CN115091027A - Positioning mechanism and cutting device - Google Patents

Abstract

The present application discloses a positioning mechanism and a cutting device. The positioning mechanism includes: a stage, a first light source, and an image capturing mechanism, wherein the stage includes a first surface and a second surface opposite to each other along a first direction, the loading stage The stage is provided with a through hole penetrating the first surface and the second surface; wherein, the first surface or the second plane of the stage is used to carry the component to be cut; the first light source is located on one side of the second surface; the image capturing mechanism is located on the first surface The surface side is used to capture at least an image of the element to be cut at the position of the through hole when the first light source illuminates the region where the through hole is located. In the above manner, the present application can improve the clarity of the image captured by the image capturing mechanism and improve the positioning accuracy.

Description

Positioning mechanism and cutting device

technical field

The application belongs to the technical field of cutting, and in particular relates to a positioning mechanism and a cutting device.

Background technique

In order to improve the shooting effect of the front camera, the position of the screen corresponding to the front camera needs to be cut to form a via hole. Usually, a positioning mark is set in the display screen, and the positioning mark is identified by the positioning device to determine the area to be cut of the display screen.

However, when the positioning device is placed on the front of the display screen, it cannot effectively identify the positioning mark, so that the cutting device needs to be additionally provided with a turning mechanism, so that the display screen can be turned over and placed on the back to identify the positioning mark.

SUMMARY OF THE INVENTION

The present application provides a positioning mechanism and a cutting device, which can improve the clarity of the image captured by the image capturing mechanism. No matter when the display module waits for the cutting element to be placed on the front or the back, it can effectively identify the positioning mark and improve the positioning accuracy. And can omit the turning mechanism, improve production efficiency.

In order to solve the above-mentioned technical problems, a technical solution adopted in the present application is to provide a positioning mechanism, comprising: a carrier, including a first surface and a second surface arranged opposite to each other along a first direction, and the carrier is provided with a penetrating first surface and a second surface. The through holes of the surface and the second surface; wherein, the first surface or the second plane of the stage is used to carry the components to be cut; the first light source is located on the side of the second surface; the image capture mechanism is located on the side of the first surface, When the first light source illuminates the area where the through hole is located, at least an image of the component to be cut at the position of the through hole is captured.

Further, the positioning mechanism further includes: a driving member connected with the first light source, and the driving member is used to drive the first light source to move, so that the first light source and the through hole are opposite or staggered along the first direction.

Further, the carrier also includes an accommodating space inside the accommodating space, the accommodating space is located on the side of the second surface facing away from the first surface, and the first surface is used to carry the component to be cut; the first light source and the driving member are located in the accommodating space, And the accommodating space is used to recover the cut part of the element to be cut.

Further, the positioning mechanism further includes: a dust extraction device, at least a part of the dust extraction device is located in the accommodating space, and the dust extraction device is used to extract the dust generated by cutting the element to be cut.

Further, the positioning mechanism further includes: a driving mechanism, and the driving mechanism is used for driving the stage to move, so that the image capturing mechanism and the through hole are opposite or staggered along the first direction.

Further, the positioning mechanism further includes: a second light source located on one side of the first surface, and the image capturing mechanism is further configured to capture at least the component to be cut at the position of the through hole when the first light source and the second light source jointly illuminate the area where the through hole is located. image at .

Further, the positioning mechanism further includes: a controller, coupled with the first light source and the second light source, for controlling the opening and closing of the first light source and the second light source; and in the area where the first light source illuminates the through hole, the second light source When the light source is turned off and the image captured by the image capturing mechanism does not meet the preset requirements, the second light source is controlled to be turned on, so that the first light source and the second light source jointly illuminate the area where the through hole is located.

Further, the first light source and the second light source include a coaxial light source, a local surface light source, or a point light source; and/or, the driving member includes a retractable cylinder.

Further, the first light source includes a local surface light source or a point light source; the second light source includes a coaxial light source.

Further, the component to be cut includes a display module, and the display module includes a polarizer, a display layer and a support film that are stacked in sequence.

In order to solve the above-mentioned technical problems, a technical solution adopted in the present application is to provide a cutting device, including the positioning mechanism in any of the above-mentioned embodiments; The area to be cut falls out of the through hole.

Further, the cutting mechanism is located on one side of the first surface; when the positioning mechanism further includes a driving mechanism, the driving mechanism is used to drive the carriage to move, so that the cutting mechanism is opposite to the through hole along the first direction; the positioning mechanism further includes a driving member At the time, the driving member is used to drive the first light source to move before the cutting mechanism cuts off the to-be-cut area of the to-be-cut component, so that the first light source and the through hole are staggered along the first direction.

Different from the prior art, the beneficial effect of the present application is: before cutting, the first light source in the positioning mechanism for the cutting device provided by the present application can illuminate the area to be cut, because the first light source and the image capturing mechanism are respectively They are located on opposite sides of the stage, so the light reflected by the surface of the area to be cut will not enter the image capture mechanism. Whether the element to be cut is placed on the front or the back, the positioning marks on the element to be cut are clearly visible and easily captured by the image capture mechanism. Captured, the clarity of the image captured by the image capture mechanism is guaranteed, and the positioning accuracy is improved; and the turning mechanism in the cutting device can be omitted to improve production efficiency, thus solving the problem of placing the light source and the image capturing mechanism on the same side of the element to be cut. When the component to be cut is placed on the front, the positioning mark is blurred, and it is not easy to be captured by the image capturing mechanism.

Description of drawings

In order to illustrate the technical solutions in the embodiments of the present application more clearly, the following briefly introduces the drawings that are used in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, under the premise of no creative work, other drawings can also be obtained from these drawings, wherein:

1 is a schematic structural diagram of an embodiment of a positioning mechanism of the present application;

2 is a schematic top view of an embodiment of the element to be cut in FIG. 1;

3 is a schematic structural diagram of another embodiment of the positioning mechanism of the present application;

FIG. 4 is a schematic cross-sectional view of the element to be cut according to an embodiment along the section line A-A in FIG. 1

5 is a schematic structural diagram of an embodiment of the positioning mechanism in FIG. 1 in a cutting state;

6 is a schematic structural diagram of another embodiment of the positioning mechanism of the present application;

7 is a schematic structural diagram of another embodiment of the positioning mechanism of the present application;

FIG. 8 is a schematic structural diagram of an embodiment of the cutting device of the present application.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

Please refer to FIG. 1 . FIG. 1 is a schematic structural diagram of an embodiment of a positioning mechanism of the present application, which is used for a cutting device. The positioning mechanism specifically includes: a stage 10 , a first light source 12 and an image capturing mechanism 16 .

Wherein, the carrier 10 includes a first surface 100 and a second surface 102 arranged opposite to each other along the first direction Y, and the carrier 10 is provided with a through hole 104 penetrating the first surface 100 and the second surface 102; wherein, the first surface 100 or the second surface 102 is used to carry the element 20 to be cut. The orthographic projection of the region to be cut 200 of the element to be cut 20 on the first surface 100 is located within the through hole 104 . The area of the region to be cut 200 may be smaller than that of the through hole 104 . Optionally, the carrier 10 may be made of a hard material such as metal, and the flatness of its surface for carrying the element to be cut 20 is relatively high, so as to facilitate the deformation of the element to be cut 20 captured by the subsequent image capturing mechanism 16 low probability. As shown in FIG. 2 , FIG. 2 is a schematic top view of an embodiment of the element to be cut in FIG. 1 . The element to be cut 20 can be a screen or the like, and a positioning mark 208 (Mark) can be provided on the to-be-cut area 200 (Dummy) of the element to be cut 20, and the positioning mark 208 can be a cross or other easily recognizable shape, So that the subsequent processor can identify and obtain the position information of the region to be cut 200 from the image captured by the image capturing mechanism 16 .

The first light source 12 may be located on one side of the second surface 102 . The image capturing mechanism 16 is located on one side of the first surface 100, and the image capturing mechanism 16 is used to capture at least an image of the component to be cut 20 at the position of the through hole 104 when the first light source 12 illuminates the area where the through hole 104 is located; optionally, The image capturing mechanism 16 may be a CCD camera or the like. The to-be-cut area 200 of the to-be-cut element 20 has a certain transmittance and can transmit the light emitted by the first light source 12 . The light emitted by the first light source 12 can pass through the to-be-cut area 200 of the to-be-cut component 20 to reach the image capture mechanism 16 , so that the image capture mechanism 16 captures an image of the to-be-cut component 20 at the position of the through hole 104 . Subsequently, when the image capturing mechanism 16 obtains the image, the image can be sent to the processor coupled thereto, so that the processor obtains the position information of the region to be cut from the image. Optionally, when the area to be cut contains a positioning mark, the processor can obtain the position information of the positioning mark from the image, and use the position information as the position information of the area to be cut, and the subsequent processor can perform a cutting path based on the position information. planning, so that the cutting mechanism can perform corresponding cutting operations according to the planned cutting path.

