CN114770306A - Semi-automatic polishing device and method - Google Patents

Abstract

The invention discloses a semi-automatic grinding device and method, wherein the semi-automatic grinding device comprises a semi-automatic grinding device body, a grinding mechanism and a driving mechanism, the grinding mechanism is placed in the semi-automatic grinding device body, and the grinding mechanism can grind the material to be ground and drive The mechanism is connected with the grinding mechanism, and the driving mechanism can drive the grinding mechanism to rotate, so that the grinding mechanism rubs against the material block to be ground, so as to realize the grinding of the material block to be ground. When grinding the material block to be ground, the drive mechanism needs to be turned on, the driving mechanism rotates, and the grinding mechanism is driven to rotate. During the rotation of the grinding mechanism, the friction with the material block to be ground is continuously carried out to realize the grinding of the material block to be ground, thereby Make the material block to be polished into a preset shape structure. Compared with the prior art, the above-mentioned semi-automatic grinding device can not only improve the grinding efficiency, but also improve the uniformity of the surface roughness of the material block, thereby further improving the grinding quality.

Description

A semi-automatic grinding device and method

technical field

The invention relates to the technical field of semiconductor polishing, in particular to a semi-automatic polishing device and method.

Background technique

At present, the grinding of semiconductor cone blocks is usually done by hand with 60-400-mesh sandpaper. The attachments on the surface of the cone blocks are manually polished by the staff, and the water chestnuts at the corners of the upper and lower end faces of the cone blocks are removed by hand. The grinding is smooth, but the efficiency of this manual grinding method is extremely low, and the surface roughness of the polished block is not uniform, which may affect the molten material in the growth process of the semiconductor single crystal material, thereby affecting the crystallization rate.

Therefore, how to provide a semi-automatic grinding device that can not only improve the grinding efficiency, but also improve the grinding quality is a technical problem that those skilled in the art need to solve urgently.

SUMMARY OF THE INVENTION

In view of this, the purpose of the present invention is to provide a semi-automatic grinding device, which can not only improve the grinding efficiency, but also improve the grinding quality.

Another object of the present invention is to provide a semi-automatic grinding method.

To achieve the above object, the present invention provides the following technical solutions:

A semi-automatic grinding device, comprising a semi-automatic grinding device body, a grinding mechanism and a driving mechanism, wherein the grinding mechanism is placed in the semi-automatic grinding device body, and the grinding mechanism can grind a to-be-grinding material block, and the driving mechanism and the The grinding mechanism is connected, and the driving mechanism can drive the grinding mechanism to rotate, so that the grinding mechanism rubs against the material block to be ground, so as to realize the grinding of the material block to be ground.

Preferably, the grinding mechanism includes a grinding wheel and a rotating rod connected to the grinding wheel, and the material block to be ground is placed in the inner cavity of the grinding wheel and is in contact with the inner wall of the grinding wheel.

Preferably, the inner cavity of the grinding wheel is a cone-shaped cavity, and the material block to be ground is a cone-shaped structure that mirrors the inner cavity of the grinding wheel.

Preferably, the drive mechanism includes a drive motor, a first pulley, a second pulley and a belt, the first pulley is connected to a motor shaft of the drive motor, the second pulley is connected to the rotating rod, the The first pulley and the second pulley are connected by the belt.

Preferably, a first bearing and a second bearing are further arranged between the first pulley and the grinding wheel, and both the first bearing and the second bearing are arranged on the rotating rod.

Preferably, it also includes a cover body disposed on the semi-automatic polishing device body, a cover body guide rail is provided on the semi-automatic polishing device body, and the cover body is matched with the cover body guide rail.

Preferably, it also includes a screw rod and a fixing block connected with the screw rod, the fixing block is placed between the grinding wheel and the cover body, and the screw rod can drive the fixing block to move in the vertical direction.

Preferably, the inner cavity of the semi-automatic polishing device body is further provided with a first partition plate and a second partition plate, and the first partition plate and the second partition plate divide the semi-automatic polishing device body into a first cavity chamber, a second chamber and a third chamber;

The drive motor and the first pulley are all disposed in the first chamber, the second pulley, the first bearing and the second bearing are all disposed in the second chamber, and the grinding wheel arranged in the third chamber;

The first partition is provided with a first through hole for the belt to pass through, and the second partition is provided with a second through hole for the rotation rod to pass through.

