CN114883948A

CN114883948A - Heat dissipation switch board

Info

Publication number: CN114883948A
Application number: CN202210593475.0A
Authority: CN
Inventors: 刘长胜; 李芳�; 刘四元
Original assignee: ANHUI MINGKUN ELECTRICAL APPLIANCE EQUIPMENT CO LTD
Current assignee: ANHUI MINGKUN ELECTRICAL APPLIANCE EQUIPMENT CO LTD
Priority date: 2022-05-27
Filing date: 2022-05-27
Publication date: 2022-08-09

Abstract

The invention discloses a heat-dissipation power distribution cabinet, which belongs to the technical field of power distribution equipment and comprises a cabinet body and a heat-conducting plate arranged inside the cabinet body, wherein a partition plate is arranged on one side of the heat-conducting plate, a plurality of heat-dissipation pipes are arranged on the partition plate, and a fan is arranged at the top of the cabinet body. According to the invention, through the arrangement of the radiating pipes, the heat conducting plate, the fan, the dustproof net and the first through holes, the radiating speed of heat in the cabinet body can be increased, the heat accumulation in the cabinet body is avoided, the radiating effect is improved, in addition, the heat radiated by equipment arranged on the heat conducting plate and the heat in the cabinet body are conducted to the radiating pipes through the heat conducting plate when the cooling cabinet is used, then, the fan is used for blowing air to the radiating pipes, so that the radiating pipes are cooled, the air entering and exiting the cabinet body can be exhausted through the first through holes, the radiating process is completed, the partition plate can be used for partitioning the interior of the cabinet body in the cooling process, and the air entering from the outside is prevented from blowing the equipment arranged on the heat conducting plate.

Description

Heat dissipation switch board

Technical Field

The invention relates to a power distribution cabinet, in particular to a heat-dissipation power distribution cabinet, and belongs to the technical field of power distribution equipment.

Background

Generally at indoor switch board, the mechanical draft that relies on the design just can ensure the operating temperature of component, but special case needs to consider the heat dissipation some, sets up many converters in some switch boards and places at the roofing, suffers sunshine and penetrates directly and the cabinet body is comparatively intensive, leads to the interior temperature of switch board to be high, has influence to the working life of components and parts in the cabinet, proposes to set up some heat dissipation measures.

The existing power distribution cabinet has poor heat dissipation effect when in use, and dust is accumulated on the surface of equipment arranged inside the cabinet body when a fan is used for heat dissipation.

Disclosure of Invention

The invention mainly aims to solve the problems that the existing power distribution cabinet is poor in heat dissipation effect in use and dust is accumulated on the surface of equipment arranged inside a cabinet body when a fan is used for heat dissipation, and provides a heat dissipation power distribution cabinet.

The purpose of the invention can be achieved by adopting the following technical scheme:

the utility model provides a heat dissipation switch board, includes the cabinet body, and install in the heat-conducting plate of the internal portion of cabinet, one side of heat-conducting plate is equipped with the baffle, be equipped with a plurality of cooling tubes on the baffle, the fan is installed at the top of the cabinet body, a plurality of first through-holes have been seted up to the bottom of the cabinet body, two cabinet doors are installed to the front symmetry of the cabinet body, the inside of first through-hole is equipped with the dust screen.

Preferably, two heat exchange boxes are symmetrically arranged on the inner wall of the cabinet body, and the two heat exchange boxes are located on the other side of the heat conducting plate.

Preferably, the top of the cabinet body is provided with a cooling box positioned on one side of the fan, and the two heat exchange boxes are communicated with the inside of the cooling box.

Preferably, the cooling tank comprises a first tank body, and a sealed shell is arranged inside the first tank body.

Preferably, the inside of sealed shell is equipped with the semiconductor refrigeration piece, the top of first box is equipped with the liquid feeding pipe.

Preferably, the heat exchange box comprises a second box body, and a plurality of third box bodies which are uniformly distributed are arranged on one side of the second box body.

Preferably, the third box body is communicated with the second box body, and a connecting pipe is installed at the top of the second box body.

Preferably, the connection pipe penetrates through the top of the cabinet body, and the connection pipe is inserted into the cooling box.

Preferably, the radiating pipe comprises a pipe body, and a plurality of second through holes which are uniformly distributed are formed in the pipe body.

Preferably, the outer side of the pipe body is provided with a truncated cone-shaped heat conducting block, and one end of the heat conducting block with a large diameter is attached to the heat conducting plate.

The invention has the beneficial technical effects that: according to the heat dissipation power distribution cabinet, through the arrangement of the heat dissipation pipes, the heat conduction plate, the fan, the dust screen and the first through holes, the heat dissipation speed of the interior of the cabinet body can be increased, the heat accumulation of the interior of the cabinet body is avoided, the heat dissipation effect is improved, in addition, when the heat distribution cabinet is used, the heat dissipated by equipment arranged on the heat conduction plate and the heat in the interior of the cabinet body are conducted to the heat dissipation pipes through the heat conduction plate, then, the fans blow air to the plurality of heat dissipation pipes, so that the heat dissipation pipes are cooled, the air entering and exiting the interior of the cabinet body can be discharged through the first through holes, the heat dissipation process is completed, the partition plate can divide the interior of the cabinet body in the cooling process, the air entering from the outside is prevented from blowing the equipment arranged on the heat conduction plate, and meanwhile, the dust accumulation of the equipment on the heat conduction plate in the cooling process is also avoided.