It should be noted that, in FIG. 1 , the first surface 100 can be understood as the upper surface, the second surface 102 can be understood as the lower surface, and the first surface 100 is used to carry the component to be cut 20 . At this time, the image capturing mechanism 16 is equivalent to The first light source 12 is located on the upper side of the stage 10 , and the first light source 12 is located on the lower side of the stage 10 . The direction in which the first surface 100 points to the second surface 102 may be the same as the direction of gravity.

In other embodiments, as shown in FIG. 3 , FIG. 3 is a schematic structural diagram of another embodiment of the positioning mechanism of the present application. In FIG. 3 , the second surface 102 can be understood as the upper surface, the first surface 100 can be understood as the lower surface, and the second surface 102 is used to carry the component to be cut 20 . At this time, the image capturing mechanism 16 is equivalent to the On the lower side, the first light source 12 corresponds to the upper side of the stage 10 . The direction in which the first surface 100 points to the second surface 102 may be opposite to the direction of gravity.

In the above design, before cutting, the first light source 12 can illuminate the area to be cut 200. Since the first light source 12 and the image capturing mechanism 16 are located on opposite sides of the stage 10, they are reflected by the surface of the area to be cut 200. The light will not enter the image capture mechanism, 16, no matter whether the element to be cut 20 is placed on the front or the back, the positioning marks on the element to be cut 20 are clearly visible and easily captured by the image capture mechanism 16 to ensure that the image capture mechanism 16 captures The sharpness of the image can be improved, and the positioning accuracy can be improved; and the turning mechanism in the cutting device can be omitted, and the production efficiency can be improved, so as to solve the problem that when the light source and the image capturing mechanism are placed on the same side of the element to be cut 20, the display module waits for the element to be cut. When the cutting element 20 is placed on the front side, there is a reflection phenomenon on the cutting element 20, and the reflected light will be reflected to the image capturing mechanism, resulting in blurred positioning marks and difficult to be captured by the image capturing mechanism.

Optionally, please refer to FIG. 4 . FIG. 4 is a schematic cross-sectional view of the element to be cut in one embodiment along the line A-A in FIG. 1 . The element to be cut 20 can be a display module, such as a flexible display module or a rigid display module. The display module may include a polarizer 204 and a display layer 202 arranged in layers. The polarizer 204 may include a linear polarizer 2042 and a quarter-wave plate 2040 which are arranged in layers. The quarter-wave plate 2040 may be located between the linear deflection layer 2042 and the display layer 202 . The linear polarization layer 2042 (PVA) can only pass light of a specific polarization direction directly. The main function of the quarter wave plate 2040 is to increase the phase by 45 degrees in a certain direction. Positioning marks (not shown in FIG. 4 ) may be provided on the display layer 202 . The display module may further include a support film 206 . The display layer 202 is located between the polarizer 204 and the support film 206 . The positioning marks can be provided on the film layer between the polarizer 204 and the support film 206 . The front placement of the display module means that the display layer 202 is located between the polarizer 204 and the surface for carrying the component to be cut 20 . The display module backside placement means that the polarizer 204 is located between the display layer 202 and the surface for carrying the component to be cut 20 . The to-be-cut area of the display module corresponds to the corresponding area of the photosensitive element, and the display module after the to-be-cut area is cut off, a light-transmitting hole is formed here. In order to solve the problem that the transmittance of the to-be-cut area 200 is not high, resulting in poor light collection effect of the photosensitive element.

