CN114938605A - A cooling system and application - Google Patents

Abstract

The invention relates to a cooling system and application thereof, belonging to the technical field of thermal management of airborne electronic equipment; it comprises a spray cooling module and a microchannel heat exchanger; the coolant after heat absorption flows through the microchannel heat exchanger, and the spray cooling module cools the microchannel heat exchanger. The surface of the channel heat exchanger is spray-cooled. The microchannel heat exchanger includes an inlet pipeline, a heat exchange component, and an outlet pipeline. The coolant after heat absorption flows into the heat exchange component through the inlet pipeline, and then is transported back to the onboard electronic equipment through the outlet pipeline after cooling; the spray cooling module It includes a spray nozzle array, a water storage tank, a working fluid pump, and a connecting pipeline; the working fluid is introduced from the water storage tank into the connecting pipeline through the working fluid pump, and then sprayed through the spray nozzle array, which will affect the outer surface of the microchannel heat exchanger. Perform spray cooling. The invention proposes spray cooling on the outer surface of the microchannel heat exchanger to strengthen the heat transfer performance of the heat exchanger, and the cooling effect is obviously enhanced by combining the microchannel heat exchanger with the spray cooling technology.

Description

A cooling system and application

technical field

The invention belongs to the technical field of thermal management of airborne electronic equipment, and in particular relates to a cooling system and application.

Background technique

At present, the electronic technology industry is developing rapidly, and electronic devices tend to be high-efficiency, miniaturized, and integrated. Following this, the heat flux density of electronic devices is increased, and the thermal management requirements are greatly increased. Compared with ground electronic devices, the ambient temperature of airborne electronic equipment is higher due to the aerodynamic heat of the aircraft, and the low air pressure and thin air in the high-altitude environment make the heat dissipation environment worse. Therefore, when the airborne electronic equipment is running The heat dissipation faces greater challenges.

The traditional air cooling method will not be able to meet the increasing heat dissipation requirements. Compared with air-cooled technology, liquid-cooled technology has the characteristics of high cooling efficiency, stable operation and low energy consumption. According to actual engineering needs, liquid cooling technologies include microchannel heat exchangers, spray cooling, spray cooling, etc. Among them, the micro-channel heat exchanger is small in size, saves space, has high heat flux density, and has small spray cooling flow but high heat dissipation efficiency, which has become the main research direction of the application of liquid cooling technology. Therefore, many scholars have studied the above two efficient cooling methods separately to achieve higher cooling efficiency. However, both techniques have their own technical limitations.

As far as microchannel heat exchangers are concerned, in order to enhance heat exchange, most researches focus on adding microstructures to the heat exchanger channels, which results in higher processing technology requirements and higher manufacturing costs. The research on spray cooling technology mainly focuses on optimizing and improving the spray system itself, such as the optimal spray flow rate, spray height, nozzle type and spray cooling surface structure of the spray system. The conclusions drawn under different studies are also different. , most of them are only suitable for specific application scenarios, and the general applicability is poor. Therefore, it is of great significance to carry out targeted research for the specific application requirements of airborne electronic equipment cooling.

At present, the cooling process used in the airborne cooling system is that the coolant rapidly cools the heat-loaded surface through the atomizing nozzle, and the high-temperature coolant after absorbing heat flows through the spiral coil in the middle interlayer of the phase change heat storage device. It is transferred to the phase change medium in the phase change heat storage device, and the cooled coolant sprays and cools the heat load surface again to realize the cycle. However, the cooling effect of the high-temperature coolant in this cooling system has certain limitations: compared with the high heat transfer coefficient of spray cooling, the heat transfer coefficient of the phase change medium for heat absorption is lower, and the heat transfer capacity of the two is poorly matched. It is difficult to guarantee the effective cooling of the spray coolant.

The spray cooling system using spiral coils in the prior art mainly includes a liquid cooling system for airborne electronic equipment, a spray cooling cavity (including a conical vertical spiral coil and a spray nozzle), a water pump, and the like. The operation process is as follows: the high-temperature coolant flows into the conical vertical spiral coil in the spray cooling cavity, and the spray nozzle at the top of the cavity sprays the atomized droplets to the outer wall of the spiral coil, thereby realizing heat exchange and cooling. The above-mentioned vertical spiral coils are distributed in a conical shape, the cone angle is equivalent to the spray cone angle, and the spray cone can cover the spiral coils. Compared with the ordinary spiral coil, the conical spiral three-dimensional coil in this spray cooling system increases the contact area between the spray and the coil, and improves the heat exchange efficiency of the spray cooling. However, there is only one spray nozzle in this system, which is located above the conical spiral coil for spraying, which results in insufficient heat exchange on the back of the coil and limited cooling efficiency; secondly, the applied conical vertical spiral coil is large in volume , insufficient space utilization.

Therefore, a method for efficient cooling of the coolant in the airborne liquid cooling and heat sink has been developed. For efficient cooling of airborne electronic equipment, the weight and volume of the airborne heat sink can be greatly reduced, and the endurance of the aircraft can be improved. And reduce energy consumption, which has very important practical value and innovative significance, and can effectively solve the problem that the coolant in the current airborne liquid cooling and heat sink cannot be rapidly and stably cooled, and realize circulating cooling.

SUMMARY OF THE INVENTION

Technical problem to be solved:

In order to avoid the shortcomings of the prior art, the present invention provides a cooling system and application, which integrates the spray cooling technology and the microchannel heat exchanger cooling technology into the same system, effectively utilizes the advantages of the high heat transfer coefficient of the two, and can Effectively cools high-temperature coolant while ensuring that the cooling system requires less pumping power; continuously and efficiently cools the onboard electronic equipment, greatly reduces the weight and volume of the onboard heat sink, improves the endurance of the aircraft and reduces energy consumption .

The technical scheme of the present invention is: a cooling system, which is characterized in that: it includes a spray cooling module and a microchannel heat exchanger; the coolant after heat absorption flows through the microchannel heat exchanger, and passes through the spray cooling module. The surface of the microchannel heat exchanger is spray-cooled, and the cooled coolant returns to the airborne electronic equipment to continue cooling the airborne electronic equipment.

A further technical solution of the present invention is: the microchannel heat exchanger includes an inlet pipeline, a heat exchange component, and an outlet pipeline, the coolant after heat absorption flows into the heat exchange component through the inlet pipeline, and then passes through the outlet pipeline after cooling. transport back to the onboard electronics;

The heat exchange assembly includes a shell, a flow divider, a heat exchange channel, and a current collector, and the shell is a cavity structure with a flat shape; the flow divider and the current collector are arranged at both ends of the cavity, and the heat exchange channel is arranged in the middle of the cavity, and connect the flow divider and the collector; the inlet pipeline is connected with the flow divider, and the outlet pipeline is connected with the collector;

The coolant input from the inlet pipeline flows through the splitter, is divided into several branches and then flows into the heat exchange channel. The coolant flowing out of the heat exchange channel is then collected by the collector and directed to the heat exchanger outlet pipeline. .

A further technical solution of the present invention is: the two ends of the casing are arc-shaped structures, and a through hole is opened in the middle near the outer edges of the two ends of the arc, which are respectively used as connection ports with the inlet pipeline and the outlet pipeline; the The inlet pipeline and the outlet pipeline are respectively connected vertically with the flow divider and the collector.

A further technical solution of the present invention is that: the flow divider is located at one end of the connecting inlet pipeline, and includes a plurality of linear guide fins; Below the hole, the incoming coolant is divided into several sub-streams.

A further technical solution of the present invention is that: the heat exchange channel includes a plurality of channels arranged side by side in the spanwise direction, and communicates with the branches separated by the linear guide fins in the flow divider in a one-to-one correspondence.

A further technical solution of the present invention is: the cross-section of each channel in the heat exchange channel is circular, square or polygonal; the equivalent diameter of the channel is 0.1 mm to 1 mm.

A further technical solution of the present invention is that: the collector is located at one end of the connecting outlet pipeline, and includes a plurality of arc-shaped baffles; the plurality of arc-shaped baffles are radially arranged on the outlet pipeline. Below the connected through holes, branches separated by a plurality of arc-shaped guide fins are connected with each channel in the heat exchange channel one by one; the coolant flowing out of the heat exchange channel is collected and led out from the outlet pipeline.

A further technical solution of the present invention is: the spray cooling module includes two spray nozzle arrays, a water storage tank, a working fluid pump, and a connecting pipeline; the two spray nozzle arrays are respectively fixed on the microchannel heat exchanger. on both sides, and are connected with the water storage tank through the connecting pipeline and the working fluid pump respectively;

The working medium water in the water storage tank is powered by the working medium pump, is introduced into the connecting pipeline from the water storage tank, and then sprayed out through the spray nozzle array to spray and cool the outer surface of the microchannel heat exchanger.

A further technical solution of the present invention is that: the spray nozzle array includes a plurality of nozzles arranged in an array, and the nozzles are all facing the microchannel heat exchanger to ensure that the spray droplets evenly cover the surface of the microchannel heat exchanger.

An application of a cooling system, characterized in that the cooling system is applied to airborne electronic equipment, the heat of the airborne electronic equipment is transferred to a coolant, the coolant after heat absorption flows through a microchannel heat exchanger, and is cooled by spraying The module cools the surface of the microchannel heat exchanger, thereby realizing the enhanced heat exchange of the coolant in the microchannel heat exchanger, and the cooled coolant returns to the onboard electronic equipment.

beneficial effect

The beneficial effect of the present invention is that most of the existing researches focus on improving the heat exchange efficiency of the heat exchanger by improving the structure of the heat exchanger or adjusting the design parameters. On the one hand, although the cooling efficiency is improved by studying the structure of the heat exchanger under a given working condition, the applicability is low, and the cooling effect is also limited; on the other hand, the structure of the heat exchanger studied is complex, The processing difficulty is high, and the practicability needs to be investigated. In order to solve this problem, the present invention proposes spray cooling on the outer surface of the microchannel heat exchanger to enhance the heat transfer performance of the heat exchanger, and the cooling effect is significantly enhanced by combining the microchannel heat exchanger with the spray cooling technology. At the same time, a guide fin structure is added inside the micro-channel heat exchanger, which can uniform the fluid flow in each channel. Compared with the manifold type splitter, the guide vane type splitter requires lower pumping power, has a simple structure, is convenient to process, and has strong practicability.

The microchannel heat exchanger of the present invention is provided with a flow divider, a heat exchange channel and a current collector. The splitter is connected with the inlet pipe of the heat exchanger, and the tail end is connected with the heat exchange channel. Heat exchange; the linear guide vanes set in the flow divider can distribute the coolant flow of each channel. The collector is connected with the outlet pipeline, and the tail end is connected with the heat exchange channel. The arc-shaped guide fins are arranged to concentrate the coolant in each channel to the outlet of the heat exchanger.

The spray nozzle array uniformly sprays the atomized water droplets on the outer surface of the micro-channel heat exchanger, and utilizes the latent heat of vaporization of water to cool the outer surface of the heat exchanger, thereby realizing enhanced heat exchange of the coolant in the heat exchanger.

Description of drawings

1 is a schematic diagram of a cooling system for realizing efficient heat exchange of coolant in an airborne liquid cooling and heat sink of the present invention;

2 is a schematic diagram of a microchannel heat exchanger in a cooling system for realizing efficient heat exchange of coolant in an airborne liquid cooling and heat sink of the present invention;

3 is a schematic diagram of the internal structure of a micro-channel heat exchanger in a cooling system for realizing efficient heat exchange of coolant in an airborne liquid cooling and heat sink of the present invention.

Description of reference numerals: 1. Microchannel heat exchanger, 1-1. Inlet pipeline, 1-2. Diverter, 1-3. Channel, 1-4. Collector, 1-5. Outlet pipeline, 1-2-1. Linear deflector, 1-4-1. Arc deflector, 2. Spray nozzle array, 3. Water storage tank, 4. Working fluid pump, 5. Connecting pipeline.

Detailed ways

The embodiments described below with reference to the accompanying drawings are exemplary, and are intended to explain the present invention and should not be construed as limiting the present invention.

In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", " rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc., or The positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, Therefore, it should not be construed as a limitation of the present invention.

Referring to FIG. 1 , a cooling system in this embodiment includes a spray cooling module and a microchannel heat exchanger; the heat-absorbing coolant flows through the microchannel heat exchanger, and the microchannel heat exchanger is exchanged through the spray cooling module. The surface of the heater is spray-cooled, and the cooled coolant returns to the onboard electronic equipment to continue cooling the onboard electronic equipment.

The spray cooling module includes two spray nozzle arrays 2 , a water storage tank 3 , a working fluid pump 4 , and a connecting pipeline 5 ; the two spray nozzle arrays 2 are respectively fixed on both sides of the microchannel heat exchanger 1 . , and are communicated with the water storage tank 5 through the connecting pipeline 5 and the working fluid pump 4 respectively; , and then sprayed through the spray nozzle array 2 to spray and cool the outer surface of the microchannel heat exchanger 1 . The spray nozzle array 2 includes a plurality of nozzles arranged in an array, and the nozzles are all facing the microchannel heat exchanger to ensure that the spray droplets evenly cover the surface of the microchannel heat exchanger.

Referring to FIG. 2 , the microchannel heat exchanger includes an inlet pipeline 1-1, a heat exchange component, and an outlet pipeline 1-5. The coolant after heat absorption flows into the heat exchange component through the inlet pipeline, and after cooling It is transported back to the onboard electronic equipment through the outlet pipeline; the heat exchange assembly includes a shell, a flow divider 1-2, a heat exchange channel 1-3, and a collector 1-4, and the shell is a flat cavity structure; The shunt 1-2 and the current collector 1-4 are arranged at both ends of the cavity, the heat exchange channel 1-3 is arranged in the middle of the cavity, and the shunt 1-2 and the current collector 1-4 are communicated; The inlet pipeline 1-1 is communicated with the diverter 1-2, and the outlet pipeline 1-5 is communicated with the collector 1-4; the coolant input from the inlet pipeline 1-1 flows through the diverter 1-2, After being divided into several branches, it flows into the heat exchange channel 1-3, and the coolant flowing out from the heat exchange channel 1-3 is collected by the collector 1-4 and guided to the heat exchanger outlet pipeline 1-5.

The two ends of the shell of the microchannel heat exchanger 1 are arc-shaped structures, and a through hole is opened in the middle of the outer edges of the arcs at both ends, which are respectively used as connection ports with the inlet pipeline and the outlet pipeline; the inlet The pipeline and the outlet pipeline are respectively connected vertically with the flow divider 1-2 and the current collector 1-4.

Referring to FIG. 3 , the diverter 1-2 is located at one end of the connecting inlet pipeline 1-1, and includes a plurality of linear guide vanes 1-2-1; the plurality of linear guide vanes 1-2-1 are It is arranged radially below the through hole connected to the inlet pipeline 1-1, and divides the inflowing coolant into several branches. The heat exchange channel 1-3 includes a plurality of channels arranged side by side in the span direction, and communicates with the branches separated by the linear guide fins 1-2-1 in the flow divider 1-2 in a one-to-one correspondence. The cross section of each channel in the heat exchange channels 1-3 is circular, square or polygonal; the equivalent diameter of the channel is 0.1 mm to 1 mm. The current collector 1-4 is located at one end of the connecting outlet pipeline 1-5, and includes a plurality of arc-shaped guide fins 1-4-1; the plurality of arc-shaped guide fins 1-4-1 are radially arranged Distributed below the through hole connected to the outlet pipeline 1-5, the branches separated by a plurality of arc-shaped guide fins 1-4-1 communicate with each channel in the heat exchange channel 1-3 in a one-to-one correspondence ; Converge the coolant flowing out of the heat exchange channels 1-3 and export it from the outlet pipeline 1-5.

Example:

As shown in Figures 1-3, in this embodiment, a cooling system for realizing efficient heat exchange of coolant in an airborne liquid cooling and heat sink includes a microchannel heat exchanger 1, a spray nozzle array 2, a water storage tank 3, a working medium Pump 4 and connecting pipeline 5. The microchannel heat exchanger 1 includes an inlet pipeline 1-1, a flow divider 1-2, a channel 1-3, a collector 1-4 and an outlet pipeline 1-5. The inlet pipeline 1 is in vertical communication with the top surface of the flow divider 2. The flow divider 2 is provided with a plurality of linear guide vanes 1-2-1. The channel 1-3 is a plurality of continuous and uniform single channels. One end of 1-3 is connected to the shunt 1-2, and the other end is connected to the collector 1-4. The collector 1-4 is provided with a plurality of arc-shaped guide vanes 1-4-1. The outlet pipeline 1-5 are in vertical communication with the top surface of the collector 1-4. The spray nozzle arrays 2 are fixed on both sides of the microchannel heat exchanger 1 .

work process:

The high-temperature coolant after heat exchange enters into the splitter 1-2 through the inlet pipe 1-1, and the linear guide fins 1-2-1 inside the splitter evenly distribute the coolant to the heat exchanger channels 1-3, The coolant flowing through channels 1-3 transfers heat to the surface of the microchannel heat exchanger 1 . At the same time, the water is pumped out from the water storage tank 3 by the working fluid pump 4, and enters the spray nozzle array 2 at a high flow rate. The outer surface of the microchannel heat exchanger 1 uses the latent heat of vaporization of water to cool the outer surface of the heat exchanger, thereby realizing the enhanced heat exchange of the coolant in the heat exchanger.

Although the embodiments of the present invention have been shown and described above, it should be understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and those of ordinary skill in the art will not depart from the principles and spirit of the present invention Variations, modifications, substitutions, and alterations to the above-described embodiments are possible within the scope of the present invention without departing from the scope of the present invention.

Claims (10)

1. A cooling system, characterized by: comprises a spray cooling module and a micro-channel heat exchanger; and the coolant after absorbing heat flows through the micro-channel heat exchanger, the surface of the micro-channel heat exchanger is subjected to spray cooling through the spray cooling module, and the cooled coolant returns to the airborne electronic equipment to continue to cool the airborne electronic equipment.

2. The cooling system of claim 1, wherein: the microchannel heat exchanger comprises an inlet pipeline, a heat exchange assembly and an outlet pipeline, wherein the coolant after absorbing heat flows into the heat exchange assembly through the inlet pipeline, and is conveyed back to the airborne electronic equipment through the outlet pipeline after being cooled;

the heat exchange assembly comprises a shell, a flow divider, a heat exchange channel and a current collector, wherein the shell is of a hollow cavity structure with a flat appearance; the flow divider and the flow collector are arranged at two ends of the cavity, and the heat exchange channel is arranged in the middle of the cavity and communicates the flow divider and the flow collector; the inlet pipeline is communicated with the flow divider, and the outlet pipeline is communicated with the flow collector;

the coolant input from the inlet pipeline flows through the flow divider, is divided into a plurality of branches and then flows into the heat exchange channel, and the coolant flowing out of the heat exchange channel is converged by the current collector and is guided to the outlet pipeline of the heat exchanger.

3. The cooling system of claim 2, wherein: the two ends of the shell are of arc structures, and the middle parts of the shell close to the arc outer edges of the two ends are respectively provided with a through hole which is respectively used as a connecting port with an inlet pipeline and an outlet pipeline; the inlet pipeline and the outlet pipeline are respectively and vertically communicated with the flow divider and the flow collector.

4. The cooling system according to claim 2 or 3, wherein: the flow divider is positioned at one end of the connecting inlet pipeline and comprises a plurality of linear flow deflectors; the linear guide vanes are radially arranged below the through hole connected with the inlet pipeline, and divide the flowing coolant into a plurality of branches.

5. The cooling system of claim 4, wherein: the heat exchange channels comprise a plurality of channels which are arranged in parallel along the spanwise direction and are communicated with the branches separated by the linear type flow deflectors in the flow divider in a one-to-one correspondence mode.

6. The cooling system of claim 5, wherein: the cross section of each channel in the heat exchange channels is circular, square or polygonal; the equivalent diameter of the channel is 0.1 mm-1 mm.

7. The cooling system of claim 5, wherein: the current collector is positioned at one end of the connecting outlet pipeline and comprises a plurality of arc-shaped flow deflectors; the plurality of arc-shaped flow deflectors are radially arranged below the through hole connected with the outlet pipeline, and the branches separated by the plurality of arc-shaped flow deflectors are communicated with the channels in the heat exchange channels in a one-to-one correspondence manner; the coolant flowing out of the heat exchange channel is gathered and led out from the outlet pipeline.

8. The cooling system of claim 1, wherein: the spray cooling module comprises two spray nozzle arrays, a water storage tank, a working medium pump and a connecting pipeline; the two spray nozzle arrays are respectively fixed on two sides of the micro-channel heat exchanger and are respectively communicated with the water storage tank through a connecting pipeline and a working medium pump;

working medium water in the water storage tank is powered by a working medium pump, is guided into the connecting pipeline from the water storage tank and is sprayed out through the spray nozzle array to carry out spray cooling on the outer surface of the micro-channel heat exchanger.

9. The cooling system of claim 8, wherein: the spray nozzle array comprises a plurality of nozzles which are arranged in an array, and the nozzles face the microchannel heat exchanger, so that spray liquid drops can uniformly cover the surface of the microchannel heat exchanger.

10. The use of the cooling system according to any one of claims 1 to 9, wherein the cooling system is applied to an onboard electronic device, heat of the onboard electronic device is transferred to a coolant, the coolant after absorbing heat flows through the microchannel heat exchanger, the surface of the microchannel heat exchanger is cooled by the spray cooling module, so that the heat exchange of the coolant in the microchannel heat exchanger is enhanced, and the cooled coolant returns to the onboard electronic device.

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