CN115181379A - Processing technology of fluororubber sealing ring - Google Patents
Processing technology of fluororubber sealing ring Download PDFInfo
- Publication number
- CN115181379A CN115181379A CN202210858785.0A CN202210858785A CN115181379A CN 115181379 A CN115181379 A CN 115181379A CN 202210858785 A CN202210858785 A CN 202210858785A CN 115181379 A CN115181379 A CN 115181379A
- Authority
- CN
- China
- Prior art keywords
- seal ring
- fluororubber
- parts
- vulcanization
- sealing ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 title claims abstract description 45
- 229920001973 fluoroelastomer Polymers 0.000 title claims abstract description 32
- 238000005516 engineering process Methods 0.000 title claims abstract description 18
- 238000004073 vulcanization Methods 0.000 claims abstract description 59
- 229920001971 elastomer Polymers 0.000 claims abstract description 36
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 24
- 239000011737 fluorine Substances 0.000 claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 claims abstract description 15
- 239000002245 particle Substances 0.000 claims abstract description 15
- 150000001875 compounds Chemical class 0.000 claims abstract description 14
- 239000000806 elastomer Substances 0.000 claims abstract description 13
- 239000000843 powder Substances 0.000 claims abstract description 12
- -1 polytetrafluoroethylene Polymers 0.000 claims abstract description 10
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims abstract description 10
- 239000004810 polytetrafluoroethylene Substances 0.000 claims abstract description 10
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 14
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical group FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 claims description 7
- HCDGVLDPFQMKDK-UHFFFAOYSA-N hexafluoropropylene Chemical group FC(F)=C(F)C(F)(F)F HCDGVLDPFQMKDK-UHFFFAOYSA-N 0.000 claims description 7
- 229910052757 nitrogen Inorganic materials 0.000 claims description 7
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- 238000007689 inspection Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 abstract description 12
- 238000001556 precipitation Methods 0.000 abstract description 5
- 238000002360 preparation method Methods 0.000 abstract 1
- 239000000047 product Substances 0.000 description 11
- 210000002381 plasma Anatomy 0.000 description 9
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 8
- 238000001312 dry etching Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 239000007789 gas Substances 0.000 description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- 229920006169 Perfluoroelastomer Polymers 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 230000000670 limiting effect Effects 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- QKCGXXHCELUCKW-UHFFFAOYSA-N n-[4-[4-(dinaphthalen-2-ylamino)phenyl]phenyl]-n-naphthalen-2-ylnaphthalen-2-amine Chemical compound C1=CC=CC2=CC(N(C=3C=CC(=CC=3)C=3C=CC(=CC=3)N(C=3C=C4C=CC=CC4=CC=3)C=3C=C4C=CC=CC4=CC=3)C3=CC4=CC=CC=C4C=C3)=CC=C21 QKCGXXHCELUCKW-UHFFFAOYSA-N 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- UJMWVICAENGCRF-UHFFFAOYSA-N oxygen difluoride Chemical compound FOF UJMWVICAENGCRF-UHFFFAOYSA-N 0.000 description 2
- 238000004321 preservation Methods 0.000 description 2
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 230000037237 body shape Effects 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000003345 natural gas Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
- C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention relates to the technical field of sealing element processing technologies, in particular to a processing technology of a fluororubber sealing ring. The preparation method comprises the following steps of preparing 100 parts of ternary fluorine-containing copolymerized elastomer, 25 parts of polytetrafluoroethylene, 2 parts of bis-penta vulcanizing agent and 4 parts of triallyl isocyanurate into rubber compound; standing the prepared rubber compound for more than 8 hours; placing the placed rubber compound into a preforming mold to prepare an unvulcanized seal ring blank; putting the seal ring blank into a vulcanizing machine for primary vulcanization, and then putting the seal ring blank into a high-temperature oven for secondary vulcanization to prepare a finished seal ring; wherein, the particle size of the polytetrafluoroethylene powder added at the beginning is 3um-20um. Aiming at the technical problems of high cost and poor performance of the traditional sealing ring, the invention can greatly reduce the sealing cost of semiconductor manufacturing equipment and can effectively reduce the particle precipitation of a sealed product in a plasma environment.
