CN115056369A - Quartz support of semiconductor diffusion furnace and precision positioning device thereof - Google Patents

Abstract

The invention relates to semiconductor device production equipment and discloses a quartz bracket of a semiconductor diffusion furnace and a precision positioning device thereof, wherein the quartz bracket of the semiconductor diffusion furnace comprises a vertical bracket shaft and a bracket claw disc sleeved on the vertical bracket shaft, wherein one end of the vertical bracket shaft, which is used for being matched with the bracket claw disc, is provided with a conical surface, and the bracket claw disc is provided with a conical notch for embedding one end of the vertical bracket shaft with the conical surface; the split quartz bracket can adapt to a diffusion furnace with a transverse furnace tube, so that the quartz bracket can be placed in the transverse furnace tube to support wafers; the precision positioning device can improve the processing precision of the vertical shaft of the bracket, so that the vertical shaft of the bracket can more stably drive the wafer on the claw disc of the bracket to rotate in the rotating process.

Description

A semiconductor diffusion furnace quartz support and its precise positioning device

technical field

The invention relates to the field of semiconductor equipment, in particular to a quartz support of a semiconductor diffusion furnace and a precise positioning device thereof.

Background technique

In the field of semiconductors, the chip is the core of the industry, and the manufacturing process of the chip has the characteristics of high precision, small size and great technical difficulty. The basic process of chip manufacturing mainly includes: chip design, FPGA verification, wafer lithography and development, etching, chip packaging, etc. The chip manufacturing process is the most complicated, requiring wet cleaning, lithography, ion implantation, dry etching, plasma washing, and heat treatment. , chemical vapor deposition, physical vapor deposition, electroplating treatment, chemical/mechanical surface treatment, wafer testing and other processes.

For the vapor deposition process of the wafer, the main purpose of the process is to diffuse the elements phosphorus and boron into the silicon wafer to dope the wafer. Therefore, the equipment required for vapor deposition is a diffusion furnace. During processing, the wafer is placed on the quartz support in the furnace tube of the diffusion furnace, and the diffusion gas is introduced into the furnace tube. The diffusion gas penetrates into the surface of the wafer according to a specific law to form a PN junction.

For the diffusion furnace, there are two types of furnace tubes: horizontal and vertical. The so-called horizontal and vertical placement refers to the orientation of the furnace tubes. The furnace tubes are placed horizontally and vertically. Regardless of whether the furnace tube is placed horizontally or vertically, for the wafer, during the diffusion process, it must always be kept in a horizontal state. In this case, the quartz support used to support the wafer must be vertical. In the diffusion furnace with the furnace tube placed horizontally, the horizontal space of the furnace tube is large, the vertical space is narrow, and the vertical height of the quartz support is large, so it is difficult to put the quartz support into the furnace tube for wafer processing. support.

SUMMARY OF THE INVENTION

In order to be able to meet the support requirements for wafers of a diffusion furnace with a furnace tube placed laterally, the first object of the present invention is to provide a quartz support for a semiconductor diffusion furnace.

A kind of semiconductor diffusion furnace quartz support provided by the invention adopts the following technical scheme:

A quartz support for a semiconductor diffusion furnace, comprising a support vertical shaft and a support claw plate sleeved on the support vertical shaft, one end of the support vertical shaft used for cooperating with the support claw plate is provided with a tapered surface, and the support claw plate is provided with a tapered surface. There is a tapered notch for inserting the end of the vertical shaft of the bracket with the tapered surface.

By adopting the above technical solution, when in use, the bracket claw plate enters the furnace tube of the diffusion furnace through the nozzle in the horizontal direction, and the vertical axis of the bracket enters the masturbation tube through the furnace tube wall in the vertical direction from the bottom of the furnace tube, and communicates with the bracket claw. The plate forms a socket fit. At this time, after the conical surface on the vertical shaft of the bracket and the claw plate of the bracket are in contact, the power transmission between the vertical shaft of the bracket and the claw plate of the bracket is realized with the help of the claw plate of the bracket and the weight of the wafer placed on the claw plate of the bracket. Therefore, the vertical shaft of the support can drive the support claw plate to rotate.

