CN115002599A

CN115002599A - Earphone based on digital sound production chip

Info

Publication number: CN115002599A
Application number: CN202210693441.9A
Authority: CN
Inventors: 刘长华; 乔文利; 袁飞洋
Original assignee: Earth Mountain Suzhou Microelectronics Technology Co ltd
Current assignee: Earth Mountain Suzhou Microelectronics Technology Co ltd
Priority date: 2022-06-17
Filing date: 2022-06-17
Publication date: 2022-09-02

Abstract

The invention discloses an earphone based on a digital sounding chip, which relates to the technical field of digital sounding, and solves the problems of large volume, slow response and large distortion of the traditional speaker unit of the existing earphone. The headset based on a digital sound-emitting chip at least includes: a controller and a digital sound-emitting chip; the controller receives the audio signal input from the audio input end, processes the audio signal, calculates the multi-channel quantized digital pulse signal, and converts the multi-channel quantized digital pulse signal. The quantized digital pulse signal is transmitted to the digital sound chip; the digital sound chip is provided with basic transducer elements cascaded into an array, and the digital sound chip distributes multiple quantized digital pulse signals to each transducer element, and each transducer element receives To the digital pulse signal, pulse sound waves are generated; the sound waves are superimposed on each other to realize sound. The earphone based on the digital sound-emitting chip provided by the present invention has the advantages of miniaturization and digitization of the speaker unit.

Description

Earphone based on digital sound production chip

Technical Field

The invention relates to the technical field of digital sound production, in particular to an earphone based on a digital sound production chip.

Background

Nowadays, earphones can be classified into an electrodynamic type, an electromagnetic type, a capacitive type, a piezoelectric type and the like according to the structure and the working principle of a sound generating unit, and are generally classified into four types, namely a moving coil, a moving iron, static electricity and a flat diaphragm, in the market. Although the specific implementation mode is different, the sound production principle is the same in nature, and the sound production principle is that an internal diaphragm is driven through an electric signal, and the diaphragm pushes air to produce vibration and produce sound.

If the working principle of the moving coil earphone is adopted, namely after an audio signal is input into the voice coil, an electromagnetic field generated by the voice coil changes along with the change of the signal, the changed electromagnetic field and the magnetic circuit interact to push the voice coil and the vibrating diaphragm to move, and the vibrating diaphragm pushes air to generate sound waves.

The difference of the structure and the working principle of the earphone sounding unit leads to obvious advantages and disadvantages of the earphone sounding unit, and the moving iron type can achieve small volume, narrow sound range and poor low-frequency characteristic; the electrostatic type has good linearity and small distortion, but needs to be provided with a special earphone amplifier with high voltage and cannot be directly driven by common sound equipment.

Disclosure of Invention

The invention aims to provide an earphone based on a digital sound production chip, which replaces the traditional sound production unit with the digital sound production chip, directly converts a digital audio stream into sound waves, and realizes the miniaturization of the earphone under the condition of ensuring the sound quality.

In order to achieve the above purpose, the invention provides the following technical scheme:

a digital sound chip based headset, the headset comprising at least:

the controller and the digital sound chip;

the controller receives an audio signal input by an audio input end, processes the audio signal, calculates to obtain a plurality of paths of quantized digital pulse signals, and transmits the plurality of paths of quantized digital pulse signals to the digital sounding chip; simultaneously controlling the digital sound chip to sound;

basic transduction elements which are cascaded to form an array are arranged on the digital sound production chip, the digital sound production chip distributes the multi-channel quantized digital pulse signals to each channel of transduction elements, and each channel of transduction elements receives the digital pulse signals and generates pulse sound waves; the sound waves are mutually superposed to realize sound production.

Optionally, the controller and the digital sound chip are arranged on the main board; the digital sound production chip comprises a first digital sound production chip and a second digital sound production chip; the earphone comprises a main earphone, an auxiliary earphone and an auxiliary main board; the main board is arranged in the main earphone, the auxiliary main board is arranged in the auxiliary earphone, a first digital sound production chip and a first controller are arranged on the main board, and a second digital sound production chip is arranged on the auxiliary main board; the first controller processes the received audio signals, calculates to obtain multi-path quantized digital pulse signals, and divides the multi-path quantized digital pulse signals into two groups of digital pulse signals to be respectively transmitted to the first digital sound production chip and the second digital sound production chip; the first path of digital pulse signal and the second path of digital pulse signal both comprise multi-path quantized digital pulse signals.