In one embodiment, please continue to refer to FIG. 1 , when the first surface 100 is used to carry the component to be cut 20 , that is, when the first light source 12 is located on the lower side of the stage 10 , the positioning mechanism provided by the present application further includes and the first A driver 14 to which the light source 12 is connected. The driving member 14 is used to drive the first light source 12 to move, so that the first light source 12 and the through hole 104 are disposed opposite or staggered along the first direction Y. Optionally, the driving member 14 can be used to drive the first light source 12 to move along the second direction X, so that the first light source 12 and the through hole 104 are arranged opposite or staggered along the first direction Y; The first direction Y in which the surface 100 points to the second surface 102 is vertical. For example, as shown in FIG. 1 , before cutting, the driving member 14 is used to drive the first light source 12 to move to the position of the through hole 104 along the second direction X, and the first light source 12 illuminates the area to be cut 200 at the position of the through hole 104 , In order for the image capture mechanism to capture the image and identify the positioning mark; optionally, the central axis of the first light source 12 may be coincident with the central axis of the area to be cut 200, so that the first light source 12 has a better illumination effect on the area to be cut 200 . As shown in FIG. 5 , FIG. 5 is a schematic structural diagram of an embodiment of the positioning mechanism in FIG. 1 in a cutting state. After the image capturing mechanism captures the image, before cutting, the driving member 14 is used to drive the first light source 12 away from the through hole 104 along the second direction X, so that the driving member 14 and the first light source 12 are directly connected to the stage 10 during cutting. The projection is staggered from the through hole 104 , and at this time, the first light source 12 will not affect the falling of the cut area to be cut 200 . It should be noted that the second direction X marked in FIG. 1 and FIG. 5 is a horizontal direction, but it can be understood that the second direction X may be any direction on a horizontal plane parallel to the first surface 100 The direction is not limited in this application. Optionally, the driving member 14 includes a telescopic cylinder, the telescopic cylinder includes a telescopic rod, one end of the telescopic rod is fixedly connected to the first light source 12 , and the first light source 12 moves along the second direction X under the driving of the telescopic rod.

In addition, in FIG. 1 , the first light source 12 and the driving member 14 are located outside the stage 10 ; in other embodiments, please refer to FIG. 6 , which is a schematic structural diagram of another embodiment of the positioning mechanism of the present application. The stage 10 may also include a receiving space 106 within it. Optionally, the accommodating space 106 is located on the side of the second surface 102 facing away from the first surface 100 , and the first surface 100 is used to carry the component to be cut 20 ; wherein, the first light source 12 and the driver 14 may be located in the accommodating space 106 , and the accommodating space 106 is used for recovering the cut part of the element 20 to be cut. Optionally, a collection box may also be provided inside the accommodating space 106 , located just below the through hole 104 , to collect the cut parts of the element 20 to be cut. The above-mentioned design of the carrier 10 can reduce the probability that the fallen cut part is sputtered to other positions, which is convenient for subsequent collection and processing. Alternatively, the image capturing mechanism 16 may be located outside the receiving space 106 .

Alternatively, please continue to refer to FIG. 6 , the positioning mechanism provided by the present application further includes a dust extraction device 18 , and at least part of the dust extraction device 18 is located in the accommodating space 106 for extracting the dust generated by cutting the element to be cut 20 . dust. For example, the dust extraction device 18 includes a vacuum generator 182 and a vacuum line 180 in communication with the vacuum generator 182 . The vacuum generator 182 may be located outside the accommodating space 106; the vacuum tube 180 may extend from the interior of the accommodating space 106 to the outside of the accommodating space 106, and the orthographic projection of the end of the vacuum tube 180 located in the accommodating space 106 on the first surface 100 is located at The periphery of the through hole 104; optionally, the side wall of the accommodating space 106 is provided with a via hole (not marked), and the vacuum tube 180 passes through the via hole. The introduction of the above-mentioned dust extraction device 18 can extract the dust or small particles generated when cutting the element to be cut 20 without affecting the falling of the cut part, so as to reduce the dust or small particles attached to the surface of the element to be cut 20. , thereby reducing the probability of stress concentration at the position of dust or small particles under the action of extrusion force in the subsequent process, resulting in top damage and cracking of the element to be cut 20 .

Of course, in other embodiments, the vacuum tube 180 and the vacuum generator 182 may all be placed inside the accommodating space 106 , which is not limited in this application.

In another embodiment, please refer to FIG. 3 again, when the second surface 102 is used to carry the component to be cut 20, that is, when the image capturing mechanism 16 is located on the lower side of the stage 10, the positioning mechanism provided by the present application further includes and The drive 14 to which the image capture mechanism 16 is connected. The driving member 14 can be used to drive the image capturing mechanism 16 to move along the direction, so that the image capturing mechanism 16 and the through hole 104 are disposed opposite or staggered along the first direction Y. The driving member 14 can be used to drive the image capturing mechanism 16 to move along the second direction X, so that the image capturing mechanism 16 and the through hole 104 are arranged opposite or staggered along the first direction Y; wherein the second direction X and the first surface 100 point to the first direction. The first direction Y of the two surfaces 102 is vertical. For example, as shown in FIG. 3 , before cutting, the driving member 14 is used to drive the image capturing mechanism 16 to move to the position of the through hole 104 along the second direction X, and make the first light source 12 illuminate the component to be cut at the position of the through hole 104 . , so that the image capturing mechanism captures the image and identifies the positioning mark, and after the image capturing mechanism captures the image, the driving member 14 is used to drive the image capturing mechanism 16 away from the through hole 104 along the second direction X before cutting, so as to drive the member during cutting 14 and the orthographic projection of the image capturing mechanism 16 on the stage 10 are staggered from the through hole 104 , at this time, the image capturing mechanism 16 will not affect the falling of the cut area to be cut 200 .

