CN115172225A - Wafer cleaning system - Google Patents
Wafer cleaning system Download PDFInfo
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- CN115172225A CN115172225A CN202210939459.2A CN202210939459A CN115172225A CN 115172225 A CN115172225 A CN 115172225A CN 202210939459 A CN202210939459 A CN 202210939459A CN 115172225 A CN115172225 A CN 115172225A
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- 238000004140 cleaning Methods 0.000 title claims abstract description 128
- 235000012431 wafers Nutrition 0.000 claims abstract description 74
- 239000003814 drug Substances 0.000 claims abstract description 44
- 239000000725 suspension Substances 0.000 claims abstract description 44
- 239000007788 liquid Substances 0.000 claims abstract description 42
- 238000001035 drying Methods 0.000 claims abstract description 30
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000011248 coating agent Substances 0.000 claims abstract description 11
- 238000000576 coating method Methods 0.000 claims abstract description 11
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 16
- 239000000126 substance Substances 0.000 claims description 16
- 239000000428 dust Substances 0.000 claims description 12
- 238000005524 ceramic coating Methods 0.000 claims description 3
- 239000000835 fiber Substances 0.000 claims description 3
- 238000005339 levitation Methods 0.000 claims description 3
- 239000011241 protective layer Substances 0.000 claims description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 12
- 239000000243 solution Substances 0.000 description 14
- 239000007789 gas Substances 0.000 description 11
- 229940079593 drug Drugs 0.000 description 9
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 238000012544 monitoring process Methods 0.000 description 4
- 239000002912 waste gas Substances 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005536 corrosion prevention Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention relates to a wafer cleaning system, which comprises a cleaning rack, a feeding table, a mechanical arm and an air suspension moving device, wherein a plurality of grooves are sequentially arranged on the cleaning rack, the inner wall of each groove is coated with an yttrium oxide coating, and at least one groove is used as a liquid medicine groove, one groove is used as a water groove and one groove is used as a drying groove; a feeding box is arranged on the feeding table; the mechanical arm is detachably connected with a mechanical arm, and the mechanical arm is used for grabbing the wafers in the feeding box and placing the wafers in corresponding grooves; the mechanical arm is connected with the air suspension moving device, and the air suspension moving device is used for driving the mechanical arm to move to the corresponding groove. The invention can effectively improve the cleaning efficiency and cleaning effect of the wafer.
Description
Technical Field
The invention relates to the technical field of wafer cleaning, in particular to a wafer cleaning system.
Background
In the manufacturing process of a semiconductor integrated circuit, a wafer needs to be cleaned to remove impurities remained on the surface of the wafer, a wet cleaning process is generally adopted, when the wet cleaning is carried out, the wafer needs to be placed in a cleaning tank, liquid medicine is injected into the cleaning tank, and the wafer is cleaned by the liquid medicine.
Therefore, the existing wet cleaning process has poor cleaning efficiency and cleaning effect and cannot meet the use requirement.
Disclosure of Invention
Therefore, the technical problem to be solved by the invention is to overcome the defects of poor cleaning efficiency and poor cleaning effect of the wet cleaning process in the prior art.
In order to solve the above technical problem, the present invention provides a wafer cleaning system, including:
the cleaning machine comprises a cleaning rack, wherein a plurality of grooves are sequentially arranged on the cleaning rack, an yttrium oxide coating is coated on the inner wall of each groove, and at least one groove is used as a liquid medicine groove, one groove is used as a water groove, and the other groove is used as a drying groove;
the wafer feeding device comprises a feeding table, a feeding box and a wafer conveying device, wherein the feeding table is provided with the feeding box, and the feeding box is used for storing wafers;
the mechanical arm is detachably connected with a mechanical arm, and the mechanical arm is used for grabbing the wafers in the feeding box and placing the wafers in corresponding grooves;
and the mechanical arm is connected with the air suspension moving device, and the air suspension moving device is used for driving the mechanical arm to move to the corresponding groove.