Drawings

Fig. 1 is a schematic overall structural view of a preferred embodiment of a heat-dissipating power distribution cabinet according to the present invention;

fig. 2 is a schematic internal structural diagram of a preferred embodiment of the heat-dissipation power distribution cabinet according to the present invention;

fig. 3 is a schematic structural view of a heat exchange box of a preferred embodiment of the heat distribution cabinet according to the present invention;

fig. 4 is a schematic view of a heat dissipation pipe structure of a preferred embodiment of the heat dissipation power distribution cabinet according to the present invention;

fig. 5 is a schematic structural view of a cooling box of a preferred embodiment of the heat-dissipation power distribution cabinet according to the present invention;

fig. 6 is an enlarged view of the structure at a in fig. 2 of a preferred embodiment of the heat-dissipating power distribution cabinet according to the present invention.

In the figure: 1. a cabinet body; 2. a cabinet door; 3. a cooling tank; 4. a fan; 5. a heat exchange box; 6. a radiating pipe; 7. a partition plate; 8. a heat conducting plate; 9. a first through hole; 10. a dust screen; 301. a first case; 302. sealing the shell; 303. a semiconductor refrigeration sheet; 304. a liquid feeding pipe; 501. a second case; 502. a third box body; 503. a connecting pipe; 601. a pipe body; 602. a heat conducting block; 603. a second via.

Detailed Description

In order to make the technical solutions of the present invention more clear and definite for those skilled in the art, the present invention is further described in detail below with reference to the examples and the accompanying drawings, but the embodiments of the present invention are not limited thereto.

As shown in fig. 1-6, the heat dissipation power distribution cabinet that this embodiment provided, including the cabinet body 1 to and install in the inside heat-conducting plate 8 of the cabinet body 1, one side of heat-conducting plate 8 is equipped with baffle 7, is equipped with a plurality of cooling tubes 6 on the baffle 7, and fan 4 is installed at the top of the cabinet body 1, and a plurality of first through-holes 9 have been seted up to the bottom of the cabinet body 1, and two cabinet doors 2 are installed to the front symmetry of the cabinet body 1, and the inside of first through-hole 9 is equipped with dust screen 10. Through the cooling tube 6, the heat-conducting plate 8, fan 4, the setting of dust screen 10 and first through-hole 9, can accelerate the speed of the inside heat effluvium of the cabinet body 1, avoid the inside heat of the cabinet body 1 to pile up and improve the radiating effect, and install the heat that equipment gived off on the heat-conducting plate 8 and the heat of the internal portion of cabinet when using and give the cooling tube 6 through the conduction of heat-conducting plate 8, then blow to a plurality of cooling tubes 6 through fan 4, thereby cool off cooling tube 6, the air of the internal portion of the cabinet of discrepancy 1 can be discharged through first through-hole 9, thereby accomplish radiating process, in refrigerated in-process baffle 7 can be cut apart the inside of the cabinet body 1, the air of avoiding external entering is blown to the equipment of installing on the heat-conducting plate 8, the equipment on the heat-conducting plate 8 of also having avoided simultaneously is carrying out refrigerated in-process and is piled up the dust.

In this embodiment, as shown in fig. 1, fig. 2, fig. 3 and fig. 5, two heat exchange boxes 5 are symmetrically installed on the inner wall of the cabinet body 1, the two heat exchange boxes 5 are both located at the other side of the heat conducting plate 8, the cooling box 3 located at one side of the fan 4 is installed at the top of the cabinet body 1, the two heat exchange boxes 5 are both communicated with the inside of the cooling box 3, and through the arrangement of the heat exchange boxes 5, heat inside the cabinet body 1 can be absorbed and then transferred to the cooling box 3, so that heat dissipation inside the cabinet body 1 is completed; the cooling box 3 comprises a first box body 301, a sealing shell 302 is arranged inside the first box body 301, a semiconductor refrigerating sheet 303 is arranged inside the sealing shell 302, a liquid feeding pipe 304 is arranged at the top of the first box body 301, cooling liquid can be conveniently added into the first box body 301 through the arrangement of the liquid feeding pipe 304, and the liquid inside the first box body 301 can be cooled through the arrangement of the semiconductor refrigerating sheet 303; the heat exchange box 5 comprises a second box body 501, one side of the second box body 501 is provided with a plurality of evenly distributed third box bodies 502, the third box bodies 502 are communicated with the inside of the second box body 501, a connecting pipe 503 is installed at the top of the second box body 501, the connecting pipe 503 runs through the top of the cabinet body 1, the connecting pipe 503 is inserted into the inside of the cooling box 3, the heat exchange box is arranged through the plurality of third box bodies 502, hot air in the cabinet body 1 can enter spaces of the plurality of third box bodies 502 to exchange heat, the setting of the connecting pipe 503 is realized, the inside of the second box body 501 and the inside of the third box body 502 can be communicated with the inside of the first box body 301, and therefore heat exchange of internal cooling liquid is completed.

