air-cooling radiator are threadedly connected with fixing screws, the fixing screws penetrate the main fixing frame, the auxiliary air-cooling radiator and the auxiliary fixing frame, and the fixing screws are connected with the main fixing frame and the auxiliary air-cooling frame. The connection relationship between the radiator and the sub-fixed frame is a screw connection.

Further, the front and rear sides of the main heat dissipation fin plate and the auxiliary heat dissipation fin plate protrude from the main fixed frame and the auxiliary fixed frame respectively, and the inner sides of the main heat dissipation fin plate and the auxiliary heat dissipation fin plate are provided with water cooling holes. And both the main heat dissipation fin plate and the auxiliary heat dissipation fin plate are provided with heat conduction holes.

Further, the heat-conducting pipe group includes more than five heat-conducting pipes, the heat-conducting pipes are encircled in a rectangular shape, and the heat-conducting pipes pass through the heat-conducting holes from the tops of the main fixing frame and the auxiliary fixing frame and extend to the main fixing frame and the auxiliary fixing frame. bottom of.

Further, the water-cooling duct is U-shaped, and the two ends of the water-cooling duct are respectively connected to the left and right sides of the cold row. Fins and auxiliary cooling fins.

Further, the left and right sides of the inside of the cold row are respectively provided with a heat flow return pipe and a cold outflow pipe connected to both ends of the water-cooled conduit, and the heat flow return pipe and the cold outflow pipe respectively penetrate the inside of the cold row and extend to the water cooling head. The top sides are connected.

Further, the heat-conducting plate is L-shaped, and the heat-conducting plate is a copper plate, and a heat-dissipating hole is formed in the interior of the heat-conducting plate.

Further, a heat sink is attached to the outside of the heat conducting plate, the heat sink is a graphite heat sink, and the heat sink is L-shaped.

(3) Beneficial effects

Compared with the prior art, the technical solution of the present application has the following beneficial effects:

1. The assembled electronic radiator, the main air-cooled radiator, the main fixed frame, the auxiliary air-cooled radiator and the auxiliary fixed frame are attached to each other, and the structure is tight to ensure the maximum reduction of the gap, avoid increasing the space area, and use the fixed screw , lock the main air-cooled radiator, the main fixed frame, the auxiliary air-cooled radiator and the auxiliary fixed frame to each other to avoid loosening. The bottom of the fixed frame is provided with a cold radiator, which improves the heat dissipation base and avoids the increase of the volume of the peripheral heat dissipation equipment. At the same time, a heat conduction plate is attached to the outside of the cold radiator, and the L-shaped design increases the radiation heat dissipation base with a minimized volume.

2. The assembled electronic radiator utilizes the dual-group air-cooling system of the main air-cooled radiator and the auxiliary air-cooled radiator to realize a dual forced cooling system, forcing the air to flow, and bringing the heat of the heat source to the atmospheric environment. The fixed frame and the sub-fixed frame are respectively provided with main cooling fins and auxiliary cooling fins. As passive cooling elements, the metal with good thermal conductivity, light weight and easy processing is attached to the heating surface, and the composite heat exchange mode is used to Heat dissipation, after absorbing the heat, the heat is dissipated by two sets of air cooling systems in the form of convection.

Description of drawings

Fig. 1 is the structural representation of the present invention;

FIG. 2 is a schematic structural diagram of the main cooling fin plate of the present invention;

3 is a schematic diagram of the partial structure of the heat pipe of the present invention;

FIG. 4 is a schematic structural diagram of a heat conducting plate and a heat sink according to the present invention;

FIG. 5 is a schematic structural diagram of the water cooling conduit, the heat return pipe and the cold outflow pipe of the present invention.