In addition, similar to the embodiments in FIGS. 1 and 6 , the image capturing mechanism 16 and the driving member 14 may be located outside the stage 10; The side of the surface 100 facing away from the second surface 102, the second surface 102 is used to carry the element to be cut 20; the image capture mechanism 16 and the driving member 14 can be located in the accommodating space 106, and the accommodating space 106 is used for recycling the element to be cut 20 the cut part. Optionally, the first light source 12 may be located outside the accommodating space.

In yet another embodiment, please refer to FIG. 7 , which is a schematic structural diagram of another embodiment of the positioning mechanism of the present application. In this embodiment, the positioning mechanism may also include a second light source 11 in addition to the related elements mentioned in the above embodiments. The first light source 12 and the second light source 11 may be located on different sides. The second light source 11 is located on one side of the first surface 100 , that is, the second light source 11 is disposed on the same side as the image capturing mechanism 16 , and the image capturing mechanism 16 is also used to jointly illuminate the area where the through hole 104 is located in the first light source 12 and the second light source 11 , at least an image of the element to be cut 20 at the location of the through hole 104 is captured. Optionally, the central axis of the second light source 11 is coincident with the central axis of the image capturing mechanism 16; for example, the second light source 11 may be annular, and the orthographic projection of the second light source 11 on the first surface of the stage 10 may surround The second light source 11 may be close to the first surface of the stage 10 relative to the image capturing mechanism 16 . In the above design manner, the first light source 12 and the second light source 11 can cooperate with each other, so that the positioning mechanism can be applied to more application scenarios, and the image captured by the image capturing mechanism 16 can be more effective.

Optionally, when the image capturing mechanism 16 is located in the accommodating space, the second light source 11 may be located in the accommodating space, and the positioning mechanism may further include a second driving member connected to the second light source 11, and the second driving member is used to drive the first light source 11. The two light sources are moved so that the second light source and the through hole are opposite or staggered along the first direction, so that when the image is captured, the second light source is opposite to the through hole along the first direction, and after the image is captured, before cutting off the component to be cut , so that the second light source and the through hole are staggered along the first direction, so that the second light source does not affect the drop of the area to be cut. Optionally, when the image capturing mechanism 16 is located outside the accommodating space, the second light source 11 may be located outside the accommodating space, and the positions of the image capturing mechanism 16 and the second light source 11 may be fixed without moving after image capturing.

Optionally, the first light source 12 and the second light source 11 include coaxial light sources, local surface light sources, or point light sources. Preferably, the first light source 12 includes a local surface light source or a point light source; the second light source 11 includes a coaxial light source. In the above design manner, the types of the first light source 12 and the second light source 11 are relatively common and easy to obtain. In addition, the first light source 12 is preferably a local surface light source or a point light source, so that the first light source 12 can more intensively illuminate the area to be cut 200 at the position of the through hole 104 ; the second light source 11 is preferably a coaxial light source. In this way, the intensity of the reflected light generated after the light from the second light source 11 is irradiated to the to-be-cut area 200 can be reduced, so as to reduce the influence of the reflected light on the effect of the image captured by the image capturing mechanism 16 .

Please continue to refer to FIG. 7 , the positioning mechanism provided by the present application further includes a controller 13 , and the controller 13 is coupled to the first light source 12 and the second light source 11 . The controller 13 is used to control the opening and closing of the first light source 12 and the second light source 11, so that when the image capturing mechanism 16 captures an image, at least one of the first light source 12 and the second light source 11 illuminates the light at the position of the through hole 104. Element to be cut. In the above-mentioned design manner, the introduction of the controller 13 improves the automation degree of the positioning mechanism, so as to improve the production efficiency.

Optionally, the controller 13 is used to control the opening and closing of the first light source 12 and the second light source 11; and when the first light source 12 illuminates the area where the through hole 104 is located, the second light source 11 is turned off, and the image captured by the image capture mechanism 16 is turned off. When the image does not meet the preset requirements, the second light source 11 is controlled to be turned on, so that the first light source 12 and the second light source 11 jointly illuminate the area where the through hole 104 is located, so as to capture the image of the component to be cut at the position of the through hole.

