CN115167079B - Wafer conveying device of photoetching machine - Google Patents
Wafer conveying device of photoetching machine Download PDFInfo
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- CN115167079B CN115167079B CN202210859707.2A CN202210859707A CN115167079B CN 115167079 B CN115167079 B CN 115167079B CN 202210859707 A CN202210859707 A CN 202210859707A CN 115167079 B CN115167079 B CN 115167079B
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- wafer
- fixedly connected
- feeding
- outer box
- inner box
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- 238000001259 photo etching Methods 0.000 title claims abstract description 43
- 239000000463 material Substances 0.000 claims abstract description 36
- 238000007599 discharging Methods 0.000 claims abstract description 22
- 238000005096 rolling process Methods 0.000 claims abstract description 19
- 230000000087 stabilizing effect Effects 0.000 claims description 17
- 238000000926 separation method Methods 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 abstract description 166
- 238000000034 method Methods 0.000 abstract description 12
- 239000004065 semiconductor Substances 0.000 abstract description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 10
- 238000007664 blowing Methods 0.000 description 10
- 229910052710 silicon Inorganic materials 0.000 description 10
- 239000010703 silicon Substances 0.000 description 10
- 239000013078 crystal Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052729 chemical element Inorganic materials 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G13/00—Roller-ways
- B65G13/02—Roller-ways having driven rollers
- B65G13/06—Roller driving means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70975—Assembly, maintenance, transport or storage of apparatus
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a wafer conveying device of a photoetching machine, which belongs to the technical field of semiconductor materials, and comprises a wafer outer box and a feeding device, wherein the feeding device is positioned at one side of the wafer outer box, one side end of the wafer outer box is fixedly connected with a discharging sloping plate, the feeding device is provided with a feeding disc, and the feeding disc corresponds to the discharging sloping plate; in the invention, a plurality of wafers are only required to be put on the wafer separating strips by a worker, the lifting inner box is controlled by the driving component to lift by the lifting component, the distance of each upward movement of the lifting inner box is the same, so that the uppermost wafer is controlled by the pushing component and the rolling component to move, the wafers enter the feeding tray and are conveyed by the feeding device, according to the photoetching time of the photoetching machine on the wafers, only one wafer is sent out each time by the lifting inner box, the sending time is the same, and no human interference is required, thereby avoiding the influence on the taking of the photoetching machine caused by stacking of the wafers in the conveying process.
Description
Technical Field
The invention belongs to the technical field of semiconductor materials, and particularly relates to a wafer conveying device of a photoetching machine.
Background
Elemental silicon is a gray, brittle, tetravalent nonmetallic chemical element. 27.8% of the crust components are composed of silicon elements, which are relatively rich elements in nature, and are ranked second to the oxygen element content. Elemental silicon is found in quartz, agate, flint, and plain beach stone. Silicon wafers, also known as wafers, are fabricated from silicon ingots, from which millions of transistors can be etched by specialized processes, and are widely used in the manufacture of integrated circuits, silicon being a semiconductor material that is not itself very conductive, however, its resistivity can be precisely controlled by the addition of appropriate dopants. Before semiconductor fabrication, silicon must be converted to wafers, beginning with the growth of a silicon ingot. Monocrystalline silicon is a solid in which atoms periodically form in a three-dimensional spatial pattern that extends throughout the material. Polysilicon is formed as a single crystal of a plurality of small single crystals having different crystal orientations, and cannot be used as a semiconductor circuit. The polysilicon must be melted into a single crystal for processing into wafers for use in semiconductor applications, wherein the silicon wafers are lithographically processed using a lithographically machine during the manufacturing process.
At present, when a silicon wafer is subjected to photoetching through a photoetching machine, the wafer needs to be moved into the photoetching machine by using a conveying device, and a common conveying device adopts belt conveying, so that a worker is required to place the wafer on a belt.
Disclosure of Invention
The invention aims to provide a wafer conveying device of a photoetching machine, which aims to solve the problems that the common conveying device in the prior art adopts belt conveying, a worker is required to place a wafer on a belt, the belt conveying can not determine the conveying time of the wafer because a certain time is generated in the photoetching process of the photoetching machine, the wafer is easily accumulated, and the taking of the wafer by the photoetching machine is affected.