Preferably, the body of the semi-automatic polishing device is also provided with a liquid inlet for the entry of cooling liquid and a liquid discharge port for the discharge of the cooling liquid, and the liquid inlet and the liquid discharge port are both arranged in the on the side wall of the second chamber.

A semi-automatic grinding method, applied to the semi-automatic grinding device as described in any of the above, comprises the following steps:

S100: Install the material block to be ground in the grinding wheel of the semi-automatic grinding device, so that the material block to be ground and the inner wall of the inner cavity of the grinding wheel are abutted;

S200: Turn on the drive mechanism, control the rotational speed of the drive mechanism to be 100r/min-200r/min, control the rotation time of the drive mechanism to be 10min-40min, and open the cooling water source at the same time, so that the cooling water flows into the semi-automatic grinding device cooling the grinding wheel in the second chamber of the body;

S300: After the grinding of the material block to be ground is completed, the driving mechanism and the cooling water source are turned off, and when the grinding wheel stops rotating, the material block to be ground is removed.

It can be seen from the above technical solutions that when grinding the material block to be ground, the drive mechanism needs to be turned on, the driving mechanism rotates, and the grinding mechanism is driven to rotate. Grinding the to-be-ground material block, so that the to-be-ground material block becomes a preset shape structure. Compared with the prior art, grinding the material block to be ground by the semi-automatic grinding device can not only improve the grinding efficiency, but also improve the uniformity of the surface roughness of the material block, thereby further improving the grinding quality.

Description of drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only It is an embodiment of the present invention. For those of ordinary skill in the art, other drawings can also be obtained according to the provided drawings without creative work.

1 is a schematic structural diagram of a semi-automatic grinding device disclosed in an embodiment of the present invention;

FIG. 2 is a schematic flowchart of a semi-automatic grinding method disclosed in an embodiment of the present invention.

Among them, the names of the parts are as follows:

100 is the semi-automatic grinding device body, 101 is the first partition, 1011 is the first through hole, 1012 is the second through hole, 102 is the second partition, 103 is the first chamber, 104 is the second chamber, 1041 is the drain port, 105 is the third chamber, 200 is the grinding mechanism, 201 is the grinding wheel, 202 is the rotating rod, 300 is the cover, 400 is the driving mechanism, 401 is the driving motor, 402 is the first pulley, and 403 is the first pulley. Two pulleys, 404 is a belt, 500 is a first bearing, 600 is a second bearing, 700 is a screw, 701 is a handle, 800 is a fixed block, and 900 is a material block to be polished.

Detailed ways

In view of this, the core of the present invention is to provide a semi-automatic grinding device, which can not only improve the grinding efficiency, but also improve the grinding quality.

Another core of the present invention is to provide a semi-automatic grinding method.

In order to make those skilled in the art better understand the solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

Referring to FIG. 1 , the semi-automatic grinding device disclosed in the embodiment of the present invention includes a semi-automatic grinding device body 100 , a grinding mechanism 200 and a driving mechanism 400 , wherein the grinding mechanism 200 is placed in the semi-automatic grinding device body 100 , and the grinding mechanism 200 can When grinding the material block 900 to be ground, the driving mechanism 400 is connected to the grinding mechanism 200, and the driving mechanism 400 can drive the grinding mechanism 200 to rotate, so that the grinding mechanism 200 rubs against the material block 900 to be ground, so as to realize the grinding of the material block 900 to be ground.

When grinding the material block 900 to be ground, the driving mechanism 400 needs to be turned on, the driving mechanism 400 rotates to drive the grinding mechanism 200 to rotate, and the grinding mechanism 200 continuously rubs against the material block 900 to be ground during the rotation of the grinding mechanism 200, so as to realize the grinding process. The material block 900 is ground, so that the material block 900 to be ground becomes a preset shape structure. Compared with the prior art, grinding the block 900 to be ground by the semi-automatic grinding device can not only improve the grinding efficiency, but also improve the uniformity of the surface roughness of the block, thereby further improving the grinding quality.

The embodiment of the present invention does not limit the specific structure of the grinding mechanism 200, as long as the structure that meets the use requirements of the present invention is within the protection scope of the present invention.

