CN115213791A - Sand mill for processing gyromagnetic ferrite dielectric ceramic and polishing method thereof - Google Patents
Sand mill for processing gyromagnetic ferrite dielectric ceramic and polishing method thereof Download PDFInfo
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- CN115213791A CN115213791A CN202210703884.1A CN202210703884A CN115213791A CN 115213791 A CN115213791 A CN 115213791A CN 202210703884 A CN202210703884 A CN 202210703884A CN 115213791 A CN115213791 A CN 115213791A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
- B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a sand mill for processing gyromagnetic ferrite dielectric ceramic and a polishing method thereof, relates to the technical field of microwave ferrite, and aims to solve the problems that the product damage rate is high when the existing ferrite dielectric ceramic wafer is processed by abrasive flow polishing, the ceramic wafer is troublesome to turn over when the existing ferrite dielectric ceramic wafer is polished by using the sand mill, and the efficiency is low when a large batch of ferrite dielectric ceramic wafers are processed. The middle of automatic upset sanding burnishing machine is provided with transport mechanism, the drive belt, and it sets up the centre at transport mechanism, be provided with a plurality of potsherds conveying check on the drive belt, potsherds upset backing plate, its setting is in the inside of drive belt, the inside first upset groove that is provided with in top of potsherds upset backing plate, first plane polishing mechanism, its setting is at transport mechanism's top front end, first plane polishing mechanism's rear is provided with first side polishing mechanism, first side polishing mechanism's rear is provided with second plane polishing mechanism.
Description
Technical Field
The invention relates to the technical field of microwave ferrite, in particular to a sand mill for processing gyromagnetic ferrite dielectric ceramic and a polishing method thereof.
Background
The ferrite dielectric ceramic sheet is a ceramic material which is applied to a microwave frequency band circuit and used as a dielectric material and can complete one or more functions, and an abrasive flow polishing machine or a sand mill is required to polish and polish the ceramic material in the production process.
For example, chinese patent publication No. CN213319397U (a table type sander), a driving wheel and a driven wheel are disposed at two ends of a workbench, the driving wheel and the driven wheel are disposed in a slot hole, one end of the driving wheel passes through a first bearing and is connected with the rotating wheel, a motor is disposed at the lower end of the workbench and is connected with the rotating wheel through a belt, blocking platforms are symmetrically disposed on a sidewall of the workbench, an adjusting column is disposed through the blocking platforms, a shaft sleeve is disposed at one end of the adjusting column, a second bearing is disposed in the shaft sleeve, two ends of the driven wheel pass through a transverse groove and are disposed in the second bearing, and an abrasive cloth is disposed between the driving wheel and the driven wheel.
However, the product damage rate is high during abrasive flow polishing in the prior art, the ceramic wafer is troublesome to turn over when a sand mill is used for polishing, and the efficiency is low when a large batch of ferrite medium ceramic wafers are processed; therefore, the prior requirements are not met, and a sand mill for processing gyromagnetic ferrite medium ceramics and a polishing method thereof are provided.
Disclosure of Invention
The invention aims to provide a sand mill for processing gyromagnetic ferrite dielectric ceramic and a polishing method thereof, and aims to solve the problems that the existing ferrite dielectric ceramic wafer processing abrasive flow polishing in the background technology has high product damage rate, the ceramic wafer is troublesome to turn over when the sand mill is used for polishing, and the efficiency is low when a large batch of ferrite dielectric ceramic wafers are processed.