Optionally, one end of the support vertical shaft with the tapered surface is integrally provided with a synchronization bump, and the support claw plate is provided with a synchronization groove that communicates with the tapered slot and is used for embedding the synchronization bump.

By adopting the above technical solution, the coordination between the synchronizing bump and the synchronizing groove can further constrain the relative rotation between the bracket claw plate and the bracket vertical axis along the circumferential direction of the bracket vertical axis, improve the synchronization between the bracket vertical axis and the bracket claw plate, reduce the The idle rotation of the vertical shaft of the support can better drive the wafer on the support claw plate to rotate.

Optionally, the bracket claw plate includes at least three support claws, and a positioning column is formed on the support claw toward the side away from the vertical axis of the bracket, and the surfaces of the positioning column on the side facing away from the support claw are mutually opposite. coplanar with each other.

By adopting the above technical solution, the number of three support claws is the optimal number for the support claw plate to support the wafer stably, and the positioning posts on the support claws can support the wafer, and the coplanar positioning posts can ensure that the wafer is in a horizontal state, In addition, the positioning column can space a certain space between the support claw plate and the wafer, so that the diffusion process of the wafer has higher precision.

Optionally, the support vertical shaft has a hollow structure, the side wall of the support vertical shaft is provided with an air hole communicating with the inner cavity of the support vertical shaft, and the end of the support vertical shaft away from the tapered surface is provided with a key groove.

By adopting the above technical solution, since the wafer is placed horizontally and supported on the support claw plate, it is difficult to handle the bottom surface of the wafer in place, and process gas can be introduced into the vertical shaft of the support with a hollow structure, so that the bottom surface of the wafer can also be It is processed to reduce the repeated processing times of the wafer and improve the process precision of the wafer.

The blank of the vertical shaft of the bracket is a quartz rod tube, and the accuracy and straightness of the blank are not enough. The real application needs to be processed, mainly requiring mechanical cutting of the blank. In this process, due to the large length of the vertical shaft of the bracket , Although in the process of processing, there will be tooling to preliminarily determine the rough material, but it is still difficult to avoid the bending and deformation of the rough material, resulting in low precision of the vertical shaft of the processed bracket, so that the vertical shaft of the bracket is driving the wafer to rotate. During the process, wafer deflection is caused.

In order to obtain a support vertical shaft with higher precision, the second object of the present invention is to provide a precise positioning device for a semiconductor quartz support.

The precise positioning device for a semiconductor quartz support provided by the present invention adopts the following technical solutions:

A precision positioning device for a semiconductor quartz support, used for positioning the support vertical shaft during processing, comprising a positioning sleeve for embedding the support vertical shaft, a positioning rod passing through the center of the positioning sleeve and used to penetrate the center of the support vertical shaft. A socket cavity is formed between the positioning rod and the inner wall of the positioning sleeve for embedding the vertical shaft of the bracket, and a driving mechanism for driving the positioning rod to expand and contract is arranged on the rotating shaft of the positioning sleeve.

By adopting the above technical solution, when in use, the positioning sleeve is rotated and installed on the tailstock of the lathe, the quartz rod tube blank is inserted into the positioning sleeve, and then the driving mechanism drives the positioning rod to extend and penetrate into the center of the blank. At this time, the positioning rod The rigidity of the blank can be strengthened, so that in the process of mechanical cutting, the blank is not easily bent under the contact of the cutter head, and the circular runout after the machining of the vertical shaft of the bracket is reduced, thereby improving the machining accuracy of the vertical shaft of the bracket.

Optionally, the drive mechanism includes a drive gear that is rotatably mounted on the positioning sleeve, a forward bar and a backward bar that are mounted on the positioning sleeve and whose movement direction is parallel to the extension and retraction direction of the positioning rod. There is a matching groove, one of the inner side walls of the matching groove is formed with a meshing tooth, the driving gear part is recessed into the matching groove and meshes with the meshing tooth, a ratchet wheel is coaxially fixed on the driving gear, and the advancing bar and The backward bars are respectively located on both sides of the ratchet wheel, the forward bar and the backward bar are both provided with pawls for driving the ratchet wheel to rotate, and the driving directions of the pawls on the forward bar and the pawls on the backward bar are opposite to the driving directions of the ratchet wheel At the same time, the positioning sleeve is provided with a limit component for limiting the rotation of the driving gear.