In this embodiment, as shown in fig. 1 and 4, the heat dissipation pipe 6 includes a pipe body 601, a plurality of second through holes 603 uniformly distributed are provided on the pipe body 601, the outer side of the pipe body 601 is provided with a heat conduction block 602 in a circular truncated cone shape, one end of the heat conduction block 602 with a large diameter is attached to the heat conduction plate 8, through the arrangement of the second through hole 603, the air can pass through the pipe body 601 conveniently, and through the arrangement of the heat conduction block 602 attached to the heat conduction plate 8, the heat transmission of the heat conduction plate 8 to the pipe body 601 can be accelerated conveniently.

In this embodiment, as shown in fig. 1 to fig. 6, the working process of the heat dissipation power distribution cabinet provided in this embodiment is as follows:

step 1: when the cooling cabinet is used, equipment is arranged on the heat conducting plate 8, heat emitted by the equipment on the heat conducting plate 8 and heat inside the cabinet body 1 are conducted to the radiating pipes 6 through the heat conducting plate 8 in the using process, then air is blown to the plurality of radiating pipes 6 through the fan 4, so that the radiating pipes 6 are cooled, air entering and exiting the cabinet body 1 can be discharged through the first through holes 9, the radiating process is finished, and cooling liquid is injected into the first cabinet body 301 through the liquid adding pipe 304 when the temperature is high in summer;

step 2: the injected cooling liquid can enter the inside of the second box body 501 and the third box body 502 through the connecting pipe 503, at this moment, the inside cooling liquid of the second box body 501 and the third box body 502 can absorb the heat inside the cabinet body 1, and meanwhile, the semiconductor refrigerating sheet 303 is started to cool the cooling liquid inside the first box body 301, so that the cooling liquid inside the heat exchange box 5 can always absorb the heat inside the cabinet body 1.

The above description is only a further embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can substitute or change the technical solution of the present invention and its idea within the scope of the present invention.

Claims

1. A heat dissipation power distribution cabinet, characterized in that it comprises a cabinet body (1), and a heat conduction plate (8) installed inside the cabinet body (1), one side of the heat conduction plate (8) is provided with A partition (7), a plurality of heat dissipation pipes (6) are arranged on the partition (7), a fan (4) is installed on the top of the cabinet (1), and a bottom of the cabinet (1) is provided with a fan (4). There are a plurality of first through holes (9), two cabinet doors (2) are symmetrically installed on the front of the cabinet body (1), and a dust filter (10) is arranged inside the first through holes (9). .

2 . The heat dissipation power distribution cabinet according to claim 1 , wherein two heat exchange boxes ( 5 ) are symmetrically installed on the inner wall of the cabinet body ( 1 ), and the two heat exchange boxes ( 5) Both are located on the other side of the heat conducting plate (8).

3. A heat dissipation power distribution cabinet according to claim 2, characterized in that a cooling box (3) located on one side of the fan (4) is installed on the top of the cabinet (1), and two cooling boxes (3) are installed on the top of the cabinet (1). The heat exchange boxes (5) are all communicated with the inside of the cooling box (3).

4. The heat dissipation power distribution cabinet according to claim 3, wherein the cooling box (3) comprises a first box body (301), and the inside of the first box body (301) is provided with a seal Shell (302).

5. The heat dissipation power distribution cabinet according to claim 4, characterized in that, a semiconductor refrigeration sheet (303) is provided inside the sealing shell (302), and a top of the first box (301) is provided with a semiconductor refrigeration sheet (303). There is a liquid addition tube (304).

6. The heat dissipation power distribution cabinet according to claim 3, wherein the heat exchange box (5) comprises a second box body (501), and one side of the second box body (501) is provided with There are a plurality of uniformly distributed third boxes (502).

7. The heat dissipation power distribution cabinet according to claim 6, wherein the third box body (502) and the interior of the second box body (501) communicate with each other, and the second box body A connecting pipe (503) is installed on the top of (501).

8. The heat dissipation power distribution cabinet according to claim 7, wherein the connecting pipe (503) penetrates through the top of the cabinet (1), and the connecting pipe (503) is inserted into the cooling Inside the box (3).

9 . The heat dissipation power distribution cabinet according to claim 1 , wherein the heat dissipation pipe ( 6 ) comprises a pipe body ( 601 ), and the pipe body ( 601 ) is provided with a plurality of uniformly distributed first Two through holes (603).

10. The heat dissipation power distribution cabinet according to claim 9, characterized in that, a frustum-shaped heat-conducting block (602) is provided on the outer side of the heat-conducting block (601), and the heat-conducting block (602) has a large diameter. One end is attached to the heat conducting plate (8).