CN114751009B - Automatic laminating packaging equipment for chip processing - Google Patents
Automatic laminating packaging equipment for chip processing Download PDFInfo
- Publication number
- CN114751009B CN114751009B CN202210670721.8A CN202210670721A CN114751009B CN 114751009 B CN114751009 B CN 114751009B CN 202210670721 A CN202210670721 A CN 202210670721A CN 114751009 B CN114751009 B CN 114751009B
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- Prior art keywords
- film
- sliding
- motor
- driving
- stretching
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 15
- 238000010030 laminating Methods 0.000 title claims description 25
- 238000003825 pressing Methods 0.000 claims abstract description 73
- 238000005520 cutting process Methods 0.000 claims abstract description 52
- 239000007888 film coating Substances 0.000 claims abstract description 33
- 238000009501 film coating Methods 0.000 claims abstract description 33
- 238000003860 storage Methods 0.000 claims abstract description 7
- 238000007599 discharging Methods 0.000 claims abstract description 5
- 210000003128 head Anatomy 0.000 claims description 38
- 230000006835 compression Effects 0.000 claims description 14
- 238000007906 compression Methods 0.000 claims description 14
- 210000002489 tectorial membrane Anatomy 0.000 claims description 11
- 238000005538 encapsulation Methods 0.000 claims description 3
- 239000002994 raw material Substances 0.000 abstract description 26
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 188
- 239000000463 material Substances 0.000 description 52
- 238000003892 spreading Methods 0.000 description 31
- 239000012528 membrane Substances 0.000 description 20
- 238000009434 installation Methods 0.000 description 5
- 230000037303 wrinkles Effects 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B33/00—Packaging articles by applying removable, e.g. strippable, coatings
- B65B33/02—Packaging small articles, e.g. spare parts for machines or engines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65B—MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING
- B65B61/00—Auxiliary devices, not otherwise provided for, for operating on sheets, blanks, webs, binding material, containers or packages
- B65B61/005—Auxiliary devices, not otherwise provided for, for operating on sheets, blanks, webs, binding material, containers or packages for removing material by cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Basic Packing Technique (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
Abstract
The invention provides automatic film coating and packaging equipment for chip processing, which relates to the technical field of automatic film coating and comprises an equipment workbench, wherein one end of the equipment workbench is provided with a film discharging machine for outputting a film, the other end of the equipment workbench is provided with a film collecting machine for recovering the edge of the residual film, a film coating propping assembly and a film coating pressing assembly are respectively arranged between two first electric sliding rails in a sliding manner, the lower end of the output end of a lifting motor is fixedly connected with a film cutting motor, the output shaft of the film cutting motor is coaxially and fixedly connected with a film cutting rotating head, and the side surface of the film cutting rotating head is fixedly connected with a film cutting rotating arm; according to the invention, the wafer raw material in the chip storage cabinet is started to drive the chip feeding arm at the front end to take out the wafer raw material, then the feeding electric push rod drives the chip feeding arm at the front end to place the wafer on one chip processing round table, and the feeding electric push rod drives the chip feeding arm at the front end to take out the wafer raw material which is finished by coating on the other chip processing round table.
Description
Technical Field
The invention relates to the technical field of automatic film coating, in particular to automatic film coating and packaging equipment for chip processing.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular; various circuit device structures can be fabricated on a silicon wafer to form an IC product with specific electrical functions. The starting material for the wafer is silicon, while the crust surface has an inexhaustible amount of silicon dioxide. The silicon dioxide ore is refined by an electric arc furnace, chloridized by hydrochloric acid and distilled to prepare high-purity polysilicon.
And in chip processing, need cut the wafer, and need carry out the tectorial membrane encapsulation to wafer circuit one side before the cutting, protect, and present wafer tectorial membrane equipment is after the cutting to last wafer tectorial membrane, the membrane material is because the centre is amputated, lead to the centre to appear the fretwork, and when the membrane material conveying, because under tightening and centre fretwork state, when the transfer roller acted on the incomplete material both sides edge of fretwork, do not have the restriction of middle membrane material, will draw in to the centre, thereby produce the fold, be difficult for to next wafer tectorial membrane.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides automatic film covering and packaging equipment for chip processing, which solves the problems that in the existing chip processing, a wafer needs to be cut, one surface of a wafer circuit needs to be covered and packaged before cutting for protection, after the existing wafer film covering equipment is used for covering and cutting the previous wafer, a film material is cut in the middle to form hollow parts, and when the film material is conveyed, the conveying rollers are not limited by the middle film material when the conveying rollers act on the two side edges of the hollow-out residual material under the tightened and middle hollow-out state, the film material can be folded in the middle to generate wrinkles, so that the next wafer is not easy to be covered with films.
