CN114824021A - Small-spacing display module and manufacturing method thereof - Google Patents
Small-spacing display module and manufacturing method thereof Download PDFInfo
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- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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Abstract
The invention discloses a small-spacing display module and a manufacturing method thereof, wherein the small-spacing display module comprises: a substrate provided with an LED chip; the ink color packaging layer is used for shading and packaging the LED chip; the imaging layer covers the ink color packaging layer and comprises at least two transparent gradient layers, and the transparency of the at least two transparent gradient layers is gradually reduced along the direction far away from the ink color packaging layer. The small-spacing display module and the manufacturing method thereof provided by the invention make full use of the optical principle, the imaging layer comprises at least two transparent gradient layers, the ink color consistency of the small-spacing display module is improved, the ink color height consistency of the upper screen can be realized without picking sheets, the display color difference at different angles is eliminated, and the display module with high contrast is presented.
Description
Technical Field
The invention belongs to the technical field of display, and particularly relates to a small-spacing display module and a manufacturing method thereof.
Background
The LED indoor display application technology is developed vigorously, and currently, there are more or less technical bottlenecks in the adoption of display technologies such as projection, LCD and OLED. Mini & micro led display has attracted much attention as a novel small-space high-definition display technology, especially in indoor large-screen high-definition display applications, such as application scenarios in command centers, conference centers, security monitoring, household large-screen televisions, and the like.
The Mini & MicroLED small-space display screen module is mainly manufactured by three technical schemes: 1. SMD; 2. IMDs (2in 1,4in1, etc.); 3. chip On Board (COB). The COB is more attractive due to its good display effect, high integration level, simple structure and fine-pitch (currently, IMD and SMD are difficult to achieve below pitch 1). Current COB module mainly has 3 defects: 1. a large amount of manual picking sheets are required before screen installation, and even a large display screen formed by modules with good ink color consistency is selected, the problem of poor overall ink color consistency also exists, and the problems of ink color difference, white frames, black frames and the like appear at different positions, different viewing angles and different light rays are specifically reflected; 2. the front side and the side surface have color difference, which is mainly caused by non-uniform light emitting effect of the packaging body; 3. the prior display screens such as computers, mobile phones, spliced LCD screens and the like are all in a mirror mode, namely, images outside the world can be clearly seen through the display screens and can be used as mirror surfaces.
In the actual production process, the inconsistent ink colors of the small-spacing display modules bring huge loss to enterprises, and a large amount of manpower is needed to sort, so that the labor cost is greatly improved, and the production efficiency is reduced; meanwhile, the inconsistent ink color easily causes the difference of display screen products, which is not favorable for market promotion.
In the prior art, chinese patent with patent publication No. CN112018226A and invention name of a display module and a method for manufacturing the same discloses a similar technology, but the technology still has some defects, and although the consistency of ink colors is greatly improved, the problem of inconsistent ink colors still exists. Also, although some layers in the package structure are ground or polished in the prior art, this is only a routine practice in the industry and there is no substantial improvement in achieving the full ink color uniformity.
In view of the above, research and development personnel of the applicant make more intensive research to overcome the technical problems which plague enterprises for a long time.
Disclosure of Invention
The invention aims to provide a small-spacing display module and a manufacturing method thereof, so as to solve or at least partially solve the problem of inconsistent ink colors.
In order to achieve the purpose, the invention adopts the following technical scheme:
in a first aspect, there is provided a small-pitch display module, comprising:
a substrate provided with an LED chip;
the ink packaging layer is used for shading and packaging the LED chip and covers the substrate and the LED chip;
the imaging layer covers the ink color packaging layer, the imaging layer comprises at least two layers of transparent gradient layers, the transparency of the at least two layers of transparent gradient layers is gradually reduced along the direction far away from the ink color packaging layer, the surface roughness Ra of the imaging layer facing one side of the ink color packaging layer is less than 1 micrometer, and Rz is less than 2 micrometers.
Optionally, the surface roughness Ra of the side of the imaging layer opposite to the ink color packaging layer is less than 2 micrometers, and Rz is less than 4 micrometers.
Optionally, the surface roughness Ra of the side of the ink encapsulation layer facing away from the substrate is less than 1 micrometer, and Rz is less than 2 micrometers.
Optionally, the ink color packaging layer comprises a packaging layer and an ink color layer covered on the packaging layer, wherein the surface roughness Ra of one side, opposite to the substrate, of the packaging layer is less than 3 micrometers, and Rz is less than 6 micrometers.
Optionally, the surface roughness Ra of the side of the ink color layer opposite to the packaging layer is less than 1 micrometer, and Rz is less than 2 micrometers.
Optionally, the ink encapsulation layer comprises a mixture of black pigment and at least one of epoxy resin, silica gel and polyurethane;
diffusion powder and matting powder are added in the ink color packaging layer;
the black pigment comprises at least one of graphite powder, carbon powder, iron black and black resin.
Optionally, the imaging layer comprises a mixture of at least one of fluorocarbon resin, epoxy resin, silica gel and polyurethane and a diffusion powder or matting powder;
the thickness of the imaging layer is 1-200 microns.
Optionally, the imaging layer comprises five transparent graded layers with a transparency of 98%, 90%, 85%, 80% and 70%, respectively.
In a second aspect, a method for manufacturing a small-pitch display module is provided, including:
forming an ink color packaging layer for shading and packaging the LED chip on a substrate and the LED chip on the substrate;
forming an imaging layer on the ink encapsulation layer; the imaging layer comprises at least two transparent gradient layers, the transparency of the at least two transparent gradient layers is gradually reduced along the direction far away from the ink color packaging layer, the surface roughness Ra of the imaging layer facing one side of the ink color packaging layer is less than 1 micrometer, and Rz is less than 2 micrometers.
Optionally, the forming an ink color encapsulation layer for shielding light and encapsulating the LED chip on the substrate and the LED chip on the substrate includes:
forming an ink color packaging layer at one time; or the packaging layer and the ink color layer are formed in sequence, and the ink color layer covers the packaging layer.
Compared with the prior art, the embodiment of the invention has the following beneficial effects:
according to the small-spacing display module and the manufacturing method thereof provided by the embodiment of the invention, the optical principle is fully utilized, the imaging layer comprises at least two transparent gradient layers, the roughness of the surface of the imaging layer is controlled, the ink color consistency of the small-spacing display module is improved, the ink color height consistency of the upper screen can be realized without selecting sheets, the display color difference of different angles is eliminated, and the display module with high contrast is presented.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
The structures, ratios, sizes, and the like shown in the present specification are only used for matching with the contents disclosed in the specification, so that those skilled in the art can understand and read the present invention, and do not limit the conditions for implementing the present invention, so that the present invention has no technical significance, and any structural modifications, changes in the ratio relationship, or adjustments of the sizes, without affecting the functions and purposes of the present invention, should still fall within the scope covered by the contents disclosed in the present invention.
Fig. 1 is a structural diagram of a small-pitch display module according to an embodiment of the present invention;
FIG. 2 is a block diagram of an imaging layer provided by an embodiment of the present invention;
FIG. 3 is a block diagram of a small-pitch display module according to an embodiment of the present invention;
FIG. 4 is a flowchart of a method for manufacturing a small-pitch display module according to an embodiment of the present invention;
FIG. 5 is a block diagram of a small-pitch display module according to an embodiment of the present invention;
fig. 6 is a structural diagram of a small-pitch display module according to an embodiment of the present invention.
Illustration of the drawings:
10. a substrate; 11. an LED chip; 12. patterning the light blocking layer; 13. a black matrix; 20. a packaging layer; 30. an ink layer; 40. an imaging layer; 401. a first transparent graded layer; 402. a second transparent graded layer; 403. a third transparent graded layer; 404. a fourth transparent graded layer; 405. a fifth transparent graded layer; 50. and an ink color packaging layer.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 3, the present embodiment provides a small-pitch display module, respectively, which makes full use of the optical principle to improve the ink color consistency of the small-pitch display module, and can achieve the consistent ink color height of the upper screen without picking up the sheet, and simultaneously eliminate the display color difference at different angles to present a high-contrast display module.
Specifically, the small-pitch display module includes a substrate 10, an LED chip 11 flip-chip mounted on the substrate 10, and an ink encapsulation layer 50 covering the substrate 10 and the LED chip 11 for shielding light and encapsulating the LED chip 11. Alternatively, the ink encapsulation layer 50 is formed at once, as shown in fig. 3; or alternatively, the ink encapsulation layer 50 is composed of the encapsulation layer 20 and the ink layer 30 formed in sequence. An ink color layer 30 overlies the encapsulation layer 20, as shown in fig. 1.
The height of the ink encapsulation layer 50 is higher than the height of the LED chip 11.
Optionally, the substrate 10 is a PCB, glass, ceramic or other substrate.
An imaging layer 40 is further disposed on the ink color packaging layer 50, the imaging layer 40 includes at least two transparent gradient layers, and the transparency of the at least two transparent gradient layers gradually decreases along a direction away from the ink color packaging layer 50. The surface of the imaging layer 40 on the side facing the ink encapsulation layer 50 (i.e., the lower surface of the imaging layer in fig. 1) has a roughness Ra < 1 micron and Rz < 2 microns. In a preferred embodiment, the roughness Ra may be 0.5 micrometers or less, 0.1 micrometers or less, or 0.01 micrometers or less, and the Rz may be 0.1 micrometers or less, 0.05 micrometers or less, or 0.02 micrometers or less, respectively.
Optionally, imaging layer 40 comprises five transparent graded layers, first transparent graded layer 401, second transparent graded layer 402, third transparent graded layer 403, fourth transparent graded layer 404, and fifth transparent graded layer 405, having a transparency of 98%, 90%, 85%, 80%, and 70%, respectively.
The embodiment provides a booth apart from display module, make full use of optical principle, the formation of image layer includes two-layer at least transparent gradual change layer, makes same display module's different black region constantly reflect in inside, makes people's eye see more evenly, improves booth apart from display module's china ink colour uniformity, need not choose the piece also can realize the screen painting colour highly uniform, has eliminated different angle display colour differences simultaneously, demonstrates the display module assembly of high contrast.
To further improve the ink color consistency of the small pitch display module, the surface of the imaging layer 40 is planarized. The surface of the imaging layer 40 on the side facing away from the ink encapsulating layer 50 (i.e., the upper surface of the imaging layer in FIG. 1) is specular and has a roughness Ra < 2 microns and Rz < 4 microns. As a preferred embodiment, the roughness Ra may be 1.5 micrometers or less, 0.5 micrometers or less, or 0.1 micrometers or less, respectively, and the Rz may be 3 micrometers or less, 1 micrometer or less, or 0.2 micrometers or less, respectively, to improve the ink color consistency of the display module.
In this embodiment, in order to improve the ink consistency of the small-pitch display module, the surface of the ink encapsulation layer 50 is planarized, so that the surface of the ink encapsulation layer 50 opposite to the substrate 10 is a mirror surface.
Alternatively, the planarization process may be implemented by polishing, grinding, or smooth release film lamination.
Furthermore, in order to make the small-pitch display module have higher ink color consistency, the roughness of the mirror surface can be controlled, so that the surface roughness Ra of the side, opposite to the substrate 10, of the ink color packaging layer 50 is less than 1 micrometer, and Rz is less than 2 micrometers. In a preferred embodiment, the roughness Ra may be 0.5 micrometers or less, 0.1 micrometers or less, or 0.01 micrometers or less, and the Rz may be 0.1 micrometers or less, 0.05 micrometers or less, or 0.02 micrometers or less, respectively.
Optionally, the ink color encapsulation layer 50 includes a mixture of black pigment and at least one of epoxy, silicone, and polyurethane; diffusion powder and matting powder are added into the ink color packaging layer 50; the black pigment comprises at least one of graphite powder, carbon powder, iron black and/or black resin.
Alternatively, when the ink encapsulation layer 50 includes the encapsulation layer 20 and the ink layer 30, the ink uniformity of the display module can be improved by controlling the roughness of the surface of the encapsulation layer 20, such that the roughness Ra < 3 microns and Rz < 6 microns. Alternatively, the values of Ra and Rz may be measured using a step tester. In a preferred embodiment, the roughness Ra may be 2 micrometers or less, 1 micrometer or less, or 0.5 micrometers or less, and the Rz may be 1 micrometer or less, 0.5 micrometer or less, or 0.25 micrometer or less, respectively.
The ink color consistency of the display module can also be improved by controlling the surface roughness of the ink color layer 30. Optionally, the roughness Ra is controlled to be less than 1 micron, and Rz is controlled to be less than 2 microns. In a preferred embodiment, the roughness Ra may be 0.5 micrometers or less, 0.1 micrometers or less, or 0.01 micrometers or less, and the Rz may be 0.1 micrometers or less, 0.05 micrometers or less, or 0.02 micrometers or less, respectively.
Note that the encapsulating layer 20 includes epoxy resin, silicone rubber, or polyurethane. Optionally, a diffusing powder, a black pigment and a matting powder are added in the encapsulating layer 20. Optionally, the mass ratio of the black pigment to the packaging layer 20 is 0.1-5%, and the mass ratio of the matting powder to the packaging layer 20 is 0.1-5%; optionally, the black pigment includes at least one of graphite powder, carbon powder, iron black, and black resin. Optionally, the thickness of the encapsulation layer 20 is 30-400 microns.
The ink color layer 30 includes a mixture of at least one of fluorocarbon resin, epoxy resin, silicone, and polyurethane with a black pigment. Optionally, a diffusing powder or a matting powder is further added to the ink color layer 30. Optionally, the mass ratio of the black pigment to the ink layer 30 is 3-80%. Optionally, the black pigment includes at least one of graphite powder, carbon powder, iron black, and black resin. Optionally, the ink color layer 30 has a thickness of 1-100 microns.
It should be noted that the image forming layer 40 includes a mixture of at least one of fluorocarbon resin, epoxy resin, silicone, and polyurethane, and a diffusing powder or matting powder. Optionally, the thickness of the imaging layer 40 is 1-200 micrometers, the imaging layer 40 is a transparent layer, and the transparency is 50% -100%. Optionally, the imaging layer 40 has a thickness of 1-100 microns. Further, the imaging layer 40 may include functions of fingerprint prevention, bump prevention, and static electricity discharge.
Referring to fig. 4, another embodiment of the present application provides a manufacturing method, which can manufacture the small-pitch display module provided in the above embodiment. Specifically, the manufacturing method comprises the following steps:
s101, forming an ink color packaging layer 50 on the substrate 10 and the LED chip 11 on the substrate 10; can be formed by spraying or film pressing;
s102, forming an imaging layer 40 on the ink color packaging layer 50, wherein the imaging layer 40 comprises at least two transparent gradient layers, and the transparency of the at least two transparent gradient layers is gradually reduced along the direction far away from the ink color packaging layer 50; can be formed by spraying or film pressing; the surface roughness Ra of the imaging layer 40 facing the ink packaging layer 50 is less than 1 micrometer, and Rz is less than 2 micrometers.
Alternatively, the ink color encapsulation layer 50 may be formed at a time, or may be composed of an encapsulation layer 20 and an ink color layer 30 formed in sequence, wherein the ink color layer 30 covers the encapsulation layer 20.
Optionally, imaging layer 40 comprises five transparent graded layers, first transparent graded layer 401, second transparent graded layer 402, third transparent graded layer 403, fourth transparent graded layer 404, and fifth transparent graded layer 405, having a transparency of 98%, 90%, 85%, 80%, and 70%, respectively.
According to the manufacturing method of the small-spacing display module, the optical principle is fully utilized, the imaging layer comprises at least two transparent gradient layers, the ink color consistency of the small-spacing display module is improved, the ink color height consistency of the upper screen can be realized without picking the sheet, the display color difference at different angles is eliminated, and the display module with high contrast is presented.
Optionally, planarizing the surface of the encapsulation layer 20; the surface of the encapsulation layer 20 opposite to the substrate 10 is a mirror surface, and the surface roughness Ra is less than 3 micrometers, and Rz is less than 6 micrometers. Alternatively, the values of Ra and Rz may be measured using a step tester. In a preferred embodiment, the roughness Ra may be 2 micrometers or less, 1 micrometer or less, or 0.5 micrometers or less, and the Rz may be 1 micrometer or less, 0.5 micrometer or less, or 0.25 micrometer or less, respectively.
Carrying out flattening treatment on the surface of the ink color layer 30; the surface of the ink layer 30 opposite to the packaging layer 20 is a mirror surface, the roughness Ra is less than 1 micron, and the Rz is less than 2 microns. In a preferred embodiment, the roughness Ra may be 0.5 micrometers or less, 0.1 micrometers or less, or 0.01 micrometers or less, and the Rz may be 0.1 micrometers or less, 0.05 micrometers or less, or 0.02 micrometers or less, respectively.
Alternatively, when the ink color sealing layer 50 is formed at one time, after the ink color sealing layer 50 is formed; carrying out flattening treatment on the surface of the ink color packaging layer 50; the surface of the ink color packaging layer 50, which is opposite to the substrate 10, is a mirror surface, the roughness Ra of the mirror surface is less than 1 micrometer, and the Rz of the mirror surface is less than 2 micrometers. In a preferred embodiment, the roughness Ra may be 0.5 micrometers or less, 0.1 micrometers or less, or 0.01 micrometers or less, and the Rz may be 0.1 micrometers or less, 0.05 micrometers or less, or 0.02 micrometers or less, respectively.
Optionally, planarizing the surface of imaging layer 40; the surface of the imaging layer 40 opposite to the ink color packaging layer 50 is a mirror surface, the roughness Ra is less than 2 micrometers, and the Rz is less than 4 micrometers. As a preferred embodiment, the roughness Ra may be 1.5 micrometers or less, 0.5 micrometers or less, or 0.1 micrometers or less, respectively, and the Rz may be 3 micrometers or less, 1 micrometer or less, or 0.2 micrometers or less, respectively, to improve the ink color consistency of the display module.
Since the components of the encapsulation layer 20, the ink color layer 30, the imaging layer 40 and the ink color encapsulation layer 50 are specifically described in the above embodiments, the description thereof is omitted.
Optionally, the planarization process may be implemented by polishing, grinding, or smooth release film lamination.
The manufacturing method provided by the embodiment makes full use of the optical principle, the imaging layer 40 comprises at least two transparent gradient layers, the ink color consistency of the small-spacing display module is improved by controlling the surface roughness, the ink color height consistency of the upper screen can be realized without picking up sheets, the display color difference at different angles is eliminated, and the display module with high contrast is presented.
As an alternative to any of the embodiments described above, the encapsulating layer 20 is divided into two parts, an undercoat layer and a matte layer.
Referring to fig. 5 and 6, the undercoat layer may form a black matrix 13, which is distributed between the LED chips 11 in the LED array. A matte layer is over the primer layer. Alternatively, the undercoat layer is a resin material mixed with a melanin pigment (carbon powder, iron black, etc.), and the matte layer is a resin material mixed with a scattering powder, a diffusing powder, or a matting powder. The resin material is epoxy resin, silica gel or polyurethane.
As an alternative implementation manner of any of the above embodiments, the LED chip 11 includes a LED chip group, and a QD layer is disposed on the LED chip group.
The substrate 10 is provided with a patterned light-blocking layer 12, LED chip units in an LED chip group are limited in a light-limiting unit of the patterned light-blocking layer 12, the LED chip units may be one pixel (three RGB chips) or a single LED chip, and the size of the light-limiting unit matches with that of the LED chip units.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A small pitch display module, comprising:
a substrate provided with an LED chip;
the ink packaging layer is used for shading and packaging the LED chip and covers the substrate and the LED chip;
the imaging layer covers the ink color packaging layer, the imaging layer comprises at least two layers of transparent gradient layers, the transparency of the at least two layers of transparent gradient layers is gradually reduced along the direction far away from the ink color packaging layer, the surface roughness Ra of the imaging layer facing one side of the ink color packaging layer is less than 1 micrometer, and Rz is less than 2 micrometers.
2. The small-pitch display module of claim 1, wherein the imaging layer has a surface roughness Ra < 2 microns on a side facing away from the ink encapsulation layer, and Rz < 4 microns.
3. The small-pitch display module of claim 1, wherein the surface roughness Ra < 1 micron and Rz < 2 microns of the side of the ink encapsulation layer facing away from the substrate.
4. The small-pitch display module of claim 1, wherein the ink encapsulation layer comprises an encapsulation layer and an ink layer covering the encapsulation layer, wherein the encapsulation layer has a surface roughness Ra < 3 micrometers and Rz < 6 micrometers on a side facing away from the substrate.
5. The small-pitch display module of claim 4, wherein the ink color layer has a surface roughness Ra < 1 micron and Rz < 2 microns on a side facing away from the encapsulation layer.
6. The small-pitch display module of claim 1, wherein the ink encapsulation layer comprises a mixture of black pigment and at least one of epoxy, silicone, and polyurethane;
diffusion powder and matting powder are added in the ink color packaging layer;
the black pigment comprises at least one of graphite powder, carbon powder, iron black and black resin.
7. The small-gap display module as claimed in claim 1, wherein the image layer comprises a mixture of at least one of fluorocarbon resin, epoxy resin, silica gel, and polyurethane with a diffusion powder or matting powder;
the thickness of the imaging layer is 1-200 microns.
8. The small-pitch display module of claim 1, wherein the image-forming layer comprises five transparent graded layers with a transparency of 98%, 90%, 85%, 80% and 70%, respectively.
9. A method for manufacturing a small-spacing display module is characterized by comprising the following steps:
forming an ink color packaging layer for shading and packaging the LED chip on a substrate and the LED chip on the substrate;
forming an imaging layer on the ink encapsulation layer; the imaging layer comprises at least two transparent gradient layers, the transparency of the at least two transparent gradient layers is gradually reduced along the direction far away from the ink color packaging layer, the surface roughness Ra of the imaging layer facing one side of the ink color packaging layer is less than 1 micrometer, and Rz is less than 2 micrometers.
10. The method of manufacturing according to claim 9, wherein the forming of an ink color encapsulation layer for shielding light and encapsulating the LED chip on the substrate and the LED chip on the substrate includes:
forming an ink color packaging layer at one time; or the packaging layer and the ink color layer are formed in sequence, and the ink color layer covers the packaging layer.
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