CN114874707A - Conductive adhesive tape - Google Patents

Conductive adhesive tape Download PDF

Info

Publication number
CN114874707A
CN114874707A CN202210590172.3A CN202210590172A CN114874707A CN 114874707 A CN114874707 A CN 114874707A CN 202210590172 A CN202210590172 A CN 202210590172A CN 114874707 A CN114874707 A CN 114874707A
Authority
CN
China
Prior art keywords
silver
conductive
layer
copper conductive
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210590172.3A
Other languages
Chinese (zh)
Inventor
龙治香
光忠明
郑章勤
周晓南
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Anhui Jinghua New Material Technology Co ltd
Original Assignee
Anhui Jinghua New Material Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anhui Jinghua New Material Technology Co ltd filed Critical Anhui Jinghua New Material Technology Co ltd
Priority to CN202210590172.3A priority Critical patent/CN114874707A/en
Publication of CN114874707A publication Critical patent/CN114874707A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/10—Encapsulated ingredients
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/50—Adhesives in the form of films or foils characterised by a primer layer between the carrier and the adhesive
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/085—Copper
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/22—Presence of unspecified polymer
    • C09J2400/226—Presence of unspecified polymer in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • C09J2463/003—Presence of epoxy resin in the primer coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Conductive Materials (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The invention discloses a conductive adhesive tape, which sequentially comprises a conductive ink layer, an adhesive layer and a release paper layer, wherein a silver/copper conductive powder layer is further formed on the surface of the conductive ink layer far away from the adhesive layer, the silver/copper conductive powder layer comprises silver-coated copper conductive particle fillers, and the vertical impedance value of the silver/copper conductive powder layer is not more than 0.004 omega/cm 2. According to the invention, by optimizing the conductive function structure of the conductive adhesive tape, the defects of easiness in salient points, adhesive surface glue patterns, poor bonding, poor shielding effect and the like are effectively overcome.