In order to achieve the purpose, the invention is realized by the following technical scheme: the utility model provides an automatic tectorial membrane encapsulation equipment of chip processing, includes the equipment workstation, equipment workstation one end is provided with the play membrane machine that is used for exporting the membrane, the equipment workstation other end is provided with the receipts membrane machine that is used for retrieving surplus membrane limit, the equal fixed mounting of both sides inner wall has first electronic slide rail, two around the equipment workstation slide respectively between the electronic slide rail and slide and be provided with the tectorial membrane and strut the subassembly and the tectorial membrane is held up the pressure subassembly, equipment workstation upper end fixed mounting has two membrane to cut the support frame, two support frame upper end fixed mounting is cut to the membrane has the membrane installation base, installation base one end fixed mounting is cut to the membrane has elevator motor, elevator motor's output lower extreme fixedly connected with membrane cuts the motor, coaxial fixedly connected with membrane cuts the rotating head on the output shaft of membrane cuts the motor, the rotatory arm is cut to membrane side fixedly connected with membrane, rotatory arm one end downside fixed mounting is cut to the membrane has the membrane cutter piece.
Preferably, the front end of the equipment workbench is provided with a rotary lifting platform, a feeding arm base is fixedly mounted at the upper end of the output end of the rotary lifting platform, a feeding arm sliding seat is fixedly mounted at the upper end of the feeding arm base, a feeding electric push rod is fixedly mounted on one side of the feeding arm sliding seat, and the output end of the feeding electric push rod is fixedly connected with a chip feeding arm.
Preferably, one end of the rotary lifting platform is provided with a chip storage cabinet, and the other end of the rotary lifting platform is provided with a PLC (programmable logic controller);
a second electric slide rail is fixedly arranged at the rear end of the equipment workbench and at the lower end of one first electric slide rail, an electric telescopic base is arranged on the second electric slide rail in a sliding manner, and the output end of the electric telescopic base is fixedly connected with a transfer support arm;
and two chip processing circular truncated cones are arranged on the inner wall of the bottom of the equipment workbench.
Preferably, the cover film spreading assembly comprises: the film laminating machine comprises a support component frame, a first film laminating motor, a support driving rotating shaft, a film clamping driving convex circle, a first spring, a film clamping driving head, a support pressing rod, a support driving cylinder and a support rod;
a spreading assembly frame is slidably mounted between the two first electric slide rails, two first film-coating motor frames are fixedly mounted at the upper end of the spreading assembly frame, a first film-coating motor is fixedly mounted at the outer side of one of the first film-coating motor frames, a spreading driving rotating shaft is coaxially and fixedly connected between the output shaft of the first film-coating motor and the two first film-coating motor frames, and a film clamping driving convex circle is integrally arranged on the spreading driving rotating shaft;
a first spring is fixedly arranged on the surface of the upper end of the spreading assembly frame and positioned right below the film clamping driving convex circle, a film clamping driving head is arranged in the first spring in a sliding manner, and a spreading pressing rod is fixedly connected to the lower end of the film clamping driving head;
the surface of the outer side of each of the two ends of the opening component frame is fixedly provided with an opening driving cylinder, and an opening rod is arranged between the output ends of the opening driving cylinders.
Preferably, the clamping membrane driving convex circle is an ellipse.
Preferably, the distraction compression bar is located between the distraction assembly frame and the distraction rod.
Preferably, the opening lever includes: the device comprises a spreading rod bearing, a driving cylinder connecting rod, a spreading sliding roller, a spreading sliding rod, a limiting sliding strip, a spreading main roller, a spreading sliding groove and a limiting sliding groove;
the output ends of the two expanding driving cylinders are fixedly connected with driving cylinder connecting rods, one ends of the two driving cylinder connecting rods are provided with expanding rod bearings, inner rings of the two expanding rod bearings are fixedly connected with expanding sliding rollers, the inner ends of the two expanding sliding rollers are coaxially and fixedly connected with expanding sliding rods, and the side surfaces of the two expanding sliding rods are uniformly provided with limiting sliding strips;
two it struts the home roll to be provided with between the sliding roller to strut, strut the home roll both ends and all seted up the sliding tray that struts, two strut the sliding tray inner wall and all seted up spacing sliding tray.
Preferably, the distraction sliding rod is arranged in the distraction sliding groove in a sliding manner, and the limit sliding strip is arranged in the limit sliding groove in a sliding manner.
Preferably, the film-coated press supporting assembly comprises: the film laminating machine comprises a pressing component frame, a second film laminating motor, a pressing driving rotating shaft, a pressing driving flange, a second spring, a pressing driving head, a pressing roller pressing rod and a pressing roller;
a pressure supporting component frame is slidably mounted between the two first electric sliding rails, two second film-coated motor frames are fixedly mounted at the upper end of the pressure supporting component frame, a second film-coated motor is fixedly mounted on the surface of the outer side of one of the second film-coated motor frames, a pressure supporting driving rotating shaft is coaxially and fixedly connected onto an output shaft of the second film-coated motor and positioned between the two second film-coated motor frames, and a pressure supporting driving flange is fixedly connected onto the pressure supporting driving rotating shaft;
a second spring is fixedly arranged at the upper end of the pressure supporting component frame and under the pressure supporting driving flange, a pressure supporting driving head is arranged in the second spring in a sliding manner, and a pressure supporting roller pressing rod is fixedly connected to the lower end of the pressure supporting driving head;
the lower end of the pressure supporting component frame is positioned below the pressure supporting roller pressing rod and is rotatably provided with a pressure supporting roller.