Optionally, a second controller is arranged on the secondary main board, and the second controller is electrically connected or wirelessly connected with the first controller; the first controller processes the received audio signal, calculates to obtain a multi-path quantized digital pulse signal and controls the first digital sounding chip to sound; and the second controller receives the audio signal input by the audio input end, processes the audio signal, calculates to obtain a multi-channel quantized digital pulse signal and controls the second control chip to sound.

Optionally, the audio input end is a bluetooth antenna or an audio interface; when the earphone is a wireless earphone, the audio input end is a Bluetooth antenna; when the earphone is a wired earphone, the audio input end is an audio interface.

Optionally, the digital sound chip includes:

a substrate; at least a contact, an ASIC chip and a basic transduction element are arranged on the substrate; the basic transduction elements are cascaded into an array;

the contact receives a plurality of paths of quantized digital pulse signals and transmits the signals to the ASIC chip;

the ASIC chip transmits the multi-channel quantized digital pulse signals to each channel of energy conversion element, and each channel of energy conversion element receives the digital pulse signals and generates pulse sound waves; the sound waves are mutually superposed to realize sound production.

Optionally, the thickness of the digital sound chip is less than or equal to 2mm, and the length of the digital sound chip is less than 20 mm.

Optionally, a first digital sound chip, a power supply, a controller, and a first microphone are integrated in the main earphone; the second digital sound production chip, the antenna and the second microphone are integrated in the auxiliary earphone.

Optionally, the first controller in the main earphone controls the first digital sound production chip to produce sound, and the sound is transmitted to the auxiliary earphone through the waveguide tube.

Optionally, the earphone comprises a headband, an earshell and a cavity cover plate;

the main board is arranged in a containing cavity formed by the earshell, the cavity cover plate covers the earshell, and the cavity cover plate is hollow or provided with a sound outlet;

the head band is used for fixing the earmuff, a cavity is formed in the head band, and the waveguide tube is arranged in the cavity.

Compared with the prior art, in the earphone based on the digital sound chip, the earphone at least comprises: a controller and a main board; the mainboard is at least provided with a digital sounding chip; the controller receives an audio signal input by an audio input end, processes the audio signal, calculates to obtain a plurality of paths of quantized digital pulse signals, transmits the plurality of paths of quantized digital pulse signals to the digital sounding chip, and controls the digital sounding chip to sound; basic transduction elements which are cascaded into an array are arranged on the digital sound production chip, the digital sound production chip distributes received multi-channel quantized digital pulse signals to each channel of transduction elements, and each channel of transduction elements receives the digital pulse signals and generates pulse sound waves; the sound waves are mutually superposed to realize sound production. The earphone uses the digital sound chip to replace the traditional sound production unit, the controller and the digital sound production chip are matched to convert the digital audio stream into sound waves, the sound can be accurately reproduced within the audio frequency range of 20 HZ-20000 HZ, the conversion rate is high, and the distortion is small; the digital sound production chip is mutually matched with other structures in the earphone, and the problem that the technical difficulty is high when the traditional sound production unit is applied to the earphone and needs to consider matching with an acoustic cavity, a frequency division circuit, a mechanical structure and the like is solved.

The sound wave generated by the digital sound production chip arranged on the main earphone is controlled by the controller to point to the waveguide tube, so that the sound wave is transmitted to the auxiliary earphone; the digital sound production chips are respectively arranged on the main earphone and the auxiliary earphone, so that sound waves can be transmitted to the ears of a user without controlling the directivity; the main earphone and the auxiliary earphone are respectively provided with a digital sounding chip, each digital sounding chip is correspondingly provided with a controller, and the two controllers are electrically or wirelessly connected to establish a communication relation so as to synchronize audio content data generated by each digital sounding chip; the flexible selection of the number of digit vocal chip and controller and the cooperation between each other for this earphone both is applicable to wired earphone, also is applicable to wireless earphone, can satisfy the design demand of multiple type earphone in aspects such as volume, shape, tone quality simultaneously.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 is a structural diagram of an earphone based on a digital sound chip according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of a front side of a digital sound chip according to an embodiment of the present invention;

