CN114786433B - A voltage doubler rectifier for high voltage power supply of electro-aerodynamic propulsion - Google Patents

A voltage doubler rectifier for high voltage power supply of electro-aerodynamic propulsion Download PDF

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Publication number
CN114786433B
CN114786433B CN202210439239.3A CN202210439239A CN114786433B CN 114786433 B CN114786433 B CN 114786433B CN 202210439239 A CN202210439239 A CN 202210439239A CN 114786433 B CN114786433 B CN 114786433B
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voltage
thermal resistance
pcb
voltage diode
diode
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CN114786433A (en
Inventor
赵振兴
李博约
刘增
朱积嘉
陈宇
杨亚超
戴瑜兴
彭子舜
漆俊
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Hunan Institute of Engineering
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20127—Natural convection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B64—AIRCRAFT; AVIATION; COSMONAUTICS
    • B64D—EQUIPMENT FOR FITTING IN OR TO AIRCRAFT; FLIGHT SUITS; PARACHUTES; ARRANGEMENT OR MOUNTING OF POWER PLANTS OR PROPULSION TRANSMISSIONS IN AIRCRAFT
    • B64D27/00—Arrangement or mounting of power plants in aircraft; Aircraft characterised by the type or position of power plants
    • B64D27/02—Aircraft characterised by the type or position of power plants
    • B64D27/24—Aircraft characterised by the type or position of power plants using steam or spring force
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/02—Conversion of AC power input into DC power output without possibility of reversal
    • H02M7/04—Conversion of AC power input into DC power output without possibility of reversal by static converters
    • H02M7/06—Conversion of AC power input into DC power output without possibility of reversal by static converters using discharge tubes without control electrode or semiconductor devices without control electrode
    • H02M7/10—Conversion of AC power input into DC power output without possibility of reversal by static converters using discharge tubes without control electrode or semiconductor devices without control electrode arranged for operation in series, e.g. for multiplication of voltage
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Rectifiers (AREA)

Abstract

The invention is applicable to the field of power electronics and discloses a voltage doubling rectifier for an electric-air power propulsion high-voltage power supply, which comprises a three-dimensional heat dissipation structure, a power supply and a power supply, wherein the three-dimensional heat dissipation structure comprises two PCB boards, two high-voltage diodes and a high-voltage capacitor; the two high-voltage diodes comprise a first high-voltage diode and a second high-voltage diode, the cathode of the second high-voltage diode is connected with the anode of the first high-voltage diode through the second PCB, and the cathode of the first high-voltage diode is connected with two high-voltage capacitors connected in series through the first PCB and is connected with the anode of the second high-voltage diode. The three-dimensional structure is beneficial to increasing the heat radiating area, reducing the weight of the heat radiating device and the heat radiating material, realizing the reduction of the weight of the voltage doubling rectifying circuit, and achieving the final purpose of reducing the weight of the LCC converter, thereby meeting the light design requirement of the aircraft.

Description

Voltage doubling rectifier for electric aerodynamic propulsion high-voltage power supply
Technical Field
The invention belongs to the technical field of power electronics, and particularly relates to a voltage doubling rectifier for an electric-air power propulsion high-voltage power supply.
Background
The electric aerodynamic propulsion mode is a novel propulsion mode, is different from the traditional mechanical motion to generate thrust, the thrust is derived from 'ion wind' generated by high-voltage ionized air, and meanwhile, the electric aerodynamic propulsion mode relies on a high-voltage power supply with high power density by using the characteristic of light weight of an aircraft of the propulsion mode, and a voltage doubler rectifier is an important component in the high-voltage power supply and influences important parameters such as power density of a circuit.
The voltage doubling rectifier in the traditional LCC converter is arranged on the PCB in a patch welding mode, so that the contact surface with air is small, heat dissipation of a high-voltage device is not facilitated, heat dissipation measures such as a radiator and a fan are required to be added for guaranteeing the reliability of the voltage doubling rectifier, the weight of the converter is increased, the light weight design of an electric-air power propulsion type aircraft is not facilitated, and the weight of a part of the voltage doubling rectifier is increased due to the PCB used by the voltage doubling rectifier.
Disclosure of Invention
The embodiment of the invention provides a voltage doubling rectifier for an electric aerodynamic propulsion high-voltage power supply, which aims to solve the problem that the existing voltage doubling rectifier for the electric aerodynamic propulsion high-voltage power supply is lack in order to optimize the integral light weight of a converter.
The embodiment of the invention provides a voltage doubling rectifier for an electric aerodynamic propulsion high-voltage power supply, which comprises a three-dimensional heat dissipation structure, a voltage doubling rectifier and a voltage doubling rectifier, wherein the three-dimensional heat dissipation structure comprises two PCB boards, two high-voltage diodes and a high-voltage capacitor, wherein the two PCB boards comprise a first PCB board and a second PCB board, and the two high-voltage diodes comprise a first high-voltage diode and a second high-voltage diode;
the cathode of the second high-voltage diode is connected with the anode of the first high-voltage diode through the second PCB;
and the cathode of the first high-voltage diode is connected with the two high-voltage capacitors in series through the first PCB and is connected with the anode of the second high-voltage diode.
Preferably, the voltage doubling rectifier further comprises a curable insulating adhesive and a curable heat-conducting silicone grease;
the solidifiable insulating glue is arranged at each metal contact point;
the solidifiable heat-conducting silicone grease is arranged on the shell of the three-dimensional heat dissipation structure.
Preferably, the voltage doubler rectifier satisfies at least one of the following conditions:
the solidifiable insulating adhesive wraps each metal contact point in a potting mode;
The thermal resistance of the solidifiable heat conduction silicone grease is smaller than the thermal resistance of the first high-voltage diode and the second high-voltage diode.
Preferably, the width of the copper foil of the PCB is calculated by adopting the following formula:
;
Wherein, For the thickness of the copper foil of the PCB,Is the heat conductivity coefficient of the high-voltage diode pin,Is the heat conductivity coefficient of the copper foil of the PCB,Is the high voltage diode pin diameter.
Preferably, the thickness of the curable insulating adhesive is calculated by the following formula:
;
where Vout is the output voltage and vis_max is the insulation material maximum insulation voltage.
Preferably, whether the settable thermally conductive silicone grease is required is determined by:
calculating the thermal resistance of the pin of the high-voltage diode and the solder thermal resistance of the high-voltage diode;
Calculating thermal resistance of the PCB copper foil under natural convection conditions;
Calculating the temperature rise of equivalent thermal resistance;
when the temperature rise of the equivalent thermal resistance is smaller than the minimum allowable temperature rise of the PN junction of the high-voltage diode, the solidifiable heat conduction silicone grease does not need to be added;
when the temperature rise of the equivalent thermal resistance is greater than or equal to the minimum allowable temperature rise of the PN junction of the high-voltage diode, the solidifiable heat-conducting silicone grease needs to be added.
Preferably, the calculation of the thermal resistance of the pin of the high-voltage diode specifically adopts the following modes:
;
the method for calculating the soldering tin thermal resistance of the high-voltage diode specifically adopts the following modes:
;
Wherein, For the length of the high voltage diode pins,Is the heat conductivity coefficient of the pin of the high-voltage diode,For the high voltage diode pin diameter,Is the thermal conductivity coefficient of the high-voltage diode soldering tin,For the thickness of the copper foil of the PCB, d 1 is the solder thickness.
Preferably, the method for calculating the thermal resistance of the PCB copper foil under the natural convection condition specifically comprises the following steps:
;
Wherein the method comprises the steps of The length of the copper foil of the PCB is the length required by the connection device to form a complete circuit; Is the natural convection heat exchange coefficient of the air, The width of the copper foil of the PCB is the width of the copper foil of the PCB,The thickness of the copper foil of the PCB is equal to that of the copper foil of the PCB.
Preferably, the temperature rise for calculating the equivalent thermal resistance is specifically as follows:
;
Wherein, ;
Wherein, For the diode PN junction to the shell thermal resistance,For the case-to-air thermal resistance,For the thermal resistance of the high voltage diode,Is the solder thermal resistance of the high-voltage diode,Is the thermal resistance of the copper foil of the PCB under the natural convection condition,Is the temperature rise of the equivalent thermal resistance,For diode loss, R eq is the equivalent thermal resistance of the diode itself.
Preferably, when the temperature rise of the equivalent thermal resistance is greater than or equal to the minimum allowable temperature rise of the PN junction of the high-voltage diode, the thickness of the solidifiable heat-conducting silicone grease which needs to be increased is determined specifically by the following way:
;
As described in the above formula 、AndThe method comprises the following steps:
;
;
;
Wherein the method comprises the steps of For the radius of the high voltage diode package,For the length of the high voltage diode package,For the PN junction to shell thermal resistance of the high voltage diode,For the case-to-air thermal resistance,For the thermal resistance of the high voltage diode,Is the solder thermal resistance of the high-voltage diode,Is the thermal resistance of the copper foil of the PCB under the natural convection condition,In order for the high voltage diode to be worn out,Is the natural convection coefficient of the air,Is the maximum allowable temperature rise.
The invention has the beneficial effects that the voltage doubling rectifier for the electric-air power propulsion high-voltage power supply comprises a three-dimensional heat dissipation structure, the three-dimensional structure is used for increasing the heat dissipation area of the voltage doubling rectifier, reducing the weight of a heat dissipation device and heat dissipation materials, reducing the weight of a voltage doubling rectifying circuit, and achieving the final purpose of reducing the weight of an LCC converter, thereby meeting the light-weight design requirement of an aircraft. The voltage doubling rectifier further comprises a solidifiable insulating adhesive and solidifiable heat-conducting silicone grease, wherein the solidifiable insulating adhesive is arranged on each metal contact point, the solidifiable heat-conducting silicone grease is arranged on the shell of the three-dimensional heat dissipation structure, and further, the copper foil existing on the PCB of the voltage doubling rectifier circuit is utilized and the surface area of the copper foil is designed, so that the copper foil is used for heat conduction and heat dissipation of the voltage doubling rectifier, and meanwhile, the thickness of the heat-conducting silicone grease is designed, so that the weight reduction of the voltage doubling rectifier circuit is further realized.
Drawings
FIG. 1 is a block diagram of a voltage doubler rectifier according to an embodiment of the present invention;
FIG. 2 is a schematic circuit diagram of a voltage doubler rectifier according to an embodiment of the present invention;
fig. 3 is a schematic diagram of thermal resistance of a voltage doubler rectifier according to an embodiment of the present invention.
The reference numeral is a first PCB 1, a second PCB 2, a first high-voltage diode 3, a second high-voltage diode 4, a high-voltage capacitor 5, a solidifiable insulating adhesive 6 and a solidifiable heat-conducting silicone grease 7.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or be connected to the other element through intervening elements. In the following embodiments, "connected" is understood to mean "electrically connected", "communicatively connected", and the like, if the connected circuits, modules, units, and the like have electrical or data transferred therebetween.
As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," and/or the like, specify the presence of stated features, integers, steps, operations, elements, components, or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or groups thereof. Meanwhile, the term used in the present specification includes any and all combinations of the items listed in association.
The invention provides a lightweight integrated transformer for an electric aerodynamic propulsion high-voltage power supply, as shown in fig. 1, which comprises a three-dimensional heat dissipation structure, wherein the three-dimensional heat dissipation structure comprises two PCBs, two high-voltage diodes and a high-voltage capacitor 5, the two PCBs comprise a first PCB 1 and a second PCB 2, and the two high-voltage diodes comprise a first high-voltage diode 3 and a second high-voltage diode 4;
the cathode of the second high-voltage diode 4 is connected with the anode of the first high-voltage diode 3 through the second PCB 2, and the cathode of the first high-voltage diode 3 is connected with the anode of the second high-voltage diode 4 after being connected with two high-voltage capacitors 5 in series through the first PCB 1.
Specifically, in the invention, the first PCB 1 is an upper PCB, and the second PCB is a lower PCB.
The invention has the beneficial effects that the voltage doubling rectifier for the electric-air power propulsion high-voltage power supply comprises a three-dimensional heat dissipation structure, the three-dimensional structure is used for increasing the heat dissipation area of the voltage doubling rectifier, reducing the weight of a heat dissipation device and heat dissipation materials, reducing the weight of a voltage doubling rectifying circuit, and achieving the final purpose of reducing the weight of an LCC converter, thereby meeting the light-weight design requirement of an aircraft.
As shown in fig. 1, the voltage doubling rectifier further comprises a solidifiable insulating glue 6 and solidifiable heat conduction silicone grease 7, wherein the solidifiable insulating glue 6 is positioned at each metal contact point, the solidifiable heat conduction silicone grease 7 is positioned at the outer shells of the first high-voltage diode 3 and the second high-voltage diode 4, the solidifiable insulating glue 6 wraps each metal contact point in a potting mode, and the thermal resistance of the solidifiable heat conduction silicone grease 7 is smaller than the thermal resistance of the outer shells of the first high-voltage diode 3 and the second high-voltage diode 4.
The width of the PCB copper foil and the thickness of the solidifiable heat conduction silicone grease designed in the figure 1 are reasonably designed to meet the design requirements of heat dissipation and light weight, and the thickness of the solidifiable insulating adhesive and the thickness of the solidifiable heat conduction silicone grease are reasonably designed to serve as a radiator and lighten the weight of the radiator.
The specific design scheme is as follows:
1) The width of the copper foil in the PCB is as follows:
;
Wherein, For the thickness of the copper foil of the PCB,Is the heat conductivity coefficient of the high-voltage diode pin,Is the heat conductivity coefficient of the copper foil of the PCB,Is the high voltage diode pin diameter.
2) The thickness of the solidifiable insulating adhesive is as follows:
。
v out is the output voltage.
3) Whether the solidifiable heat-conducting silicone grease needs to be adopted or not is determined by the following method:
step S10, calculating the pin thermal resistance and the soldering thermal resistance of the high-voltage diode;
step S20, calculating thermal resistance of the PCB copper foil under natural convection conditions;
step S30, calculating the temperature rise of equivalent thermal resistance;
step S40, when the temperature rise of the equivalent thermal resistance is smaller than the minimum allowable temperature rise of the PN junction of the high-voltage diode, the solidifiable heat-conducting silicone grease does not need to be added;
In step S40, when the temperature rise of the equivalent thermal resistance is greater than or equal to the minimum allowable temperature rise of the PN junction of the high voltage diode, the curable heat-conductive silicone grease needs to be added.
In step S10, the following method is specifically adopted to calculate the thermal resistance of the pin of the high-voltage diode:
;
the method for calculating the soldering tin thermal resistance of the high-voltage diode specifically adopts the following modes:
;
Wherein, For the length of the high voltage diode pins,Is the heat conductivity coefficient of the pin of the high-voltage diode,For the high voltage diode pin diameter,Is the thermal conductivity coefficient of the high-voltage diode soldering tin,For the thickness of the copper foil of the PCB, d 1 is the solder thickness.
In step S20, the thermal resistance under the natural convection condition of the copper foil of the PCB board is calculated as:
;
Wherein the method comprises the steps of The length of the copper foil of the PCB is the length required by the connection device to form a complete circuit; Is the natural convection heat exchange coefficient of the air, The width of the copper foil of the PCB is the width of the copper foil of the PCB,The thickness of the copper foil of the PCB is equal to that of the copper foil of the PCB.;
;
;
;
Wherein the method comprises the steps ofIn order to achieve an air density of the air,Is the coefficient of expansion of air, and is the air expansion coefficient,The acceleration of the gravity is that,For the temperature difference between the average temperature of the copper foil and the ambient temperature,For the air diffusion rate perpendicular to the PCB board,Is the specific heat capacity of air,Is the viscosity coefficient of air, and is used for controlling the temperature of the air,Is the heat conductivity coefficient of the air,In order to provide a number of noose,For the purpose of the gara dawn number,Is the planchet number.
In step S30, the temperature rise of the equivalent thermal resistance is calculated as:
;
Wherein, ;
Wherein, For the diode PN junction to the shell thermal resistance,For the case-to-air thermal resistance,For the thermal resistance of the high voltage diode,Is the solder thermal resistance of the high-voltage diode,Is the thermal resistance of the copper foil of the PCB under the natural convection condition,Is the temperature rise of the equivalent thermal resistance,For diode loss, R eq is the equivalent thermal resistance of the diode itself.
In step S40, when the temperature rise of the equivalent thermal resistance is greater than or equal to the minimum allowable temperature rise of the PN junction of the high voltage diode, the thickness of the curable heat-conductive silicone grease to be increased is specifically determined in the following manner:
;
As described in the above formula 、AndThe method comprises the following steps:
;
;
;
Wherein the method comprises the steps of For the radius of the high voltage diode package,For the length of the high voltage diode package,For the PN junction to shell thermal resistance of the high voltage diode,For the case-to-air thermal resistance,For the thermal resistance of the high voltage diode,Is the solder thermal resistance of the high-voltage diode,Is the thermal resistance of the copper foil of the PCB under the natural convection condition,In order for the high voltage diode to be worn out,Is the natural convection coefficient of the air,Is the maximum allowable temperature rise.
As shown in fig. 2, a schematic diagram of the voltage doubler rectifier circuit shown in fig. 1 is shown.
As shown in fig. 3, a graph of the thermal resistance of the voltage doubler rectifier shown in fig. 1 is shown.
The invention provides a voltage doubling rectifier for an electric-air power propulsion high-voltage power supply, and aims to realize the light-weight design of a voltage doubling rectifying circuit in an LCC converter so as to effectively reduce the weight of the converter. The invention adopts a three-dimensional structure to help increase the heat dissipation area and reduce the weight of a heat dissipation device and heat dissipation materials, utilizes the copper foil existing in the PCB of the voltage doubling rectifying circuit and designs the surface area of the copper foil to enable the copper foil to be used for heat conduction and heat dissipation of the voltage doubling rectifier, and simultaneously designs the thickness of heat dissipation silicone grease to reduce the weight of the voltage doubling rectifying circuit, thereby achieving the final purpose of reducing the weight of the LCC converter and further meeting the light weight design requirement of an aircraft.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the application, which are described in detail and are not to be construed as limiting the scope of the application. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of protection of the present application is to be determined by the appended claims.

Claims (4)

1. The voltage doubling rectifier for the electric aerodynamic propulsion high-voltage power supply is characterized by comprising a three-dimensional heat dissipation structure, a first voltage diode and a second voltage diode, wherein the three-dimensional heat dissipation structure comprises two PCB boards, two high-voltage diodes and a high-voltage capacitor;
the cathode of the second high-voltage diode is connected with the anode of the first high-voltage diode through the second PCB;
The cathodes of the first high-voltage diodes are connected with the two high-voltage capacitors in series through the first PCB and are connected with the anodes of the second high-voltage diodes;
the voltage doubling rectifier also comprises a solidifiable insulating adhesive and solidifiable heat-conducting silicone grease;
the curable heat conduction silicone grease is arranged on the shells of the first high-voltage diode and the second high-voltage diode;
Whether the solidifiable heat-conducting silicone grease needs to be adopted or not is determined by the following method:
calculating the thermal resistance of the pin of the high-voltage diode and the solder thermal resistance of the high-voltage diode;
Calculating thermal resistance of the PCB copper foil under natural convection conditions;
Calculating the temperature rise of equivalent thermal resistance;
when the temperature rise of the equivalent thermal resistance is smaller than the minimum allowable temperature rise of the PN junction of the high-voltage diode, the solidifiable heat conduction silicone grease does not need to be added;
When the temperature rise of the equivalent thermal resistance is greater than or equal to the minimum allowable temperature rise of the PN junction of the high-voltage diode, the solidifiable heat-conducting silicone grease needs to be added;
the temperature rise for calculating the equivalent thermal resistance is specifically as follows:
;
Wherein:
;
For the diode PN junction to the shell thermal resistance, For the case-to-air thermal resistance,For the thermal resistance of the high voltage diode,Is the solder thermal resistance of the high-voltage diode,Is the thermal resistance under the natural convection condition of the copper foil of the PCB, R eq is the equivalent thermal resistance of the diode itself,Is the temperature rise of the equivalent thermal resistance,Is diode loss.
2. A voltage doubler rectifier for use in electro-aerodynamic propulsion high voltage power supply according to claim 1, wherein the voltage doubler rectifier satisfies at least one of the following conditions:
the solidifiable insulating adhesive wraps each metal contact point in a potting mode;
The thermal resistance of the solidifiable heat conduction silicone grease is smaller than the thermal resistance of the first high-voltage diode and the second high-voltage diode.
3. A voltage doubler rectifier for use in electro-aerodynamic propulsion high voltage power supply according to claim 1, characterized by:
The method for calculating the thermal resistance of the pin of the high-voltage diode specifically adopts the following modes:
;
the method for calculating the soldering tin thermal resistance of the high-voltage diode specifically adopts the following modes:
;
Wherein, For the length of the high voltage diode pins,Is the heat conductivity coefficient of the pin of the high-voltage diode,For the high voltage diode pin diameter,Is the thermal conductivity coefficient of the high-voltage diode soldering tin,For the thickness of the copper foil of the PCB, d 1 is the solder thickness.
4. The voltage doubler rectifier for an electro-aerodynamic propulsion high-voltage power supply of claim 1, wherein the calculation of thermal resistance under natural convection conditions of the copper foil of the PCB is specifically performed by:
;
Wherein the method comprises the steps of The length of the copper foil of the PCB is the length required by the connection device to form a complete circuit; Is the natural convection heat exchange coefficient of the air, The width of the copper foil of the PCB is the width of the copper foil of the PCB,The thickness of the copper foil of the PCB is equal to that of the copper foil of the PCB.
CN202210439239.3A 2022-04-25 2022-04-25 A voltage doubler rectifier for high voltage power supply of electro-aerodynamic propulsion Active CN114786433B (en)

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CN101324325A (en) * 2007-06-11 2008-12-17 精碟科技股份有限公司 Light emitting diode module
CN102593112A (en) * 2012-03-15 2012-07-18 鞍山雷盛电子有限公司 High frequency voltage doubling rectifier module

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