In order to achieve the purpose, the invention provides the following technical scheme: a gyromagnetic ferrite medium ceramic processing sand mill comprises an automatic overturning and sanding polishing machine, wherein a transmission mechanism is arranged in the middle of the automatic overturning and sanding polishing machine;
further comprising:
the transmission belt is arranged in the middle of the conveying mechanism and is meshed and connected with a rotating shaft of the conveying mechanism, a plurality of ceramic wafer conveying grids are arranged on the transmission belt and are integrated with the ceramic wafer conveying grids, a plurality of water leakage holes are formed in the transmission belt, and the transmission belt and the water leakage holes are integrated;
the ceramic plate overturning base plate is arranged inside the transmission belt and is welded with the transmission mechanism, six first overturning grooves are formed in the upper portion of the ceramic plate overturning base plate and are integrated with the ceramic plate overturning base plate, a plurality of water leakage holes are formed in the ceramic plate overturning base plate, and the ceramic plate overturning base plate and the water leakage holes in the ceramic plate overturning base plate are integrated;
the polishing device comprises a first plane polishing mechanism, a second plane polishing mechanism and a conveying mechanism, wherein the first plane polishing mechanism is arranged at the front end above the conveying mechanism, the first side polishing mechanism is arranged behind the first plane polishing mechanism, the second plane polishing mechanism is arranged behind the first side polishing mechanism, the second side polishing mechanism is arranged behind the second plane polishing mechanism, and the first plane polishing mechanism, the first side polishing mechanism, the second plane polishing mechanism and the second side polishing mechanism are all connected with the conveying mechanism through screws.
Preferably, polishing wheels are arranged in the middle of the lower portions of the first plane polishing mechanism, the first side edge polishing mechanism, the second plane polishing mechanism and the second side edge polishing mechanism, and a water spray nozzle is arranged above each polishing wheel.
Preferably, a polishing transmission mechanism is arranged below one side of each of the first plane polishing mechanism, the first side polishing mechanism, the second plane polishing mechanism and the second side polishing mechanism, the four polishing transmission mechanisms are respectively connected with four polishing mechanism chains, a rotating motor is arranged below the other side of each of the four polishing transmission mechanisms, the four polishing transmission mechanisms are connected with a rotating motor shaft below the other side, a polishing mechanism positioning table is arranged at the front end and the rear end of each polishing transmission mechanism, and the polishing mechanism positioning tables are welded with the conveying mechanisms.
Preferably, transport mechanism's below is provided with the sanding frame, and the sanding frame passes through the screw and is connected with transport mechanism, one side front end of transport mechanism is provided with conveying drive mechanism, and conveying drive mechanism is connected with transport mechanism's pivot chain, and conveying drive mechanism's opposite side below is provided with the rotating electrical machines, and conveying drive mechanism is connected with the rotating electrical machines axle of opposite side below.
Preferably, the below of rotating electrical machines is provided with the motor fixing base, and rotating electrical machines and motor fixing base embedded connection, the below of motor fixing base is provided with the motor platform, and the motor fixing base passes through the screw and is connected with the motor platform, and motor platform and sanding frame welded connection.
Preferably, transport mechanism's below is provided with the header tank, and header tank and sanding frame welded connection, the front end of header tank is provided with the delivery port, and delivery port and header tank structure as an organic whole.
Preferably, the place ahead in first returning face groove is provided with first glide plane, and first glide plane and potsherd upset backing plate structure as an organic whole, the rear end in first returning face groove is provided with the second glide plane, and second glide plane and potsherd upset backing plate structure as an organic whole, the rear end in second glide plane is provided with six second returning face grooves, and six second returning face grooves and potsherd upset backing plate structure as an organic whole.
Preferably, a first guide inclined surface is uniformly and integrally arranged at the front end inside the first turnover groove and the second turnover groove, an upright surface is arranged at the rear end of the first guide inclined surface, a first limiting surface is arranged on one side of the first guide inclined surface, a first pressing surface is arranged at the rear end of the first limiting surface, an upright guide rail is arranged at the rear end between the upright surface and the first pressing surface, a second pressing surface is arranged on the other side of the rear end of the upright guide rail, a second guide inclined surface is arranged on one side of the second pressing surface, a second limiting surface is arranged at the rear end of the second pressing surface, and a guide plane is arranged at the rear end of the second guide inclined surface.