Description
Technical Field
The invention relates to the technical field of sealing element processing technologies, in particular to a processing technology of a fluororubber sealing ring.
Background
The sealing rings are used in a large amount in the dry etching environment of semiconductor manufacturing equipment, most of the sealing rings used at present are made of full fluorine ether rubber (FFKM), the full fluorine ether rubber is expensive, the price of the full fluorine ether rubber is generally dozens of times or even one hundred times of that of the fluorine rubber, and the use cost is high. In a dry etching environment, due to the existence of various plasma gases, such as oxygen, nitrogen trifluoride, chlorine, nitrogen, carbon tetrafluoride, and the like, a traditional sealing ring is easy to age under the irradiation of the plasma gases, so that a product generates particle powder, semiconductor manufacturing equipment is polluted, and finally the yield of semiconductors is reduced.
Disclosure of Invention
Technical problem to be solved by the invention
The invention provides a processing technology of a fluororubber sealing ring, aiming at solving the technical problems of high cost and poor performance of the traditional sealing ring, and aims to manufacture the fluororubber sealing ring, which can greatly reduce the sealing cost of semiconductor manufacturing equipment and can effectively reduce the particle precipitation of a sealed product in a plasma environment.
Technical scheme
In order to solve the problems, the technical scheme provided by the invention is as follows:
a processing technology of a fluororubber sealing ring is characterized in that 100 parts of ternary fluorine-containing copolymerized elastomer, 25 parts of polytetrafluoroethylene, 2 parts of dipenta-penta-vulcanizing agent and 4 parts of triallyl isocyanurate are jointly prepared into rubber compound; standing the prepared rubber compound for more than 8 hours; placing the placed rubber compound into a preforming mold to prepare an unvulcanized seal ring blank; putting the seal ring blank into a vulcanizing machine for primary vulcanization, and then putting the seal ring blank into a high-temperature oven for secondary vulcanization to prepare a finished seal ring; wherein, the particle size of the polytetrafluoroethylene powder added at the beginning is 3um-20um.
Optionally, the ternary fluorine-containing copolymer elastomer is vinylidene fluoride or tetrafluoroethylene or hexafluoropropylene.
Optionally, the primary vulcanization temperature is 165-180 ℃, and the vulcanization time is 6-25 min.
Optionally, the secondary vulcanization comprises keeping the temperature in a nitrogen-filled oven at 180-230 ℃ for 2-6 h.
Optionally, before the unvulcanized seal ring blank is prepared, the preforming mold is placed in a vulcanizing machine for preheating, and the preheating temperature is 70 ℃.
Optionally, the primary vulcanization comprises a primary vulcanization mold, and the primary vulcanization mold is matched with the seal ring blank.
Optionally, the primary vulcanization mold is placed in a vulcanizing machine for preheating before primary vulcanization, and the preheating temperature is 175 ℃.
Optionally, the cured seal ring is trimmed.
Optionally, the vulcanized seal ring is subjected to an inspection of appearance dimensions.
Advantageous effects
Compared with the prior art, the technical scheme provided by the invention has the following beneficial effects:
aiming at the technical problems of high cost and poor performance of the traditional sealing ring, the invention can greatly reduce the sealing cost of semiconductor manufacturing equipment and can effectively reduce the particle precipitation of a sealed product in a plasma environment.
Detailed Description
For a further understanding of the present invention, reference will now be made to the following examples.
The present application will be described in further detail with reference to examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. The terms first, second, and the like in the present invention are provided for convenience of describing the technical solution of the present invention, and have no specific limiting effect, but are all generic terms, and do not limit the technical solution of the present invention. It should be noted that, in the present application, the embodiments and features of the embodiments may be combined with each other without conflict. In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art. The technical solutions in the same embodiment and the technical solutions in different embodiments can be arranged and combined to form a new technical solution without contradiction or conflict, and the technical solutions are within the scope of the present invention.