As a preferred embodiment, in the semi-automatic grinding device disclosed in the embodiment of the present invention, the grinding mechanism 200 includes a grinding wheel 201 for placing the material block 900 to be ground, and a rotating rod 202 connected to the grinding wheel 201, wherein the material block 900 to be ground is It is placed in the inner cavity of the grinding wheel 201 and is in contact with the inner wall of the grinding wheel 201 . During the rotation of the grinding wheel 201, the grinding material block 900 can be ground.

The embodiment of the present invention does not limit the specific structure and shape of the inner cavity of the grinding wheel. The inner cavity of the grinding wheel can be a rectangular structure, a cone-shaped structure, and of course other structures, as long as the structures that meet the use requirements of the present invention are all in within the protection scope of the present invention.

Wherein, the different shapes and structures of the inner cavity of the grinding wheel need to be ground for the material block 900 to be ground which is adapted to its shape.

Preferably, the inner cavity of the grinding wheel 201 disclosed in the embodiment of the present invention is a cone-shaped cavity, and the material block 900 to be ground is a cone-shaped structure simulating the inner cavity of the grinding wheel 201 .

The embodiment of the present invention does not limit the specific structure of the driving mechanism 400, as long as the structure that meets the use requirements of the present invention is within the protection scope of the present invention.

As a preferred embodiment, the drive mechanism 400 disclosed in the embodiment of the present invention includes a drive motor 401, a first pulley 402, a second pulley 403, and a belt 404. The first pulley 402 is connected to the motor shaft of the drive motor 401, and the second pulley 403 Connected to the rotating rod 202 , the first pulley 402 and the second pulley 403 are connected by a belt 404 .

Start the drive motor 401, the motor shaft of the drive motor 401 rotates, and drives the first pulley 402 to rotate, the first pulley 402 drives the second pulley 403 to rotate through the belt 404, the second pulley 403 drives the rotating rod 202 to rotate, and the rotating rod 202 drives the grinding wheel 201 During the rotation, the grinding wheel 201 rubs with the material block 900 to be ground, so as to realize the grinding of the material block 900 to be ground.

In order to ensure that the rotating rod 202 can rotate smoothly, in the semi-automatic grinding device disclosed in the embodiment of the present invention, a first bearing 500 and a second bearing 600 are further provided between the first pulley 402 and the grinding wheel 201 , wherein the first bearing 500 and the second bearing 600 are both disposed on the rotating rod 202 .

As a preferred embodiment, the semi-automatic grinding device disclosed in the embodiment of the present invention further includes a cover body 300 disposed on the semi-automatic grinding device body 100 , the semi-automatic grinding device body 100 is provided with a cover body guide rail, and the cover body 300 is connected with the cover body guide rail. Cooperate. In this way, the cover body 300 can be sealed with the semi-automatic sanding device body 100 through the cover guide rail.

In order to limit the position of the material block 900 to be ground, the semi-automatic grinding device disclosed in the embodiment of the present invention further includes a screw 700 and a fixed block 800 connected to the screw 700 , wherein the fixed block 800 is placed on the grinding wheel 201 and the cover 300 In between, the screw 700 can drive the fixed block 900 to move in the vertical direction.

It should be noted that the cover body 300 is provided with a threaded hole, and the screw 700 is matched with the threaded hole. When the screw 700 is rotated clockwise, the screw 700 drives the fixing block 800 to move toward the direction of the material block 900 to be polished gradually until it matches the The material block 800 to be ground is in contact, and under the action of the screw 700 and the fixing block 800, the material block 900 to be ground can be attached to the inner wall of the inner cavity of the grinding wheel 201. In this way, the grinding wheel 201 can treat the grinding material block during the rotation process. 900 realizes grinding; when the screw 700 is rotated counterclockwise, the screw 700 drives the fixed block 800 to move away from the material block 800 to be ground, so as to separate the fixed block 800 from the material block 900 to be ground.

It should be noted that the degree of fit between the material block 900 to be ground and the grinding wheel 201 cannot be too tight or too loose, so as to ensure that the grinding wheel 201 is in contact with the material block 900 to be ground, and the grinding wheel 201 can be rotated to realize the material block 900 to be ground. can be polished.

The specific structure of the fixing block 800 is not limited in the embodiment of the present invention. The fixing block 800 may be metal, plastic, or rubber, as long as the structure that meets the usage requirements of the present invention is within the protection scope of the present invention.

As a preferred embodiment, the fixing block 800 disclosed in the embodiment of the present invention is preferably a rubber block. Due to the elastic effect of the rubber block, damage to the material block 900 to be polished can be avoided.

As a preferred embodiment of the present invention, in the semi-automatic grinding device disclosed in the embodiment of the present invention, the inner cavity of the semi-automatic grinding device body 100 is further provided with a first partition plate 101 and a second partition plate 102, wherein the first partition plate 101 and The second partition 102 partitions the semi-automatic sanding device body 100 into a first chamber 103 , a second chamber 104 and a third chamber 105 .

The driving motor 401 and the first pulley 402 are all arranged in the first chamber 103, the second pulley 403, the first bearing 500 and the second bearing 600 are all arranged in the second chamber 104, and the grinding wheel 201 is arranged in the third chamber 104. Inside the chamber 105 ; the first partition plate 101 is provided with a first through hole 1011 for the belt 404 to pass through, and the second partition plate 102 is provided with a second through hole 1012 for the rotating rod 202 to pass through.

During the grinding process of the grinding wheel 201, the temperature will rise. In order to ensure the normal operation of the grinding wheel 201, the body 100 of the semi-automatic grinding device disclosed in the embodiment of the present invention is further provided with a liquid inlet for cooling liquid to enter, and a liquid inlet for cooling The liquid discharge port 1041 for liquid discharge, wherein the liquid inlet port and the liquid discharge port 1041 are both arranged on the side wall of the second chamber 104. The cooling of the grinding wheel 201 by the cooling liquid can ensure the normal operation of the grinding wheel 201, and further improve the The service life of the grinding wheel 201.

Of course, since the liquid inlet and the liquid discharge port 1041 are only arranged on the side wall of the second chamber 104, the cooling liquid only flows in the second chamber 104, and will not affect the driving mechanism 400, the first bearing 500 and the The second bearing 600 and the like are affected.

Please refer to FIG. 2 , an embodiment of the present invention also discloses a semi-automatic grinding method, which is applied to the semi-automatic grinding device disclosed in any of the above-mentioned embodiments, and includes the following steps:

S100: Install the material block 900 to be ground in the grinding wheel 201 of the semi-automatic grinding device, so that the material block 900 to be ground is in contact with the inner wall of the inner cavity of the grinding wheel 201;

S200: Turn on the driving mechanism 400, control the rotational speed of the driving mechanism 400 to be 100 r/min to 200 r/min, control the rotation time of the driving mechanism 400 to be 10 min-40 min, and simultaneously turn on the cooling water source, so that the cooling water flows into the main body 100 of the semi-automatic grinding device. The grinding wheel 201 is cooled in the second chamber 104 .

S300: After the grinding of the material block 900 to be ground is completed, the driving mechanism 400 and the cooling water source are turned off, and when the grinding wheel 201 stops rotating, the material block 900 to be ground is removed to complete the grinding.

When grinding the material block 900 to be ground, first install the material block 900 to be ground in the grinding wheel 201 of the semi-automatic grinding device, so that the material block 900 to be ground and the inner wall of the inner cavity of the grinding wheel 201 are abutted; then the driving mechanism 400 is turned on , control the rotational speed of the drive mechanism 400 to be 100r/min～200r/min, control the rotation time of the drive mechanism 400 to be 10min-40min, and turn on the cooling water source at the same time, so that the cooling water passes into the second chamber of the semi-automatic grinding device body 100 to The grinding wheel 201 is cooled; when the grinding of the material block 900 to be ground is completed, the driving mechanism 400 and the cooling water source are turned off, and when the grinding wheel 201 stops rotating, the material block 900 to be ground is removed. Compared with the prior art, grinding the material block 900 to be ground by the above-mentioned semi-automatic grinding method can not only improve the grinding efficiency, but also improve the uniformity of the surface roughness of the material block, thereby further improving the grinding quality.

The material block to be polished may be a semiconductor crystal such as gallium arsenide and indium phosphide, and the specific material thereof is not limited in the embodiment of the present invention.

It should be noted that, when the material block 900 to be ground is a cone-shaped material block, the tolerance of the diameter of the upper end face and the lower end face of the material block 900 to be ground is preferably set to φ±1 mm.

The following is a data comparison and analysis chart of manual grinding and semi-automatic grinding device grinding of three specifications of GaAs cone-shaped blocks:

Example 1

Embodiment 2

Embodiment 3

After comparing the data collected by the specific embodiment, the semi-automatic grinding method of the semiconductor tapered block disclosed in the embodiment of the present invention is at least 7 times more efficient than the manual grinding method using sandpaper, and the surface roughness uniformity of the tapered block after grinding is far better. Much better than hand sanding.