FIG. 3 is a schematic diagram of a back side of a digital sound chip according to an embodiment of the present invention;

fig. 4 is a block diagram of a headset system including a digital sound chip in accordance with an embodiment of the present invention;

fig. 5 is a flowchart of the operation of a headset including a digital sound chip according to an embodiment of the present invention;

fig. 6 is a block diagram of an earphone system including two digital sound chips according to an embodiment of the present invention;

fig. 7 is a flowchart of the operation of an earphone including two digital sound chips according to an embodiment of the present invention;

FIG. 8 is a schematic structural diagram of a motherboard according to an embodiment of the present invention;

FIG. 9 is a schematic structural diagram of a sub-motherboard according to an embodiment of the present invention;

fig. 10 is a diagram illustrating a structure of a wireless headset according to an embodiment of the present invention;

fig. 11 is a structural diagram of a rear-hanging headphone according to an embodiment of the present invention.

Reference numerals: 101-digital sound production chip, 102-controller, 201-ASIC chip, 202-basic transducer element, 301-digital sound production chip substrate, 302-contact, 801-main board substrate, 802-power supply, 803-antenna, 804-first controller, 805-contact pad, 806-microphone, 807-first digital sound production chip, 901-auxiliary main board substrate, 902-second digital sound production chip, 10-headband, 20-ear shell, 30-cavity cover plate, 40-ear cup, 50-waveguide tube, 60-head beam, 61-first ear shell, 62-first cavity cover plate, 63-first ear cup.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and do not limit the invention.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise. The meaning of "a number" is one or more unless specifically limited otherwise.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

The difference of the structure and the working principle of the sounding unit of the earphone leads to obvious advantages and disadvantages of the sounding unit, and the moving iron type earphone can achieve small volume, narrow sound range and poor low-frequency characteristic; the electrostatic type has good linearity and small distortion, but needs to be provided with a special earphone amplifier with high voltage and cannot be directly driven by common sound equipment. Meanwhile, when the traditional sounding unit is applied to the earphone, how to design the earphone in cooperation with an acoustic cavity, a frequency division circuit, a mechanical structure and the like needs to be considered, and the design difficulty is high.

Based on the problems, the invention provides the earphone based on the digital sound production chip, the digital sound production chip is adopted to replace the traditional sound production unit, any specified waveform is realized through a digital sound reconstruction algorithm, the digital audio stream is directly converted into sound waves, the sound can be accurately reproduced within the audio frequency range of 20 HZ-20000 HZ, the earphone has the advantages of high sound-electricity conversion rate, high sound pressure level, low power, small distortion and the like, can be directly integrated in an electronic PCB, and has the advantages of miniaturization and digitization of a loudspeaker unit. Next, a scheme provided by an embodiment of the present specification is explained with reference to the accompanying drawings:

as shown in fig. 1, an embodiment of the present invention provides a structure diagram of a digital sound chip-based headset, where the headset at least includes a controller 102 and a digital sound chip 101; the controller 102 receives an audio signal input by an audio input end, processes the audio signal, calculates to obtain a plurality of paths of quantized digital pulse signals, transmits the signals to the digital sound production chip 101, and controls the digital sound production chip to produce sound; basic transduction elements which are cascaded to form an array are arranged on the digital sound production chip 101, the digital sound production chip 101 distributes received multi-channel quantitative digital pulse signals to each channel of transduction elements, and each channel of transduction elements receives the digital pulse signals and generates pulse sound waves; the sound waves are mutually superposed to realize sound production.

In the structure shown in fig. 1, the digital sound chip 101 is disposed on a motherboard, and the controller 102 may be disposed on the motherboard in an earphone or on a mobile intelligent terminal, where the mobile intelligent terminal may be a mobile phone, a tablet computer, or the like. The controller 102 performs modulation and decimation operations by using a DRS algorithm according to the input audio signal and the structure of the basic transducer element of the digital sound chip to obtain multiple paths of digital pulse signals, and sends the multiple paths of digital pulse signals to the digital sound chip 101 and controls the digital sound chip 101 to generate sound.

When the controller 102 is arranged on the mobile intelligent terminal, the controller 102 and the earphone are connected in a wired or wireless manner so as to realize communication connection with the digital generation chip 101. At the moment, the mobile intelligent terminal is required to be matched with the earphone, the mobile intelligent terminal is connected with the earphone in a wireless or wired mode, the controller in the mobile intelligent terminal converts the audio signal into a multi-channel quantitative digital pulse signal and sends the multi-channel quantitative digital pulse signal to the earphone, and the digital sounding chip in the earphone converts the multi-channel quantitative digital pulse signal into sound to be sounded.

When the controller 102 is disposed on the motherboard, the controller 102 is connected to the digital sound chip 101 in a circuit or wirelessly. At the moment, the controller in the earphone receives an external audio signal, and the external audio signal is processed and then sent to the digital sounding chip in the earphone, so that the multi-channel quantized digital pulse signal is converted into sound to be sounded.

The audio input end can be a Bluetooth antenna or an audio interface, when the earphone is a wireless earphone, the audio input end is the Bluetooth antenna, and when the earphone is a wired earphone, the audio input end is the audio interface.

As shown in fig. 2 and 3, the digital sound chip in the earphone structure includes: a digital sound chip substrate 301, a primary transducer element 202, an ASIC chip 201, and contacts 302; the primary transducer element 202 and the ASIC chip 201 are disposed on one side of the digital sound chip substrate 301, and the contacts 302 are disposed on the other side of the digital sound chip substrate 301. Receiving a plurality of paths of digital pulse signals from a controller through a contact 302 and sending the signals to the ASIC chip 201, wherein the ASIC chip 201 distributes the plurality of paths of quantized digital pulse signals to each path of energy conversion element; after each path of transduction element receives the digital pulse signal, potential difference is applied between the electrode and the diaphragm to generate electrostatic force, the diaphragm is then adsorbed with the electrode, and great acceleration is achieved, so that pulse sound waves are generated, and sound waves emitted by a plurality of transduction elements which are cascaded into an array are mutually superposed to realize sound production.

The digital sound chip 101 may be sized to have a thickness of less than or equal to 2mm and a length of less than 20mm, which is easily integrated into a motherboard.

The number of the contacts 302 may be one or more, and the plurality of contacts may be arranged in the arrangement shown in fig. 3. The digital sound chip communicates with external circuitry through contacts 302.

The digital sound chip substrate 301 serves to connect and support the various components.

The base transducer element 202 is made up of a plurality of sound emitting pixel cells; the basic transducing element 202 includes an electrode, a diaphragm, a substrate, a support structure, and a dielectric structure.

Alternatively, a separate controller can be omitted, and the functions of the controller 102 can be directly integrated into the digital sound chip 101, so as to further reduce the volume of the earphone.

Optionally, when the controller 102 is disposed on the main board, since the earphones may include a main earphone and an auxiliary earphone, the corresponding digital sound chip may include one or two, which will be described below:

example 1

Only one digital sound production chip is arranged in the earphone, fig. 4 is a system block diagram of the earphone comprising the digital sound production chip, as shown in fig. 4, a power supply module supplies power to the whole system, an audio interface receives audio signals from a media player, a controller processes the audio signals, multi-channel quantized digital pulse signals are obtained through calculation, the multi-channel quantized digital pulse signals and control signals are sent to the digital sound production chip to be used for controlling sound production, the controller in the main earphone controls the digital sound production chip to reconstruct sound, and the reconstructed sound signals are directionally focused and transmitted to the auxiliary earphone through a waveguide tube. The work flow is shown in figure 5:

step 501: the audio interface receives an input audio signal and sends the input audio signal to the controller.

Step 502: the controller processes the audio signal, calculates to obtain a plurality of paths of quantized digital pulse signals, and sends the plurality of paths of quantized digital pulse signals and the control signal to the digital sounding chip.

Step 503: and the ASIC of the digital sound production chip distributes the multi-channel quantized digital pulse signals to the energy conversion elements.

Step 504: each path of energy conversion element receives the digital pulse signal and converts the digital pulse signal into an acoustic pulse signal to be output.

Step 505: the sound waves generated by the M x N basic transduction elements are superposed to generate sound.

Step 506: the sound waves enter the main earpiece directly through the earpiece housing opening.

Step 507: the controller controls the sound wave generated by the digital sound chip to be directed to the waveguide tube.

Step 508: the sound waves reach the sub earphone through the waveguide.

The above system of fig. 4 is suitable for wired headphones, where a waveguide can be placed in the headband inside the headphones for guiding and propagating the sound waves to the secondary headphones. Audio interface: for connecting an audio playback device and then transmitting the audio information to the headphones.

In this embodiment, since the digital sound chip is located in the main earphone, the sound wave can be directly transmitted from the main earphone, and at the digital sound stage, the controller needs to control the digital sound chip to direct the sound wave generated by the digital sound chip to the waveguide, so that the sound wave can reach the sub-earphone through the waveguide and enter the ears of the person.

Example 2

The main and auxiliary earphones are provided with digital sounding chips, fig. 6 is a system block diagram of the earphone comprising two digital sounding chips, as shown in fig. 6, a power supply module supplies power for the whole system, a bluetooth antenna receives decoded digital signals from a media player, a controller processes audio signals, multi-channel quantized digital pulse signals are obtained through calculation, the multi-channel quantized digital pulse signals and control signals are sent to the digital sounding chips to control sounding, and the main and auxiliary earphones are respectively provided with one digital sounding chip for sound reconstruction. The work flow is shown in fig. 7:

step 701: the Bluetooth antenna receives an input audio signal and sends the input audio signal to the controller.

If the earphone is a wired earphone, the Bluetooth antenna is an audio interface.

Step 702: the controller audio signal is processed to obtain a plurality of paths of quantized digital pulse signals, and then the plurality of paths of quantized digital pulse signals are split into a first path of digital pulse signals and a second path of digital pulse signals, and the first path of digital pulse signals and the second path of digital pulse signals are distributed to 2 digital sound production chips.

The first path of digital pulse signal and the second path of digital pulse signal both comprise multiple paths of digital pulse signals.

Step 703: and the ASIC of the digital sound production chip distributes the received multipath quantized digital pulse signals to each path of energy conversion element.

Step 704: each path of transduction element converts the digital pulse signal into an acoustic pulse signal and outputs the acoustic pulse signal.

Step 705: the sound waves generated by the M x N basic transduction elements are superposed to generate sound.

The above system of fig. 6 may be adapted to either a wired headset or a wireless headset, wherein the bluetooth antenna is used to receive audio signals and then transmit the audio information to the headset; if the earphone is a wired earphone, the Bluetooth antenna can be replaced by an audio interface; the power supply supplies power to the system, and the system can be powered by a single power supply or a plurality of power supplies; the microphone is used for communication; the key switch and the indicator light are used for realizing the functions of starting up, shutting down, playing, pausing, state displaying and the like; the controller may comprise one or more integrated circuits for controlling various functions of the system, signal processing, and controlling characteristics of the digital sound chip sound, such as volume, directionality, and the like. The digital sound production chip is used for converting the electric signal into a sound energy signal to realize digital sound production.

Since the main and auxiliary earphones are each provided with a digital sound chip in this embodiment, the chips are located near the user's ears, and the sound waves are ensured to be emitted to the user's ears, so that the directivity does not need to be controlled.

In this embodiment, the two digital sound chips can be controlled by a controller, that is, a controller and a digital sound chip are disposed on the main board in the main earphone, and a digital sound chip is disposed on the main board in the auxiliary earphone, the controller in the main earphone divides the processed multi-channel quantized digital pulse signals into two channels and transmits them to the digital sound chips in the main earphone and the auxiliary earphone, and controls the digital sound chips in the main earphone and the auxiliary earphone to sound simultaneously.

Two digital sound production chips can also control one digital sound production chip through one controller, and at the moment, the two controllers need to establish a communication relation through electric connection or wireless communication so as to synchronize data of audio content generated by each digital sound production chip or other data related to sound generation and function control. The controller in the main earphone processes the received audio signal input by the audio input end to obtain a multi-channel quantized digital pulse signal and sends the multi-channel quantized digital pulse signal to the digital sounding chip in the main earphone, and controls the digital sounding chip in the main earphone to sound; a controller and a digital sound chip are arranged on the main board in the auxiliary earphone; the controller in the auxiliary earphone processes the received audio signal input by the audio input end to obtain a multi-path quantized digital pulse signal and sends the multi-path quantized digital pulse signal to the digital sounding chip in the auxiliary earphone, and controls the digital sounding chip in the auxiliary earphone to sound.

The earphone structure uses the digital sound chip to replace the traditional sound production unit, directly converts the digital audio stream into sound waves, can accurately reproduce the sound within the audio frequency range of 20 HZ-20000 HZ, and has high conversion rate; the digital sound production chip is directly integrated in the mainboard, and the problem that the technical difficulty is high when the traditional sound production unit is applied to the earphone and needs to consider matching with an acoustic cavity, a frequency division circuit, a mechanical structure and the like is solved.

The sound wave generated by the digital sound production chip arranged on the main earphone is controlled by the controller to point to the waveguide tube, so that the sound wave is transmitted to the auxiliary earphone; the digital sound production chips are respectively arranged on the main earphone and the auxiliary earphone, so that sound waves can be transmitted to the ears of a user without controlling the directivity; the main earphone and the auxiliary earphone are respectively provided with a digital sounding chip, each digital sounding chip is correspondingly provided with a controller, and the two controllers are electrically or wirelessly connected to establish a communication relation so as to synchronize audio content data generated by each digital sounding chip; the number of the digital sounding chip and the controller is flexibly selected and mutually matched, the earphone structure is suitable for wired earphones and wireless earphones, and meanwhile, the design requirements of various earphones on the aspects of size, shape, tone quality and the like can be met.

As a possible implementation manner, main components used for power supply, control, sound generation, and the like in the system may be integrated in a main headset, and a main board in the main headset may be configured as a main board as shown in fig. 8, and as shown in fig. 8, the main board includes a main board substrate 801, and a power supply 802, an antenna 803, a first controller 804, a contact pad 805, a microphone 806, and a first digital sound generation chip 807 are disposed on the main board substrate 801.

The main board substrate 801 is used for bearing each device and realizing electrical connection among different devices; the power supply 802 is used for supplying power to the whole headset, can be used for supplying power to the headset by using a single power supply or a plurality of power supplies, and can also be configured to be charged wirelessly; the antenna 803 is used for receiving the audio signal and then transmitting the audio signal to the earphone; the first controller 804 comprises one or more integrated circuits for controlling various functions of the system, performing signal processing, and controlling sound characteristics, such as volume, directivity, etc., of the first digital sound chip 807; contact pad 805: the device is used for connecting an external circuit and used for power supply, audio signal input and the like; the microphone 806 is used for conversation; the first digital sound chip 807 is used to convert the electrical signal into an acoustic energy signal, so as to implement digital sound production.

It should be understood that fig. 8 is only a schematic structural diagram of the motherboard, which indicates the main components, and the actually included components may not be limited to the above. The external shapes of the main board and each device are also only schematic diagrams, and do not represent actual shapes.

As a possible implementation manner, the digital sound generating chip and the devices for power supply and control in the system may be integrated in the main headset, the auxiliary headset integrates the digital sound generating chip with an antenna, a microphone, and the like, the main board in the main headset may be a main board as shown in fig. 8, the main board in the auxiliary headset may be an auxiliary board as shown in fig. 9, and the main board and the auxiliary board may be in communication connection through a wire or wirelessly. The auxiliary main board is also a main board structure, and is called as an auxiliary main board for distinguishing from the main board in the main earphone.

As shown in fig. 9, the sub-main board includes: a sub-motherboard substrate 901, an antenna 803, a second digital sound chip 902, a microphone 806, and contact pads 805.