The embodiment provides a processing technology of a fluororubber sealing ring, which comprises the steps of preparing 100 parts of ternary fluorine-containing copolymerized elastomer, 25 parts of polytetrafluoroethylene, 2 parts of bis-penta vulcanizing agent and 4 parts of triallyl isocyanurate into rubber compound; standing the prepared rubber compound for more than 8 hours; placing the placed rubber compound into a preforming mold to prepare an unvulcanized seal ring blank; putting the seal ring blank into a vulcanizing machine for primary vulcanization, and then putting the seal ring blank into a high-temperature oven for secondary vulcanization to prepare a finished seal ring; wherein, the particle size of the polytetrafluoroethylene powder added at the beginning is 3um-20um.
The processing technology of the fluororubber sealing ring of the embodiment aims to manufacture the fluororubber sealing ring to replace a full fluorine ether rubber (FFKM) sealing ring used in a dry etching environment of the existing semiconductor manufacturing equipment. Because the price of the perfluoro-ether rubber is high, the price of the perfluoro-ether rubber is generally dozens of times or even one hundred times of that of the fluororubber; therefore, the fluororubber sealing ring manufactured by the fluororubber sealing ring processing technology of the embodiment can greatly reduce the sealing cost of semiconductor manufacturing equipment.
Meanwhile, in a dry etching environment, various plasma gases, such as oxygen, nitrogen trifluoride, chlorine, nitrogen, carbon tetrafluoride, and the like, are contained, and under the irradiation of the plasmas, the traditional sealing ring is easy to age, so that particle powder is generated, and further, the semiconductor manufacturing equipment is polluted, and the semiconductor yield is reduced. The fluororubber sealing ring manufactured by the fluororubber sealing ring processing technology of the embodiment can effectively reduce the particle precipitation of the sealed product in the plasma environment.
The ternary fluorine-containing copolymer elastomer in the present embodiment is a main material, and a ternary fluorine-containing copolymer elastomer using vinylidene fluoride, tetrafluoroethylene, hexafluoropropylene or the like having a high fluorine content can be generally used.
In this example, the particle size of the polytetrafluoroethylene powder added at the beginning was 3 μm to 20 μm for the purposes of: when the particle size of the powder is less than 3 mu m, an aggregation effect is generated, so that the Mooney viscosity of the rubber compound is increased linearly, and the rubber compound cannot be further processed; and when the particle size of the powder is more than 20 mu m, the filling effect of the powder particles in the raw rubber is not ideal, and the produced product has low mechanical property and strength and does not meet the market demand.
In the processing technology of the fluororubber sealing ring in the embodiment, two-side vulcanization processing is performed together to further improve the crosslinking strength of the fluororubber and further volatilize small molecular substances in the product, and the secondary vulcanization is also beneficial to improving the sealing effect of the product because the fluororubber sealing ring is used for sealing a corresponding structure in semiconductor manufacturing equipment. Wherein, the primary vulcanization is shaping vulcanization, which aims to form the shape of the fluororubber sealing ring, namely the main body shape of the O-shaped ring; since fluororubbers are difficult to vulcanize, require high vulcanization temperature and long vulcanization time, the present example adopts a secondary vulcanization method: the primary vulcanization is carried out on a vulcanizing machine with a lower temperature, and the secondary vulcanization is carried out in a high-temperature oven.
As an optional embodiment of this embodiment, the ternary fluorine-containing copolymer elastomer is vinylidene fluoride, tetrafluoroethylene or hexafluoropropylene. The usage scenario based on the fluororubber sealing ring is in semiconductor processing equipment, and in order to meet the requirements of specific mechanical properties such as sealing performance, deformation performance and the like, the ternary fluorine-containing copolymerized elastomer can be selected from the ternary fluorine-containing copolymerized elastomers of vinylidene fluoride with high fluorine content or tetrafluoroethylene or hexafluoropropylene.