In the description of this application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the indicated device or element must have a specific orientation or a specific orientation. construction and operation, and therefore should not be construed as limitations on this application. Furthermore, the terms "first", "second", and "third" are used for descriptive purposes only and should not be construed to indicate or imply relative importance.

Unless otherwise expressly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection, It can also be an electrical connection; it can be a direct connection, an indirect connection through an intermediate medium, or an internal connection between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood in specific situations.

The above description of the disclosed embodiments enables any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (10)

1. a semi-automatic grinding device is characterized in that, comprises a semi-automatic grinding device body, a grinding mechanism and a drive mechanism, the grinding mechanism is placed in the semi-automatic grinding device body, and the grinding mechanism can be polished to the grinding block. , the driving mechanism is connected with the grinding mechanism, and the driving mechanism can drive the grinding mechanism to rotate, so that the grinding mechanism rubs with the material block to be ground, so as to realize the grinding of the material block to be ground. 2 . The semi-automatic grinding device according to claim 1 , wherein the grinding mechanism comprises a grinding wheel and a rotating rod connected with the grinding wheel, and the material block to be ground is placed in the inner cavity of the grinding wheel, and 2 . in contact with the inner wall of the grinding wheel. 3 . The semi-automatic grinding device according to claim 2 , wherein the inner cavity of the grinding wheel is a cone-shaped cavity, and the material block to be ground is a cone-shaped structure that follows the inner cavity of the grinding wheel. 4 . 4. The semi-automatic grinding device according to claim 2, wherein the drive mechanism comprises a drive motor, a first pulley, a second pulley and a belt, and the first pulley is connected to a motor shaft of the drive motor, The second pulley is connected with the rotating rod, and the first pulley and the second pulley are connected through the belt. 5. The semi-automatic grinding device according to claim 4, wherein a first bearing and a second bearing are further arranged between the first pulley and the grinding wheel, and the first bearing and the second bearing All are arranged on the rotating rod. 6 . The semi-automatic polishing device according to claim 1 , further comprising a cover body disposed on the body of the semi-automatic polishing device, the body of the semi-automatic polishing device is provided with a cover guide rail, and the cover body is connected to the body of the semi-automatic polishing device. The cover guide rails are matched with each other. 7 . The semi-automatic grinding device according to claim 6 , further comprising a screw rod and a fixing block connected with the screw rod, the fixing block being placed between the grinding wheel and the cover body, and the The screw can drive the fixed block to move in the vertical direction. 8 . The semi-automatic polishing device according to claim 5 , wherein the inner cavity of the semi-automatic polishing device body is further provided with a first partition plate and a second partition plate, the first partition plate and the second partition plate A partition divides the semi-automatic sanding device body into a first chamber, a second chamber and a third chamber; The drive motor and the first pulley are all disposed in the first chamber, the second pulley, the first bearing and the second bearing are all disposed in the second chamber, and the grinding wheel arranged in the third chamber; The first partition is provided with a first through hole for the belt to pass through, and the second partition is provided with a second through hole for the rotation rod to pass through. 9 . The semi-automatic grinding device according to claim 8 , wherein the semi-automatic grinding device body is further provided with a liquid inlet for the entry of cooling liquid and a liquid discharge port for the discharge of the cooling liquid, so the Both the liquid inlet port and the liquid discharge port are arranged on the side wall of the second chamber. 10. A semi-automatic grinding method, applied to the semi-automatic grinding device as claimed in any one of claims 1-9, characterized in that, comprising the following steps: S100: install the material block to be ground in the grinding wheel of the semi-automatic grinding device, so that the material block to be ground and the inner wall of the inner cavity of the grinding wheel fit together; S200: Turn on the drive mechanism, control the rotational speed of the drive mechanism to be 100r/min-200r/min, control the rotation time of the drive mechanism to be 10min-40min, and open the cooling water source at the same time, so that the cooling water flows into the semi-automatic grinding device cooling the grinding wheel in the second chamber of the body; S300: After the grinding of the material block to be ground is completed, the driving mechanism and the cooling water source are turned off, and when the grinding wheel stops rotating, the material block to be ground is removed.

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