Description

Conductive adhesive tape
Technical Field
The present invention relates to the field of electronic technology, and more particularly, to a conductive tape.
Background
With the continuous development of the electronic product industry, people have higher and higher requirements on the communication quality of electronic products, so that a large number of conductive shielding tapes are increasingly used. The conductive adhesive tape in the current market is generally formed by mixing conductive powder and pressure-sensitive glue, coating the mixture on release paper, then coating the mixture on metal foil and rolling the metal foil, or formed by mixing the conductive powder and the pressure-sensitive glue, coating the mixture on the release paper, then coating the mixture on conductive cloth and rolling the conductive cloth. The common conductive adhesive tape in the market has large particle size of powder, is easy to protrude after being attached with a thin conductive material, causes the abnormalities of adhesive surface glue pattern, infirm attachment and the like, and has relatively poor conductive performance and shielding effect.
The information disclosed in this background section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art that is already known to a person skilled in the art.
Disclosure of Invention
The invention aims to provide a conductive adhesive tape, which optimizes the construction form of a silver/copper conductive powder layer of the traditional conductive adhesive tape, thereby greatly reducing the resistance value of the conductive adhesive tape while optimizing the product cost, effectively improving the problems of glue flowers and the like formed by conductive particle fillers and having good conductivity and form performance.
In order to achieve the above object, an embodiment of the present invention provides a conductive adhesive tape, which sequentially includes a conductive ink layer, an adhesive layer, and a release paper layer, wherein a silver/copper conductive powder layer is further formed on a surface of the conductive ink layer away from the adhesive layer, the silver/copper conductive powder layer includes a silver-coated copper conductive particle filler, the silver-coated copper conductive particle filler has a spherical particle row shape, and an average particle diameter of 400 meshes (calculated by 90% of particles). Preferably, the silver/copper conductive powder layer is formed by uniformly mixing silver-coated copper conductive particle filler and an adhesive, and the adding proportion of the silver-coated copper conductive particle filler is 5-15%. The silver/copper conductive powder layer has a thickness of 10-25 μm and a vertical impedance value of not more than 0.010 Ω/cm 2 。
In one or more embodiments of the present invention, the silver content of the silver-coated copper conductive particle filler is 5-15 percent, and the vertical impedance value of the silver/copper conductive powder layer is not more than 0.004 omega/cm 2 。
In one or more embodiments of the present invention, the thickness of the release paper layer is 130-150 μm.
In one or more embodiments of the present invention, the conductive ink layer comprises, in wt.%: 15-20% of thermosetting resin; 60-65% of metal fiber; 1-4% of metal powder; 1-4% of a curing agent; 0-2% of antioxidant; the balance of solvent. The preparation method of the preferred conductive ink layer comprises the following steps: fully mixing the weighed materials of the thermosetting resin, the solvent, the metal fiber and the metal powder, and then grinding and dispersing for 2 to 4 times by using a three-roll grinder to form a uniform mixed phase; then adding curing agent and antioxidant, grinding and dispersing for 2-4 times by using a three-roll grinder to form a uniform mixed phase, and the conductive ink has the advantages of high conductivity and good shielding effect.
In one or more embodiments of the present invention, the thermosetting resin is selected from epoxy resins.
In one or more embodiments of the invention, the metal fibers have a radius of 0.1 to 20 μm and a length of 1 to 950 μm. The metal fiber is selected from copper fiber and nickel fiber.
In one or more embodiments of the present invention, the metal powder is selected from copper powder and silver powder. The metal powder is spherical powder with particle radius of 0.1-9 μm.
In one or more embodiments of the present invention, the curing agent is selected from basic curing agents, and is a nitrogen-containing compound of aliphatic amine and aromatic amine. The medium-temperature curing agent can be diethylenetriamine, triethylene tetramine or the like.
In one or more embodiments of the present invention, the antioxidant is selected from antioxidant 264 or antioxidant DNP. An antioxidant agent which can prevent oxidation of the metal fibers and metal powder.
Compared with the prior art, the conductive adhesive tape provided by the embodiment of the invention sequentially comprises silver/copper conductive powder, conductive ink, an adhesive layer and a release paper layer from top to bottom, wherein the silver/copper conductive powder adopts conductive particle filler of silver-coated copper, so that the resistance value is greatly reduced, and the vertical impedance value is not highGreater than 0.004 ohm/cm 2 (ii) a And the surface has no offset problem of convex point products caused by large powder. And the silver-coated copper structure avoids the problem that copper powder is easy to oxidize, and reduces the cost of using pure silver powder. The conductive adhesive tape has good conductive effect, the thickness of the conductive adhesive tape is 10-25 mu m, and the vertical impedance value is not more than 0.010 omega/cm 2 And the shielding effect is good.
Detailed Description
The technical solution of the present invention is described in detail below with reference to the specific embodiments of the present invention, but it should be understood that the scope of the present invention is not limited by the specific embodiments.
Throughout the specification and claims, unless explicitly stated otherwise, the term "comprise" or variations such as "comprises" or "comprising", etc., will be understood to imply the inclusion of a stated element or component but not the exclusion of any other element or component.
Conductive ink layer example 1
In this embodiment, the conductive ink layer comprises the following raw materials:
Figure BDA0003664805550000031
conductive ink layer example 2
In this embodiment, the conductive ink layer comprises the following raw materials:
Figure BDA0003664805550000032
Figure BDA0003664805550000041
conductive ink layer example 3
In this embodiment, the conductive ink layer comprises the following raw materials:
Figure BDA0003664805550000042
conductive ink layer example 4
In this embodiment, the conductive ink layer comprises the following raw materials:
Figure BDA0003664805550000043
example 1
The conductive tape of the embodiment sequentially comprises a silver/copper conductive powder layer, a conductive ink layer (taking the conductive ink layer embodiment 1 as an example), an adhesive layer and a release paper layer with the thickness of 130 μm, wherein the silver-coated copper conductive particle filler in the silver/copper conductive powder layer is in a granular form, and at least 10% of the quantity of the silver-coated copper conductive particle filler is partially exposed (the exposure means that the radius of not more than two thirds of the silver-coated copper conductive particle filler is not shielded, the following is the same) on the surface, the granular row of the silver-coated copper conductive particle filler is spherical, the average grain diameter is 400 meshes (calculated by 90% of the granular quantity), the silver content in the silver-coated copper conductive particle filler is 8%, and the vertical impedance value of the silver/copper conductive powder layer is not more than 0.004 Ω/cm 2 。
The performance of 10 samples of this example was tested, and the average value was calculated:
thickness of conductive adhesive Conductive ink thickness μm Vertical impedance omega/cm 2 Shielding effectiveness
18μm 4μm 0.0096 35DB
Example 2
The conductive tape of the embodiment sequentially comprises a silver/copper conductive powder layer, a conductive ink layer (taking the conductive ink layer embodiment 2 as an example), an adhesive layer and a release paper layer with the thickness of 135 μm, wherein the silver-coated copper conductive particle filler in the silver/copper conductive powder layer is in a granular form, at least 20% of the conductive particle filler is exposed on the surface, the silver-coated copper conductive particle filler is spherical in a grain row shape, the average grain diameter is 400 meshes (based on 90% of the grain number), the silver content in the silver-coated copper conductive particle filler is 10%, and the vertical impedance value of the silver/copper conductive powder layer is not more than 0.004 omega/cm 2 。
The performance of 10 samples of this example was tested, and the average value was:
thickness of conductive adhesive Conductive ink thickness μm Vertical impedance omega/cm 2 Shielding effectiveness
20μm 4.5μm 0.0090 36DB
Example 3
The conductive tape of the embodiment sequentially comprises a silver/copper conductive powder layer,A conductive ink layer (taking example 3 of the conductive ink layer as an example), an adhesive layer and a release paper layer with the thickness of 140 μm, wherein the silver-coated copper conductive particle filler in the silver/copper conductive powder layer is in a granular form, at least 30% of the quantity of the silver-coated copper conductive particle filler is exposed on the surface, the row shape of the silver-coated copper conductive particle filler is spherical, the average grain diameter is 400 meshes (calculated by 90% of grains), the content of silver in the silver-coated copper conductive particle filler is 12%, and the vertical impedance value of the silver/copper conductive powder layer is not more than 0.004 omega/cm 2 。
The performance of 10 samples of this example was tested, and the average value was calculated:
thickness of conductive adhesive Conductive ink thickness μm Vertical impedance omega/cm 2 Shielding effectiveness
18.5μm 4.5μm 0.0081 37DB
Example 4
The conductive tape of this embodiment sequentially comprises a silver/copper conductive powder layer, a conductive ink layer (taking example 4 of the conductive ink layer as an example), an adhesive layer, and a release paper layer with a thickness of 145 μm, wherein the silver-coated copper conductive particle filler in the silver/copper conductive powder layer is in a granular form, and at least 50% of the quantity of the silver-coated copper conductive particle filler is exposed on the surface, the silver-coated copper conductive particle filler has a granular shape, the grain row shape is spherical, the average grain diameter is 400 meshes (calculated by 90% of the grain number),the silver content in the silver-coated copper conductive particle filler is 9 percent, and the vertical impedance value of the silver/copper conductive powder layer is not more than 0.004 omega/cm 2 。
The performance of 10 samples of this example was tested, and the average value was calculated:
thickness of conductive adhesive Conductive ink thickness μm Vertical impedance omega/cm 2 Shielding effectiveness
20μm 5μm 0.0089 40DB
Example 11
The conductive tape of the embodiment sequentially comprises a silver/copper conductive powder layer, a conductive ink layer (taking the conductive ink layer as an example 1), an adhesive layer and a release paper layer with the thickness of 130 μm, wherein the silver/copper conductive powder layer is formed by uniformly mixing silver-coated copper conductive particle filler and polyurethane adhesive, the adding proportion of the silver-coated copper conductive particle filler is 5%, the silver-coated copper conductive particle filler in the silver/copper conductive powder layer is exposed on the surface in a granular form and at least accounts for 10% of the quantity of the silver-coated copper conductive particle filler, the granular row of the silver-coated copper conductive particle filler is spherical, the average grain size is 400 meshes (counted by 90% of the grains), the silver content in the silver-coated copper conductive particle filler is 8%, and the vertical impedance value of the silver/copper conductive powder layer is not more than 0.004 Ω/cm 2 The silver/copper conductive powder layer has a thickness of 10-25 μm and a vertical resistance value of not more than 0.010 Ω -cm 2 。
The performance of 10 samples of this example was tested, and the average value was calculated:
thickness of conductive paste Conductive ink thickness μm Vertical impedance omega/cm 2 Shielding effectiveness
20μm 4.5μm 0.0091 38DB
Example 12
The conductive tape of the embodiment sequentially comprises a silver/copper conductive powder layer, a conductive ink layer (taking the conductive ink layer as an example 2), an adhesive layer and a release paper layer with the thickness of 135 micrometers, wherein the silver/copper conductive powder layer is formed by uniformly mixing silver-coated copper conductive particle fillers and an acrylic adhesive, the adding proportion of the silver-coated copper conductive particle fillers is 7.5%, the silver-coated copper conductive particle fillers in the silver/copper conductive powder layer are exposed on the surface in a granular form and at least 20% of the quantity of the silver-coated copper conductive particle fillers, the granular rows of the silver-coated copper conductive particle fillers are spherical, the average grain size is 400 meshes (counted by 90% of the granules), the silver content in the silver-coated copper conductive particle fillers is 10%, and the vertical impedance value of the silver/copper conductive powder layer is not more than 0.004 ohm/cm 2 The thickness of the silver/copper conductive powder layer is 10-25 μm, and the vertical resistance value is not more than 0.010 omega/cm 2 。
The performance of 10 samples of this example was tested, and the average value was calculated:
thickness of conductive adhesive Conductive ink thickness μm Vertical impedance omega/cm 2 Shielding effectiveness
19μm 5μm 0.0082 39DB
Example 13
The conductive tape of the embodiment sequentially comprises a silver/copper conductive powder layer, a conductive ink layer (taking the conductive ink layer as an example 3), an adhesive layer and a release paper layer with the thickness of 140 μm, wherein the silver/copper conductive powder layer is formed by uniformly mixing silver-coated copper conductive particle filler and epoxy adhesive, the adding proportion of the silver-coated copper conductive particle filler is 10%, the silver-coated copper conductive particle filler in the silver/copper conductive powder layer is exposed on the surface in a granular form and at least accounts for 30% of the quantity of the silver-coated copper conductive particle filler, the granular row of the silver-coated copper conductive particle filler is spherical, the average grain size is 400 meshes (counted by 90% of the grains), the silver content in the silver-coated copper conductive particle filler is 12%, and the vertical impedance value of the silver/copper conductive powder layer is not more than 0.004 Ω/cm 2 The thickness of the silver/copper conductive powder layer is 10-25 μm, and the vertical impedance value is not more than 0.010 omega/cm 2 。
The performance of 10 samples of this example was tested, and the average value was calculated:
thickness of conductive adhesive Conductive ink thickness μm Vertical impedance omega/cm 2 Shielding effectiveness
19μm 5μm 0.0073 39DB
Example 14
The conductive tape of the embodiment sequentially comprises a silver/copper conductive powder layer, a conductive ink layer (taking the conductive ink layer as an example 4), an adhesive layer and a release paper layer with the thickness of 145 μm, wherein the silver/copper conductive powder layer is formed by uniformly mixing silver-coated copper conductive particle fillers and adhesives, the adding proportion of the silver-coated copper conductive particle fillers is 6.5%, the silver-coated copper conductive particle fillers in the silver/copper conductive powder layer are exposed on the surface in a granular form and at least 50% of the quantity of the silver-coated copper conductive particle fillers, the granular rows of the silver-coated copper conductive particle fillers are spherical, the average grain size is 400 meshes (counted by 90% of the grains), the silver content in the silver-coated copper conductive particle fillers is 9%, and the vertical impedance value of the silver/copper conductive powder layer is not more than 0.004 Ω/cm 2 The thickness of the silver/copper conductive powder layer is 10-25 μm, and the vertical impedance value is not more than 0.010 omega/cm 2 。
The performance of 10 samples of this example was tested, and the average value was calculated:
thickness of conductive adhesive Conductive ink thickness μm Vertical impedance omega/cm 2 Shielding effectiveness
19.5μm 5.5μm 0.0086 42DB
The foregoing descriptions of specific exemplary embodiments of the present invention have been presented for purposes of illustration and description. It is not intended to limit the invention to the precise form disclosed, and obviously many modifications and variations are possible in light of the above teaching. The exemplary embodiments were chosen and described in order to explain certain principles of the invention and its practical application to enable one skilled in the art to make and use various exemplary embodiments of the invention and various alternatives and modifications as are suited to the particular use contemplated. It is intended that the scope of the invention be defined by the claims and their equivalents.

Claims (10)

1. The conductive adhesive tape sequentially comprises a conductive ink layer, an adhesive layer and a release paper layer, and is characterized in that a silver/copper conductive powder layer is further formed on the surface of the conductive ink layer far away from the adhesive layer, the silver/copper conductive powder layer comprises silver-coated copper conductive particle filler, the silver-coated copper conductive particle filler is spherical, and the average particle size of the silver-coated copper conductive particle filler is 400 meshes.
2. The conductive tape according to claim 1, wherein the silver/copper conductive powder layer further comprises an adhesive, the silver/copper conductive powder layer is formed by uniformly mixing silver-coated copper conductive particle filler and the adhesive, and the proportion of the silver-coated copper conductive particle filler is 5-15%.
3. The conductive tape of claim 1, wherein the silver content of the silver-coated copper conductive particle filler is 5-15%, and the vertical resistance value of the silver/copper conductive powder layer is not more than 0.004 Ω/cm 2 。
4. The conductive tape of claim 1, wherein the release paper layer has a thickness of 130-150 μm.
5. The conductive tape of claim 1, wherein the conductive ink layer comprises the following raw materials in wt.%: 15-20% of thermosetting resin; 60-65% of metal fiber; 1-4% of metal powder; 1-4% of a curing agent; 0-2% of antioxidant; the balance of solvent.
6. The electrically conductive tape of claim 5, wherein the thermosetting resin is selected from the group consisting of epoxy resins.
7. The conductive tape of claim 5, wherein the metal fibers have a radius of 0.1 to 20 μm and a length of 1 to 950 μm.
8. The conductive tape of claim 5 wherein the metal powder is selected from the group consisting of copper powder and silver powder.
9. The conductive adhesive tape according to claim 5, wherein the curing agent is selected from basic curing agents, and is a nitrogen-containing compound of aliphatic amine and aromatic amine.
10. The electrically conductive adhesive tape of claim 5, wherein the antioxidant is selected from the group consisting of antioxidant 264, antioxidant DNP.
CN202210590172.3A 2022-05-26 2022-05-26 Conductive adhesive tape Pending CN114874707A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210590172.3A CN114874707A (en) 2022-05-26 2022-05-26 Conductive adhesive tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210590172.3A CN114874707A (en) 2022-05-26 2022-05-26 Conductive adhesive tape

Publications (1)

Publication Number Publication Date
CN114874707A true CN114874707A (en) 2022-08-09

Family

ID=82678192

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210590172.3A Pending CN114874707A (en) 2022-05-26 2022-05-26 Conductive adhesive tape

Country Status (1)

Country Link
CN (1) CN114874707A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101792627A (en) * 2010-03-10 2010-08-04 彩虹集团公司 Shielding electrically conductive printing ink and preparation method thereof
CN208586240U (en) * 2018-06-15 2019-03-08 苏州世诺新材料科技有限公司 A kind of heat dissipation of portability and electromagnetic shielding adhesive tape
CN111087939A (en) * 2019-12-05 2020-05-01 江苏晶华新材料科技有限公司 Conductive adhesive tape

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101792627A (en) * 2010-03-10 2010-08-04 彩虹集团公司 Shielding electrically conductive printing ink and preparation method thereof
CN208586240U (en) * 2018-06-15 2019-03-08 苏州世诺新材料科技有限公司 A kind of heat dissipation of portability and electromagnetic shielding adhesive tape
CN111087939A (en) * 2019-12-05 2020-05-01 江苏晶华新材料科技有限公司 Conductive adhesive tape

Similar Documents

Publication Publication Date Title
KR102295909B1 (en) Silver-coated alloy powder, conductive paste, electronic components and electrical devices
EP0169060B1 (en) Solderable conductive compositions, their use as coatings on substrates, and compositions useful in forming them
JP5281529B2 (en) Heat curable conductive paste composition, electrode and wiring pattern forming method using the conductive paste composition
US10347388B2 (en) Conductive copper paste, conductive copper paste cured film, and semiconductor device
DE60114851T2 (en) HIGHLY RELIABLE NON-CONDUCTIVE ADHESIVES FOR SOLDERLESS FLIP CHIP BONDINGS AND FLIP CHIP BOND PROCESSES THEREWITH
DE3217723A1 (en) CONDUCTIVE ADHESIVE PASTE
KR101295801B1 (en) Conductive adhesive material composition
CN105304161B (en) Low-temperature environment-friendly conductive silver paste and preparation method and application
CN113436781A (en) Wear-resistant conductive paste and preparation method thereof
US7799408B2 (en) Conductive powder, conductive composition, and producing method of the same
CN109616242B (en) End electrode silver paste without plating for inductor
CN114874707A (en) Conductive adhesive tape
CN113130112B (en) Preparation method of copper paste with stable conductivity
DE4036274A1 (en) MOISTURE-RESISTANT ELECTRICALLY CONDUCTIVE ADHESIVES, METHOD OF MANUFACTURING AND THEIR USE
TW201828307A (en) Resistance material
JP2016164293A (en) Conductive paste
JP2009001661A (en) Adhesive and bonded body
JP4739999B2 (en) Method for manufacturing anisotropic conductive material and anisotropic conductive material
CN113004735A (en) Matte black copper foil and preparation method thereof
JPH08167320A (en) Conductive composition
JP5169512B2 (en) Planar antenna and manufacturing method thereof
CN111087939A (en) Conductive adhesive tape
KR101764220B1 (en) Conductive composition for nano imprint, and method for manufacturing touch panel using the same
CN116417177B (en) Conductive paste for ceramic capacitor and preparation method thereof
JPH06336563A (en) Conductive coating material

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20220809