As an optional implementation mode of the embodiment, the primary vulcanization temperature is 165-180 ℃, and the vulcanization time is 6-25 min. Conceivable, possible embodiments are included: the primary vulcanization temperature can be 165 ℃ and the vulcanization time is 25min; or the primary vulcanization temperature can be 170 ℃, and the vulcanization time is 20min; alternatively, the primary vulcanization temperature can be 180 ℃, the vulcanization time is 6min and the like. Considering the factors of processing effect, processing cost and the like comprehensively, a preferred embodiment is that the primary vulcanization temperature is 175 ℃, and the vulcanization time is 10min, so that the fluororubber sealing ring can be shaped and is suitable for economical production.
As an optional implementation mode of the embodiment, the secondary vulcanization comprises constant temperature for 2-6 h in a nitrogen-filled oven with the temperature of 180-230 ℃. Because the fluororubber is difficult to vulcanize, the required vulcanization temperature is high, and the vulcanization time is long, secondary vulcanization is designed. Conceivable, the following possible embodiments are included: the temperature of the secondary vulcanization can be set at 180 ℃, and the corresponding heat preservation time can be selected to be 6 hours; or the temperature of the secondary vulcanization can be set at 130 ℃, the corresponding heat preservation time can be selected from 2 hours, and the like, so that the sealing ring can meet the performance requirement. One preferable embodiment is that the sealing ring which is shaped after primary vulcanization is further vulcanized in a nitrogen-filled oven at the temperature of 200 ℃ for 4 hours, so that the product performance meets the requirement.
As an optional implementation manner of this embodiment, before the unvulcanized seal ring blank is prepared, the pre-forming mold is placed in a vulcanizing machine for preheating, and the preheating temperature is 70 ℃.
As an optional implementation manner of this embodiment, the primary vulcanization includes a primary vulcanization mold, and the primary vulcanization mold is matched with the seal ring blank.
As an optional implementation manner of this embodiment, before the primary vulcanization, the primary vulcanization mold is placed in a vulcanizing machine for preheating, and the preheating temperature is 175 ℃.
As an optional implementation manner of this embodiment, the vulcanized sealing ring is trimmed.
As an optional implementation manner of this embodiment, the vulcanized seal ring is subjected to the inspection of the appearance size.
The sealing ring manufactured by the processing technology of the fluororubber sealing ring in the embodiment has less particle precipitation in a plasma environment and better performance. The following are example 1 and comparative example 1:
example 1
100 parts of vinylidene fluoride/tetrafluoroethylene/hexafluoropropylene ternary fluorine-containing copolymerized elastomer ("FLS 2650", manufactured by 3M company, fluorine content 70.3%), 25 parts of polytetrafluoroethylene, 2 parts of organic peroxide ("bis-penta"), and 4 parts of triallyl isocyanurate (75% TAIC) were uniformly mixed by an open mill, and then subjected to primary vulcanization at 175 ℃ for 10 minutes to prepare 0-Ring product #214 (CS: 3.53mm, ID: 24.99mm), and then subjected to secondary vulcanization at 200 ℃ in a nitrogen oven at constant temperature for 4 hours to obtain the final fluorine rubber seal Ring product.
Comparative example 1
100 parts by mass of a vinylidene fluoride/tetrafluoroethylene/hexafluoropropylene terpolymer elastomer having a high fluorine content ("FLS 2650" manufactured by 3M and a fluorine content of 70.3% by mass), 25 parts by mass of natural gas thermal carbon black (MT N990 manufactured by cancarb), 2 parts by mass of an organic peroxide ("Bierpenta" manufactured by arkema), and 4 parts by mass of triallyl isocyanurate (75% TAIC and manufactured by arkema) were uniformly mixed by an open mill, and then subjected to primary vulcanization at 175 ℃ for 10min to prepare a 0-Ring product #214 (CS: 3.53mm, ID 24.99mm), and subjected to secondary vulcanization at a constant temperature of 4 hours in a nitrogen-purged oven of 200 ℃ to obtain a final product.
The powder deposition was observed by exposing example 1 and comparative example 1 to plasma irradiation in a dry etching environment. The corresponding comparison results are shown in the following table:
| fluorine content (% by weight) | Whether powder is separated out or not | Compression set (%) | |
| Example 1 | 70.30% | Whether or not | 35% |
| Comparative example 1 | 70.30% | Is that | 27% |
The present invention and the embodiments thereof have been described above schematically, and the description is not limited to the embodiments, but is only one of the embodiments of the present invention, and the actual structure is not limited thereto. Therefore, without departing from the spirit of the present invention, a person of ordinary skill in the art should understand that the present invention shall not be limited to the embodiments and the similar structural modes without creative design.
Claims (9)
1. A processing technology of a fluororubber sealing ring is characterized in that 100 parts of ternary fluorine-containing copolymerized elastomer, 25 parts of polytetrafluoroethylene, 2 parts of bis-penta vulcanizing agent and 4 parts of triallyl isocyanurate are jointly prepared into rubber compound; standing the prepared rubber compound for more than 8 hours; placing the placed rubber compound into a pre-forming die to prepare an unvulcanized seal ring blank; putting the seal ring blank into a vulcanizing machine for primary vulcanization, and then putting the seal ring blank into a high-temperature oven for secondary vulcanization to prepare a finished seal ring;
wherein, the particle size of the polytetrafluoroethylene powder added at the beginning is 3um-20um.
2. The processing technology of the fluororubber sealing ring according to claim 1, wherein the ternary fluorine-containing copolymerized elastomer is vinylidene fluoride, tetrafluoroethylene or hexafluoropropylene.
3. The processing technology for the fluororubber sealing ring according to claim 1, wherein the primary vulcanization temperature is 165-180 ℃ and the vulcanization time is 6-25 min.
4. The processing technology of the fluororubber sealing ring according to claim 1, wherein the secondary vulcanization comprises keeping the temperature in a nitrogen oven at 180-230 ℃ for 2-6 h.
5. The process for manufacturing a fluororubber seal ring according to claim 1, wherein the pre-forming mold is placed in a vulcanizing machine for preheating at a temperature of 70 ℃ before the unvulcanized seal ring blank is obtained.
6. The process of claim 1, wherein the primary vulcanization comprises a primary vulcanization mold, and the primary vulcanization mold is matched with the seal ring blank.
7. The process for manufacturing a fluororubber seal ring according to claim 6, wherein the primary vulcanization mold is placed in a vulcanizer and preheated to 175 ℃ before primary vulcanization.
8. The process for manufacturing a fluororubber seal ring according to claim 1, wherein the vulcanized seal ring is trimmed.