Preferably, the polishing method of the gyromagnetic ferrite medium ceramic processing sand mill comprises the following steps:
the method comprises the following steps: putting the dielectric ceramic wafer into the ceramic wafer conveying grid, starting the rotating motor to drive the driving belt and the polishing wheel to rotate, and simultaneously spraying water from the water spraying port;
step two: the ceramic wafer passes below the first plane polishing mechanism, the polishing wheel rotates to polish the first surface of the ceramic wafer, and water sprayed from the water spray nozzle takes away dust generated by polishing, flows into the water collecting tank below through the water leakage hole and is discharged through the water outlet;
step three: the transmission belt rotates to drive the ceramic wafer in the ceramic wafer conveying grid to move backwards and enter the first turnover groove, one side of the ceramic wafer is downwards sunk into the first guide inclined plane, the other side of the ceramic wafer is continuously driven by the ceramic wafer conveying grid to move backwards, the ceramic wafer gradually enters the lower part of the first pressing surface, the other side of the ceramic wafer is lifted by the vertical surface to enable the ceramic wafer to gradually stand into the vertical guide rail, the ceramic wafer is driven to pass through the lower part of the first side polishing mechanism, corners of the ceramic wafer are polished and polished by the polishing wheel, water sprayed from the water spray nozzle brings away dust generated by polishing, the dust flows into a water collecting tank below the ceramic wafer through the water leakage hole and is discharged through the water outlet;
step four: the ceramic wafer continues to move backwards, the upper side of the ceramic wafer is pressed towards one side by the second pressing surface, the other side of the ceramic wafer rotates to a second limiting surface, after the ceramic wafer is separated from the first overturning groove, the second surface of the ceramic wafer is overturned to the upper side, the second surface of the ceramic wafer passes through the lower side of the second plane polishing mechanism, the second surface of the ceramic wafer is polished and polished by the polishing wheel, and dust generated by polishing is taken away by water sprayed from the water spraying port, flows into the water collecting tank below through the water leakage hole and is discharged through the water outlet;
step five: and D, continuously moving the ceramic wafer backwards, moving the ceramic wafer to a second overturning groove, repeating the step three, finishing polishing the other side of the ceramic wafer, repeating the step four, overturning the ceramic wafer, moving the ceramic wafer to the tail end of the transmission belt, and collecting the ceramic wafer.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, the ceramic wafer overturning backing plate is arranged inside the transmission belt, the first overturning groove is arranged on the ceramic wafer overturning backing plate, the medium ceramic wafer can be driven to overturn by the first guide inclined surface, the first limiting surface, the vertical surface and the first pressing surface in the first overturning groove after being polished by the first plane polishing mechanism and moved into the first overturning groove, so that the ceramic wafer is erected to polish the side edge of the ceramic wafer, and then moves backwards continuously, the lower end surface of the original ceramic wafer is overturned to the upper side by the second pressing surface, the second guide inclined surface, the second limiting surface and the guide plane, so that the second plane polishing mechanism can polish the other side surface of the ceramic wafer, the step of the first overturning groove is repeated after the ceramic wafer passes through the second overturning groove, the other side edge of the ceramic wafer is polished, the problem that the product damage rate is high when the existing ferrite medium is processed by abrasive flow polishing is avoided, the ceramic wafer overturning of the ceramic wafer is troublesome when a sand grinder is used for polishing, and the problem that the ferrite medium ceramic wafer in large batch is low in processing efficiency occurs.
2. The ceramic wafer conveying grid is arranged on the transmission belt, the ceramic wafer can be clamped in the ceramic wafer conveying grid and moved by the ceramic wafer conveying grid, the highest point of the ceramic wafer is always located in the ceramic wafer conveying grid, so that the ceramic wafer can be continuously driven to move after entering the first turnover groove, dust generated by polishing can be pressed down by water sprayed from a water spraying port when the ceramic wafer is polished and polished, and the ceramic wafer is taken away through a water leakage hole, so that flying dust is prevented from being generated, workshops and equipment are polluted, meanwhile, polishing mechanism positioning tables are arranged below the first plane polishing mechanism, the first side polishing mechanism, the second plane polishing mechanism and the second side polishing mechanism, the four polishing mechanisms can be erected, polishing wheels in the polishing mechanisms are prevented from being pressed down to grind the ceramic wafer thin, and the problem that defective products are generated on the ceramic wafer is solved.