It should be understood that the sub-motherboard shown in fig. 9 is only a schematic diagram of a motherboard structure, and the actually included components may not be limited to the above. The external shapes of the main board and each device are also only schematic diagrams, and do not represent actual shapes.

Because digital sound production chip is integrated on the mainboard, no longer need be used for specially encapsulating the chamber that holds of speaker in the earlap, as long as have enough space that holds the mainboard can, consequently the earphone main part can accomplish very little, and this earphone can be designed for the earphone of types such as pleasant formula, wear-type. The following description will be made taking headphones as an example:

fig. 10 is a structure diagram of a wireless headset, and as shown in fig. 10, the headset structure includes a headband 10, an earshell 20, a cavity cover 30, an earmuff 40, a waveguide 50, and a main board disposed in the earshell 20. The cavity cover plate 30 is covered on the ear shell 20, and the ear cover 40 is covered on the cavity cover plate 30. In consideration of wearing comfort, even if the earphone main body can be made small, the earshell portion can be made as thin as possible but is not preferably made small.

The headband 10 is used for fixing the earmuffs 20, and the headband 10 can be designed to be telescopic so as to ensure the wearing comfort of different people.

The shell 20: the earmuff 20 or the connection between the earmuff 20 and the headband 10 can be designed to have a certain rotation angle for adjusting the ear-contacting ability and preventing sound leakage. The main board is disposed in a receiving cavity formed by the earshell 20.

The cavity cover plate 30: the main board is used for protecting the main board in the earmuff 20, and the cavity cover plate 30 is hollowed out or provided with a sound outlet for sound wave transmission.

The ear muffs 40: the part of the head that contacts the sound emitting unit cushions the pressure of the headband 10. In order to improve the wearing comfort, soft ear-sticking materials, light materials such as rebound foam and the like are selected.

Waveguide tube 50: located within the cavity of the headband 10 to guide and propagate sound waves to the secondary earpiece and then into the human ear.

A main board: the number of the main board is one or more, and if the number of the main board is one, the main board can be set as the main board of fig. 8, and includes electronic devices for realizing the functions of the headset and a substrate or a connecting wire for electrically connecting the electronic devices, and the main board is fixed in the earshell through a buckle, a screw, glue and the like.

In the earphone as shown in fig. 10, only the main earphone is provided with a digital sound production chip, the controller receives an input signal through the antenna, the digital audio signal and a control signal are sent to the digital sound production chip after being processed, and the substrate transduction element of the digital sound production chip converts an electric signal into a sound energy signal and mutually superposes the sound energy signal to produce sound. Because the digital sound production chip is positioned in the main earphone shell, sound waves can be directly transmitted into the main earphone. Meanwhile, in the digital sounding stage, the controller needs to control the digital sounding chip to enable the generated sound waves to point to the waveguide tube, so that the sound waves can reach the auxiliary earphone through the waveguide tube and then enter human ears.

In the headset of fig. 10, the main components of the system for power supply, control, sound production, etc. are integrated in the main headset.

Fig. 11 is a structural diagram of a rear-hanging headphone, as shown in fig. 11, the headphone structure includes a head beam 60, a first ear shell 61, a first cavity cover plate 62, a first ear cover 63, and a main board disposed in the first ear shell 61. First cavity apron 62 lid closes on first earlap 61, and first earmuff 63 lid closes on first cavity apron 62, and digital sound production chip can directly be integrated in the circuit board owing to the advantage of miniaturization, realizes the light thin requirement of back hanging earphone very easily. The first earmuff body is small and light enough on the premise of ensuring wearing comfort; the head bridge 60 is made of a material that enables the first earshell to be firmly attached, such as an elastic extension wire material having a certain restoring force after being stretched, so that the head bridge 60 can be appropriately adjusted according to different human body auricle shapes, and can be cylindrical or flat.

Wherein, the head beam 60: for holding the first ear shell 61, which is placed on both sides of the head. The elastic telescopic wire is selected to adjust the shape according to different human body auricle shapes, so that the ear-shaped protective sleeve is comfortable to wear.

First ear shell 61: the earphone body can comprise a containing cavity formed by two earshells, when two digital sounding chips are arranged, two main boards are needed, and the two main boards are respectively arranged in the containing cavity formed by the two earshells;

first cavity cover plate 62: a mainboard for protecting in the first earlap 61, the fretwork of first cavity apron 62 or be equipped with the sound hole for the sound wave transmission.

First ear cup 63: the head part is contacted with the sounding unit to buffer the pressure of the headband. In order to improve the wearing comfort, soft ear-sticking materials such as rebound foam and the like are selected.

A main board: the main board may be one or more, and includes electronic devices for implementing the functions of the headset and a substrate or wiring for electrically connecting the devices, and the main board is fixed in the earshell by means of a snap, a screw, glue, or the like.

While the invention has been described in connection with various embodiments, other variations to the disclosed embodiments can be understood and effected by those skilled in the art in practicing the claimed invention, from a review of the drawings, the disclosure, and the appended claims. In the claims, the word "comprising" does not exclude other elements or steps, and the word "a" or "an" does not exclude a plurality. A single processor or other unit may fulfill the functions of several items recited in the claims. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage.

Although the present invention has been described in connection with the specific features and embodiments thereof, it is apparent that various modifications and combinations can be made thereto without departing from the spirit and scope of the invention. Accordingly, the specification and figures are merely exemplary of the invention as defined in the appended claims and are intended to cover any and all modifications, variations, combinations, or equivalents within the scope of the invention. It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims

1. An earphone based on a digital sound production chip, the earphone at least comprises: the controller and the digital sound chip;

the controller receives an audio signal input by an audio input end, processes the audio signal, calculates to obtain a plurality of paths of quantized digital pulse signals, transmits the plurality of paths of quantized digital pulse signals to the digital sounding chip, and controls the digital sounding chip to sound;

2. The digital sound chip based earphone according to claim 1, wherein the controller and the digital sound chip are disposed on a main board; the digital sound production chip comprises a first digital sound production chip and a second digital sound production chip; the earphone comprises a main earphone, an auxiliary earphone and an auxiliary main board; the main board is arranged in the main earphone, the auxiliary main board is arranged in the auxiliary earphone, a first digital sound production chip and a first controller are arranged on the main board, and a second digital sound production chip is arranged on the auxiliary main board; the first controller processes the received audio signals, calculates to obtain multi-path quantized digital pulse signals, and divides the multi-path quantized digital pulse signals into two groups of digital pulse signals to be respectively transmitted to the first digital sound production chip and the second digital sound production chip; and the two groups of digital pulse signals comprise multi-path quantized digital pulse signals.

3. The headset based on the digital sound production chip, according to claim 2, wherein a second controller is disposed on the secondary main board, and the second controller is electrically connected or wirelessly connected with the first controller; the first controller processes the received audio signal, calculates to obtain a multi-path quantized digital pulse signal and controls the first digital sounding chip to sound; and the second controller receives the audio signal input by the audio input end, processes the audio signal, calculates to obtain a multi-channel quantized digital pulse signal and controls the second control chip to sound.

4. The headset of claim 1, wherein the audio input is a bluetooth antenna or an audio interface; when the earphone is a wireless earphone, the audio input end is a Bluetooth antenna; and when the earphone is a wired earphone, the audio input end is an audio interface.

5. The digital sound chip based earphone according to claim 1, wherein the digital sound chip comprises:

the contact receives the multi-channel quantized digital pulse signals and transmits the signals to the ASIC chip;

6. The digital sound chip-based earphone according to claim 1, wherein the thickness of the digital sound chip is less than or equal to 2mm, and the length of the digital sound chip is less than 20 mm.

7. The digital sound chip based earphone according to claim 2, wherein the main earphone is integrated with a first digital sound chip, a power supply, a controller and a first microphone; the second digital sound production chip, the antenna and the second microphone are integrated in the sub-earphone.

8. The digital sound production chip-based headset of claim 2, wherein the first controller in the main headset controls the first digital sound production chip to produce sound and transmits the sound to the sub-headset through the waveguide.

9. The digital sound chip based earphone according to claim 8, wherein the earphone comprises a head band, an earshell and a cavity cover plate;

10. The headset based on the digital sound production chip, according to claim 1, wherein the controller is disposed on the mobile intelligent terminal.