By adopting the above technical solution, when the positioning rod needs to be driven to expand and contract, the forward bar or the backward bar is driven to move. During the movement of the forward bar or the backward front, the ratchet wheel can be driven to rotate by the pawl, and the ratchet wheel can rotate during the rotation process. Through the meshing between the driving gear and the positioning rod, the positioning rod is driven to extend or retract, so as to achieve the effect of supporting the blank. The limit component is used to constrain the rotation of the ratchet after the positioning rod is adjusted to an appropriate length. Since the ratchet and the driving gear are fixed, after the ratchet is constrained, it is equivalent to indirectly locking the driving gear and positioning rod. Therefore, the positioning rod can be stably supported during the machining of the blank.

Optionally, both the forward bar and the backward bar are provided with installation grooves on the side facing the ratchet wheel, the pawls are located in the installation grooves, and a free force for driving the pawls is installed in the installation grooves of the forward bar and the backward bar. The shrapnel with the end facing out of the installation slot.

By adopting the above technical solution, the first is the effect of the elastic sheet on the pawl, which is to keep the pawl stretched out of the installation groove when the advancing bar or the retreating bar moves, so that the pawl moves with the advancing bar or the retreating bar. In the process, it can cooperate with the ratchet, and then drive the ratchet to rotate. The installation slot has two functions. The first function is to allow the pawl to be installed on the advancing bar or the retreating bar. The groove allows the pawl to retract, so that the pawl can smoothly pass over the ratchet wheel, so that when the front or back bars move back and forth, only one-way driving of the ratchet wheel can be achieved, so as to ensure that the forward bar only drives the positioning rod forward, and the back bar only drives the positioning rod forward. Only the positioning rod is driven back.

Optionally, the side wall of the positioning sleeve is provided with a movable slot that communicates with the slot holes where the advancing bar and the retreating bar are located, and a driving block for driving the advancing bar and the retreating bar to move is slidably installed on the positioning sleeve, The moving direction of the driving block is perpendicular to the moving direction of the advancing bar, and a driving portion is formed on one side of the driving block toward the advancing bar and the backward bar, and driving slopes are respectively formed on both sides of the driving portion, so The forward bar and the backward bar are in contact with the two driving slopes respectively, and at the same time, the positioning sleeve is provided with an end that exerts force on the forward bar and the backward bar away from the driving block and is used to drive the forward bar and the backward bar against the driving slope. on the elastic pusher.

By adopting the above technical solution, when it is necessary to drive the forward bar or the backward bar to move, the driving block is firstly driven to move, because the driving block has a driving part with two driving slopes, and the forward bar and the backward bar are pressed against the two driving surfaces respectively. Therefore, during the movement of the drive block, when the front bar advances, the back bar will retract backward, and when the back bar advances, the forward bar will retract, so as to ensure the The pawl engages the ratchet wheel intermittently successively, so that the advancing bar and the retreating bar can drive the positioning rod to extend and retract.

Optionally, a power groove is formed in the middle of the driving block, a bidirectional cylinder is installed on the positioning sleeve, the bidirectional cylinder is located in the power groove in the middle of the driving block, and the piston rod of the bidirectional cylinder is fixed to the driving block.

By adopting the above technical solution, the power groove is used to accommodate the two-way cylinder, so that the two-way cylinder is embedded in the drive block, so that the space occupied by the drive block and the two-way cylinder is not enlarged, thereby reducing the area of the slot on the positioning sleeve , and the bidirectional cylinder can reduce the length of the piston rod exposed outside the cylinder while ensuring the driving stroke, which is more conducive to the miniaturization of the driving block and the bidirectional cylinder.

Optionally, the limit assembly includes a limit seat installed on the positioning sleeve, an elastic member and a limit column installed on the limit seat, and the limit seat is located between the socket cavity of the positioning sleeve and the ratchet wheel and The side of the limit seat facing the ratchet is provided with an elastic member cavity, the elastic member and the limit post are installed in the elastic member cavity, and the limit post is inserted into the ratchet groove of the ratchet under the push of the elastic member.

