CN115053357A - 发光单元的制造方法 - Google Patents

发光单元的制造方法 Download PDF

Info

Publication number
CN115053357A
CN115053357A CN202080095765.1A CN202080095765A CN115053357A CN 115053357 A CN115053357 A CN 115053357A CN 202080095765 A CN202080095765 A CN 202080095765A CN 115053357 A CN115053357 A CN 115053357A
Authority
CN
China
Prior art keywords
substrate
light
emitting unit
led elements
color
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080095765.1A
Other languages
English (en)
Chinese (zh)
Inventor
谷泽由治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Corp
Original Assignee
Fuji Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Corp filed Critical Fuji Corp
Publication of CN115053357A publication Critical patent/CN115053357A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/01—Manufacture or treatment
    • H10H29/02—Manufacture or treatment using pick-and-place processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Led Device Packages (AREA)
  • Supply And Installment Of Electrical Components (AREA)
CN202080095765.1A 2020-03-03 2020-03-03 发光单元的制造方法 Pending CN115053357A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/008893 WO2021176554A1 (ja) 2020-03-03 2020-03-03 発光ユニットの製造方法

Publications (1)

Publication Number Publication Date
CN115053357A true CN115053357A (zh) 2022-09-13

Family

ID=77613166

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080095765.1A Pending CN115053357A (zh) 2020-03-03 2020-03-03 发光单元的制造方法

Country Status (4)

Country Link
EP (1) EP4117046A4 (https=)
JP (1) JPWO2021176554A1 (https=)
CN (1) CN115053357A (https=)
WO (1) WO2021176554A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110273873A1 (en) * 2010-05-06 2011-11-10 Funai Electric Co., Ltd. Light source unit
JP2013041730A (ja) * 2011-08-12 2013-02-28 Sharp Corp 光源モジュール
CN103026514A (zh) * 2010-09-30 2013-04-03 日亚化学工业株式会社 发光装置以及发光装置的制造方法
JP2017108092A (ja) * 2015-11-30 2017-06-15 日亜化学工業株式会社 発光装置の製造方法
WO2019130398A1 (ja) * 2017-12-25 2019-07-04 株式会社Ｆｕｊｉ 生産管理装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4551948B2 (ja) * 2007-06-13 2010-09-29 シャープ株式会社 線状光源装置、面発光装置、面状光源装置、および、液晶表示装置
JP2013065644A (ja) * 2011-09-16 2013-04-11 Panasonic Corp 発光素子の製造システムおよび製造方法ならびに発光素子パッケージの製造システムおよび製造方法
US20130075769A1 (en) * 2011-09-22 2013-03-28 Ledengin, Inc. Selection of phosphors and leds in a multi-chip emitter for a single white color bin
JP6076046B2 (ja) * 2012-11-07 2017-02-08 ヤマハ発動機株式会社 電子部品実装装置、演算装置および実装方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110273873A1 (en) * 2010-05-06 2011-11-10 Funai Electric Co., Ltd. Light source unit
CN103026514A (zh) * 2010-09-30 2013-04-03 日亚化学工业株式会社 发光装置以及发光装置的制造方法
JP2013041730A (ja) * 2011-08-12 2013-02-28 Sharp Corp 光源モジュール
JP2017108092A (ja) * 2015-11-30 2017-06-15 日亜化学工業株式会社 発光装置の製造方法
CN107039410A (zh) * 2015-11-30 2017-08-11 日亚化学工业株式会社 发光装置的制造方法
WO2019130398A1 (ja) * 2017-12-25 2019-07-04 株式会社Ｆｕｊｉ 生産管理装置

Also Published As

Publication number Publication date
EP4117046A4 (en) 2023-04-12
EP4117046A1 (en) 2023-01-11
WO2021176554A1 (ja) 2021-09-10
JPWO2021176554A1 (https=) 2021-09-10

Similar Documents

Publication Publication Date Title
KR20090008220A (ko) 광 유닛
US20130163228A1 (en) Light source module and backlight unit
KR100616595B1 (ko) Ｌｅｄ 패키지 및 이를 구비한 광원
JP4846055B1 (ja) Ｌｅｄ選択装置及びｌｅｄ選択プログラム及びｌｅｄ選択方法
JP4843752B1 (ja) 部品実装方法、および、部品実装機
CN115138583A (zh) 一种发光芯片的分选方法及分选装置
KR102454905B1 (ko) 디스플레이용 장치 및 방법
CN115053357A (zh) 发光单元的制造方法
KR102486822B1 (ko) 칩 이송 장치 및 이를 이용한 칩 이송 방법
US20050281025A1 (en) High density LED array
JP2019013334A5 (https=)
JP4777938B2 (ja) 部品実装方法、部品実装機
JP4884566B1 (ja) Ｌｅｄ選択装置及びｌｅｄ選択プログラム及びｌｅｄ選択方法
JP2025071255A (ja) 発光モジュール
JP2012094709A (ja) 半導体発光装置及びその製造方法
JP2018063973A (ja) 部品実装機、部品認識方法
KR102244684B1 (ko) 발광 다이오드 모듈
CN116349421A (zh) Nc数据生成方法、nc数据生成装置及元件安装系统
KR101878946B1 (ko) Ｌｅｄ 경관조명장치의 구역별 발광오류 자동보정 시스템
CN108351077B (zh) 光照射装置
KR102066608B1 (ko) 조명 장치
JP7341603B2 (ja) 発光装置及び発光装置の製造方法
JP7796345B2 (ja) 部品実装方法、及び、部品実装システム
CN113228090A (zh) 外形数据共享系统及外形数据共享方法
JP2013004585A (ja) Ｌｅｄ駆動回路およびｌｅｄ駆動方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination