CN114830351A - 一种半导体结构及其制备方法 - Google Patents
一种半导体结构及其制备方法 Download PDFInfo
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- CN114830351A CN114830351A CN201980102335.5A CN201980102335A CN114830351A CN 114830351 A CN114830351 A CN 114830351A CN 201980102335 A CN201980102335 A CN 201980102335A CN 114830351 A CN114830351 A CN 114830351A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 125
- 238000002360 preparation method Methods 0.000 title description 5
- 230000004888 barrier function Effects 0.000 claims abstract description 18
- 239000000463 material Substances 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 claims abstract description 6
- 230000007704 transition Effects 0.000 claims description 36
- 238000011065 in-situ storage Methods 0.000 claims description 34
- 229910002601 GaN Inorganic materials 0.000 claims description 10
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 7
- 230000006911 nucleation Effects 0.000 claims description 4
- 238000010899 nucleation Methods 0.000 claims description 4
- 230000000779 depleting effect Effects 0.000 abstract 1
- 230000005533 two-dimensional electron gas Effects 0.000 description 5
- 238000009413 insulation Methods 0.000 description 3
- 229910002704 AlGaN Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- RNQKDQAVIXDKAG-UHFFFAOYSA-N aluminum gallium Chemical compound [Al].[Ga] RNQKDQAVIXDKAG-UHFFFAOYSA-N 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- AJGDITRVXRPLBY-UHFFFAOYSA-N aluminum indium Chemical compound [Al].[In] AJGDITRVXRPLBY-UHFFFAOYSA-N 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
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Abstract
一种半导体结构及其制备方法,通过设置至少两个包括层叠设置的沟道层(11)和势垒层(12)的异质结(1),其中所述异质结(1)的栅极区域包括至少一个第一p型半导体(2),所述第一p型半导体(2)至少贯穿所述顶层势垒层(12)及部分所述沟道层(11),利用多层沟道层(11)和势垒层(12)实现多层2DEG以提高2DEG的浓度,从而减小电阻,并且通过第一p型半导体(2)内的p型半导体材料来耗尽2DEG实现常关,以提高阈值电压。
Description
PCT国内申请,说明书已公开。
Claims (14)
- PCT国内申请,权利要求书已公开。
Applications Claiming Priority (1)
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PCT/CN2019/130513 WO2021134479A1 (zh) | 2019-12-31 | 2019-12-31 | 一种半导体结构及其制备方法 |
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CN114830351A true CN114830351A (zh) | 2022-07-29 |
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US (1) | US20210265495A1 (zh) |
CN (1) | CN114830351A (zh) |
WO (1) | WO2021134479A1 (zh) |
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CN118299402A (zh) * | 2023-01-04 | 2024-07-05 | 中兴通讯股份有限公司 | 一种氮化镓器件及氮化镓器件的制作方法 |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5221849A (en) * | 1992-06-16 | 1993-06-22 | Motorola, Inc. | Semiconductor device with active quantum well gate |
US5608753A (en) * | 1995-06-29 | 1997-03-04 | Xerox Corporation | Semiconductor devices incorporating p-type and n-type impurity induced layer disordered material |
US6992319B2 (en) * | 2000-07-18 | 2006-01-31 | Epitaxial Technologies | Ultra-linear multi-channel field effect transistor |
US8008649B2 (en) * | 2009-02-13 | 2011-08-30 | Board Of Regents, The University Of Texas System | Incorporating gate control over a resonant tunneling structure in CMOS to reduce off-state current leakage, supply voltage and power consumption |
CN102130158B (zh) * | 2011-01-05 | 2012-07-25 | 西安电子科技大学 | 阶梯型凹槽栅高电子迁移率晶体管 |
CN102683394B (zh) * | 2012-04-17 | 2014-12-10 | 苏州晶湛半导体有限公司 | 一种增强型器件及其制造方法 |
US9000484B2 (en) * | 2012-05-23 | 2015-04-07 | Hrl Laboratories, Llc | Non-uniform lateral profile of two-dimensional electron gas charge density in type III nitride HEMT devices using ion implantation through gray scale mask |
CN106415802B (zh) * | 2014-05-26 | 2019-07-02 | 夏普株式会社 | 氮化物类化合物半导体 |
CN106298903A (zh) * | 2015-05-18 | 2017-01-04 | 中国科学院苏州纳米技术与纳米仿生研究所 | 二次外延p型ⅲ族氮化物实现增强型hemt的方法及增强型hemt |
US9419121B1 (en) * | 2015-07-17 | 2016-08-16 | Mitsubishi Electric Research Laboratories, Inc. | Semiconductor device with multiple carrier channels |
JP6746887B2 (ja) * | 2015-09-16 | 2020-08-26 | 住友電気工業株式会社 | 高電子移動度トランジスタ、及び高電子移動度トランジスタの製造方法 |
DE102018133325B4 (de) * | 2017-12-27 | 2024-04-18 | Denso Corporation | Halbleitervorrichtung |
US10403718B2 (en) * | 2017-12-28 | 2019-09-03 | Nxp Usa, Inc. | Semiconductor devices with regrown contacts and methods of fabrication |
US10964733B2 (en) * | 2019-09-04 | 2021-03-30 | Semiconductor Components Industries, Llc | Opto-electronic HEMT |
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2019
- 2019-12-31 CN CN201980102335.5A patent/CN114830351A/zh active Pending
- 2019-12-31 WO PCT/CN2019/130513 patent/WO2021134479A1/zh active Application Filing
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2021
- 2021-05-10 US US17/315,665 patent/US20210265495A1/en active Pending
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WO2021134479A1 (zh) | 2021-07-08 |
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