By adopting the above technical solution, the limit seat is used as the installation body of the limit post and the elastic member, and the elastic member pushes the limit post to always move towards the ratchet wheel, and makes the limit post embedded in the ratchet groove of the ratchet, so that the Rotation is constrained to limit the extension and retraction of the positioning rod.

To sum up, the split quartz support can be adapted to the diffusion furnace with the furnace tube horizontally placed, so that the quartz support can be placed in the horizontal furnace tube to support the wafer; and the precision positioning device can improve the machining accuracy of the vertical axis of the support, making During the rotation process of the support vertical shaft, the wafer on the support claw plate can be driven to rotate more smoothly.

Description of drawings

Fig. 1 is the structural representation of the quartz support of the embodiment 1 of the present invention;

2 is a schematic structural diagram of a precision positioning device according to Embodiment 2 of the present invention;

3 is a schematic structural diagram of a driving mechanism of the precision positioning device according to Embodiment 2 of the present invention.

Description of reference numbers:

1. Support vertical shaft; 11. Conical surface; 12. Synchronous bump; 13. Air hole; 14. Keyway; 2. Support claw plate; 21. Support claw; 22. Conical slot; 23. Synchronous groove; 24. Positioning column; 3. Positioning sleeve; 31. Sleeve end; 32. Driving groove; 33. Active groove; 4. Positioning rod; 41. Matching groove; 42. Meshing tooth; 5. Driving mechanism; 51. Driving gear; 511 52, forward bar; 53, backward bar; 54, installation slot; 55, pawl; 56, shrapnel; 6, drive block; 61, power slot; 62, drive part; 63, drive slope; 7, bidirectional Cylinder; 8. Elastic pusher; 9. Limit assembly; 91, Limit seat; 911, Elastic cavity; 92, Elastic piece; 93, Limit column.

Detailed ways

The present invention will be described in further detail below in conjunction with accompanying drawings 1 to 3 .

Example 1:

The embodiment of the present application discloses a quartz support for a semiconductor diffusion furnace. Referring to FIG. 1 , it includes a support vertical shaft 1 and a support claw plate 2 . The support vertical shaft 1 is in the shape of a long tube, and its interior is a hollow structure. The outer surface of the support vertical shaft 1 is processed by machining. , the bracket vertical shaft 1 after the cutting process forms a two-section structure with a large diameter and a small diameter, and a tapered surface 11 is opened at the end of the smaller diameter of the bracket vertical shaft 1, and the bracket vertical shaft 1 has one end of the tapered surface 11. The part is integrally provided with a synchronizing bump 12 extending radially along the vertical axis 1 of the bracket. At the same time, an air hole 13 communicating with the inner cavity of the support vertical shaft 1 is provided on the side wall of the smaller diameter section of the support vertical shaft 1 and close to the larger diameter section, and a key groove 14 is opened on the side wall of the larger diameter end of the support vertical shaft 1 , the keyway 14 is used for key matching when connecting the diffusion furnace.

The bracket claw plate 2 includes at least three support claws 21. The bracket claw plate 2 is provided with a conical slot 22 whose shape matches the end of the bracket vertical shaft 1 with the tapered surface 11 at the intersection of the support claws 21, and is provided with a conical slot 22. The synchronizing groove 23 communicates with the conical groove 22 and matches the shape of the synchronizing protrusion 12. When in use, the end of the support vertical shaft 1 with the conical surface 11 is inserted into the conical groove 22, and the synchronizing protrusion 12 is inserted into the conical groove 22. Embedded in the synchronizing groove 23, with the help of the transmission action of the tapered surface 11 and the synchronizing block, the support claw disc 2 rotates with the support vertical shaft 1.

In order to achieve better support for the wafer by the support claw plate 2, a positioning column 24 is integrally protruded at the end of the support claw 21 and facing away from the support vertical shaft 1. The state of the surface, so that after the wafer is placed, it can be closer to the level.