In order to achieve the above purpose, the present invention provides the following technical solutions:
the utility model provides a wafer conveyor of photoetching machine, includes wafer outer tank and material feeding unit, material feeding unit is located one side of wafer outer tank, one side fixedly connected with blowing swash plate of wafer outer tank, the last feeding tray that is provided with of material feeding unit, and the feeding tray is corresponding with the blowing swash plate, sliding connection has the lift inner tank in the wafer outer tank, the one side of wafer outer tank has excavated the wafer and has placed the mouth, and the wafer is placed the mouth and is corresponding with the lift inner tank, fixedly connected with a plurality of wafer separation strips in the lift inner tank, be provided with lifting unit, drive assembly, pushing component and rolling element between lift inner tank and the wafer outer tank, drive assembly passes through the lift of lifting unit control lift inner tank in the wafer outer tank, pushing component cooperation rolling element is used for controlling the removal of wafer.
As a preferable scheme of the invention, the feeding device comprises a slide rail support frame, an electric slide rail and a feeding slide seat, wherein the slide rail support frame is positioned on one side of the wafer outer box, the electric slide rail is fixedly connected to the upper end of the slide rail support frame, the electric slide rail is electrically connected with an external power supply, the feeding slide seat is slidably connected to the electric slide rail, and the feeding tray is fixedly connected to the feeding slide seat.
As a preferable scheme of the invention, the lifting assembly comprises two supporting blocks, two ball screws and two travel nuts, wherein the two supporting blocks are respectively and fixedly connected to two side walls of the wafer placing opening, the two ball screws are respectively and rotatably connected to the two supporting blocks, the two travel nuts are respectively and fixedly connected to two side ends of the lifting inner box, and the two travel nuts are respectively and threadedly connected to the outer surfaces of the two ball screws.
As a preferable scheme of the invention, the driving assembly comprises a driving motor, a driving rotating rod, two driving bevel gears and two driven bevel gears, wherein the driving motor is fixedly connected to one side end of the wafer outer box, the driving motor is electrically connected with an external power supply, the driving rotating rod is rotatably connected in the wafer outer box, one end of the driving rotating rod movably penetrates through the wafer outer box and is fixedly connected to the output end of the driving motor, the two driving bevel gears are fixedly connected to the outer surface of the driving rotating rod, the two driven bevel gears are respectively and fixedly connected to the bottom ends of the two ball screw rods, and the two driven bevel gears penetrate to the lower sides of the two supporting blocks and are respectively meshed with the two driving bevel gears.
As a preferable scheme of the invention, the pushing component comprises two worms, two fixing plates, two worm wheels, two eccentric rotating rods, a fixing block, a reciprocating push-pull frame, a pushing plate and two eccentric connecting rods, wherein the two worms are respectively and fixedly connected to the top ends of the two ball screws, the two fixing plates are respectively and fixedly connected to the upper ends of the wafer outer box, the two worm wheels are respectively and rotatably connected to one ends of the two fixing plates close to each other, the two worm wheels are respectively meshed with the two worm wheels, the two eccentric rotating rods are respectively and fixedly connected to one ends of the two worm wheels close to each other, the fixing block is fixedly connected to one side end of the wafer outer box, the reciprocating push-pull frame movably penetrates through the fixing block, the pushing plate is fixedly connected to the reciprocating push-pull frame, the pushing plate corresponds to the plurality of wafer separating strips, and the two eccentric connecting rods are respectively and movably hinged between the two eccentric rotating rods and the reciprocating push-pull frame through hinge shafts.
As a preferable scheme of the invention, the rolling assembly comprises two fixed racks, a plurality of material moving rotating rollers and a plurality of groups of rotating gears, wherein the two fixed racks are fixedly connected to one side wall of the wafer outer box, the plurality of material moving rotating rollers are rotatably connected in the lifting inner box and respectively correspond to the plurality of wafer dividing strips, the plurality of groups of rotating gears are respectively fixedly connected to two ends of the plurality of material moving rotating rollers, and the plurality of groups of rotating gears movably penetrate through two sides of the lifting inner box and correspond to the two fixed racks.
As a preferable scheme of the invention, a plurality of stable sliding grooves are cut at two side ends of the lifting inner box, a plurality of stable strips are fixedly connected with the bottom wall of the wafer outer box, and the stable sliding grooves are respectively and slidably connected with the stable strips.
As a preferable scheme of the invention, the two side walls of the wafer outer box are fixedly connected with the auxiliary stabilizing blocks, and the two worms are respectively and rotatably connected in the two auxiliary stabilizing blocks.
As a preferable scheme of the invention, the discharging inclined plate is provided with a roller mounting groove in an opening way, and a plurality of sliding rollers are rotationally connected in the roller mounting groove.
As a preferable scheme of the invention, the upper end of the feeding tray is fixedly connected with a feeding protection frame, and an opening of the feeding protection frame corresponds to the discharging sloping plate.
Compared with the prior art, the invention has the beneficial effects that:
1. in this scheme, the photoetching machine is placed in one side that material feeding unit kept away from the wafer outer container, place the wafer in the lift inner container through the wafer placing port, utilize a plurality of wafer dividing strips to put the wafer layering, then control lift subassembly start through drive assembly, lift subassembly makes lift inner container upwards remove certain distance, lift inner container drives a plurality of wafers through a plurality of wafer dividing strips and upwards remove, simultaneously pushing component and rolling element can start at the in-process that lift inner container removed, the wafer that is located the upper strata is pushed by pushing component, rolling element makes the wafer of upper strata remove, pushing component cooperation rolling element makes the wafer of upper strata remove to in the blowing swash plate, the blowing swash plate has certain inclination, make the wafer landing to in the feed tray, then the feed tray is moved to the photoetching machine, the photoetching machine receives the wafer in the feed tray and carries out the photoetching, when the wafer photoetching is about to be accomplished, material feeding device makes the feed tray reset and the blowing contact, repeat the step again, make the wafer of upper strata in the lift inner container get into the feed tray again, the continuous carry the wafer to the photoetching machine.
2. In this scheme, the staff only need put into a plurality of wafers on the separate strip of a plurality of wafers, drive assembly goes up and down the interior case of lift through lifting unit control, the distance that the interior case of lift was upwards moved at every turn is the same, make the wafer of upper strata by pushing away material subassembly and rolling element control removal, thereby make the wafer get into in the feeding tray and carry through material feeding unit, according to the photoetching time of photoetching machine to the wafer, the interior case of lift only sends out a wafer at every turn, the time of sending out is the same, do not need the human interference, thereby avoid the wafer to take place to pile up the taking that influences the photoetching machine at the in-process of carrying.
3. In this scheme, lift inner box 4 reciprocates the in-process that reciprocates through a plurality of firm spouts 31 and remove on a plurality of firm strips 25, a plurality of firm spouts 31 and a plurality of 35 make the removal of lift inner box 4 keep good stability, two supplementary firm pieces 26 are used for supporting two worms 17, make the rotation of two worms 17 keep stable, because two worms 17 and two ball screw 8 fixed connection, can make the rotation of two ball screw 8 keep good stability simultaneously, roller mounting groove 30 is used for installing a plurality of sliding roller 27, a plurality of sliding roller 27 make get into the quick slip of wafer in the blowing swash plate 3, make the removal of wafer in the blowing swash plate 3 more smooth and easy, the pay-off protective frame 28 is used for blocking the wafer of sliding out in the blowing swash plate 3, avoid the wafer to drop at the in-process of removal.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate the invention and together with the embodiments of the invention, serve to explain the invention. In the drawings:
FIG. 1 is a first perspective view of the present invention;
FIG. 2 is a schematic view of a second perspective structure of the present invention;
FIG. 3 is a first cross-sectional schematic view of the present invention;
FIG. 4 is a second cross-sectional schematic view of the present invention;
FIG. 5 is a schematic diagram of an exploded construction of the present invention;
FIG. 6 is a schematic perspective view of the wafer enclosure of the present invention;
FIG. 7 is a schematic perspective view of a lifting inner box according to the present invention;
FIG. 8 is a first perspective view of a part of the structure of the present invention;
FIG. 9 is a second perspective view of a part of the structure of the present invention;
fig. 10 is a schematic view of a third perspective view of a part of the structure in the present invention.
In the figure: 1. a wafer outer case; 2. a feeding device; 201. a slide rail support; 202. an electric slide rail; 203. a feeding slide seat; 3. a discharging sloping plate; 4. lifting the inner box; 5. a wafer placement port; 6. a wafer separator bar; 7. a support block; 8. a ball screw; 9. a travel nut; 10. a driving motor; 11. a driving rotating rod; 12. a driving bevel gear; 13. a driven bevel gear; 14. a fixed rack; 15. a material moving rotating roller; 16. rotating the gear; 17. a worm; 18. a fixing plate; 19. a worm wheel; 20. an eccentric rotating rod; 21. a fixed block; 22. a reciprocating push-pull frame; 23. a pushing plate; 24. an eccentric link; 25. a stabilizing strip; 26. an auxiliary stabilizing block; 27. a sliding material rotating roller; 28. a feeding protection frame; 29. a feeding tray; 30. a roller mounting groove; 31. and stabilizing the chute.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-10, the present invention provides the following technical solutions: the utility model provides a wafer conveyor of photoetching machine, including wafer outer tank 1 and material feeding unit 2, material feeding unit 2 is located one side of wafer outer tank 1, one side fixedly connected with blowing swash plate 3 of wafer outer tank 1, be provided with material feeding tray 29 on the material feeding unit 2, and material feeding tray 29 is corresponding with blowing swash plate 3, sliding connection has lift inner tank 4 in wafer outer tank 1, one side of wafer outer tank 1 has cut the wafer and has placed mouth 5, and the wafer is placed mouth 5 and is corresponding with lift inner tank 4, fixedly connected with a plurality of wafer separate pieces 6 in the lift inner tank 4, be provided with lifting assembly between lift inner tank 4 and the wafer outer tank 1, drive assembly, push away material subassembly and rolling element, drive assembly passes through lifting assembly control lift of lift inner tank 4 in wafer outer tank 1, push away material subassembly cooperation rolling element and be used for controlling the removal of wafer.