Preferably, the rail drive flange is elliptical.
The invention provides automatic film-covering packaging equipment for chip processing. The method has the following beneficial effects:
according to the invention, wafer raw materials in a chip storage cabinet are lifted and rotated by rotating a feeding arm base at the upper end of a lifting table, a sliding seat of a feeding arm is lifted to a corresponding height, a feeding electric push rod is started to drive a chip feeding arm at the front end to take out the wafer raw materials and integrally rotate, then the feeding electric push rod drives the chip feeding arm at the front end to place a wafer on one chip processing circular table, and the feeding electric push rod drives the chip feeding arm at the front end to take out the wafer raw materials finished by coating on the other chip processing circular table;
the electric telescopic base is driven to move by the second electric slide rail, the front end of the electric telescopic base is driven by the electric telescopic base to transfer a newly fed raw material to the chip processing round table of the film covering area, the chip processing round table is lifted and is in contact with the film material above, and the film covering pressing component is driven by the first electric slide rail to press the upper end of the film material, so that the film covering is firmer;
the film cutting motor is lowered through the lifting motor at the upper end to drive the film cutting rotating head to rotate, so that the film cutting blade at one side rotates to cut along the edge of the wafer raw material, then the film covering and unfolding assembly is driven to move through the first electric sliding rail, the edge of the cut film material is taken up firstly, the film material at the center is left on the wafer raw material, the film covering and unfolding assembly is driven to return again to move the cut film material, and after the movement is finished, the internal structure of the film covering and unfolding assembly is started to clamp the hollowed film material to stretch outwards, so that wrinkles are prevented;
the film spreading driving device comprises a film spreading driving assembly, a film spreading driving motor, a film clamping driving head, a first spring, a film spreading pressing rod, a film spreading cylinder and a film spreading driving cylinder, wherein the spreading driving motor in the film spreading assembly drives the rotating shaft to rotate, the elliptical film clamping driving head on the film spreading driving motor drives the protruding circle to rotate, the film clamping driving head at the lower end is pushed to compress the first spring, so that a film material between the spreading pressing rod and the spreading rod can be downwards clamped by the spreading pressing rod at the lower end, and the movement of the spreading rod can be driven by the spreading driving cylinder;
the two sides of the hollow-out membrane material can be clamped with the opening compression rod at the upper end through the opening sliding roller and the opening main roller in the opening rod;
wherein, hold up the compression roller through the tectorial membrane in pressing the subassembly, will be attached to compress tightly the laminating material on the wafer raw materials and paste in reality, can accomplish through the second tectorial membrane motor of upper end and strut the same operation in the subassembly with the tectorial membrane to can control the rotation of holding up the compression roller and fix.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of another embodiment of the present invention;
FIG. 3 is an enlarged view of the structure of FIG. 2 at A according to the present invention;
FIG. 4 is a schematic structural view of the film spreading assembly of the present invention;
FIG. 5 is a partial schematic view of a first spring according to the present invention;
FIG. 6 is a schematic structural view of the film clamping driving head and the spreading compression bar of the present invention;
FIG. 7 is a schematic view of the structure of the spreader bar of the present invention;
FIG. 8 is a side view of the spreader bar of the present invention;
FIG. 9 is a cross-sectional view taken along line a-a of FIG. 8 according to the present invention;
FIG. 10 is a schematic structural view of a film-coated pressure maintaining assembly according to the present invention;
FIG. 11 is a partial schematic view of a second spring according to the present invention;
FIG. 12 is a schematic structural view of the pressing driving head and pressing rod of the pressing roller.
Wherein, 1, an equipment workbench; 2. discharging the film machine; 3. a film collecting machine; 4. a first motorized slide rail; 5. a film-covering distraction assembly; 501. a distraction assembly frame; 502. a first film-coated motor frame; 503. a first film-covered motor; 504. the rotating shaft is driven to be unfolded; 505. clamping the film to drive the convex circle; 506. a first spring; 507. a film clamping driving head; 508. the pressure lever is opened; 509. the driving cylinder is propped open; 510. an opening lever; 5101. a strut bearing; 5102. a driving cylinder connecting rod; 5103. spreading the sliding roller; 5104. the sliding rod is propped open; 5105. a limiting sliding strip; 5106. opening the main roller; 5107. opening the sliding groove; 5108. a limiting sliding groove; 6. laminating and supporting the pressing component; 601. a rail assembly frame; 602. a second film-coated motor frame; 603. a second film-covered motor; 604. the centralizing pressure drives the rotating shaft; 605. centralizing and pressing the driving flange; 606. a second spring; 607. supporting and pressing the driving head; 608. a pressure supporting roller; 609. supporting and pressing the roller; 7. a second motorized slide rail; 8. an electric telescopic base; 9. transferring the supporting arm; 10. rotating the lifting platform; 11. a chip storage cabinet; 12. a PLC controller; 13. a feed arm base; 14. a feed arm sliding seat; 15. a feeding electric push rod; 16. a chip feed arm; 17. a film cutting support frame; 18. a film cutting installation base; 19. a lifting motor; 20. a film cutting motor; 21. rotating the head by film cutting; 22. a rotary arm for film cutting; 23. a film cutting blade; 24. and the chip processing round platform.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 to 3, an embodiment of the invention provides an automatic film laminating and packaging device for chip processing, which includes a device workbench 1, wherein one end of the device workbench 1 is provided with a film discharging machine 2 for outputting a film, the other end of the device workbench 1 is provided with a film collecting machine 3 for recovering a residual film edge, inner walls of front and rear sides of the device workbench 1 are fixedly provided with first electric slide rails 4, a film laminating spreading assembly 5 and a film laminating supporting and pressing assembly 6 are respectively arranged between the two first electric slide rails 4 in a sliding manner, the upper end of the device workbench 1 is fixedly provided with two film cutting support frames 17, the upper ends of the two film cutting support frames 17 are fixedly provided with a film cutting installation base 18, one end of the film cutting installation base 18 is fixedly provided with a lifting motor 19, the lower end of an output end of the lifting motor 19 is fixedly connected with a film cutting motor 20, an output shaft of the film cutting motor 20 is coaxially and fixedly connected with a film cutting rotating head 21, the side of the film cutting rotating head 21 is fixedly connected with a film cutting rotating arm 22, one end of the film cutting rotating arm 22 is fixedly provided with a film cutting blade 23, the lower end of the film cutting rotating arm 22 is provided with a lifting platform 10, the output end of the rotating platform 10 is fixedly connected with a lifting arm 14, the lifting arm is provided with a feeding arm, one end of the PLC arm is provided with a feeding arm 14, the lifting arm is provided with a feeding arm, and a feeding arm 14, one side of the feeding arm is provided with a feeding arm rotating arm 14, and a feeding arm rotating arm is provided with a feeding arm rotating control base 14; a second electric slide rail 7 is fixedly arranged at the rear end of the equipment workbench 1 and at the lower end of one first electric slide rail 4, an electric telescopic base 8 is arranged on the second electric slide rail 7 in a sliding manner, and the output end of the electric telescopic base 8 is fixedly connected with a transfer support arm 9; two chip processing round tables 24 are arranged on the inner wall of the bottom of the equipment workbench 1.
According to the technical scheme, the wafer raw material in the chip storage cabinet 11 is lifted and rotated by driving the feeding arm base 13 at the upper end to rotate through the rotary lifting platform 10, the feeding arm sliding seat 14 is lifted to a corresponding height, the feeding electric push rod 15 is started to drive the chip feeding arm 16 at the front end to take out the wafer raw material and integrally rotate, then the feeding electric push rod 15 drives the chip feeding arm 16 at the front end to place the wafer on one of the chip processing round tables 24, and the feeding electric push rod 15 drives the chip feeding arm 16 at the front end to take out the wafer raw material which is coated on the other chip processing round table 24;
the second electric slide rail 7 drives the electric telescopic base 8 to move, the electric telescopic base 8 drives the transfer supporting arm 9 at the front end, a newly fed raw material is transferred onto the chip processing circular table 24 of the film covering area, the chip processing circular table 24 is lifted and is in contact with the upper film material, and the first electric slide rail 4 firstly drives the film covering and pressing component 6 to press the upper end of the film material, so that the film covering is firmer;
then, the film cutting motor 20 is lowered through the lifting motor 19 at the upper end to drive the film cutting rotating head 21 to rotate, the film cutting blade 23 on one side is made to rotate to cut along the edge of the wafer raw material, then the film covering and opening assembly 5 is driven to move through the first electric slide rail 4, the edge of the cut film material is taken up firstly, the film material in the center is left on the wafer raw material, the film covering and opening assembly 5 is driven to return again to move the cut film material, and after the movement is finished, the internal structure of the film covering and opening assembly 5 is started to clamp the hollowed film material to be tightened outwards, so that wrinkles are prevented from being generated.