Optionally, the manner of coupling between the controller 13 and the first light source 12 and the second light source 11 may be wired or wireless communication connection.

In one embodiment, the controller 13 is specifically configured to control one of the first light source 12 and the second light source 11 to illuminate the component to be cut at the position of the through hole 104 before cutting, and the processor determines that the image captured by the image capturing mechanism 16 When the image does not meet the preset requirements, the first light source 12 and the second light source 11 are further controlled to jointly illuminate the element to be cut at the position of the through hole 104 . That is, in the positioning process, only one light source is firstly irradiated on the component to be cut at the position of the through hole 104, and then the image capturing mechanism 16 captures and obtains an image based on the current lighting conditions. When the processor determines the clarity of the positioning mark in the image according to the image When the brightness or brightness does not meet the preset requirements, the controller 13 further controls another light source to light up, so that the clarity and brightness of the positioning marks in the image captured by the image capture mechanism 16 can meet the preset conditions to ensure the positioning results. accuracy.

Preferably, the controller 13 and the processor are coupled through wired or wireless communication, so that information exchange can be performed between the controller 13 and the processor, so as to further improve the automation degree of the positioning mechanism. And the controller 13 and the processor can be integrated into one device to reduce the device volume.

In an application scenario, the priority of the first light source 12 may be higher than the priority of the second light source 11; that is, the controller 13 is used to control the first light source 12 to illuminate the component to be cut at the position of the through hole 104 before cutting, and the first The two light sources 11 are turned off; and when the processor determines that the image captured by the image capture mechanism 16 does not meet the preset requirements, it controls the first light source 12 and the second light source 11 to jointly illuminate the component to be cut at the position of the through hole 104 . The first light source 12 and the image capturing mechanism 16 are located on opposite sides of the stage 10. When the first light source 12 illuminates the component to be cut at the position of the through hole 104, even if the area to be cut 200 generates reflected light, the reflected light will also Not captured by the image capture mechanism 16 so that the quality of the image captured by the image capture mechanism 16 is better. The above-mentioned design method of preferentially using the first light source 12 can reduce the energy consumption of the positioning mechanism and reduce the cost.

In other embodiments, the manner in which the controller 13 controls the first light source 12 and the second light source 11 may also be other. For example, the controller 13 is used to control at least one of the first light source 12 and the second light source 11 to illuminate the component to be cut at the position of the through hole 104 before cutting, and the processor determines that the image captured by the image capturing mechanism 16 does not meet the predetermined requirements. When required, the brightness of the light source that is illuminating the element to be cut at the location of the through hole 104 is controlled. For example, when the controller 13 only controls the first light source 12 to illuminate the component to be cut at the position of the through hole 104 before cutting, and the processor determines that the brightness or definition of the positioning marks in the image captured by the image capturing mechanism 16 is insufficient, the controller 13 controls The controller 13 can control the brightness of the first light source 12 to increase. The above design method can further improve the application range of the positioning mechanism.

For another example, the controller 13 can also control the working modes of the first light source 12 and the second light source 11 according to the placement mode of the element to be cut 20 . Specifically, the element to be cut 20 includes a display module, and the display module includes a polarizer, a display layer and a support film that are stacked in sequence. Optionally, the positioning marks on the element to be cut 20 may be formed by special patterns in one or more film layers in the display module. The first surface 100 is used to carry the component to be cut 20, and the controller 13 is used to control the first light source 12 or the second light source 12 in response to the polarizer facing the first surface 100 (ie, when the polarizer is located between the first surface and the supporting film). The light source 11 illuminates the component to be cut at the position of the through hole 104; in response to the polarizer facing away from the first surface 100 (ie, when the support film is located between the polarizer and the first surface 100), the controller 13 is used to control the first light source 12 to pass through. For the element to be cut at the position of the hole 104, the second light source 11 is turned off. Of course, at this time, if the controller 13 receives that the image captured by the image capturing mechanism 16 does not meet the preset requirements, the controller 13 may further control the other turned off light source to turn on, so that the two light sources can illuminate the light source together. The element to be cut at the location of the hole 104 .

In addition, please continue to refer to FIG. 7 , the controller 13 can also be coupled to the driving element 14 for controlling the start and stop of the driving element 14 . For example, the controller 13 sends an approaching instruction related to the second direction X to the driving member 14 before cutting, so that the driving member 14 drives the first light source 12 to move along the second direction X to the position of the through hole 104 according to the approaching instruction and when the controller 13 determines that the image captured by the image capture mechanism 16 meets the preset condition, the controller 13 issues a remote command related to the second direction X to the driving member 14, so that the driving member 14 drives the first driving member 14 according to the remote command. A light source 12 moves away from the through hole 104 along the second direction X.