In the specific embodiment of the invention, the photoetching machine is arranged on one side of the feeding device 2 far away from the wafer outer box 1, wafers are placed into the lifting inner box 4 through the wafer placing opening 5, the wafers are layered and placed by utilizing the plurality of wafer dividing strips 6, then the lifting assembly is controlled to start by the driving assembly, the lifting assembly enables the lifting inner box 4 to move upwards for a certain distance, the lifting inner box 4 drives the plurality of wafers to move upwards through the plurality of wafer dividing strips 6, meanwhile, the pushing assembly and the rolling assembly are started in the moving process of the lifting inner box 4, the uppermost wafer is pushed by the pushing assembly, the rolling assembly enables the uppermost wafer to move, the pushing assembly is matched with the rolling assembly to enable the uppermost wafer to move into the discharging inclined plate 3, the discharging inclined plate 3 has a certain inclined angle, the wafers slide into the feeding tray 29, then the feeding device 2 controls the feeding tray 29 to move towards the photoetching machine, the photoetching machine receives wafers in the feeding tray 29 for photoetching, when the photoetching of the wafers is about to be completed, the feeding device 2 enables the feeding tray 29 to reset and contact with the discharging inclined plate 3, the steps are repeated again, the uppermost wafer in the lifting inner box 4 enters the feeding tray 29 again, the wafers are continuously conveyed to the photoetching machine, wherein the distance between every two adjacent wafer separation strips 6 is the same for each movement of the lifting inner box 4, each wafer positioned on the uppermost layer can correspond to the discharging inclined plate 3, the pushing component and the rolling component only move the uppermost wafer each time, after all the wafers in the lifting inner box 4 are conveyed, the driving component controls the lifting inner box 4 to move downwards through the lifting component, the lifting inner box 4 is retracted into the wafer outer box 1, the wafer can be placed in the lift-up/down inner box 4 again through the wafer placing port 5.
Specifically, the feeding device 2 includes a slide rail support 201, an electric slide rail 202 and a feeding slide 203, the slide rail support 201 is located at one side of the wafer outer box 1, the electric slide rail 202 is fixedly connected to the upper end of the slide rail support 201, the electric slide rail 202 is electrically connected to an external power source, the feeding slide 203 is slidably connected to the electric slide rail 202, and the feeding tray 29 is fixedly connected to the feeding slide 203.
In the embodiment of the invention, the slide rail supporting frame 201 is used for supporting the electric slide rail 202, the actual length of the electric slide rail 202 is set according to the production requirement, the electric slide rail 202 controls the feeding slide carriage 203 to move through an external power supply, the feeding slide carriage 203 drives the feeding tray 29 to move, when the feeding tray 29 corresponds to the discharging inclined plate 3, the feeding slide carriage 203 stops for a certain time, the driving component controls the lifting component to start, meanwhile, the pushing component cooperates with the rolling component to move the uppermost wafer into the feeding tray 29 through the discharging inclined plate 3, and when the photoetching machine is about to finish photoetching of the previous wafer, the feeding slide carriage 203 drives the wafer in the feeding tray 29 to move towards the photoetching machine, so that the delivering time of the wafer is in seamless connection with the photoetching time of the photoetching machine.
Specifically, the lifting assembly comprises two supporting blocks 7, two ball screws 8 and two stroke nuts 9, wherein the two supporting blocks 7 are respectively and fixedly connected to two side walls of the wafer placing opening 5, the two ball screws 8 are respectively and rotatably connected to the two supporting blocks 7, the two stroke nuts 9 are respectively and fixedly connected to two side ends of the lifting inner box 4, and the two stroke nuts 9 are respectively and threadedly connected to the outer surfaces of the two ball screws 8.
In the specific embodiment of the invention, during the wafer conveying process, the two ball screws 8 respectively rotate on the two supporting blocks 7 under the control of the driving assembly, the two supporting blocks 7 are used for supporting the two ball screws 8, the two ball screws 8 can enable the two stroke nuts 9 to move up and down, and the two stroke nuts 9 control the lifting of the lifting inner box 4.
Specifically, the driving assembly includes driving motor 10, driving rotating rod 11, two driving bevel gears 12 and two driven bevel gears 13, driving motor 10 fixed connection is in one side end of wafer outer case 1, and driving motor 10 and external power source electric connection, driving rotating rod 11 rotates and connects in wafer outer case 1, and the one end activity of driving rotating rod 11 runs through wafer outer case 1 fixed connection in driving motor 10's output, two driving bevel gears 12 all fixed connection in driving rotating rod 11's surface, two driven bevel gears 13 are fixed connection respectively in the bottom of two ball screw 8, and two driven bevel gears 13 run through to the downside of two supporting shoe 7 respectively with two driving bevel gears 12 mesh.
In the specific embodiment of the present invention, during the wafer transfer process, the driving motor 10 is started by an external power source, so that the driving rotating rod 11 rotates, the driving rotating rod 11 rotates the two driving bevel gears 12, the two driving bevel gears 12 rotate the two driven bevel gears 13 respectively, and the two driven bevel gears 13 rotate the two ball screws 8 respectively, thereby controlling the lifting of the lifting inner box 4.
Specifically, the pushing component includes two worms 17, two fixed plates 18, two worm wheels 19, two eccentric rotating rods 20, a fixed block 21, a reciprocating push-pull frame 22, a pushing plate 23 and two eccentric connecting rods 24, wherein the two worms 17 are respectively and fixedly connected to the top ends of the two ball screws 8, the two fixed plates 18 are respectively and fixedly connected to the upper ends of the wafer outer box 1, the two worm wheels 19 are respectively and rotatably connected to the ends of the two fixed plates 18 close to each other, the two worm wheels 19 are respectively meshed with the two worms 17, the two eccentric rotating rods 20 are respectively and fixedly connected to the ends of the two worm wheels 19 close to each other, the fixed block 21 is fixedly connected to one side end of the wafer outer box 1, the reciprocating push-pull frame 22 movably penetrates through the fixed block 21, the pushing plate 23 is fixedly connected to the reciprocating push-pull frame 22, the pushing plate 23 corresponds to the plurality of wafer separating strips 6, and the two eccentric connecting rods 24 are respectively and movably hinged between the two eccentric rotating rods 20 and the reciprocating push-pull frame 22 through hinge shafts.
In the specific embodiment of the invention, when the lifting inner box 4 moves upwards, the two ball screws 8 are in a rotating state, so that the two worms 17 rotate, the two worms 17 respectively rotate the worm gears 19 on the two fixing plates 18, the two worm gears 19 respectively drive the two eccentric rotating rods 20 to rotate, the two eccentric rotating rods 20 respectively push and pull the reciprocating push-pull frame 22 through the two eccentric connecting rods 24, the reciprocating push-pull frame 22 moves reciprocally in the fixing blocks 21, the reciprocating push-pull frame 22 drives the push plate 23 to reciprocate, when the push plate 23 moves into the lifting inner box 4, a wafer is pushed into the discharging inclined plate 3, after the pushing is completed, the push plate 23 moves to the outer side of the lifting inner box 4, and reset is realized, wherein the distance of each upward movement of the lifting inner box 4 enables the push plate 23 to just complete one pushing process, and reset to an initial state after the pushing is completed, and no influence is caused on the conveying of the next wafer.
Specifically, the rolling assembly includes two fixed racks 14, a plurality of moving rotating rollers 15 and a plurality of groups of rotating gears 16, the two fixed racks 14 are all fixedly connected to a side wall of the wafer outer box 1, the plurality of moving rotating rollers 15 are all rotatably connected in the lifting inner box 4, the plurality of moving rotating rollers 15 respectively correspond to the plurality of wafer separating strips 6, the plurality of groups of rotating gears 16 are respectively fixedly connected to two ends of the plurality of moving rotating rollers 15, and the plurality of groups of rotating gears 16 movably penetrate through two sides of the lifting inner box 4 to correspond to the two fixed racks 14.