9. The process for producing a fluororubber gasket according to any one of claims 1 to 8, wherein the vulcanized gasket is subjected to dimensional inspection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210858785.0A CN115181379A (en) | 2022-07-20 | 2022-07-20 | Processing technology of fluororubber sealing ring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210858785.0A CN115181379A (en) | 2022-07-20 | 2022-07-20 | Processing technology of fluororubber sealing ring |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115181379A true CN115181379A (en) | 2022-10-14 |
Family
ID=83519873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210858785.0A Pending CN115181379A (en) | 2022-07-20 | 2022-07-20 | Processing technology of fluororubber sealing ring |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115181379A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10238633A (en) * | 1997-02-25 | 1998-09-08 | Morisei Kako:Kk | Sealing material |
| CN1703480A (en) * | 2002-10-11 | 2005-11-30 | 旭硝子株式会社 | Sealing material for semiconductor device and method for production thereof |
| JP2012102272A (en) * | 2010-11-11 | 2012-05-31 | Mitsubishi Cable Ind Ltd | Rubber composition, and rubber member, conveyance roller and sealing member using the rubber composition |
| CN114181480A (en) * | 2021-12-15 | 2022-03-15 | 上海如实密封科技有限公司 | Fluororubber composition and preparation method and application thereof |
| CN114479319A (en) * | 2020-10-28 | 2022-05-13 | 中昊晨光化工研究院有限公司 | Fluororubber compound and preparation method and application thereof |
-
2022
- 2022-07-20 CN CN202210858785.0A patent/CN115181379A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10238633A (en) * | 1997-02-25 | 1998-09-08 | Morisei Kako:Kk | Sealing material |
| CN1703480A (en) * | 2002-10-11 | 2005-11-30 | 旭硝子株式会社 | Sealing material for semiconductor device and method for production thereof |
| JP2012102272A (en) * | 2010-11-11 | 2012-05-31 | Mitsubishi Cable Ind Ltd | Rubber composition, and rubber member, conveyance roller and sealing member using the rubber composition |
| CN114479319A (en) * | 2020-10-28 | 2022-05-13 | 中昊晨光化工研究院有限公司 | Fluororubber compound and preparation method and application thereof |
| CN114181480A (en) * | 2021-12-15 | 2022-03-15 | 上海如实密封科技有限公司 | Fluororubber composition and preparation method and application thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105849180B (en) | Fluoro-rubber composite and crosslinking rubber-moulding body and its manufacturing method | |
| CN106883473B (en) | A kind of transformer rubber gasket and preparation method thereof | |
| EP2824144A2 (en) | Fluorine rubber composition capable of forming crack-resistant sealing material and crack-resistant sealing material obtained from the composition | |
| CN109401334B (en) | Fluorosilicone rubber sealing ring material for oil-immersed transformer and preparation method thereof | |
| CN115181379A (en) | Processing technology of fluororubber sealing ring | |
| WO2014167797A1 (en) | Method for producing crosslinked fluoroelastomer | |
| CN103305008A (en) | Non-sticky tempered glass silicone rubber and preparation method thereof | |
| CN115141442A (en) | Fluororubber composition, rubber product and preparation method thereof | |
| TWI735769B (en) | Laminated body, its manufacturing method, and gate seal | |
| CN112812474B (en) | Anti-deformation fluororubber and preparation method and application thereof | |
| CN104844918A (en) | Low-pressure variation ethylene acrylate rubber material resistant to ultra-low temperature and high-temperature oil, and preparation method thereof | |
| CN105670146B (en) | A kind of transmission belt high-performance curing bag | |
| US20230272136A1 (en) | Copolymer, injection molded body, member to be compressed, and coated wire | |
| CN105860381A (en) | Low-compression-deformation tetrafluoroethylene-propylene rubber sealing part and preparation method thereof | |
| CN112898705A (en) | Inner layer peroxide fluorine rubber material of rubber tube at high-temperature section of silicon-fluorine composite turbocharging system | |
| CN114437478A (en) | Low-temperature-resistant fluororubber/silicone rubber composite material and preparation method thereof | |
| CN114181484A (en) | Perfluoroether rubber composition and preparation method and application thereof | |
| CN112048184A (en) | Low-temperature-resistant mixing silicone rubber | |
| CN114230950B (en) | Semiconductor equipment sealing element and preparation method thereof | |
| CN105885383A (en) | High-elasticity rubber component for vehicle | |
| CN110551329A (en) | Rubber blank and preparation method thereof | |
| CN117844147A (en) | Formula, manufacturing process and detection method of high-temperature-resistant plasma rubber sealing ring | |
| CN115071138B (en) | Large-size fluororubber sealing ring and preparation method thereof | |
| JP7522418B1 (en) | Sealant forming material, sealant, and method for producing sealant | |
| CN109244575B (en) | Sucking disc for formation and vacuum pumping of square molded case lithium battery and processing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20221014 |
|
| RJ01 | Rejection of invention patent application after publication |