In the picture: 1 main air-cooled radiator, 2 main fixed frame, 3 main cooling fins, 4 auxiliary air-cooled radiators, 5 auxiliary fixed frames, 6 auxiliary cooling fins, 7 heat pipe groups, 8 water cooling pipes, 9 cooling pipes Row, 10 water blocks, 11 water pumps, 12 heat conduction plates, 13 heat sinks, 14 heat return pipes, 15 cold outflow pipes.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

1-5, an assembled electronic heat sink in this embodiment includes a main air-cooled heat sink 1, a main fixing frame 2 is fixed on the rear side of the main air-cooled heat sink 1, and the interior of the main fixing frame 2 is The main heat dissipation fin plate 3 is fixed, the rear side of the main fixed frame 2 is also fixed with an auxiliary air-cooled radiator 4, the rear side of the auxiliary air-cooled radiator 4 is fixed with an auxiliary fixed frame 5, and the inside of the auxiliary fixed frame 5 is fixed with a secondary air-cooled radiator 4. A heat-dissipating fin plate 6, a heat-conducting pipe group 7 is fixed between the main fixing frame 2 and the sub-fixing frame 5, a water-cooling conduit 8 is assembled on the main heat-dissipating fin plate 3, and the side of the water-cooling conduit 8 away from the main heat-dissipating fin plate 3 is fixed with a cooling tube. Row 9, the front side of the cold row 9 is fixed with a water-cooled head 10, the top of the water-cooled head 10 is fixed with a water pump 11, and the bottom of the cold row 9 is also fixed with a heat-conducting plate 12. , with the heat-absorbing effect made of copper, the heat can be rapidly radiated and conducted on the auxiliary heat dissipation fin plate 6 to disperse the heat, and the heat sink 13 attached to the heat conduction plate 12 is a graphite heat sink, which is a nano-advanced composite material. , suitable for uniform heat conduction on any surface, with EMI electromagnetic shielding effect, the graphite heat sink can be smoothly attached to any flat and curved surface, can be attached to the CPU surface to the maximum extent, and evenly distribute the heat on the heat conduction plate 12, indirect heat dissipation.

Among them, the auxiliary heat dissipation fin plate 6, which is heat-conducted by the heat conduction plate 12, cooperates with the heat conduction pipe group 7 to carry the heat of the heat source from the auxiliary heat dissipation fin plate 6 to the main heat dissipation fin plate 3, and then the main heat dissipation fin plate 3 passes through conduction and heat dissipation. Radiation dissipates heat in the atmospheric environment. In addition, the main cooling fins 3 and the auxiliary cooling fins 6 run through the water-cooled conduits 8. Water or other liquids are poured into the water-cooled conduits 8, and the main cooling fins are cooled by water or other liquids. The heat on the plate 3 and the auxiliary heat dissipation fin plate 6 is taken away.

In this embodiment, the two ends of the water-cooling conduit 8 are respectively connected with a heat return pipe 14 and a cold outflow pipe 15, and the heat return pipe 14 is used to conduct the water with heat or other liquids to the cold row 9, and the cold row 9 carries the heat to the cold row 9. Dissipated in the atmospheric environment, the cold exhaust 9 can conduct the water with heat or other liquids into the water cooling conduit 8 through the water cooling head 10 and the water pump 11 with the cold outflow pipe 15 to realize the fluid circulation.

The working principle of the above embodiment is:

(1) The heat source conducts heat conduction through the heat sink 13, and cooperates with the heat conduction plate 12 to transfer the heat to the auxiliary heat dissipation fin plate 6 and the cold row 9, and the auxiliary heat dissipation fin plate 6 conducts the heat to the main heat dissipation fin plate 3 through the heat pipe group 7, The main fins 3 and the auxiliary fins 6 use the main air-cooled radiator 1 and the auxiliary air-cooled radiator 4 to transfer heat by air convection respectively. In addition, the main fins 3 and the auxiliary fins 6 pass through the water-cooled ducts 8 The heat is dispersed in the cold row 9 , and the cold row 9 can be used to conduct the heat into the air, and the fluid circulation is realized through the water cooling head 10 and the water pump 11 .

(2) The main air cooling radiator 1, the main cooling fin plate 3, the auxiliary air cooling radiator 4, the auxiliary cooling fin plate 6, the heat conduction tube group 7, the water cooling conduit 8, the cold row 9, the heat conduction plate 12 and the heat sink 13 at the same time Work, reduce heat layer by layer, quickly consume and cooperate with each other, improve heat dissipation performance and avoid occupying a large space.

(3) Comprehensive natural heat dissipation, heat dissipation by heat sink, air cooling, water cooling, heat pipe heat dissipation and graphite sheet heat dissipation. Various heat dissipation methods occur at the same time and work together to prevent the device from starting a self-protection mechanism when the temperature is too high. , automatic power off, in addition, the above-mentioned various cooling systems are compact in structure, cooperate with each other, and have low space utilization, avoiding increasing the internal space of the chassis.

