CN115066408B - 接合体、保持装置以及静电卡盘 - Google Patents
接合体、保持装置以及静电卡盘 Download PDFInfo
- Publication number
- CN115066408B CN115066408B CN202180013930.9A CN202180013930A CN115066408B CN 115066408 B CN115066408 B CN 115066408B CN 202180013930 A CN202180013930 A CN 202180013930A CN 115066408 B CN115066408 B CN 115066408B
- Authority
- CN
- China
- Prior art keywords
- metal layer
- hole
- metal
- electrostatic chuck
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
- C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
- C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/12—Metallic interlayers
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/34—Oxidic
- C04B2237/343—Alumina or aluminates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/36—Non-oxidic
- C04B2237/366—Aluminium nitride
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/40—Metallic
- C04B2237/403—Refractory metals
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/59—Aspects relating to the structure of the interlayer
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/59—Aspects relating to the structure of the interlayer
- C04B2237/597—Aspects relating to the structure of the interlayer whereby the interlayer is continuous but porous, e.g. containing hollow or porous particles, macro- or micropores or cracks
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/62—Forming laminates or joined articles comprising holes, channels or other types of openings
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/76—Forming laminates or joined articles comprising at least one member in the form other than a sheet or disc, e.g. two tubes or a tube and a sheet or disc
- C04B2237/765—Forming laminates or joined articles comprising at least one member in the form other than a sheet or disc, e.g. two tubes or a tube and a sheet or disc at least one member being a tube
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Ceramic Products (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020-139760 | 2020-08-21 | ||
| JP2020139760 | 2020-08-21 | ||
| PCT/JP2021/024111 WO2022038898A1 (ja) | 2020-08-21 | 2021-06-25 | 接合体、保持装置、および、静電チャック |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115066408A CN115066408A (zh) | 2022-09-16 |
| CN115066408B true CN115066408B (zh) | 2023-12-05 |
Family
ID=80350311
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202180013930.9A Active CN115066408B (zh) | 2020-08-21 | 2021-06-25 | 接合体、保持装置以及静电卡盘 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20230303457A1 (https=) |
| JP (1) | JP7300069B2 (https=) |
| KR (1) | KR102814220B1 (https=) |
| CN (1) | CN115066408B (https=) |
| TW (1) | TWI798730B (https=) |
| WO (1) | WO2022038898A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021261284A1 (ja) * | 2020-06-26 | 2021-12-30 | 日本特殊陶業株式会社 | 接合体、および静電チャック |
| JPWO2025220065A1 (https=) * | 2024-04-15 | 2025-10-23 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1891671A (zh) * | 2005-07-04 | 2007-01-10 | 京瓷株式会社 | 接合体和使用其的晶片支撑构件及晶片处理方法 |
| TW200711030A (en) * | 2005-02-23 | 2007-03-16 | Kyocera Corp | Joined article and member for holding wafer and structure for mounting the same, and method for treating wafer |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59156976A (ja) * | 1983-02-25 | 1984-09-06 | 臼井国際産業株式会社 | 金属部材とセラミツク部材との結合体及びその結合方法 |
| JP3485390B2 (ja) | 1995-07-28 | 2004-01-13 | 京セラ株式会社 | 静電チャック |
| US6490146B2 (en) * | 1999-05-07 | 2002-12-03 | Applied Materials Inc. | Electrostatic chuck bonded to base with a bond layer and method |
| JP4107643B2 (ja) * | 2002-07-23 | 2008-06-25 | 日本碍子株式会社 | 接合体の製造方法 |
| DE60326599D1 (de) * | 2002-09-06 | 2009-04-23 | Ork Corp | Metallbalgrohr, verfahren zur herstellung desselben und flexibles rohr für hochdruckfluid |
| JP5204958B2 (ja) * | 2006-06-19 | 2013-06-05 | 日本発條株式会社 | 接合体 |
| JP6525793B2 (ja) | 2015-07-29 | 2019-06-05 | 京セラ株式会社 | 試料保持具 |
| JP6786439B2 (ja) * | 2016-06-28 | 2020-11-18 | 日本特殊陶業株式会社 | 保持装置および保持装置の製造方法 |
| CN110770877B (zh) * | 2017-06-13 | 2024-06-18 | 日本碍子株式会社 | 半导体制造装置用部件 |
| US11715652B2 (en) * | 2018-09-28 | 2023-08-01 | Ngk Insulators, Ltd. | Member for semiconductor manufacturing apparatus |
| JP7175773B2 (ja) * | 2019-01-07 | 2022-11-21 | 京セラ株式会社 | 試料保持具 |
-
2021
- 2021-06-25 KR KR1020227027559A patent/KR102814220B1/ko active Active
- 2021-06-25 WO PCT/JP2021/024111 patent/WO2022038898A1/ja not_active Ceased
- 2021-06-25 JP JP2022543306A patent/JP7300069B2/ja active Active
- 2021-06-25 TW TW110123298A patent/TWI798730B/zh active
- 2021-06-25 CN CN202180013930.9A patent/CN115066408B/zh active Active
- 2021-06-25 US US18/041,284 patent/US20230303457A1/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200711030A (en) * | 2005-02-23 | 2007-03-16 | Kyocera Corp | Joined article and member for holding wafer and structure for mounting the same, and method for treating wafer |
| CN1891671A (zh) * | 2005-07-04 | 2007-01-10 | 京瓷株式会社 | 接合体和使用其的晶片支撑构件及晶片处理方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20220124252A (ko) | 2022-09-13 |
| WO2022038898A1 (ja) | 2022-02-24 |
| KR102814220B1 (ko) | 2025-05-28 |
| CN115066408A (zh) | 2022-09-16 |
| TWI798730B (zh) | 2023-04-11 |
| JP7300069B2 (ja) | 2023-06-28 |
| US20230303457A1 (en) | 2023-09-28 |
| JPWO2022038898A1 (https=) | 2022-02-24 |
| TW202226438A (zh) | 2022-07-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |