Defect elimination formula part multiangular polishing equipment for machine-building
Technical Field
The invention belongs to the technical field of part polishing, and particularly relates to a defect elimination type part polygonal polishing device for machine manufacturing.
Background
China is a large industrial country and is also a large manufacturing country, and with the rapid development of the industrial level of China in recent years, products can be polished in the mechanical manufacturing process, so that automatic polishing equipment is indispensable.
The prior polishing equipment has the following problems:
1. after the workpiece is polished by the conventional polishing equipment, burrs appear on the surface of the workpiece, and the workpiece with the burrs needs to be secondarily processed;
2. traditional ion polishing equipment can only carry out microcosmic flattening effect to the work piece surface, and can't carry out macroscopic flattening to the work piece, and practical efficiency is low, and the range of application has the restriction.
Disclosure of Invention
Aiming at the situation and overcoming the defects of the prior art, the scheme provides a part polygonal polishing device for mechanical manufacturing with defects eliminated, aiming at the problem that the polishing efficiency is influenced by the residual scraps on the surface of a workpiece, the energy ions and the mechanical polishing structure are creatively combined and applied to the technical field of part polishing, and the removal of the shawl generated in the polishing process of the surface of the workpiece is realized through the arranged indexing type turning shawl removing and polishing mechanism, so that the corrosion resistance of the polishing surface of the workpiece is enhanced, and the problem that the polishing quality of the workpiece is influenced by the scraps adhered to the surface of the workpiece in the polishing process, which is difficult to solve in the prior art, is solved;
according to the invention, the side-impact cooling type workpiece positioning mechanism is arranged, so that the side wall of the workpiece is cooled under the condition that no waste liquid or raised dust is generated, and the jet effect is adopted in the mode, so that the workpiece is convenient to maintain low-temperature polishing;
the scheme provides a part polygonal polishing device for mechanical manufacturing, which adopts a mode of offsetting defects, completes the shawl removal and polishing of workpieces, and can cool the temperature generated in the polishing of the workpieces.
The technical scheme adopted by the scheme is as follows: the multi-angle part polishing equipment for the defect elimination type machine manufacturing comprises a bottom plate, support columns, a workbench, an indexing type turning type cloak removing polishing mechanism and a side impact cooling type workpiece positioning mechanism, wherein multiple groups of the support columns are arranged on the upper wall of the bottom plate, the workbench is arranged on the upper wall of the support columns, the indexing type turning type cloak removing polishing mechanism is arranged above the workbench, the side impact cooling type workpiece positioning mechanism is arranged on the upper wall of the bottom plate, the indexing type turning type cloak removing polishing mechanism comprises a turning object separating component, a lifting polishing component and a compensation type spraying mechanism, the turning object separating component is arranged on the upper wall of the workbench, the lifting polishing component is arranged on the upper wall of the turning object separating component, the compensation type spraying mechanism is arranged on the upper wall of the lifting polishing component, and the side impact cooling type workpiece positioning mechanism comprises a positioning clamping mechanism and a side wall cooling mechanism, the positioning and clamping mechanism is arranged on the upper wall of the workbench, and the side wall cooling mechanism is arranged in the middle of the upper wall of the bottom plate.
As a further preferred option of the scheme, the steering object separating assembly comprises a steering motor, a steering shaft, a turntable and a bearing plate, wherein the steering motor is arranged in the middle of the bottom wall of the workbench, the steering shaft penetrates through the workbench and is arranged at the power end of the steering motor, the turntable is arranged on the outer side of one end, far away from the steering motor, of the steering shaft, the turntable is rotatably arranged on the upper wall of the workbench, and the bearing plate is arranged on the upper wall of the turntable; the lifting polishing assembly comprises a hydraulic cylinder, octagonal discs, polishing motors, polishing shafts, polishing discs and polishing sand layers, the hydraulic cylinder is arranged on the upper wall of the bearing plate, the octagonal discs are arranged on one side, away from the bearing plate, of the hydraulic cylinder, the polishing motors are arranged on the upper wall of the octagonal discs in multiple groups, the polishing motors are arranged on one sides, away from the hydraulic cylinder, of the octagonal discs, the polishing shafts are arranged at the power ends of the polishing motors, the polishing discs are arranged on one sides, away from the polishing motors, of the polishing shafts, and the polishing sand layers are arranged on the bottom walls of the polishing discs; the compensation type spraying mechanism comprises a liquid storage tank, a partition plate, a liquid polishing wax storage cavity, an energy-containing ionic liquid storage cavity, an atomizing motor, a collecting pipe, an extracting pipe, an atomizing pipe, a metal telescopic pipe and a spray head, wherein the liquid storage tank is arranged on the upper wall of an octagonal plate, the partition plate is arranged on the inner wall of the liquid storage tank, the liquid polishing wax storage cavity is arranged between the partition plate and the upper wall of the liquid storage tank, the energy-containing ionic liquid storage cavity is arranged between the partition plate and the bottom wall of the liquid storage tank, a plurality of groups of atomizing motors are arranged on the side wall of the liquid storage tank, the collecting pipe is communicated between the liquid polishing wax storage cavity and the energy-containing ionic liquid storage cavity, the extracting pipe is communicated between the power input end of the atomizing motor and the collecting pipe, the atomizing pipe is arranged at the power output end of the atomizing motor, one end of the atomizing motor, which is far away from the atomizing motor, of the metal telescopic pipe is communicated with one side of the atomizing motor, which is far away from the atomizing motor, of the atomizing pipe, the spray head is communicated with one side of the metal telescopic pipe away from the spraying pipe; the steering motor drives the steering shaft to rotate in the forward direction, the steering shaft drives the bearing plate to rotate through the turntable, the bearing plate drives the octagonal plate to rotate through the hydraulic cylinder, the octagonal plate drives the spray head to rotate above a workpiece, at the moment, the hydraulic cylinder shortens the time for driving the spray head to descend through the octagonal plate to be close to the workpiece, the atomizing motor respectively extracts liquid polishing wax and energy-containing ionic liquid through the collecting pipe, mixed liquid enters the atomizing motor through the extracting pipe, the mixed liquid enters the metal telescopic pipe through the atomizing pipe after being atomized by the atomizing motor, the metal telescopic pipe sprays mist to the surface of the workpiece through the spray head, at the moment, the metal telescopic pipe is manually compressed, the steering motor drives the steering shaft to rotate in the reverse direction, the steering shaft drives the bearing plate to rotate through the turntable, the bearing plate drives the octagonal plate to rotate through the hydraulic cylinder, the octagonal plate drives the polishing motor to rotate above the workpiece, and the hydraulic cylinder shortens the height for driving the polishing motor to descend again, the grinding motor drives the grinding disc to descend through the grinding shaft, the grinding disc drives the grinding layer to be attached to the sprayed workpiece, the grinding motor drives the grinding disc to rotate through the grinding shaft, and the grinding disc drives the grinding layer to rotate to polish the workpiece.
Preferably, the positioning and clamping mechanism comprises a workpiece groove, threaded holes, bolts, nuts, clamping blocks and a placing plate, wherein multiple groups of the workpiece groove are arranged on the upper wall of the workbench, multiple groups of the threaded holes are arranged on the inner wall of the workpiece groove in a through manner, the bolts are arranged in the threaded holes and are in threaded connection with the threaded holes, the nuts are arranged at one ends of the bolts far away from the threaded holes, the clamping blocks are arranged on one sides of the bolts close to the nuts, the clamping blocks are oppositely arranged, and the placing plate is arranged on the inner wall of the bottom of the workpiece groove; the side wall cooling mechanism comprises an air conditioning box, a partition plate, a refrigerating plate, semiconductor refrigerating sheets, a temperature guiding sheet, a ventilation opening, a ventilation fan, a cooling pipe, a heat dissipation opening and an air inlet, wherein the air conditioning box is arranged on the upper wall of a bottom plate, the partition plate is arranged on the inner wall of the air conditioning box, the refrigerating plates are symmetrically arranged between the partition plate and the bottom wall of the air conditioning box, a plurality of groups of semiconductor refrigerating sheets are arranged on the side wall of the refrigerating plate in a penetrating manner, the refrigerating ends of the semiconductor refrigerating sheets are oppositely arranged, the temperature guiding sheet is respectively arranged at the heat dissipation end and the refrigerating end of the semiconductor refrigerating sheet, the ventilation opening is arranged on the upper wall of the partition plate, the ventilation fan is arranged inside the ventilation opening, the cooling pipe is communicated between the upper wall of the air conditioning box and a workpiece groove, the heat dissipation opening is symmetrically arranged on the side wall of the air conditioning box below the partition plate, the heat dissipation opening is arranged on one side of the air conditioning box close to the heat dissipation end of the semiconductor refrigerating sheets, and the air inlet is symmetrically arranged on the side wall of the air conditioning box below the partition plate, the air inlet is arranged on one side of the cold air box close to the refrigerating end of the semiconductor refrigerating sheet; the work piece that will treat processing is placed and is placed on the board, the forward nut that rotates, the nut drives the bolt and rotates, the bolt moves along the screw hole and drives the grip block, grip block relative motion carries out the centre gripping to the work piece, the temperature of work piece is progressively rised in polishing processing, at this moment, semiconductor refrigeration piece refrigeration end cools off the inside air of cold air box through leading the temperature piece, the ventilation fan blows air conditioning to the work piece lateral wall through the cooling tube, under the effect of efflux effect, make the work piece temperature in the course of working reduce, the heat that semiconductor refrigeration piece heat dissipation end produced passes through the thermovent inside the cold air box of discharging, outside air enters into inside the cold air box through the air inlet, make the continuous impact work piece of air conditioning.
Specifically, the side wall of the workbench is provided with a controller.
The controller is respectively electrically connected with the steering motor, the hydraulic cylinder, the grinding motor, the atomizing motor, the semiconductor refrigerating sheet and the ventilating fan.
The beneficial effect who adopts above-mentioned structure this scheme to gain is as follows:
compared with the prior art, the scheme adopts the energy-containing ion polishing to effectively remove the mantle and the burr, so that the components can be well matched, the friction of a circuit is greatly reduced, the defects in the process of polishing the workpiece by the energy-containing ions are compensated under the intervention of mechanical polishing, after the liquid polishing wax and the liquid energy-containing ions are mixed, the workpiece is automatically sprayed and then polished by the matching operation of the lifting mechanism and the steering mechanism, the adverse factors generated when the materials are used are overcome, and the defect elimination type combined use of the two materials is effectively realized;
secondly, on the premise of not blowing away the substances sprayed on the surface of the workpiece, the temperature of heat generated in the machining process of the workpiece is reduced by the arranged side-impact cooling type workpiece positioning mechanism;
finally, this scheme is through the mode that two materials mix, offsets each other the drawback that mechanical polishing and ion polishing brought, carries out the assurance of maximize to work piece polishing quality, simultaneously under indexing mechanism's setting, realizes the synchronous centre gripping, the synchronous spraying and the synchronous equipment of polishing to the multiunit work piece, the improvement of very big degree the availability factor of the equipment of polishing.
Drawings
FIG. 1 is a schematic structural diagram of the present solution;
FIG. 2 is a first perspective view of the present solution;
FIG. 3 is a second perspective view of the present solution;
FIG. 4 is a front view of the present solution;
FIG. 5 is a top view of the present solution;
FIG. 6 is an enlarged view of part A of FIG. 1;
FIG. 7 is an enlarged view of the portion B of FIG. 2;
FIG. 8 is an enlarged view of the portion C of FIG. 3;
FIG. 9 is a sectional view taken along line A-A of FIG. 4;
FIG. 10 is a sectional view of portion B-B of FIG. 4;
FIG. 11 is a circuit diagram of the controller of the present embodiment;
fig. 12 is a schematic block diagram of the present solution.
The device comprises a base plate 1, a bottom plate 2, a support column 3, a workbench 4, an indexing type steering type de-flashing polishing mechanism 5, a steering object separating assembly 6, a steering motor 7, a steering shaft 8, a turntable 9, a bearing plate 10, a lifting polishing assembly 11, a hydraulic cylinder 12, an octagonal disc 13, a polishing motor 14, a polishing shaft 15, a polishing disc 16, a polishing sand layer 17, a compensation type spraying mechanism 18, a liquid storage tank 19, a partition plate 20, a liquid polishing wax storage cavity 21, an energy-containing ionic liquid storage cavity 22, an atomizing motor 23, a collecting pipe 24, an extraction pipe 25, an atomizing pipe 26, a metal telescopic pipe 27, a spray head 28, a side-flushing cooling type workpiece positioning mechanism 29, a positioning clamping mechanism 30, a workpiece groove 31, a threaded hole 32, a bolt 33, a nut 34, a clamping block 35, a placing plate 36, a placing plate 35, a side-flushing cooling type workpiece positioning mechanism 29, a positioning clamping block, a positioning mechanism 30, a workpiece groove 32, a positioning plate, a positioning, The side wall cooling mechanism 37, the cold air box 38, the partition plate 39, the refrigeration plate 40, the semiconductor refrigeration sheet 41, the temperature guide sheet 42, the ventilation opening 43, the ventilation fan 44, the cooling pipe 45, the heat dissipation opening 46, the air inlet 47 and the controller.
The accompanying drawings are included to provide a further understanding of the present solution and are incorporated in and constitute a part of this specification, illustrate embodiments of the solution and together with the description serve to explain the principles of the solution and not to limit the solution.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments; all other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present disclosure without any creative effort belong to the protection scope of the present disclosure.
In the description of the present solution, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present solution.
As shown in fig. 1-3, the multi-angle polishing apparatus for parts used in defect-eliminating machine manufacturing according to the present invention comprises a base plate 1, a supporting pillar 2, a worktable 3, a graduated turning type shawl-removing polishing mechanism 4 and a side-impact cooling type workpiece positioning mechanism 28, wherein a plurality of groups of the supporting pillars 2 are disposed on the upper wall of the base plate 1, the worktable 3 is disposed on the upper wall of the supporting pillar 2, the graduated turning type shawl-removing polishing mechanism 4 is disposed above the worktable 3, the side-impact cooling type workpiece positioning mechanism 28 is disposed on the upper wall of the base plate 1, the graduated turning type shawl-removing polishing mechanism 4 comprises a turning article-separating component 5, a lifting polishing component 10 and a compensation type spraying mechanism 17, the turning article-separating component 5 is disposed on the upper wall of the worktable 3, the lifting polishing component 10 is disposed on the upper wall of the turning article-separating component 5, the compensation type spraying mechanism 17 is disposed on the upper wall of the lifting component 10, the side-punching cooling type workpiece positioning mechanism 28 comprises a positioning clamping mechanism 29 and a side wall cooling mechanism 36, wherein the positioning clamping mechanism 29 is arranged on the upper wall of the workbench 3, and the side wall cooling mechanism 36 is arranged in the middle of the upper wall of the bottom plate 1.
As shown in fig. 4, 5, 6, 7 and 9, the steering and object-separating assembly 5 includes a steering motor 6, a steering shaft 7, a rotating disc 8 and a bearing plate 9, the steering motor 6 is disposed in the middle of the bottom wall of the workbench 3, the steering shaft 7 penetrates through the workbench 3 and is disposed at the power end of the steering motor 6, the rotating disc 8 is disposed at the outer side of one end of the steering shaft 7 far away from the steering motor 6, the rotating disc 8 is rotatably disposed on the upper wall of the workbench 3, and the bearing plate 9 is disposed on the upper wall of the rotating disc 8; the lifting polishing assembly 10 comprises a hydraulic cylinder 11, an octagonal disc 12, a polishing motor 13, polishing shafts 14, polishing discs 15 and polishing sand layers 16, wherein the hydraulic cylinder 11 is arranged on the upper wall of the bearing plate 9, the octagonal disc 12 is arranged on one side, away from the bearing plate 9, of the hydraulic cylinder 11, a plurality of groups of the polishing motors 13 are arranged on the upper wall of the octagonal disc 12, the polishing motor 13 is arranged on one side, away from the hydraulic cylinder 11, of the octagonal disc 12, the polishing shafts 14 are arranged at the power end of the polishing motor 13, the polishing discs 15 are arranged on one side, away from the polishing motors 13, of the polishing shafts 14, and the polishing sand layers 16 are arranged on the bottom wall of the polishing discs 15; the compensation type spraying mechanism 17 comprises a liquid storage tank 18, a partition plate 19, a liquid polishing wax storage cavity 20, an energy-containing ionic liquid storage cavity 21, an atomizing motor 22, a collecting pipe 23, an extraction pipe 24, an atomizing pipe 25, a metal extension pipe 26 and a spray head 27, wherein the liquid storage tank 18 is arranged on the upper wall of the octagonal plate 12, the partition plate 19 is arranged on the inner wall of the liquid storage tank 18, the liquid polishing wax storage cavity 20 is arranged between the partition plate 19 and the upper wall of the liquid storage tank 18, the energy-containing ionic liquid storage cavity 21 is arranged between the partition plate 19 and the bottom wall of the liquid storage tank 18, a plurality of groups of atomizing motors 22 are arranged on the side wall of the liquid storage tank 18, the collecting pipe 23 is communicated between the liquid polishing wax storage cavity 20 and the energy-containing ionic liquid storage cavity 21, the extraction pipe 24 is communicated between the power input end of the atomizing motor 22 and the collecting pipe 23, the atomizing pipe 25 is arranged at the power output end of the atomizing motor 22, one end of the atomizing pipe 25, which is far away from the atomizing motor 22, is penetrated on the octagonal plate 12, the metal extension tube 26 is communicated with one side of the atomizing tube 25 far away from the atomizing motor 22, and the spray head 27 is communicated with one side of the metal extension tube 26 far away from the atomizing tube 25; the steering motor 6 drives the steering shaft 7 to rotate in the forward direction, the steering shaft 7 drives the bearing plate 9 to rotate through the turntable 8, the bearing plate 9 drives the octagonal plate 12 to rotate through the hydraulic cylinder 11, the octagonal plate 12 drives the spray head 27 to rotate above a workpiece, at the moment, the hydraulic cylinder 11 shortens to drive the spray head 27 to descend through the octagonal plate 12 to be close to the workpiece, the atomizing motor 22 respectively extracts liquid polishing wax and energy-containing ionic liquid through the collecting pipe 23, mixed liquid enters the atomizing motor 22 through the extracting pipe 24, the mixed liquid enters the metal telescopic pipe 26 through the atomizing motor 22 after being atomized, the metal telescopic pipe 26 sprays fog to the surface of the workpiece through the spray head 27, at the moment, the metal telescopic pipe 26 is manually compressed, the steering motor 6 drives the steering shaft 7 to rotate in the reverse direction, the steering shaft 7 drives the bearing plate 9 to rotate through the turntable 8, the bearing plate 9 drives the octagonal plate 12 to rotate through the hydraulic cylinder 11, the octagonal plate 12 drives the grinding motor 13 to rotate above a workpiece, the hydraulic cylinder 11 shortens again to drive the grinding motor 13 to descend, the grinding motor 13 drives the grinding disc 15 to descend through the grinding shaft 14, the grinding disc 15 drives the grinding sand layer 16 to be attached to the sprayed workpiece, the grinding motor 13 drives the grinding disc 15 to rotate through the grinding shaft 14, and the grinding disc 15 drives the grinding sand layer 16 to rotate to polish the workpiece.
As shown in fig. 5, 7, 8, 9 and 10, the positioning and clamping mechanism 29 includes a workpiece groove 30, a threaded hole 31, a bolt 32, a nut 33, a clamping block 34 and a placing plate 35, wherein multiple sets of the workpiece groove 30 are arranged on the upper wall of the workbench 3, multiple sets of the threaded holes 31 are arranged in the inner wall of the workpiece groove 30, the bolt 32 is arranged in the threaded hole 31, the bolt 32 is in threaded connection with the threaded hole 31, the nut 33 is arranged at one end of the bolt 32 far away from the threaded hole 31, the clamping block 34 is arranged at one side of the bolt 32 close to the nut 33, the clamping block 34 is arranged oppositely, and the placing plate 35 is arranged on the inner wall of the bottom of the workpiece groove 30; the side wall cooling mechanism 36 comprises an air cooling box 37, a partition plate 38, a refrigerating plate 39, semiconductor refrigerating sheets 40, temperature guide sheets 41, a vent 42, a ventilating fan 43, a cooling pipe 44, a heat dissipation port 45 and an air inlet 46, wherein the air cooling box 37 is arranged on the upper wall of the base plate 1, the partition plate 38 is arranged on the inner wall of the air cooling box 37, the refrigerating plate 39 is symmetrically arranged between the partition plate 38 and the bottom wall of the air cooling box 37, multiple groups of semiconductor refrigerating sheets 40 are arranged on the side wall of the refrigerating plate 39 in a penetrating manner, the refrigerating ends of the semiconductor refrigerating sheets 40 are oppositely arranged, the temperature guide sheets 41 are respectively arranged on the heat dissipation end and the refrigerating end of the semiconductor sheets 40, the vent 42 is arranged on the upper wall of the partition plate 38, the ventilating fan 43 is arranged inside the vent 42, the cooling pipe 44 is communicated between the upper wall of the air cooling box 37 and the workpiece slot 30, and the heat dissipation port 45 is symmetrically arranged on the side wall of the air cooling box 37 below the partition plate 38, the heat dissipation port 45 is arranged on one side of the cold air box 37 close to the heat dissipation end of the semiconductor refrigeration sheet 40, the air inlets 46 are symmetrically arranged on the side wall of the cold air box 37 below the partition plate 38, and the air inlets 46 are arranged on one side of the cold air box 37 close to the refrigeration end of the semiconductor refrigeration sheet 40; a workpiece to be processed is placed on the placing plate 35, the nut 33 is rotated in the forward direction, the nut 33 drives the bolt 32 to rotate, the bolt 32 moves along the threaded hole 31 to drive the clamping block 34, the clamping block 34 moves relatively to clamp the workpiece, the temperature of the workpiece is gradually increased in polishing processing, at the moment, the refrigerating end of the semiconductor refrigerating sheet 40 cools air inside the cold air box 37 through the heat conducting sheet 41, the ventilating fan 43 blows cold air to the side wall of the workpiece through the cooling pipe 44, the temperature of the workpiece in the processing process is reduced under the action of a jet effect, heat generated by the heat radiating end of the semiconductor refrigerating sheet 40 is discharged out of the interior of the cold air box 37 through the heat radiating hole 45, and outside air enters the interior of the cold air box 37 through the air inlet 46, so that the cold air continuously impacts the workpiece.
As shown in fig. 1, the side wall of the working table 3 is provided with a controller 47.
As shown in fig. 11 and 12, the controller 47 is electrically connected to the steering motor 6, the hydraulic cylinder 11, the grinding motor 13, the atomizing motor 22, the semiconductor chilling plate 40, and the ventilation fan 43, respectively.
When the polishing device is used specifically, the polishing device is placed at a position required by a user, liquid polishing wax is added into the liquid polishing wax storage cavity 20, and energetic ionic liquid is added into the energetic ionic liquid storage cavity 21.
In the first embodiment, a workpiece to be processed is positioned and clamped.
Specifically, a workpiece to be machined is placed on the placing plate 35, the nut 33 is rotated in the forward direction, the nut 33 drives the bolt 32 to rotate, the bolt 32 moves along the threaded hole 31 to drive the clamping block 34, and the clamping block 34 moves relatively to clamp the workpiece.
In the second embodiment, the surface of the workpiece is polished based on the above embodiment.
Specifically, the controller 47 controls the steering motor 6 to start, the steering motor 6 drives the steering shaft 7 to rotate in the forward direction, the steering shaft 7 drives the bearing plate 9 to rotate through the turntable 8, the bearing plate 9 drives the octagonal plate 12 to rotate through the hydraulic cylinder 11, the octagonal plate 12 drives the spray head 27 to rotate above a workpiece, at this time, the controller 47 controls the hydraulic cylinder 11 to start, the hydraulic cylinder 11 shortens to drive the spray head 27 to descend to approach the workpiece through the octagonal plate 12, the controller 47 controls the atomizing motor 22 to start, the atomizing motor 22 respectively extracts liquid polishing wax and energetic ionic liquid through the collecting pipe 23, the mixed liquid enters the atomizing motor 22 through the extracting pipe 24, the mixed liquid enters the metal telescopic pipe 26 through the atomizing pipe 25 after being atomized by the atomizing motor 22, the metal telescopic pipe 26 sprays mist to the surface of the workpiece through the spray head 27, at this time, the metal telescopic pipe 26 is manually compressed, the controller 47 controls the steering motor 6 to start, the steering motor 6 drives the steering shaft 7 to reversely rotate, the steering shaft 7 drives the bearing plate 9 to rotate through the turntable 8, the bearing plate 9 drives the octagonal plate 12 to rotate through the hydraulic cylinder 11, the octagonal plate 12 drives the grinding motor 13 to rotate above a workpiece, the controller 47 controls the hydraulic cylinder 11 to start, the hydraulic cylinder 11 shortens again to drive the grinding motor 13 to descend, the grinding motor 13 drives the grinding disc 15 to descend through the grinding shaft 14, the grinding disc 15 drives the grinding sand layer 16 to be attached to the sprayed workpiece, the controller 47 controls the grinding motor 13 to start, the grinding motor 13 drives the grinding disc 15 to rotate through the grinding shaft 14, and the grinding disc 15 drives the grinding sand layer 16 to rotate to polish the workpiece.
In a third embodiment, the temperature of the workpiece is reduced based on the above embodiments.
Specifically, the temperature of the workpiece is gradually increased in the polishing process, at this time, the controller 47 controls the semiconductor chilling plate 40 to start, the chilling end of the semiconductor chilling plate 40 cools the air inside the cold air box 37 through the heat conducting plate 41, the controller 47 controls the ventilation fan 43 to start, the ventilation fan 43 blows the cold air to the side wall of the workpiece through the cooling pipe 44, the temperature of the workpiece is reduced in the processing process under the action of a jet effect, the heat generated by the heat dissipation end of the semiconductor chilling plate 40 is discharged out of the cold air box 37 through the heat dissipation port 45, and the outside air enters the cold air box 37 through the air inlet 46, so that the cold air continuously impacts the workpiece; repeating the above operation when using next time.
It should be noted that, in this document, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present solution have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the solution, the scope of which is defined in the appended claims and their equivalents.
The present solution and its embodiments have been described above, but the description is not limited thereto, and what is shown in the drawings is only one of the embodiments of the present solution, and the actual structure is not limited thereto. In summary, those skilled in the art should appreciate that they can readily use the present disclosure without inventive faculty to devise similar arrangements and embodiments without departing from the spirit and scope of the present disclosure.