CN115181502B - 烧结系统和烧结制品 - Google Patents
烧结系统和烧结制品 Download PDFInfo
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- CN115181502B CN115181502B CN202210556346.4A CN202210556346A CN115181502B CN 115181502 B CN115181502 B CN 115181502B CN 202210556346 A CN202210556346 A CN 202210556346A CN 115181502 B CN115181502 B CN 115181502B
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- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
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- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
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