As shown in fig. 1, 4 to 6, the film spreading assembly 5 includes: the film-clamping device comprises a propping component frame 501, a first film-coating motor frame 502, a first film-coating motor 503, a propping driving rotating shaft 504, a film-clamping driving convex circle 505, a first spring 506, a film-clamping driving head 507, a propping compression rod 508, a propping driving cylinder 509 and a propping rod 510; a stretching assembly frame 501 is slidably mounted between the two first electric sliding rails 4, two first film-coating motor frames 502 are fixedly mounted at the upper end of the stretching assembly frame 501, a first film-coating motor 503 is fixedly mounted on the outer side of one of the first film-coating motor frames 502, a stretching driving rotating shaft 504 is coaxially and fixedly connected between the output shaft of the first film-coating motor 503 and the two first film-coating motor frames 502, and a film clamping driving convex circle 505 is integrally arranged on the stretching driving rotating shaft 504; a first spring 506 is fixedly installed on the upper end surface of the opening assembly frame 501 and located right below the film clamping driving convex circle 505, a film clamping driving head 507 is arranged in the first spring 506 in a sliding manner, an opening compression rod 508 is fixedly connected to the lower end of the film clamping driving head 507, the opening driving rotating shaft 504 is driven to rotate by a first film coating motor 503 in the film coating opening assembly 5, the elliptical film clamping driving convex circle 505 on the opening driving rotating shaft is made to rotate, the lower film clamping driving head 507 is pushed to compress the first spring 506, so that a film material between the opening compression rod 510 and the opening compression rod 508 at the lower end can be clamped downwards, and after the film clamping operation process is completed, the compressed first spring 506 rebounds to enable the film clamping driving head 507 to drive the opening compression rod 508 to reset;
the outer side surfaces of two ends of the opening component frame 501 are fixedly provided with opening driving cylinders 509, two opening rods 510 are arranged between output ends of the opening driving cylinders 509, the film clamping driving convex circles 505 are oval, and the opening pressing rods 508 are located between the opening component frame 501 and the opening rods 510.
As shown in fig. 4, 7 to 9, the spreader lever 510 includes: a supporting rod bearing 5101, a driving cylinder connecting rod 5102, a supporting sliding roller 5103, a supporting sliding rod 5104, a limiting sliding strip 5105, a supporting main roller 5106, a supporting sliding groove 5107 and a limiting sliding groove 5108; the output ends of the two expanding driving cylinders 509 are fixedly connected with driving cylinder connecting rods 5102, one ends of the two driving cylinder connecting rods 5102 are respectively provided with an expanding rod bearing 5101, the inner rings of the two expanding rod bearings 5101 are respectively and fixedly connected with expanding sliding rollers 5103, the inner ends of the two expanding sliding rollers 5103 are respectively and coaxially and fixedly connected with expanding sliding rods 5104, and the side surfaces of the two expanding sliding rods 5104 are respectively and uniformly provided with limiting sliding strips 5105; the film laminating machine is characterized in that a stretching main roller 5106 is arranged between the two stretching sliding rollers 5103, stretching sliding grooves 5107 are formed in two ends of the stretching main roller 5106, limiting sliding grooves 5108 are formed in the inner walls of the two stretching sliding grooves 5107, the stretching sliding rods 5104 are arranged in the stretching sliding grooves 5107 in a sliding mode, and limiting sliding strips 5105 are arranged in the limiting sliding grooves 5108 in a sliding mode, wherein the stretching sliding rollers 5103 and the stretching main rollers 5106 in the stretching rods 510 can clamp two sides of a hollow-out film material with the stretching compression rods 508 at the upper end to drive the first electric sliding rails 4 to move the film laminating stretching assembly 5, cut residual materials are lifted through the stretching rods 510, at the moment, the first film laminating motor 503 is started to enable the long shaft of the film clamping driving convex circles 505 on the film laminating motor to move downwards, the film clamping driving heads 507 are pushed to move downwards, the stretching rods 508 press the stretching rods 510 to prevent the film laminating motor from rotating and clamp two sides of the residual materials, the first electric film laminating motor 503 drives the stretching rods 5 to move, after the stretching sliding rods 509 are reset, the stretching sliding rods to drive the two stretching rods 509 at two sides of the film laminating roller, and the stretching rods to stretch the two stretching rods 510 to enable the two stretching sliding rollers to be unfolded residual materials to be unfolded to be folded, so that the two stretching roller 5103 can be unfolded.
As shown in fig. 1, 10 to 12, the film-coated press assembly 6 includes: a pressure supporting component frame 601, a second film covering motor frame 602, a second film covering motor 603, a pressure supporting driving rotating shaft 604, a pressure supporting driving flange 605, a second spring 606, a pressure supporting driving head 607, a pressure supporting roller pressing rod 608 and a pressure supporting roller 609; a pressure supporting component frame 601 is slidably mounted between the two first electric sliding rails 4, two second film covering motor frames 602 are fixedly mounted at the upper end of the pressure supporting component frame 601, a second film covering motor 603 is fixedly mounted on the outer side surface of one of the second film covering motor frames 602, a pressure supporting driving rotating shaft 604 is coaxially and fixedly connected to the output shaft of the second film covering motor 603 and positioned between the two second film covering motor frames 602, and a pressure supporting driving flange 605 is fixedly connected to the pressure supporting driving rotating shaft 604; a second spring 606 is fixedly installed at the upper end of the pressure maintaining component frame 601 and right below the pressure maintaining driving flange 605, a pressure maintaining driving head 607 is slidably installed in the second spring 606, and a pressure maintaining roller pressing rod 608 is fixedly connected to the lower end of the pressure maintaining driving head 607; a pressure supporting roller 609 is rotatably mounted at the lower end of the pressure supporting assembly frame 601 below the pressure supporting roller pressing rod 608, and the pressure supporting driving flange 605 is oval.