Drawings
FIG. 1 is a schematic overall side view of the present invention;
FIG. 2 is a schematic view of the structure of the conveying mechanism of the present invention;
FIG. 3 is a schematic view of the structure of the ceramic plate turnover backing plate of the present invention;
FIG. 4 is a schematic overall front view of the present invention;
FIG. 5 is a schematic view of a first inversion tank of the present invention;
in the figure: 1. automatically turning over the sanding polisher; 2. a transmission belt; 3. a ceramic wafer conveying grid; 4. the ceramic wafer overturns the backing plate; 5. a first sliding surface; 6. a first turnover groove; 7. a second sliding surface; 8. a second overturning groove; 9. a first guide slope; 10. a first limiting surface; 11. a vertical surface; 12. a first press face; 13. a vertical guide rail; 14. a second press face; 15. a second lead slope; 16. a second limiting surface; 17. a guide plane; 18. a transmission mechanism; 19. a rotating electric machine; 20. a motor fixing seat; 21. a first planar polishing mechanism; 22. a first side polishing mechanism; 23. a second plane polishing mechanism; 24. a second side edge polishing mechanism; 25. polishing the transmission mechanism; 26. a polishing mechanism positioning table; 27. a polishing wheel; 28. a water jet; 29. a sanding frame; 30. a motor table; 31. a water collection tank; 32. a water outlet; 33. a transport mechanism; 34. and a water leakage hole.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1-5, an embodiment of the present invention is shown: a sand mill for processing gyromagnetic ferrite medium ceramics comprises an automatic overturning sand mill polisher 1, wherein a transmission mechanism 33 is arranged in the middle of the automatic overturning sand mill polisher 1;
further comprising:
the transmission belt 2 is arranged in the middle of the transmission mechanism 33, the transmission belt 2 is meshed with a rotating shaft of the transmission mechanism 33, the transmission belt 2 is provided with a plurality of ceramic wafer transmission grids 3, the transmission belt 2 and the ceramic wafer transmission grids 3 are of an integral structure, a plurality of water leakage holes 34 are formed in the transmission belt 2, and the transmission belt 2 and the water leakage holes 34 in the transmission belt 2 are of an integral structure;
the ceramic wafer overturning backing plate 4 is arranged inside the transmission belt 2, the ceramic wafer overturning backing plate 4 is connected with the transmission mechanism 33 in a welding mode, six first overturning grooves 6 are arranged inside the upper portion of the ceramic wafer overturning backing plate 4, the six first overturning grooves 6 and the ceramic wafer overturning backing plate 4 are of an integrated structure, a plurality of water leakage holes 34 are formed inside the ceramic wafer overturning backing plate 4, and the ceramic wafer overturning backing plate 4 and the water leakage holes 34 inside the ceramic wafer overturning backing plate are of an integrated structure;
the first plane polishing mechanism 21 is arranged at the front end above the conveying mechanism 33, a first side polishing mechanism 22 is arranged behind the first plane polishing mechanism 21, a second plane polishing mechanism 23 is arranged behind the first side polishing mechanism 22, a second side polishing mechanism 24 is arranged behind the second plane polishing mechanism 23, the first plane polishing mechanism 21, the first side polishing mechanism 22, the second plane polishing mechanism 23 and the second side polishing mechanism 24 are all connected with the conveying mechanism 33 through screws, and the first overturning groove 6 and the second overturning groove 8 can overturn the ceramic wafer so as to polish and polish two sides of the ceramic wafer.
Referring to fig. 1 and 4, polishing wheels 27 are disposed in the middle of the lower portions of the first plane polishing mechanism 21, the first side polishing mechanism 22, the second plane polishing mechanism 23, and the second side polishing mechanism 24, water spray nozzles 28 are disposed above the polishing wheels 27, the water spray nozzles 28 are connected to water pipes, and water can be sprayed from the water spray nozzles 28 after the equipment is opened, so that dust generated by polishing can be suppressed and taken away, and the dust generated by polishing can be prevented from polluting workshops to damage the equipment.
Referring to fig. 1, 2 and 4, a polishing transmission mechanism 25 is disposed below one side of each of the first plane polishing mechanism 21, the first side polishing mechanism 22, the second plane polishing mechanism 23 and the second side polishing mechanism 24, the four polishing transmission mechanisms 25 are respectively connected to four polishing mechanism chains, a rotating motor 19 is disposed below the other side of each of the four polishing transmission mechanisms 25, the four polishing transmission mechanisms 25 are respectively connected to the rotating motor 19 below the other side, a polishing mechanism positioning table 26 is disposed at each of the front and rear ends of each of the polishing transmission mechanisms 25, the polishing mechanism positioning table 26 is welded to the transmission mechanism 33, and the motor can drive the transmission belt 2 and the polishing wheel 27 to rotate so as to transmit and polish the ceramic wafers.
Referring to fig. 1, 2 and 4, a sanding frame 29 is arranged below the conveying mechanism 33, the sanding frame 29 is connected with the conveying mechanism 33 through screws, a conveying transmission mechanism 18 is arranged at the front end of one side of the conveying mechanism 33, the conveying transmission mechanism 18 is connected with a rotating shaft chain of the conveying mechanism 33, a rotating motor 19 is arranged below the other side of the conveying transmission mechanism 18, the conveying transmission mechanism 18 is connected with a rotating motor 19 shaft below the other side, and the sanding frame 29 can be used for erecting the equipment for the operation of workers.
Referring to fig. 1 and 4, a motor fixing seat 20 is arranged below the rotating motor 19, the rotating motor 19 is connected with the motor fixing seat 20 in an embedded manner, a motor table 30 is arranged below the motor fixing seat 20, the motor fixing seat 20 is connected with the motor table 30 through a screw, the motor table 30 is connected with the sanding rack 29 in a welded manner, the motor table 30 can support the motor, and power loss caused by an excessively long distance between the motor and a transmission device is avoided.
Referring to fig. 4, a water collection tank 31 is disposed below the conveying mechanism 33, the water collection tank 31 is connected to the sanding frame 29 in a welded manner, a water outlet 32 is disposed at the front end of the water collection tank 31, the water outlet 32 and the water collection tank 31 are integrated, the water collection tank 31 can collect water flowing from above, and the water is discharged through the water outlet 32, so that the water is prevented from flowing onto the motor and damaging the equipment.
Referring to fig. 3, a first sliding surface 5 is disposed in front of a first turning groove 6, the first sliding surface 5 and a ceramic sheet turning pad 4 are integrated, a second sliding surface 7 is disposed at the rear end of the first turning groove 6, the second sliding surface 7 and the ceramic sheet turning pad 4 are integrated, six second turning grooves 8 are disposed at the rear end of the second sliding surface 7, the six second turning grooves 8 and the ceramic sheet turning pad 4 are integrated, the ceramic sheet does not turn over when moving on the first sliding surface 5, so that one surface of the ceramic sheet is ground and polished, and the ceramic sheet is erected and turned over through the first turning groove 6, the second sliding surface 7 and the second turning groove 8, so that other surfaces are ground and polished.
Referring to fig. 3 and 5, a first inclined guide surface 9 is integrally formed at the front end of the interior of each of the first and second turning grooves 6 and 8, a vertical surface 11 is formed at the rear end of the first inclined guide surface 9, a first limiting surface 10 is formed at one side of the first inclined guide surface 9, a first pressing surface 12 is formed at the rear end of the first limiting surface 10, a vertical guide rail 13 is formed at the rear end between the vertical surface 11 and the first pressing surface 12, a second pressing surface 14 is formed at the other side of the rear end of the vertical guide rail 13, a second inclined guide surface 15 is formed at one side of the second pressing surface 14, a second limiting surface 16 is formed at the rear end of the second pressing surface 14, a guide plane 17 is formed at the rear end of the second inclined guide surface 15, the ceramic sheet passes through the first inclined guide surface 9, one side of the ceramic sheet is guided downward by the concave surface of the first inclined guide surface 9, the other side of the ceramic sheet is pushed upward by the vertical surface 11 when the ceramic sheet moves forward, the ceramic sheet stands, and then the ceramic sheet is placed down through the second inclined guide surface 14 and then turned over to polish the ceramic sheet.
Further, a polishing method of a sand mill for processing gyromagnetic ferrite medium ceramics comprises the following steps:
the method comprises the following steps: putting the dielectric ceramic wafer into the ceramic wafer conveying grid 3, starting the rotating motor 19 to drive the transmission belt 2 and the polishing wheel 27 to rotate, and simultaneously spraying water from the water spraying port 28;
step two: the ceramic wafer passes below the first plane polishing mechanism 21, the polishing wheel 27 rotates to polish and polish the first surface of the ceramic wafer, and the water sprayed from the water spray opening 28 takes away the dust generated by polishing, flows into the water collection tank 31 below through the water leakage hole 34 and is discharged through the water outlet 32;
step three: the driving belt 2 rotates to drive the ceramic wafer in the ceramic wafer conveying grid 3 to move backwards and enter the first overturning groove 6, one side of the ceramic wafer is downwards sunk into the first guide inclined plane 9, the other side of the ceramic wafer is continuously driven by the ceramic wafer conveying grid 3 to move backwards, the ceramic wafer gradually enters the lower part of the first pressing surface 12, the other side of the ceramic wafer is lifted by the vertical surface 11, the ceramic wafer gradually rises and enters the vertical guide rail 13, the ceramic wafer is driven to pass through the lower part of the first side polishing mechanism 22, corners are polished and polished by the polishing wheels 27, water sprayed from the water spraying ports 28 takes away dust generated by polishing, the dust flows into the water collecting tank 31 below through the water leakage holes 34 and is discharged through the water outlet 32;
step four: the ceramic wafer continues to move backwards, the upper part of the ceramic wafer is pressed to one side by the second pressing surface 14, the other side of the ceramic wafer rotates to the second limiting surface 16, after the ceramic wafer is separated from the first turnover groove 6, the second surface of the ceramic wafer is turned over to the upper part, the second surface of the ceramic wafer passes through the lower part of the second plane polishing mechanism 23, the polishing wheel 27 polishes and polishes the second surface of the ceramic wafer, and the water sprayed from the water spray opening 28 takes away the dust generated by polishing, flows into the water collecting tank 31 at the lower part through the water leakage hole 34 and is discharged through the water outlet 32;
step five: and (5) continuing moving the ceramic wafer backwards, moving the ceramic wafer to a second overturning groove 8, repeating the step three, finishing polishing the other side of the ceramic wafer, repeating the step four, overturning the ceramic wafer, moving the ceramic wafer to the tail end of the transmission belt 2, and collecting the ceramic wafer.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (9)
1. A sand mill for processing gyromagnetic ferrite medium ceramics comprises an automatic overturning sanding polisher (1), wherein a transmission mechanism (33) is arranged in the middle of the automatic overturning sanding polisher (1);
the method is characterized in that: further comprising:
the transmission belt (2) is arranged in the middle of the transmission mechanism (33), the transmission belt (2) is meshed with a rotating shaft of the transmission mechanism (33), the transmission belt (2) is provided with a plurality of ceramic wafer transmission grids (3), the transmission belt (2) and the ceramic wafer transmission grids (3) are of an integrated structure, a plurality of water leakage holes (34) are formed in the transmission belt (2), and the transmission belt (2) and the water leakage holes (34) in the transmission belt (2) are of an integrated structure;
the ceramic wafer overturning device comprises a ceramic wafer overturning base plate (4) which is arranged inside a transmission belt (2), wherein the ceramic wafer overturning base plate (4) is welded with a transmission mechanism (33), six first overturning grooves (6) are formed inside the upper portion of the ceramic wafer overturning base plate (4), the six first overturning grooves (6) and the ceramic wafer overturning base plate (4) are of an integrated structure, a plurality of water leakage holes (34) are formed inside the ceramic wafer overturning base plate (4), and the ceramic wafer overturning base plate (4) and the water leakage holes (34) inside the ceramic wafer overturning base plate are of an integrated structure;
the polishing device comprises a first plane polishing mechanism (21) arranged at the front end above a conveying mechanism (33), a first side polishing mechanism (22) is arranged behind the first plane polishing mechanism (21), a second plane polishing mechanism (23) is arranged behind the first side polishing mechanism (22), a second side polishing mechanism (24) is arranged behind the second plane polishing mechanism (23), and the first plane polishing mechanism (21), the first side polishing mechanism (22), the second plane polishing mechanism (23) and the second side polishing mechanism (24) are all connected with the conveying mechanism (33) through screws.
2. The gyromagnetic ferrite medium ceramic processing sand mill as claimed in claim 1, wherein: polishing wheels (27) are arranged in the middle of the lower portions of the first plane polishing mechanism (21), the first side polishing mechanism (22), the second plane polishing mechanism (23) and the second side polishing mechanism (24), and water spray nozzles (28) are arranged above the polishing wheels (27).
3. The gyromagnetic ferrite medium ceramic processing sand mill as claimed in claim 1, wherein: the polishing machine is characterized in that a polishing transmission mechanism (25) is arranged below one side of each of the first plane polishing mechanism (21), the first side polishing mechanism (22), the second plane polishing mechanism (23) and the second side polishing mechanism (24), four polishing transmission mechanisms (25) are connected with four polishing mechanism chains respectively, four rotating motors (19) are arranged below the other side of each polishing transmission mechanism (25), the four polishing transmission mechanisms (25) are connected with the rotating motors (19) below the other side in an axial mode, polishing mechanism positioning tables (26) are arranged at the front end and the rear end of each polishing transmission mechanism (25), and the polishing mechanism positioning tables (26) are connected with the conveying mechanisms (33) in a welding mode.
4. The gyromagnetic ferrite medium ceramic processing sand mill as claimed in claim 1, wherein: the below of transport mechanism (33) is provided with sanding frame (29), and sanding frame (29) is connected with transport mechanism (33) through the screw, one side front end of transport mechanism (33) is provided with conveying drive mechanism (18), and conveying drive mechanism (18) is connected with the pivot chain of transport mechanism (33), and the opposite side below of conveying drive mechanism (18) is provided with rotating electrical machines (19), and conveying drive mechanism (18) is connected with rotating electrical machines (19) axle of opposite side below.
5. The gyromagnetic ferrite medium ceramic processing sand mill as claimed in claim 3, wherein: the below of rotating electrical machines (19) is provided with motor fixing base (20), and rotating electrical machines (19) and motor fixing base (20) embedded connection, the below of motor fixing base (20) is provided with motor platform (30), and motor fixing base (20) is connected with motor platform (30) through the screw, and motor platform (30) and sanding frame (29) welded connection.
6. The gyromagnetic ferrite medium ceramic processing sand mill as claimed in claim 1, wherein: the below of transport mechanism (33) is provided with header tank (31), and header tank (31) and sanding frame (29) welded connection, the front end of header tank (31) is provided with delivery port (32), and delivery port (32) and header tank (31) structure as an organic whole.
7. The gyromagnetic ferrite dielectric ceramic processing sand mill as claimed in claim 1, wherein: the place ahead of first returning face groove (6) is provided with first glide plane (5), and first glide plane (5) and potsherd upset backing plate (4) structure as an organic whole, the rear end of first returning face groove (6) is provided with second glide plane (7), and second glide plane (7) and potsherd upset backing plate (4) structure as an organic whole, the rear end of second glide plane (7) is provided with six second returning face grooves (8), and six second returning face grooves (8) and potsherd upset backing plate (4) structure as an organic whole.
8. The gyromagnetic ferrite medium ceramic processing sand mill as claimed in claim 1, wherein: the inner front end of the first overturning groove (6) and the inner front end of the second overturning groove (8) are integrally provided with a first guide inclined surface (9), the rear end of the first guide inclined surface (9) is provided with an upright surface (11), one side of the first guide inclined surface (9) is provided with a first limiting surface (10), the rear end of the first limiting surface (10) is provided with a first pressing surface (12), the rear end between the upright surface (11) and the first pressing surface (12) is provided with an upright guide rail (13), the other side of the rear end of the upright guide rail (13) is provided with a second pressing surface (14), one side of the second pressing surface (14) is provided with a second guide inclined surface (15), the rear end of the second pressing surface (14) is provided with a second limiting surface (16), and the rear end of the second guide inclined surface (15) is provided with a guide plane (17).
9. A polishing method of a gyromagnetic ferrite medium ceramic processing sand mill is realized based on any one of claims 1 to 8, and is characterized by comprising the following steps:
the method comprises the following steps: putting the dielectric ceramic wafer into the ceramic wafer conveying grid (3), starting the rotating motor (19) to drive the transmission belt (2) and the polishing wheel (27) to rotate, and simultaneously spraying water from the water spraying port (28);
step two: the ceramic wafer passes through the lower part of the first plane polishing mechanism (21), a polishing wheel (27) rotates to polish the first surface of the ceramic wafer, and water sprayed from a water spray nozzle (28) takes away dust generated by polishing, flows into a water collecting tank (31) at the lower part through a water leakage hole (34), and is discharged through a water outlet (32);
step three: the transmission belt (2) rotates to drive the ceramic wafer in the ceramic wafer conveying grid (3) to move backwards and enter the first overturning groove (6), one side of the ceramic wafer is downwards sunk into the first guide inclined plane (9), the other side of the ceramic wafer is continuously driven by the ceramic wafer conveying grid (3) to move backwards, the ceramic wafer gradually enters the lower part of the first pressing surface (12), the other side of the ceramic wafer is lifted by the vertical surface (11) to gradually stand up and enter the vertical guide rail (13), the ceramic wafer is driven to pass through the lower part of the first side polishing mechanism (22), corners are polished and polished by the polishing wheel (27), water sprayed from the water spraying port (28) takes away dust generated by polishing, the dust flows into a water collecting tank (31) below through the water leakage hole (34) and is discharged through the water outlet (32);
step four: the ceramic wafer continues to move backwards, the upper part of the ceramic wafer is pressed to one side by a second pressing surface (14), the other side of the ceramic wafer rotates to a second limiting surface (16), after the ceramic wafer is separated from a first overturning groove (6), the second surface of the ceramic wafer is overturned to the upper part, the second surface of the ceramic wafer passes through the lower part of a second plane polishing mechanism (23), a polishing wheel (27) polishes and polishes the second surface of the ceramic wafer, water sprayed from a water spraying port (28) takes away dust generated by polishing, the dust flows into a water collecting tank (31) below through a water leakage hole (34), and the dust is discharged through a water outlet (32);
step five: and (3) continuing moving the ceramic wafer backwards, moving the ceramic wafer to a second overturning groove (8), repeating the step three, finishing polishing the other side of the ceramic wafer, repeating the step four, overturning the ceramic wafer, moving the ceramic wafer to the end of the transmission belt (2), and collecting the ceramic wafer.
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| CN115213791B (en) | 2024-02-02 |
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