In one embodiment of the invention, the air-levitation moving device comprises a moving suspension table for carrying the robot arm, the moving suspension table is slidably connected to a guide rail, the guide rail is arranged on the upper part of the transport frame body, an air duct is connected to the moving suspension table, the moving suspension table is in a suspension state by introducing air into the air duct, and the moving suspension table is driven by a driving device to move along the guide rail.
In one embodiment of the invention, the moving suspension and the guide rail surfaces are both coated with a ceramic coating.
In one embodiment of the invention, the mechanical arm is in communication with a controller, and the controller is used for controlling the mechanical arm to replace a mechanical arm with a corresponding specification according to different wafer specifications and controlling the moving position of the mechanical arm.
In one embodiment of the invention, the liquid medicine tank and the water tank are both provided with a temperature sensor and a flow sensor, and the temperature sensor and the flow sensor are both electrically connected with the controller.
In one embodiment of the invention, a gas sensor is further mounted on the cleaning rack, and the gas sensor is electrically connected with the controller.
In one embodiment of the present invention, the controller stores therein a plurality of cleaning modes, each cleaning mode including a cleaning route, a cleaning time, a cleaning temperature, a drying time, and a chemical ratio.
In an embodiment of the present invention, the upper portion of the cleaning rack is further connected to a centralized exhaust system, the centralized exhaust system includes a plasma dust removal device and an exhaust duct, the plasma dust removal device is configured to remove dust from the exhaust gas generated in the cleaning process, and the exhaust gas after dust removal is exhausted through the exhaust duct.
In one embodiment of the invention, a lifting device is connected to the lower part of the feeding table and is used for driving the feeding table to lift.
In one embodiment of the invention, the exterior of the robot arm is coated with a protective layer using continuous silicon carbide fibers.
Compared with the prior art, the technical scheme of the invention has the following advantages:
the wafer cleaning system can effectively improve the cleaning efficiency and the cleaning effect of the wafer and has better universality.
Drawings
In order that the present disclosure may be more readily and clearly understood, reference will now be made in detail to the present disclosure, examples of which are illustrated in the accompanying drawings.
FIG. 1 is an isometric view of a wafer cleaning system of the present invention;
FIG. 2 is a front view of the wafer cleaning system shown in FIG. 1;
FIG. 3 is a side view of the wafer cleaning system shown in FIG. 1;
description reference numbers indicate: 1. cleaning the rack; 2. a feeding table; 3. feeding a material box; 4. a mechanical arm; 5. an air-levitation moving device; 6. a guide rail; 7. a storage tank; 8. a first liquid medicine tank; 9. a second liquid medicine groove; 10. a water tank; 11. a drying tank; 12. a standby groove; 13. a centralized exhaust system; 14. a lifting device; 15. a controller; 16. and (7) transporting the shelf body.
Detailed Description
The present invention is further described below in conjunction with the following figures and specific examples so that those skilled in the art may better understand the present invention and practice it, but the examples are not intended to limit the present invention.
Referring to fig. 1-3, the invention discloses a wafer cleaning system, which comprises a cleaning rack 1, a feeding table 2, a mechanical arm 4 and an air suspension moving device 5;
wherein, a plurality of tanks are sequentially arranged on the cleaning rack 1, the inner wall of each tank is coated with an yttrium oxide coating, and at least one tank is used as a liquid medicine tank, one tank is used as a water tank 10 and one tank is used as a drying tank 11;
a feeding box 3 is arranged on the feeding table 2, and the feeding box 3 is used for storing wafers;
the mechanical arm 4 is detachably connected with a mechanical hand so as to be convenient for replacing the mechanical hands with different specifications, and the mechanical hand is used for grabbing the wafers in the feeding box 3 and placing the wafers in corresponding grooves;
the mechanical arm 4 is connected with an air suspension moving device 5, and the air suspension moving device 5 is used for driving the mechanical arm 4 to move to the corresponding groove.
In the system, the number and the type of the grooves can be set according to actual process requirements.
