CN115066408B - 接合体、保持装置以及静电卡盘 - Google Patents

接合体、保持装置以及静电卡盘 Download PDF

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Publication number
CN115066408B
CN115066408B CN202180013930.9A CN202180013930A CN115066408B CN 115066408 B CN115066408 B CN 115066408B CN 202180013930 A CN202180013930 A CN 202180013930A CN 115066408 B CN115066408 B CN 115066408B
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CN
China
Prior art keywords
metal layer
hole
metal
electrostatic chuck
holes
Prior art date
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Active
Application number
CN202180013930.9A
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English (en)
Chinese (zh)
Other versions
CN115066408A (zh
Inventor
吉本修
荒川竜一
田中智雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
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Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Publication of CN115066408A publication Critical patent/CN115066408A/zh
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Publication of CN115066408B publication Critical patent/CN115066408B/zh
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    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12Metallic interlayers
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32Ceramic
    • C04B2237/34Oxidic
    • C04B2237/343Alumina or aluminates
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32Ceramic
    • C04B2237/36Non-oxidic
    • C04B2237/366Aluminium nitride
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40Metallic
    • C04B2237/403Refractory metals
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/59Aspects relating to the structure of the interlayer
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/59Aspects relating to the structure of the interlayer
    • C04B2237/597Aspects relating to the structure of the interlayer whereby the interlayer is continuous but porous, e.g. containing hollow or porous particles, macro- or micropores or cracks
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/62Forming laminates or joined articles comprising holes, channels or other types of openings
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/76Forming laminates or joined articles comprising at least one member in the form other than a sheet or disc, e.g. two tubes or a tube and a sheet or disc
    • C04B2237/765Forming laminates or joined articles comprising at least one member in the form other than a sheet or disc, e.g. two tubes or a tube and a sheet or disc at least one member being a tube

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Ceramic Products (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
CN202180013930.9A 2020-08-21 2021-06-25 接合体、保持装置以及静电卡盘 Active CN115066408B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-139760 2020-08-21
JP2020139760 2020-08-21
PCT/JP2021/024111 WO2022038898A1 (ja) 2020-08-21 2021-06-25 接合体、保持装置、および、静電チャック

Publications (2)

Publication Number Publication Date
CN115066408A CN115066408A (zh) 2022-09-16
CN115066408B true CN115066408B (zh) 2023-12-05

Family

ID=80350311

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180013930.9A Active CN115066408B (zh) 2020-08-21 2021-06-25 接合体、保持装置以及静电卡盘

Country Status (6)

Country Link
US (1) US20230303457A1 (https=)
JP (1) JP7300069B2 (https=)
KR (1) KR102814220B1 (https=)
CN (1) CN115066408B (https=)
TW (1) TWI798730B (https=)
WO (1) WO2022038898A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021261284A1 (ja) * 2020-06-26 2021-12-30 日本特殊陶業株式会社 接合体、および静電チャック
JPWO2025220065A1 (https=) * 2024-04-15 2025-10-23

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1891671A (zh) * 2005-07-04 2007-01-10 京瓷株式会社 接合体和使用其的晶片支撑构件及晶片处理方法
TW200711030A (en) * 2005-02-23 2007-03-16 Kyocera Corp Joined article and member for holding wafer and structure for mounting the same, and method for treating wafer

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59156976A (ja) * 1983-02-25 1984-09-06 臼井国際産業株式会社 金属部材とセラミツク部材との結合体及びその結合方法
JP3485390B2 (ja) 1995-07-28 2004-01-13 京セラ株式会社 静電チャック
US6490146B2 (en) * 1999-05-07 2002-12-03 Applied Materials Inc. Electrostatic chuck bonded to base with a bond layer and method
JP4107643B2 (ja) * 2002-07-23 2008-06-25 日本碍子株式会社 接合体の製造方法
DE60326599D1 (de) * 2002-09-06 2009-04-23 Ork Corp Metallbalgrohr, verfahren zur herstellung desselben und flexibles rohr für hochdruckfluid
JP5204958B2 (ja) * 2006-06-19 2013-06-05 日本発條株式会社 接合体
JP6525793B2 (ja) 2015-07-29 2019-06-05 京セラ株式会社 試料保持具
JP6786439B2 (ja) * 2016-06-28 2020-11-18 日本特殊陶業株式会社 保持装置および保持装置の製造方法
CN110770877B (zh) * 2017-06-13 2024-06-18 日本碍子株式会社 半导体制造装置用部件
US11715652B2 (en) * 2018-09-28 2023-08-01 Ngk Insulators, Ltd. Member for semiconductor manufacturing apparatus
JP7175773B2 (ja) * 2019-01-07 2022-11-21 京セラ株式会社 試料保持具

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200711030A (en) * 2005-02-23 2007-03-16 Kyocera Corp Joined article and member for holding wafer and structure for mounting the same, and method for treating wafer
CN1891671A (zh) * 2005-07-04 2007-01-10 京瓷株式会社 接合体和使用其的晶片支撑构件及晶片处理方法

Also Published As

Publication number Publication date
KR20220124252A (ko) 2022-09-13
WO2022038898A1 (ja) 2022-02-24
KR102814220B1 (ko) 2025-05-28
CN115066408A (zh) 2022-09-16
TWI798730B (zh) 2023-04-11
JP7300069B2 (ja) 2023-06-28
US20230303457A1 (en) 2023-09-28
JPWO2022038898A1 (https=) 2022-02-24
TW202226438A (zh) 2022-07-01

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