The implementation principle of a semiconductor diffusion furnace quartz support in the embodiment of the present application is as follows: when in use, the support claw plate 2 enters the furnace tube of the diffusion furnace laterally from the furnace tube mouth, and then the support vertical shaft 1 vertically passes through the furnace from the bottom of the diffusion furnace. The side wall of the tube enters the furnace tube to form a socket fit with the support claw plate 2. With the help of the tapered surface 11 and the synchronizing bump 12, the support vertical shaft 1 can drive the support claw plate 2 to rotate synchronously, so that the wafer can be better processed. Diffusion treatment.

Example 2:

A semiconductor quartz support precision positioning device, referring to FIG. 2 , includes a positioning sleeve 3 and a positioning rod 4, the positioning sleeve 3 includes a cylindrical rotating shaft part and a sleeve-shaped socket end integrally arranged on one end of the rotating shaft 31. During application, the positioning sleeve 3 is rotatably installed on the tailstock of the machine tool, so that the positioning sleeve 3 can follow the workpiece or rotate under the action of external force. The positioning rod 4 is in the shape of a slender rod, and is coaxially passed through the center of the positioning sleeve 3, and is telescopically driven by means of the drive mechanism 5 disposed on the rotating shaft portion of the positioning sleeve 3. At this time, the inner wall of the socket end 31 of the positioning sleeve 3 A socket cavity for inserting the blank bar material is formed between it and the positioning rod 4 .

2 and 3, the driving mechanism 5 includes a driving gear 51, a forward bar 52 and a backward bar 53. A matching groove 41 is formed on the side wall of the positioning rod 4 along its length direction, and one of the inner side walls of the matching groove 41 is at During the machining process, meshing teeth 42 are formed, and at the same time, the inner side wall of the positioning sleeve 3 and the position corresponding to the matching groove 41 are provided with a driving groove 32 for the installation of the driving gear 51 , the advancing bar 52 and the retreating bar 53 . The length extension direction is parallel to the extension and contraction direction of the positioning rod 4 . The ratchet wheel 511 is coaxially fixed on the driving gear 51, and the rotating shafts of the driving gear 51 and the ratchet wheel 511 are fixed on the inner wall of the driving groove 32 of the positioning sleeve 3. After installation, the driving gear 51 is partially embedded in the matching groove 41 on the positioning rod 4. And form engagement with the meshing teeth 42 , at this time the ratchet 511 is located in the driving slot 32 of the positioning sleeve 3 .

The forward bar 52 and the backward bar 53 are telescopically installed in the driving slot 32 and are located on both sides of the ratchet wheel 511 respectively. A mounting slot 54 is opened on the side wall of the forward bar 52 and the backward bar 53 towards the side of the ratchet wheel 511. The mounting slot 54 A pawl 55 is hinged, and a spring piece 56 is installed in the installation groove 54. The end of the spring piece 56 away from the connection part of itself and the inner wall of the installation groove 54 is bent and pressed against the side of the free end of the pawl 55 facing away from the ratchet wheel 511, thereby driving The pawl 55 always has a tendency to turn out toward the outside of the mounting groove 54 .

The forward bar 52 and the backward bar 53 move in dislocation during the process of driving the ratchet 511, that is, when the forward bar 52 moves, the backward bar 53 resets and stays still, and when the backward bar 53 moves, the forward bar 52 resets and remains motionless, In order to meet the requirements of this working condition, the side wall of the positioning sleeve 3 is provided with a movable groove 33 that communicates with the driving groove 32 where the advancing bar 52 and the retreating bar 53 are located, and at the same time, it is slidably installed in the movable groove 33 of the positioning sleeve 3 A driving block 6, a power groove 61 is provided in the center of the driving block 6. In order to drive the driving block 6 to move, a two-way cylinder 7 is fixedly installed on the positioning sleeve 3 and is located at the position corresponding to the power groove 61. The piston rod of the two-way cylinder 7 The telescopic direction is perpendicular to the moving direction of the forward bar 52 and the backward bar 53 , and the piston rod of the bidirectional air cylinder 7 is fixed with the driving block 6 .

In order to drive the advancing bar 52 and the retreating bar 53 , a driving portion 62 is protruded on the surface of the driving block 6 on the side facing the advancing bar 52 and the retreating bar 53 , and the driving portion 62 is triangular. There are two left and right driving slopes 63, and the advancing bar 52 and the retreating bar 53 are respectively opposite to the two driving slopes 63 of the driving part 62. An elastic pushing member 8 is installed in the driving slot 32 of the 100°C, the elastic pushing member 8 selects a spring, and the elastic pushing member 8 exerts force on one end of the advancing bar 52 and the retreating bar 53 away from the driving block 6, so that the advancing bar 52 and the retreating bar 53 are There is a tendency to counteract the drive slope 63 .

In order to stabilize the length of the positioning rod 4 extending into the blank bar material, the positioning sleeve 3 is also provided with a limit assembly 9 for limiting the rotation of the ratchet 511 , and the limit assembly 9 specifically includes a limit seat 91 , an elastic member 92 and a limiter assembly 9 . The positioning post 93 and the limiting seat 91 have a spring cavity 911 , the limiting seat 91 is fixed on the inner wall of the driving slot 32 of the positioning sleeve 3 and is located on the side of the ratchet 511 away from the driving block 6 . The elastic member 92 selects a spring, and the elastic member 92 is installed in the elastic member cavity 911 of the limiting seat 91 . The limit post 93 is installed in the elastic member cavity 911 of the limit seat 91 . After installation, the limit post 93 hooks up with the inner wall of the opening of the elastic member cavity 911 to limit the limit post 93 from coming out of the elastic member cavity 911 . At this time, the limiting column 93 presses the elastic member 92 , so that the limiting column 93 can be inserted into the ratchet groove on the ratchet wheel 511 to limit the rotation of the ratchet wheel 511 .

The implementation principle of a semiconductor quartz support precision positioning device in the embodiment of the present application is as follows: during processing, one end of the quartz rod tube blank is inserted into the main shaft of the machine tool, and then the quartz rod tube blank is moved toward the tailstock side of the machine tool, Insert the quartz rod tube blank into the positioning sleeve 3, and then drive the driving block 6 to move through the bidirectional cylinder 7 to drive the advancing bar 52 to drive the ratchet 511, so as to realize the extension of the positioning rod 4, and the positioning rod 4 is inserted into the quartz rod tube. After the inside of the blank, the rigidity of the quartz rod and tube blank can be strengthened, so that the quartz rod and tube blank can not easily be bent and deformed in the process of processing, so as to achieve the purpose of improving the processing accuracy of the vertical shaft 1 of the bracket.

The above are all preferred embodiments of the present invention, and are not intended to limit the protection scope of the present invention. Therefore: all equivalent changes made according to the structure, shape and principle of the present invention should be covered within the protection scope of the present invention. Inside.

Claims (10)

1. A quartz support of a semiconductor diffusion furnace is characterized in that: the support vertical shaft structure comprises a support vertical shaft (1) and a support claw disc (2) sleeved on the support vertical shaft (1), wherein a conical surface (11) is arranged at one end, matched with the support claw disc (2), of the support vertical shaft (1), and a conical notch (22) used for enabling one end, provided with the conical surface (11), of the support vertical shaft (1) to be embedded is arranged on the support claw disc (2).

2. The quartz holder for a semiconductor diffusion furnace according to claim 1, wherein: the synchronous lug (12) is integrally arranged at one end, provided with a conical surface (11), of the vertical shaft (1) of the support, and a synchronous groove (23) communicated with the conical notch (22) and used for being embedded by the synchronous lug (12) is formed in the claw disc (2) of the support.

3. The quartz holder for a semiconductor diffusion furnace according to claim 1, wherein: the support claw disc (2) comprises at least three support claws (21), positioning columns (24) are formed on the support claws (21) in a protruding mode towards one side, away from the support vertical shaft (1), and the surfaces, opposite to the support claws (21), of the positioning columns (24) are coplanar with one another.

4. The quartz holder for a semiconductor diffusion furnace according to any one of claims 1 to 3, wherein: the support vertical shaft (1) is of a hollow structure, an air hole (13) communicated with an inner cavity of the support vertical shaft (1) is formed in the side wall of the support vertical shaft (1), and a key groove (14) is formed in one end, far away from the conical surface (11), of the support vertical shaft (1).

5. The utility model provides a semiconductor quartz support precision positioning device which characterized in that: the positioning device for the processing of the support vertical shaft (1) in the claims 1 to 4 comprises a positioning sleeve (3) for embedding the support vertical shaft (1) and a positioning rod (4) which is arranged in the center of the positioning sleeve (3) in a penetrating manner and is used for penetrating into the center of the support vertical shaft (1), a sleeve connection cavity for embedding the support vertical shaft (1) is formed between the positioning rod (4) and the inner wall of the positioning sleeve (3), and a driving mechanism (5) for driving the positioning rod (4) to stretch is arranged on a rotating shaft of the positioning sleeve (3).

6. The fine positioning device for the semiconductor quartz support according to claim 5, wherein: actuating mechanism (5) including rotate install drive gear (51) on position sleeve (3), install on position sleeve (3) and direction of motion is on a parallel with advance strip (52) and the back strip (53) of the flexible direction of position bar (4), cooperation groove (41) have been seted up along self length direction on position bar (4), one of them inside wall of cooperation groove (41) is formed with meshing tooth (42), drive gear (51) part is absorbed in cooperation groove (41) and forms the meshing with meshing tooth (42), coaxial fixed ratchet (511) on drive gear (51), advance strip (52) and back strip (53) are located the both sides of ratchet (511) respectively, all be provided with on advance strip (52) and the back strip (53) and be used for driving the rotatory pawl (55) of ratchet (511), just advance the drive direction looks of ratchet (511) on pawl (55) on strip (52) and the back strip (53) to ratchet (511) on ratchet (511) mutually And meanwhile, a limiting component (9) used for limiting the rotation of the driving gear (51) is arranged on the positioning sleeve (3).

7. The precision positioning device for the semiconductor quartz holder according to claim 6, wherein: mounting grooves (54) are formed in one sides, facing the ratchet wheel (511), of the advancing strip (52) and the retreating strip (53), the pawl (55) is located in the mounting grooves (54), and an elastic sheet (56) used for driving the free end of the pawl (55) to rotate out towards the mounting grooves (54) is mounted in the mounting grooves (54) of the advancing strip (52) and the retreating strip (53).

8. The precision positioning device for the semiconductor quartz holder according to claim 6 or 7, wherein: the side wall of the positioning sleeve (3) is provided with a movable groove (33) communicated with the groove hole where the advancing strip (52) and the retreating strip (53) are positioned, a driving block (6) for driving the forward strip (52) and the backward strip (53) to move is arranged on the positioning sleeve (3) in a sliding way, the moving direction of the driving block (6) is vertical to the moving direction of the advancing bar (52), the driving block (6) is convexly provided with a driving part (62) towards one side of the forward strip (52) and the backward strip (53), two sides of the driving part (62) are respectively provided with a driving inclined plane (63), the advancing strip (52) and the retreating strip (53) are respectively abutted against the two driving inclined planes (63), meanwhile, an elastic pushing piece (8) which applies force to one end, away from the driving block (6), of the advancing strip (52) and the retreating strip (53) and is used for driving the advancing strip (52) and the retreating strip (53) to abut against the driving inclined plane (63) is arranged on the positioning sleeve (3).

9. The precision positioning device for the semiconductor quartz holder according to claim 8, wherein: the middle part of the driving block (6) is provided with a power groove (61), the positioning sleeve (3) is provided with a bidirectional cylinder (7), the bidirectional cylinder (7) is positioned in the power groove (61) in the middle part of the driving block (6), and a piston rod of the bidirectional cylinder (7) is fixed with the driving block (6).

10. The precision positioning device for the semiconductor quartz holder according to claim 6 or 7, wherein: the limiting assembly (9) comprises a limiting seat (91) arranged on the locating sleeve (3), an elastic piece (92) arranged on the limiting seat (91) and a limiting column (93), the limiting seat (91) is located between a sleeve connection cavity of the locating sleeve (3) and the ratchet wheel (511), an elastic piece cavity (911) is arranged on one side, facing the ratchet wheel (511), of the limiting seat (91), the elastic piece (92) and the limiting column (93) are arranged in the elastic piece cavity (911), and the limiting column (93) is embedded into a ratchet groove facing the ratchet wheel (511) under the pushing of the elastic piece (92).

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