In the embodiment of the invention, when the wafers are placed on the wafer separating strips 6, the wafers are contacted with the plurality of material moving rotating rollers 15, when the material pushing plate 23 pushes the uppermost wafer, the lifting inner box 4 is in a moving state, the lifting inner box 4 can enable a group of rotating gears 16 corresponding to the uppermost wafer to contact with the two fixed racks 14, the two fixed racks 14 enable the group of rotating gears 16 to rotate, so that one material moving rotating roller 15 is driven to rotate, and the material moving rotating roller 15 drives the uppermost wafer to move, so that the movement of the wafers is smoother.
Specifically, a plurality of stabilizing sliding grooves 31 are cut at two side ends of the lifting inner box 4, the bottom wall of the wafer outer box 1 is fixedly connected with a plurality of stabilizing strips 25, and the stabilizing sliding grooves 31 are respectively and slidably connected with the stabilizing strips 25.
In the embodiment of the present invention, the lifting inner case 4 moves on the plurality of stabilizing bars 25 through the plurality of stabilizing sliding grooves 31 during the up-and-down movement, and the plurality of stabilizing sliding grooves 31 and the plurality of 35 maintain good stability of the movement of the lifting inner case 4.
Specifically, the two side walls of the wafer outer box 1 are fixedly connected with auxiliary stabilizing blocks 26, and the two worms 17 are respectively and rotatably connected in the two auxiliary stabilizing blocks 26.
In the embodiment of the present invention, the two auxiliary stabilizing blocks 26 are used for supporting the two worms 17, so that the rotation of the two worms 17 is kept stable, and the two worms 17 are fixedly connected with the two ball screws 8, so that the rotation of the two ball screws 8 can be kept well stable.
Specifically, a roller mounting groove 30 is cut on the discharging inclined plate 3, and a plurality of sliding rollers 27 are rotatably connected in the roller mounting groove 30.
In the embodiment of the present invention, the roller mounting groove 30 is used for mounting a plurality of sliding rollers 27, and the sliding rollers 27 enable the wafer entering the discharging inclined plate 3 to slide rapidly, so that the movement of the wafer in the discharging inclined plate 3 is smoother.
Specifically, the upper end of the feeding tray 29 is fixedly connected with a feeding protection frame 28, and an opening of the feeding protection frame 28 corresponds to the discharging inclined plate 3.
In the embodiment of the present invention, the feeding protection frame 28 is used for blocking the wafer sliding out of the discharging inclined plate 3, so as to prevent the wafer from falling in the moving process.
The working principle and the using flow of the invention are as follows: when the wafers are required to be conveyed, the photoetching machine is placed at one end of the feeding device 2 far away from the wafer outer box 1, the wafers are firstly placed into the lifting inner box 4 through the wafer placing opening 5, the wafers are placed in layers through the wafer separating strips 6, then the driving motor 10 is started through an external power supply, the driving motor 10 rotates the driving rotating rod 11, the driving rotating rod 11 rotates the two driving bevel gears 12, the two driving bevel gears 12 respectively rotate the two driven bevel gears 13, the two driven bevel gears 13 respectively rotate the two ball screws 8 on the two supporting blocks 7, the two ball screws 8 drive the lifting inner box 4 to move upwards by a certain distance through the two stroke nuts 9, the lifting inner box 4 drives the wafers to move upwards through the wafer separating strips 6, meanwhile, the two ball screws 8 drive the two worms 17 to rotate, the two worms 17 respectively rotate worm gears 19 on two fixed plates 18, the two worm gears 19 respectively drive two eccentric rotating rods 20 to rotate, the two eccentric rotating rods 20 respectively push and pull a reciprocating push and pull frame 22 through two eccentric connecting rods 24, the reciprocating push and pull frame 22 reciprocates in a fixed block 21, the reciprocating push and pull frame 22 drives a pushing plate 23 to reciprocate, when the pushing plate 23 moves into a lifting inner box 4, a wafer is pushed into a discharging inclined plate 3, after the pushing is completed, the pushing plate 23 moves towards the outer side of the lifting inner box 4 to realize resetting, the pushing plate 23 is pushed, the lifting inner box 4 is in a moving state, the lifting inner box 4 enables a group of rotating gears 16 corresponding to the uppermost wafer to contact with the two fixed racks 14, the two fixed racks 14 enable the group of rotating gears 16 to rotate, so as to drive one lifting rotating roller 15 to rotate, the material moving rotating roller 15 drives the uppermost wafer to move, so that the uppermost wafer moves into the material placing inclined plate 3, then the driving motor 10 stops running, the material placing inclined plate 3 has a certain inclination angle, the wafer slides into the feeding disc 29, the electric sliding rail 202 controls the feeding disc 29 to move towards the photoetching machine through the feeding sliding seat 203, the photoetching machine receives the wafer in the feeding disc 29 for photoetching, when the photoetching of the wafer is about to be completed, the feeding device 2 enables the feeding disc 29 to reset to be in contact with the material placing inclined plate 3, the steps are repeated again, the uppermost wafer in the lifting inner box 4 enters the feeding disc 29 again, the wafer is continuously conveyed to the photoetching machine, after all the wafers in the lifting inner box 4 are conveyed, the driving motor 10 controls the driving rotating rod 11 to reversely rotate, so that the lifting inner box 4 moves downwards, the lifting inner box 4 retracts into the wafer outer box 1, and the wafer can be placed into the lifting inner box 4 again through the wafer placing opening 5.
Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present invention, and the present invention is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present invention has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. The utility model provides a wafer conveyor of photoetching machine, includes wafer outer container (1) and material feeding unit (2), its characterized in that: the feeding device (2) is positioned at one side of the wafer outer box (1), one side end of the wafer outer box (1) is fixedly connected with a discharging inclined plate (3), a feeding disc (29) is arranged on the feeding device (2), the feeding disc (29) corresponds to the discharging inclined plate (3), the lifting inner box (4) is connected in a sliding manner in the wafer outer box (1), a wafer placing opening (5) is cut at one side end of the wafer outer box (1), the wafer placing opening (5) corresponds to the lifting inner box (4), a plurality of wafer separation strips (6) are fixedly connected in the lifting inner box (4), a lifting assembly, a driving assembly, a pushing assembly and a rolling assembly are arranged between the lifting inner box (4) and the wafer outer box (1), the driving assembly controls the lifting of the lifting inner box (4) in the wafer outer box (1) through the lifting assembly, and the pushing assembly is matched with the rolling assembly to control the movement of the wafer;
the lifting assembly comprises two supporting blocks (7), two ball screws (8) and two stroke nuts (9), wherein the two supporting blocks (7) are respectively and fixedly connected to two side walls of the wafer placing opening (5), the two ball screws (8) are respectively and rotatably connected to the two supporting blocks (7), the two stroke nuts (9) are respectively and fixedly connected to two side ends of the lifting inner box (4), and the two stroke nuts (9) are respectively and threadedly connected to the outer surfaces of the two ball screws (8);
the driving assembly comprises a driving motor (10), a driving rotating rod (11), two driving bevel gears (12) and two driven bevel gears (13), wherein the driving motor (10) is fixedly connected to one side end of the wafer outer box (1), the driving motor (10) is electrically connected with an external power supply, the driving rotating rod (11) is rotationally connected in the wafer outer box (1), one end of the driving rotating rod (11) movably penetrates through the wafer outer box (1) and is fixedly connected to the output end of the driving motor (10), the two driving bevel gears (12) are fixedly connected to the outer surface of the driving rotating rod (11), the two driven bevel gears (13) are respectively fixedly connected to the bottom ends of the two ball screw rods (8), and the two driven bevel gears (13) penetrate through the lower sides of the two supporting blocks (7) and are respectively meshed with the two driving bevel gears (12);
the pushing assembly comprises two worms (17), two fixing plates (18), two worm wheels (19), two eccentric rotating rods (20), a fixing block (21), a reciprocating push-pull frame (22), a pushing plate (23) and two eccentric connecting rods (24), wherein the two worms (17) are respectively and fixedly connected to the top ends of the two ball screws (8), the two fixing plates (18) are respectively and fixedly connected to the upper end of the wafer outer box (1), the two worm wheels (19) are respectively and rotatably connected to the close ends of the two fixing plates (18), the two worm wheels (19) are respectively meshed with the two worm wheels (17), the two eccentric rotating rods (20) are respectively and fixedly connected to the close ends of the two worm wheels (19), the fixing block (21) is fixedly connected to one side end of the wafer outer box (1), the reciprocating push-pull frame (22) is movably penetrated through the fixing block (21), the pushing plate (23) is fixedly connected to the reciprocating push-pull frame (22), and the pushing plate (23) is correspondingly hinged to the two eccentric connecting rods (20) through the two eccentric connecting rods (24) in a hinged mode;
the rolling assembly comprises two fixed racks (14), a plurality of material moving rotating rollers (15) and a plurality of groups of rotating gears (16), wherein the two fixed racks (14) are fixedly connected to one side wall of the wafer outer box (1), the plurality of material moving rotating rollers (15) are rotatably connected in the lifting inner box (4), the plurality of material moving rotating rollers (15) are respectively corresponding to the plurality of wafer separating strips (6), the plurality of groups of rotating gears (16) are respectively fixedly connected to two ends of the plurality of material moving rotating rollers (15), and the plurality of groups of rotating gears (16) movably penetrate through two sides of the lifting inner box (4) to be corresponding to the two fixed racks (14).