It should be noted that, in this document, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any relationship between these entities or operations. any such actual relationship or sequence exists. Moreover, the terms "comprising", "comprising" or any other variation thereof are intended to encompass a non-exclusive inclusion such that a process, method, article or device that includes a list of elements includes not only those elements, but also includes not explicitly listed or other elements inherent to such a process, method, article or apparatus. Without further limitation, an element qualified by the phrase "comprising a..." does not preclude the presence of additional identical elements in the process, method, article, or device that includes the element.

Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, and substitutions can be made in these embodiments without departing from the principle and spirit of the invention and modifications, the scope of the present invention is defined by the appended claims and their equivalents.

Claims (8)

1. The utility model provides an assembled electronic radiator, includes main forced air cooling radiator (1), its characterized in that: the rear side of main forced air cooling radiator (1) is fixed with main fixed frame (2), the inside of main fixed frame (2) is fixed with main heat dissipation finned plate (3), the rear side of main fixed frame (2) still is fixed with vice forced air cooling radiator (4), the rear side of vice forced air cooling radiator (4) is fixed with vice fixed frame (5), the inside of vice fixed frame (5) is fixed with vice heat dissipation finned plate (6), be fixed with heat pipe group (7) between main fixed frame (2) and vice fixed frame (5), the equipment has water-cooling pipe (8) on main heat dissipation finned plate (3), one side that main heat dissipation finned plate (3) were kept away from in water-cooling pipe (8) is fixed with cold row (9), the front side of cold row (9) is fixed with water-cooling head (10), the top of water-cooling head (10) is fixed with water pump (11), the bottom of cold row (9) still is fixed with heat-conducting plate (12).

2. The assembled electronic heat sink of claim 1, wherein: the all threaded connection in inside four corners of main forced air cooling radiator (1) has clamping screw, clamping screw runs through main fixed frame (2), vice forced air cooling radiator (4) and vice fixed frame (5), clamping screw is threaded connection with the fixed frame of main (2), vice forced air cooling radiator (4) and vice fixed frame (5) the connected relation.

3. The assembled electronic heat sink of claim 1, wherein: the front side and the rear side of the main radiating fin plate (3) and the auxiliary radiating fin plate (6) respectively protrude out of the main fixing frame (2) and the auxiliary fixing frame (5), water cooling holes are formed in two sides of the inside of the main radiating fin plate (3) and the inner side of the auxiliary radiating fin plate (6), and heat conducting holes are formed in the inside of the main radiating fin plate (3) and the inner side of the auxiliary radiating fin plate (6).

4. A modular electronic heat sink as recited in claim 3, wherein: the heat conduction pipe set (7) comprises heat conduction pipes of which the number is more than five, the heat conduction pipes are surrounded to be rectangular, and the heat conduction pipes penetrate through the heat conduction holes from the tops of the main fixing frame (2) and the auxiliary fixing frame (5) and extend to the bottoms of the main fixing frame (2) and the auxiliary fixing frame (5).

5. The assembled electronic heat sink of claim 1, wherein: the water-cooling guide pipe (8) is U-shaped, the two ends of the water-cooling guide pipe (8) are respectively connected with the left side and the right side of the cold row (9), and the outside of the water-cooling guide pipe (8) penetrates through the main radiating fin plate (3) and the auxiliary radiating fin plate (6) through water-cooling holes in the main radiating fin plate (3) and the auxiliary radiating fin plate (6).

6. The assembled electronic heat sink of claim 1, wherein: the inside left and right sides of cold row (9) is provided with respectively with water-cooling pipe (8) both ends be connected hot fluid return pipe (14) and cold flow exit tube (15), hot fluid return pipe (14) and cold flow exit tube (15) run through cold row (9) inside respectively and extend to and are connected with the top both sides of water-cooling head (10).

7. The assembled electronic heat sink of claim 1, wherein: the heat conducting plate (12) is L-shaped, the heat conducting plate (12) is a copper plate, and heat dissipation holes are formed in the heat conducting plate (12).

8. The assembled electronic heat sink of claim 1, wherein: the heat conducting plate is characterized in that radiating fins (13) are attached to the outer portion of the heat conducting plate (12), the radiating fins (13) are graphite radiating fins, and the radiating fins (13) are L-shaped.

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