Through the structure, the mechanical arm 4 can be controlled to automatically move back and forth by the gas suspension moving device 5, so that automatic feeding and discharging and automatic cleaning of wafers are realized, and the cleaning efficiency is greatly improved;
the yttrium oxide coating is coated on the inner wall of each groove, so that the chemical property of the yttrium oxide coating is very stable, and the corrosion phenomenon of the grooves due to the influence of cleaning liquid medicine can be effectively prevented.
The traditional groove is generally made of aluminum metal, corrosion is very easy to occur in the wet cleaning process, the yttrium oxide coating is coated, compared with the traditional quartz coating, the corrosion prevention effect is better, the quartz coating is easy to peel off and is easy to absorb ions, so that the cleaning effect is influenced, the yttrium oxide coating can avoid the defects of the quartz coating, and the cleaning effect can be effectively guaranteed while the effective protection effect is achieved on the groove body.
In one of the embodiments, the air suspension moving device 5 includes a moving suspension table for bearing the mechanical arm 4, the moving suspension table can be connected to the guide rail 6 in a sliding manner, the guide rail 6 is arranged on the upper portion of the transportation frame body 16, an air duct is connected to the moving suspension table, the moving suspension table is in a suspension state by introducing air into the air duct, the moving suspension table is driven by the driving device to move along the guide rail 6, and the mechanical arm 4 is driven by the moving suspension table to move together.
The driving device can be a linear motor, a hydraulic cylinder, an air cylinder and the like.
Furthermore, the air suspension moving device 5 can adopt a nano-scale air suspension moving device 5, and has higher moving precision which can reach 0.001-0.0015 mm.
In one embodiment, the surfaces of the moving suspension table and the guide rail 6 are coated with ceramic coatings, so that a better anti-corrosion effect can be achieved, the moving suspension table and the guide rail are prevented from being corroded by liquid medicine or waste gas in the cleaning process, and the moving precision and reliability of the moving suspension table and the guide rail are ensured.
In one embodiment, the robot 4 is in communication with a controller 15, and the controller 15 is configured to control the robot 4 to change the robot with a corresponding specification according to a different wafer specification, and control the moving position of the robot 4.
The clamping requirements of wafers with different sizes on the manipulator are different, so that each specification of wafer corresponds to one specification of manipulator; the controller 15 can realize automatic matching of the wafer and the manipulator, and can also automatically control the moving route of the manipulator 4, thereby meeting different cleaning requirements.
For example, the mechanical arm 4 can be provided with a hand-changing turntable, the hand-changing turntable is provided with a plurality of mechanical arms with different specifications, and when switching is needed, the mechanical arms with different specifications can be switched only by controlling the hand-changing turntable to rotate; alternatively, a special hand changer may be provided for detaching the robot from the robot arm 4 and attaching a new robot to the robot arm 4.
Further, the communication mode between the robot arm 4 and the controller 15 may be any one of RS232, RS485, PPI/MPI, PROFIBUS DP/PA/FMS field bus, ethernet bus, DEVICEnet bus, and wireless network.
In one embodiment, the liquid medicine tank and the water tank 10 are both provided with a temperature sensor and a flow sensor, and the temperature sensor and the flow sensor are both electrically connected with the controller 15.
Further, a gas sensor is mounted on the cleaning rack 1, and the gas sensor is electrically connected with the controller 15.
The temperature sensor is used for monitoring the temperature in the tank and transmitting the temperature to the controller 15;
the flow sensor is used for monitoring the liquid flow in the tank and transmitting the liquid flow to the controller 15;
the gas sensor is used to detect the concentration of the exhaust gas generated during the cleaning process or the concentration of the shielding gas input during the cleaning process, and transmits the detected concentration to the controller 15.
Through the arrangement of the various sensors, the cleaning parameters can be monitored and controlled in real time, adjustment can be made in time, and the cleaning effect and the cleaning safety are guaranteed.
Further, the material loading box 3 may be provided with a detection sensor to detect the wafer specification and transmit the detected wafer specification to the controller 15.