2. A wafer handling device for a lithographic machine according to claim 1, wherein: the feeding device (2) comprises a sliding rail supporting frame (201), an electric sliding rail (202) and a feeding sliding seat (203), wherein the sliding rail supporting frame (201) is located on one side of a wafer outer box (1), the electric sliding rail (202) is fixedly connected to the upper end of the sliding rail supporting frame (201), the electric sliding rail (202) is electrically connected with an external power supply, the feeding sliding seat (203) is slidingly connected to the electric sliding rail (202), and the feeding disc (29) is fixedly connected to the feeding sliding seat (203).
3. A wafer handling device for a lithographic machine according to claim 2, wherein: the two side ends of the lifting inner box (4) are provided with a plurality of stable sliding grooves (31), the bottom wall of the wafer outer box (1) is fixedly connected with a plurality of stable strips (25), and the stable sliding grooves (31) are respectively in sliding connection with the stable strips (25).
4. A wafer handling device for a lithographic machine according to claim 3, wherein: two side walls of the wafer outer box (1) are fixedly connected with auxiliary stabilizing blocks (26), and two worms (17) are respectively connected in the two auxiliary stabilizing blocks (26) in a rotating mode.
5. A wafer handling device for a lithographic machine according to claim 4, wherein: the discharging inclined plate (3) is provided with a roller mounting groove (30), and a plurality of sliding rollers (27) are rotationally connected in the roller mounting groove (30).
6. A wafer handling device for a lithographic apparatus according to claim 5, wherein: the upper end of the feeding disc (29) is fixedly connected with a feeding protection frame (28), and an opening of the feeding protection frame (28) corresponds to the discharging inclined plate (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210859707.2A CN115167079B (en) | 2022-07-20 | 2022-07-20 | Wafer conveying device of photoetching machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210859707.2A CN115167079B (en) | 2022-07-20 | 2022-07-20 | Wafer conveying device of photoetching machine |
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| Publication Number | Publication Date |
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| CN115167079A CN115167079A (en) | 2022-10-11 |
| CN115167079B true CN115167079B (en) | 2023-10-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210859707.2A Active CN115167079B (en) | 2022-07-20 | 2022-07-20 | Wafer conveying device of photoetching machine |
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| JP2001156147A (en) * | 1999-11-29 | 2001-06-08 | Rorze Corp | Wafer-conveying device |
| WO2009068241A1 (en) * | 2007-11-27 | 2009-06-04 | Kuka Systems Gmbh | Feed device |
| CN108584285A (en) * | 2018-06-22 | 2018-09-28 | 江苏纳沛斯半导体有限公司 | A kind of stand alone type wafer detection and selection machine feeding mechanism and detection and selection machine |
| CN213059210U (en) * | 2020-09-04 | 2021-04-27 | 镇江晶鼎光电科技有限公司 | Continuous uninterrupted discharging device of photoetching machine |
| CN213536531U (en) * | 2020-10-12 | 2021-06-25 | 锐捷芯盛（天津）电子科技有限公司 | Feeding device of photoetching machine |
| CN113231945A (en) * | 2021-06-24 | 2021-08-10 | 深圳市智动精密设备有限公司 | Jig for arranging and forming semiconductor wafers |
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2022
- 2022-07-20 CN CN202210859707.2A patent/CN115167079B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001156147A (en) * | 1999-11-29 | 2001-06-08 | Rorze Corp | Wafer-conveying device |
| WO2009068241A1 (en) * | 2007-11-27 | 2009-06-04 | Kuka Systems Gmbh | Feed device |
| CN108584285A (en) * | 2018-06-22 | 2018-09-28 | 江苏纳沛斯半导体有限公司 | A kind of stand alone type wafer detection and selection machine feeding mechanism and detection and selection machine |
| CN213059210U (en) * | 2020-09-04 | 2021-04-27 | 镇江晶鼎光电科技有限公司 | Continuous uninterrupted discharging device of photoetching machine |
| CN213536531U (en) * | 2020-10-12 | 2021-06-25 | 锐捷芯盛（天津）电子科技有限公司 | Feeding device of photoetching machine |
| CN113231945A (en) * | 2021-06-24 | 2021-08-10 | 深圳市智动精密设备有限公司 | Jig for arranging and forming semiconductor wafers |
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| Publication number | Publication date |
|---|---|
| CN115167079A (en) | 2022-10-11 |
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