Optionally, when the driving member 14 is also used to drive the first light source 12 to move in the first direction Y, the controller 13 may also issue a message when the processor determines that the image captured by the image capturing mechanism 16 does not meet the preset conditions. A movement command related to the first direction Y is sent to the driving member 14, so that the driving member 14 drives the first light source 12 to approach or move away from the through hole 104 along the first direction Y according to the movement command, so as to change the application of the first light source 12 to the to-be-cut The brightness of the light in the area 200 .

In addition, the positioning mechanism provided in the present application may further include a driving mechanism (not shown in the figure). Optionally, the driving mechanism is used to drive the stage 10 to move, so that the image capturing mechanism 16 can be opposed to the through hole 104 along the first direction Y or staggered. For example, before cutting, the driving mechanism can drive the stage 10 to move, so that the image capturing mechanism 16 is disposed opposite the through hole 104 along the first direction Y, and the image capturing mechanism 16 can at least capture the component to be cut 20 at the position of the through hole 104 and when the processor obtains the position information of the positioning marks in the component to be cut 20 from the image, the driving mechanism can drive the stage 10 to move, so that the image capturing mechanism 16 and the through hole 104 are dislocated along the first direction Y, The subsequent cutting mechanism may perform a cutting operation at the position of the through hole 104 . Optionally, the first light source 12 and the driving member 14 may be located in the accommodating space of the stage 10 . When the driving mechanism drives the stage 10 to move, the first light source 12 and the driving member 14 in the accommodating space of the stage 10 also move together.

When the image capturing mechanism 16 and the driving member 14 are located in the accommodating space of the stage, optionally, the driving mechanism is used to drive the stage 10 to move, so that the first light source 12 can be opposite to the through hole 104 along the first direction Y or stagger. When the driving mechanism drives the stage 10 to move, the image capturing mechanism 16 and the driving member 14 in the accommodating space of the stage 10 also move together.

In addition, the present application also provides a cutting device including any of the above positioning mechanisms; please refer to FIG. 8 , which is a schematic structural diagram of an embodiment of the cutting device of the present application. The cutting device includes the positioning mechanism 26 and the cutting mechanism 22 (eg, laser cutting mechanism, etc.) mentioned in any of the above-mentioned embodiments. The area to be cut 200 is dropped from the through hole 104 .

Optionally, the cutting device provided by the present application may further include a processor 24, the processor 24, the image capturing mechanism 16 and the controller 13, for obtaining the position information of the area to be cut 200 according to the image captured by the image capturing mechanism 16 .

Alternatively, the cutting mechanism 22 is located on one side of the first surface 100; when the positioning mechanism 26 further includes a driving mechanism (not shown), the driving mechanism is used to drive the stage 10 to move, so that the cutting mechanism 22 is connected to the through hole. 104 are opposite along the first direction Y; when the positioning mechanism 26 further includes the driving member 14, the driving member 14 is used to drive the first light source 12 to move before the cutting mechanism 22 cuts off the to-be-cut area of the component 20 to be cut, so as to make the first light source 12 move. A light source 12 is staggered along the first direction X from the through hole 104 . The cutting mechanism 22 may be located outside the receiving space of the stage. The cutting mechanism 22 may comprise a laser cutting mechanism.

In an application scenario, please refer to Fig. 8, the above-mentioned cutting device can cut the component to be cut as follows:

A. The component to be cut 20 is placed on the carrier 10 by a device such as a robotic arm, and the orthographic projection of the area 200 to be cut of the component to be cut 20 on the carrier 10 is located in the through hole 104 .

B. The driving member 14 drives the first light source 12 to move along the second direction X to the position of the through hole 104 ; and at this time, the second light source 11 and the first light source 12 can be lit at the same time.

C. The image capture mechanism 16 captures an image of the element to be cut 20 from the side of the first surface 100 and transmits the image to the processor 24 .

D. The processor 24 obtains the position information of the positioning marks in the component to be cut 20 from the image, and performs cutting path planning based on the position information.

E. The processor 24 sends the planned cutting path to the cutting mechanism, and the driving member 14 drives the first light source 12 to move away from the through hole 104 along the second direction X.

F. The cutting mechanism 22 cuts and removes the to-be-cut area according to the issued cutting path, and the cut to-be-cut area 200 falls into the lower collection box through the through hole 104 .

G. The cut cutting element 20 is removed from the stage 10 by means of a robotic arm or the like.

Of course, in other embodiments, the cooperation manner of the first light source 12 and the second light source 11 may also be other, for details, please refer to the relevant control manner of the controller 13 above, which will not be repeated here.

It should be noted that when the first light source 12 is used alone, and the component to be cut 20 includes a display module, and the display module includes a polarizer, a display layer and a supporting film that are stacked in sequence, the polarizer can be located on the first surface. Between the film and the support film, the cutting operation performed by the cutting mechanism 22 from the first surface side can be called back cutting; The cutting operation performed on the side may be referred to as a tangent. When the second light source 11 is used alone, and the component to be cut 20 includes a display module, the display module includes a polarizer, a display layer and a supporting film that are stacked in sequence, and the polarizer must be located between the first surface and the supporting film. time, that is, the cutting mechanism 22 can only perform back cutting at this time.

The above descriptions are only the embodiments of the present application, and are not intended to limit the scope of the patent of the present application. Any equivalent structure or equivalent process transformation made by using the contents of the description and drawings of the present application, or directly or indirectly applied to other related technologies Fields are similarly included within the scope of patent protection of this application.

Claims (10)

1. a positioning mechanism, is characterized in that, comprises: a stage, comprising a first surface and a second surface opposite to each other along a first direction, the stage is provided with a through hole penetrating the first surface and the second surface; wherein, all the stages of the stage the first surface or the second plane is used to carry the element to be cut; a first light source, located on one side of the second surface; An image capturing mechanism, located on one side of the first surface, is configured to capture at least an image of the component to be cut at the position of the through hole when the first light source illuminates the area where the through hole is located. 2. The positioning mechanism according to claim 1, wherein the positioning mechanism further comprises: a driving member connected with the first light source, The driving member is used for driving the first light source to move, so that the first light source and the through hole are opposite or staggered along the first direction. 3. The positioning mechanism according to claim 2, characterized in that, The carrier also includes an accommodating space inside the accommodating space, the accommodating space is located on the side of the second surface facing away from the first surface, and the first surface is used to carry the element to be cut; the first surface The light source and the driving member are located in the accommodating space, and the accommodating space is used for recovering the cut part of the element to be cut. 4 . The positioning mechanism according to claim 3 , wherein the positioning mechanism further comprises: a dust extraction device, at least a part of the dust extraction device is located in the accommodating space, and the dust extraction device is used to extract the dust. 5 . Remove dust from cutting the element to be cut. 5. The positioning mechanism according to claim 2, wherein the positioning mechanism further comprises: and a driving mechanism, which is used for driving the stage to move, so that the image capturing mechanism and the through hole are opposite or staggered along the first direction. 6. The positioning mechanism according to claim 1, wherein the positioning mechanism further comprises: A second light source is located on one side of the first surface, and the image capturing mechanism is further configured to capture at least the element to be cut when the first light source and the second light source jointly illuminate the area where the through hole is located Image at the location of the via. 7. The positioning mechanism according to claim 6, wherein the positioning mechanism further comprises: a controller, coupled to the first light source and the second light source, for controlling the opening and closing of the first light source and the second light source; When the second light source is turned off and the image captured by the image capturing mechanism does not meet the preset requirements, the second light source is controlled to be turned on, so that the first light source and the second light source are illuminated together the area where the through hole is located. 8. The positioning mechanism according to claim 6, characterized in that, The first light source and the second light source include a coaxial light source, a local surface light source, or a point light source; and/or, the driving member includes a retractable cylinder; Preferably, the first light source includes a local surface light source or a point light source; the second light source includes a coaxial light source; Preferably, the component to be cut includes a display module, and the display module includes a polarizer, a display layer and a support film that are stacked in sequence. 9. A cutting device, characterized in that, comprising: The positioning mechanism of any one of claims 1-8; The cutting mechanism is used for cutting and removing the to-be-cut area of the to-be-cut element, and the cut to-be-cut area falls out of the through hole. 10. The cutting device according to claim 9, wherein the cutting mechanism is located on one side of the first surface; When the positioning mechanism further includes a driving mechanism, the driving mechanism is used to drive the carriage to move, so that the cutting mechanism is opposite to the through hole along the first direction; When the positioning mechanism further includes a driving member, the driving member is used to drive the first light source to move before the cutting mechanism cuts off the to-be-cut area of the to-be-cut element, so as to make the first light source move. staggered from the through hole along the first direction.

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