In addition, a leakage sensor may be provided on the tank, and the leakage sensor is also electrically connected to the controller 15 to detect whether the tank is leaked.
In one embodiment, the controller 15 stores therein a plurality of cleaning modes, each including a cleaning route, a cleaning time, a cleaning temperature, a drying time, and a chemical ratio.
For example, the wash route is: a first liquid medicine groove 8, a second liquid medicine groove 9, a water groove 10 and a drying groove 11; that is, the mechanical arm 4 moves to the first liquid medicine tank 8 first, the wafer grabbed by the mechanical arm is placed in the first liquid medicine tank 8 for primary cleaning, after the cleaning is finished, the mechanical arm grabs the wafer again and moves to the second liquid medicine tank 9 for secondary cleaning, after the cleaning is finished, the mechanical arm grabs the wafer again and moves to the water tank 10 for pure water cleaning, and then the cleaned wafer is moved to the drying tank 11 by the mechanical arm for drying;
the cleaning route can also be as follows: a first liquid medicine tank 8, a water tank 10 and a drying tank 11; or the following steps: water tank 10-drying tank 11, etc.;
the cleaning time and the cleaning temperature mainly refer to the cleaning time and the cleaning temperature of the wafer in the chemical solution tank/water tank 10, and the drying time refers to the drying time of the wafer in the drying tank 11.
Specifically, different cleaning times or cleaning temperatures may be set for different chemical solution tanks or water tanks 10, for example, the cleaning time includes a first cleaning time and a second cleaning time, the first cleaning time is the cleaning time of the wafer in the chemical solution tank, and the second cleaning time is the cleaning time of the wafer in the water tank 10.
The liquid medicine ratio refers to the ratio of liquid medicine required to be input in the liquid medicine groove.
Through the arrangement of the multiple cleaning modes, a user can select different cleaning modes according to requirements, different process requirements can be met, and when the cleaning robot is used specifically, the user only needs to select the corresponding cleaning mode, and the controller 15 can control the mechanical arm 4 to move according to the corresponding route to realize automatic cleaning.
Further, the cleaning temperature is 20-48 degrees; the cleaning time is 6-10 seconds.
In one embodiment, the cleaning system further comprises a dosing device, and the dosing device is connected with the liquid medicine tank through a pipeline; the controller 15 can control the drug adding device to input the drug solution to the drug solution tank through the pipeline, and when the drug solution amount reaches a set value, the drug adding device is closed, and the drug solution conveying is stopped.
It can be understood that the above-mentioned pipes need to have better acid resistance and alkali resistance, and the number of the arrangement can be set according to the actual needs.
In one embodiment, the upper part of the washing machine frame is further connected with a centralized exhaust system 13, the centralized exhaust system 13 comprises a plasma dust removal device and an exhaust pipe, the plasma dust removal device is used for removing dust from the waste gas generated in the washing process, and the waste gas after dust removal is exhausted through the exhaust pipe, so that the requirement of environmental protection is met.
In one embodiment, a lifting device 14 is connected to the lower portion of the feeding table 2, and the lifting device 14 is used for driving the feeding table 2 to lift so as to adjust the height of the feeding box 3 according to the height of the production line.
In one embodiment, the protection layer is coated outside the manipulator, the protection layer is made of continuous silicon carbide fibers, the protection layer has good heat resistance and oxidation resistance, the strength retention rate is over 80% at the highest use temperature, the chemical stability is good, and the protection effect on the manipulator can be effectively achieved.
In one embodiment, a centrifugal dryer is provided in the drying tub 11.
When spin-drying is carried out, the speed of the centrifugal spin-drying machine is controlled to be 1500-2100 revolutions per minute, and spin-drying can be completed within 2-3 minutes.
In addition to the chemical solution tank, the water tank 10 and the drying tank 11, a tank as a spare tank 12 and a tank as a storage tank 7 may be provided in the cleaning machine frame 1, the spare tank 12 is used as a spare for different processes, and the storage tank 7 may be provided with some corrosion-resistant accessories.
The liquid medicine added into the liquid medicine groove can be phosphoric acid or sulfuric acid, can also be a mixed solution of sulfuric acid solution and hydrogen peroxide solution, and can also be other types of liquid medicines.
The method of using the cleaning system of the above embodiment will be described in detail below by taking as an example a system provided with two chemical solution tanks (the first chemical solution tank 8 and the second chemical solution tank 9, respectively), one water tank 10 and one drying tank 11, and the method adopts a cleaning mode in which the cleaning route is "first chemical solution tank 8-second chemical solution tank 9-water tank 10-drying tank 11":
s1) controlling a dosing device to automatically add liquid medicine into a first liquid medicine groove 8 and a second liquid medicine groove 9 through a conveying pipeline by a controller 15 until the liquid medicine amount meets a set value;
the controller 15 controls the mechanical arm 4 to replace the mechanical arm with a corresponding specification according to the specification of the wafer to be washed;
s2) starting the air suspension moving device 5, so that the moving suspension table drives the mechanical arm 4 to move to the feeding box 3, and the mechanical arm grabs the wafer to be washed from the feeding box 3;
s3) after grabbing, enabling the movable suspension platform to drive the mechanical arm 4 to move to the first liquid medicine groove 8, and placing the grabbed wafer to be washed in the first liquid medicine groove 8 by the mechanical arm to be soaked for 6-10 seconds to realize primary washing;
s4) grabbing the wafer subjected to primary cleaning by a manipulator, driving the manipulator 4 to move to the second liquid medicine tank 9 by the movable suspension platform, and placing the grabbed wafer in the second liquid medicine tank 9 by the manipulator to soak for 6-10 seconds to realize secondary cleaning;
s5) grabbing the wafer subjected to the secondary cleaning by the manipulator, driving the manipulator 4 to move to the water tank 10 by the movable suspension platform, and placing the grabbed wafer in the water tank 10 by the manipulator for cleaning;
and S6) grabbing the cleaned wafer in the water tank 10 by a manipulator, driving the manipulator 4 to move to the drying tank 11 by the movable suspension platform, and placing the grabbed wafer in the drying tank 11 by the manipulator for drying treatment, for example, placing the wafer in a centrifugal drier for drying, wherein the drying speed is 1500-2100 revolutions per minute.
S7) after spin-drying is completed, taking the wafer out of the drying groove 11 by the manipulator and placing the wafer on a blanking station;
then, the mechanical arm 4 is driven by the movable suspension platform to return to the upper material box 3 again for cleaning the next wafer.
In the above process, before performing step S2), the liquid medicines in the first liquid medicine tank 8 and the second liquid medicine tank 9 need to be heated, the heating time is 3 minutes, the temperature of the heated liquid medicines is 20 to 48 degrees, and the constant temperature tolerance is 0.5 degree.
In addition, the waste gas formed by chemical liquid such as acid and alkali in the cleaning process is treated by the upper centralized exhaust system 13 and then discharged; the temperature sensor, the flow sensor, the gas sensor, and the like acquire corresponding monitoring data in real time and feed back the monitoring data to the controller 15.
The wafer cleaning system of the embodiment can effectively improve the cleaning efficiency and the cleaning effect of the wafer, can be suitable for cleaning wafers with different sizes of 4-20 inches, can be suitable for various cleaning requirements such as particle removal cleaning, cleaning after etching, pre-diffusion cleaning, metal ion removal cleaning, film removal cleaning and the like, only needs to set the number of the grooves and change the type of the liquid medicine according to different cleaning requirements, has high universality and is beneficial to saving the cost.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications of the invention may be made without departing from the spirit or scope of the invention.
Claims (10)
1. A wafer cleaning system, comprising:
the cleaning machine comprises a cleaning rack, wherein a plurality of grooves are sequentially arranged on the cleaning rack, an yttrium oxide coating is coated on the inner wall of each groove, and at least one groove is used as a liquid medicine groove, one groove is used as a water groove, and the other groove is used as a drying groove;
the wafer feeding device comprises a feeding table, a feeding box and a wafer conveying device, wherein the feeding table is provided with the feeding box, and the feeding box is used for storing wafers;
the mechanical arm is detachably connected with a mechanical arm, and the mechanical arm is used for grabbing the wafers in the feeding box and placing the wafers in corresponding grooves;
and the mechanical arm is connected with the air suspension moving device, and the air suspension moving device is used for driving the mechanical arm to move to the corresponding groove.
2. The wafer cleaning system of claim 1, wherein the air-levitation moving device comprises a moving suspension table for carrying the robot arm, the moving suspension table is slidably connected to a guide rail, the guide rail is disposed on the upper portion of the transport frame, an air duct is connected to the moving suspension table, the moving suspension table is in a suspended state by introducing air into the air duct, and the moving suspension table is driven by a driving device to move along the guide rail.
3. The wafer cleaning system of claim 2, wherein the moving suspension and the guide rail surfaces are each coated with a ceramic coating.
4. The wafer cleaning system according to claim 1, wherein the robot is communicatively connected to a controller, and the controller is configured to control the robot to change the robot corresponding to the wafer specification and to control the movement position of the robot.
5. The wafer cleaning system according to claim 4, wherein a temperature sensor and a flow sensor are mounted on the chemical solution tank and the water tank, and are electrically connected with the controller.
6. The wafer cleaning system of claim 5, wherein a gas sensor is further mounted on the cleaning rack, the gas sensor being electrically connected to the controller.
7. The wafer cleaning system according to claim 4, wherein a plurality of cleaning modes are stored in the controller, and each cleaning mode comprises a cleaning route, a cleaning time, a cleaning temperature, a drying time and a chemical liquid ratio.
8. The wafer cleaning system according to claim 1, wherein a centralized exhaust system is further connected to the upper portion of the cleaning rack, the centralized exhaust system comprises a plasma dust removal device and an exhaust duct, the plasma dust removal device is used for removing dust from the exhaust gas generated in the cleaning process, and the exhaust gas after dust removal is exhausted through the exhaust duct.
9. The wafer cleaning system as claimed in claim 1, wherein a lifting device is connected to a lower portion of the loading platform, and the lifting device is used for driving the loading platform to lift.
10. The wafer cleaning system of claim 1, wherein the robot is externally coated with a protective layer, and the protective layer is made of continuous silicon carbide fiber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210939459.2A CN115172225A (en) | 2022-08-05 | 2022-08-05 | Wafer cleaning system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210939459.2A CN115172225A (en) | 2022-08-05 | 2022-08-05 | Wafer cleaning system |
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| CN115172225A true CN115172225A (en) | 2022-10-11 |
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| CN202210939459.2A Withdrawn CN115172225A (en) | 2022-08-05 | 2022-08-05 | Wafer cleaning system |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115716068A (en) * | 2022-11-14 | 2023-02-28 | 天津中环领先材料技术有限公司 | Method for cleaning silicon wafer by multi-groove integrated automatic cleaning machine |
| CN115863219A (en) * | 2022-12-12 | 2023-03-28 | 南京华易泰电子科技有限公司 | A wafer cleaning device |
| CN117259327A (en) * | 2023-08-23 | 2023-12-22 | 宁夏北瓷新材料科技有限公司 | Continuous ALN scribing sheet cleaning equipment and cleaning method thereof |
| CN117753726A (en) * | 2023-12-21 | 2024-03-26 | 苏州艾默特材料技术有限公司 | Environment-friendly intelligent cleaning equipment for parts |
-
2022
- 2022-08-05 CN CN202210939459.2A patent/CN115172225A/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115716068A (en) * | 2022-11-14 | 2023-02-28 | 天津中环领先材料技术有限公司 | Method for cleaning silicon wafer by multi-groove integrated automatic cleaning machine |
| CN115863219A (en) * | 2022-12-12 | 2023-03-28 | 南京华易泰电子科技有限公司 | A wafer cleaning device |
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Application publication date: 20221011 |