Through the technical scheme, the first electric slide rail 4 is started firstly, the film covering and pressing component 6 is driven to move, the pressing roller 609 slides above the film material, the film covering and pressing component 6 moves and resets from one side of the wafer to the other side, the film material adhered to the wafer is more compact, then the film covering and pressing component 6 moves and resets, the second film covering motor 603 at the upper end is started to drive the pressing driving rotating shaft 604 to rotate, the pressing driving flange 605 rotates, the long shaft of the pressing driving flange is downward, the pressing and pressing driving head 607 is downward, the pressing roller pressing rod 608 at the lower end presses the pressing roller 609 to prevent the pressing roller 609 from rotating, and therefore the film material can be better tightened;
the film material attached to the wafer raw material is tightly pressed and attached to the wafer raw material through the film supporting roller 609 in the film supporting and pressing assembly 6, and the second film coating motor 603 at the upper end can complete the same operation as that in the film supporting and pressing assembly 5, so that the rotation and the fixation of the supporting roller 609 can be controlled.
The working principle is as follows:
the film material in the film discharging machine 2 is firstly pulled out, bypasses from the lower end of the film covering and supporting assembly 6, passes through the middle of the film covering and opening assembly 5, namely between the opening rod 510 and the opening pressure rod 508, and finally, the head end of the film material enters the film collecting machine 3 to form a circulation;
wherein, the film material is arranged right above the two chip processing circular truncated cones 24 and right below the film cutting blade 23;
wafer raw materials in a chip storage cabinet 11 are lifted and rotated by a feeding arm base 13 at the upper end driven by a rotary lifting platform 10, a feeding arm sliding seat 14 is lifted to a corresponding height, a feeding electric push rod 15 is started to drive a chip feeding arm 16 at the front end to take out the wafer raw materials, the wafer raw materials integrally rotate, the feeding electric push rod 15 drives the chip feeding arm 16 at the front end to place a wafer on one of chip processing circular truncated cones 24, and the feeding electric push rod 15 drives the chip feeding arm 16 at the front end to take out the wafer raw materials which are coated on the other chip processing circular truncated cone 24;
the second electric slide rail 7 drives the electric telescopic base 8 to move, the electric telescopic base 8 drives the transfer supporting arm 9 at the front end, a newly-fed raw material is transferred onto the chip processing circular table 24 of the film covering area, the chip processing circular table 24 is lifted and is in contact with the upper film material, and the first electric slide rail 4 firstly drives the film covering and pressing component 6 to press the upper end of the film material, so that the film covering is firmer;
then, a film cutting motor 20 is lowered through a lifting motor 19 at the upper end to drive a film cutting rotating head 21 to rotate, a film cutting blade 23 on one side is made to rotate and cut along the edge of the wafer raw material, then a film covering and unfolding assembly 5 is driven to move through a first electric sliding rail 4, the edge of the cut film material is firstly taken up, the film material in the center is left on the wafer raw material, the film covering and unfolding assembly 5 is driven to return again, the cut film material is moved, and after the movement is finished, the internal structure of the film covering and unfolding assembly 5 is started to clamp the hollowed film material and stretch outwards, so that wrinkles are prevented;
the unfolding drive rotating shaft 504 is driven to rotate by a first film-covering motor 503 in the film-covering unfolding assembly 5, so that an elliptical film-clamping drive convex circle 505 on the unfolding drive rotating shaft rotates to push a film-clamping drive head 507 at the lower end to compress a first spring 506, a unfolding pressing rod 508 at the lower end can be downwards clamped between the unfolding pressing rod and an unfolding rod 510, and the unfolding driving cylinder 509 can drive the unfolding rod 510 to move;
wherein, through the stretching sliding roller 5103 and the stretching main roller 5106 in the stretching rod 510, two sides of the hollow-out film material can be clamped with the stretching compression rod 508 at the upper end;
the film material attached to the wafer raw material is tightly pressed and attached through the supporting and pressing roller 609 in the film covering and supporting assembly 6, and the same operation as that in the film covering and supporting assembly 5 can be completed through the second film covering motor 603 at the upper end, so that the rotation and fixation of the supporting and pressing roller 609 can be controlled;
after the wafer is conveyed to the chip processing circular table 24, the chip processing circular table 24 is lifted, the wafer on the chip processing circular table 24 is attached to the film above the chip processing circular table, the first electric slide rail 4 is started to drive the film covering and pressing assembly 6 to move, the pressing and supporting roller 609 slides above the film, the film covering and pressing assembly is moved from one side of the wafer to the other side of the wafer to attach the film adhered to the wafer more tightly, then the film covering and pressing assembly 6 is moved to reset, the second film covering motor 603 at the upper end is started to drive the pressing and supporting driving rotating shaft 604 to rotate, the pressing and supporting driving flange 605 rotates, the long shaft of the pressing and supporting driving flange is downward, the pressing and supporting roller 609 at the lower end presses the pressing and supporting roller 609 to prevent the pressing and supporting roller 609 from rotating, and the film tightening effect is better;
after the film material is tightly adhered, the upper lifting motor 19 pushes the film cutting motor 20 at the lower end to rotate the film cutting rotating arm 22 at the side surface, the film material is cut along the edge of the wafer through the film cutting blade 23 at the lower part of one end of the film material, and the lifting motor 19 drives the film material to reset;
after cutting, the first electric slide rail 4 is driven again to enable the film covering and opening assembly 5 to move, the cut excess materials are lifted through the opening rod 510, at the moment, the first film covering motor 503 is started to enable the long shaft of the film clamping driving convex circle 505 on the first film covering motor to face downwards, the film clamping driving head 507 is pushed to move downwards, the opening rod 510 is pressed through the opening pressing rod 508 to prevent the opening rod 510 from rotating and clamp two sides of the excess materials, at the moment, the first electric slide rail 4 drives the film covering and opening assembly 5 to move, after resetting, the opening driving cylinders 509 at two ends are started to drive the two opening sliding rollers 5103 in the opening rod 510 to slide, so that the excess materials at two sides can be opened towards two sides, and wrinkles generated on the excess materials are unfolded.
It should be understood that the above-mentioned embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention, and that various other modifications and changes can be made on the basis of the above description by those skilled in the art.
Claims (9)
1. The utility model provides an automatic tectorial membrane encapsulation equipment of chip processing, includes equipment workstation (1), its characterized in that: a film discharging machine (2) for outputting a film is arranged at one end of the equipment workbench (1), a film collecting machine (3) for recovering the residual film edge is arranged at the other end of the equipment workbench (1), first electric slide rails (4) are fixedly mounted on the inner walls of the front side and the rear side of the equipment workbench (1), a film covering and opening assembly (5) and a film covering and pressing assembly (6) are respectively arranged between the two first electric slide rails (4) in a sliding manner, two film cutting support frames (17) are fixedly mounted at the upper end of the equipment workbench (1), a film cutting mounting base (18) is fixedly mounted at the upper ends of the two film cutting support frames (17), a lifting motor (19) is fixedly mounted at one end of the film cutting mounting base (18), a film cutting motor (20) is fixedly connected to the lower end of the output end of the lifting motor (19), a film cutting rotating head (21) is coaxially and fixedly connected to the output shaft of the film cutting motor (20), a film cutting rotating arm (22) is fixedly connected to the side face of the film cutting rotating arm (22), and a film cutting blade (23) is fixedly mounted at the lower side of one end of the film cutting rotating arm (22);
the laminating and pressing assembly (6) comprises: the film laminating machine comprises a pressing component frame (601), a second film laminating motor frame (602), a second film laminating motor (603), a pressing driving rotating shaft (604), a pressing driving flange (605), a second spring (606), a pressing driving head (607), a pressing roller pressing rod (608) and a pressing roller (609);
a pressure supporting component frame (601) is slidably mounted between the two first electric sliding rails (4), two second film covering motor frames (602) are fixedly mounted at the upper end of the pressure supporting component frame (601), a second film covering motor (603) is fixedly mounted on the surface of the outer side of one second film covering motor frame (602), a pressure supporting driving rotating shaft (604) is coaxially and fixedly connected to the output shaft of the second film covering motor (603) and located between the two second film covering motor frames (602), and a pressure supporting driving flange (605) is fixedly connected to the pressure supporting driving rotating shaft (604);
a second spring (606) is fixedly installed at the upper end of the pressure supporting component frame (601) and is positioned under the pressure supporting driving flange (605), a pressure supporting driving head (607) is arranged in the second spring (606) in a sliding manner, and the lower end of the pressure supporting driving head (607) is fixedly connected with a pressure supporting roller pressing rod (608);
and a pressure supporting roller (609) is rotatably arranged at the lower end of the pressure supporting assembly frame (601) and below the pressure supporting roller pressing rod (608).
2. The automatic laminating and packaging equipment for chip processing according to claim 1, wherein: the equipment comprises an equipment workbench (1), wherein a rotary lifting table (10) is arranged at the front end of the equipment workbench (1), a feeding arm base (13) is fixedly mounted at the upper end of the rotary lifting table (10), a feeding arm sliding seat (14) is fixedly mounted at the upper end of the feeding arm base (13), a feeding electric push rod (15) is fixedly mounted on one side of the feeding arm sliding seat (14), and a chip feeding arm (16) is fixedly connected to the output end of the feeding electric push rod.
3. The automatic film-coating packaging equipment for chip processing according to claim 2, wherein: a chip storage cabinet (11) is arranged at one end of the rotary lifting platform (10), and a PLC (programmable logic controller) controller (12) is arranged at the other end of the rotary lifting platform (10);
a second electric slide rail (7) is fixedly arranged at the rear end of the equipment workbench (1) and at the lower end of one of the first electric slide rails (4), an electric telescopic base (8) is arranged on the second electric slide rail (7) in a sliding manner, and a transfer support arm (9) is fixedly connected to the output end of the electric telescopic base (8);
the inner wall of the bottom of the equipment workbench (1) is provided with two chip processing circular truncated cones (24).
4. The automatic film-coating packaging equipment for chip processing according to claim 3, wherein: the film expanding assembly (5) comprises: the device comprises a propping component frame (501), a first laminating motor frame (502), a first laminating motor (503), a propping driving rotating shaft (504), a film clamping driving convex circle (505), a first spring (506), a film clamping driving head (507), a propping compression rod (508), a propping driving cylinder (509) and a propping rod (510);
a stretching assembly frame (501) is slidably mounted between the two first electric sliding rails (4), two first film-coating motor frames (502) are fixedly mounted at the upper end of the stretching assembly frame (501), a first film-coating motor (503) is fixedly mounted on the outer side of one first film-coating motor frame (502), a stretching driving rotating shaft (504) is coaxially and fixedly connected to the output shaft of the first film-coating motor (503) and positioned between the two first film-coating motor frames (502), and a film clamping driving convex circle (505) is integrally arranged on the stretching driving rotating shaft (504);
a first spring (506) is fixedly installed on the upper end surface of the opening component frame (501) and is positioned right below the film clamping driving convex circle (505), a film clamping driving head (507) is arranged in the first spring (506) in a sliding mode, and an opening pressing rod (508) is fixedly connected to the lower end of the film clamping driving head (507);
the outer side surfaces of two ends of the strutting component frame (501) are fixedly provided with strutting driving cylinders (509), and two strutting rods (510) are arranged between the output ends of the strutting driving cylinders (509).
5. The automatic film-coating packaging equipment for chip processing according to claim 4, wherein: the clamping film driving convex circle (505) is oval.
6. The automatic film-coating packaging equipment for chip processing according to claim 5, wherein: the distraction compression bar (508) is located between the distraction assembly frame (501) and the distraction rod (510).
7. The automatic film-coating packaging equipment for chip processing according to claim 6, wherein: the spreader bar (510) comprises: the device comprises a supporting rod bearing (5101), a driving cylinder connecting rod (5102), a supporting sliding roller (5103), a supporting sliding rod (5104), a limiting sliding strip (5105), a supporting main roller (5106), a supporting sliding groove (5107) and a limiting sliding groove (5108);
the output ends of the two stretching driving cylinders (509) are fixedly connected with driving cylinder connecting rods (5102), one end of each of the two driving cylinder connecting rods (5102) is provided with a stretching rod bearing (5101), inner rings of the two stretching rod bearings (5101) are fixedly connected with stretching sliding rollers (5103), the inner ends of the two stretching sliding rollers (5103) are coaxially and fixedly connected with stretching sliding rods (5104), and the side surfaces of the two stretching sliding rods (5104) are uniformly provided with limiting sliding strips (5105) in an integrated mode;
a stretching main roller (5106) is arranged between the two stretching sliding rollers (5103), stretching sliding grooves (5107) are formed in the two ends of the stretching main roller (5106), and limiting sliding grooves (5108) are formed in the inner walls of the two stretching sliding grooves (5107).
8. The automatic film-coating packaging equipment for chip processing according to claim 7, wherein: the stretching sliding rod (5104) is arranged in the stretching sliding groove (5107) in a sliding mode, and the limiting sliding strip (5105) is arranged in the limiting sliding groove (5108) in a sliding mode.
9. The automatic film-coating packaging equipment for chip processing according to claim 8, wherein: the centralizing drive flange (605) is elliptical.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210670721.8A CN114751009B (en) | 2022-06-15 | 2022-06-15 | Automatic laminating packaging equipment for chip processing |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210670721.8A CN114751009B (en) | 2022-06-15 | 2022-06-15 | Automatic laminating packaging equipment for chip processing |
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| CN114751009A CN114751009A (en) | 2022-07-15 |
| CN114751009B true CN114751009B (en) | 2022-12-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN118016566B (en) * | 2024-01-22 | 2024-08-09 | 安徽佰亿微电子技术有限公司 | Packaging film covering device suitable for integrated circuit chip processing |
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| CN103359313A (en) * | 2013-06-28 | 2013-10-23 | 东莞市凯昶德电子科技股份有限公司 | An automatic film sticking machine |
| WO2017156775A1 (en) * | 2016-03-18 | 2017-09-21 | 深圳市艾励美特科技有限公司 | Multi-unit lamination machine |
| CN210026297U (en) * | 2019-03-18 | 2020-02-07 | 广东思沃精密机械有限公司 | Film releasing device |
| CN111710622A (en) * | 2019-03-18 | 2020-09-25 | 广东思沃精密机械有限公司 | laminating machine |
| CN112046835A (en) * | 2020-09-23 | 2020-12-08 | 刘亚刚 | Anti-damage wafer film pasting device for integrated circuit chip production |
| CN216186360U (en) * | 2021-11-08 | 2022-04-05 | 苏州贝尔龙机电设备有限公司 | Novel film sticking machine |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103359313A (en) * | 2013-06-28 | 2013-10-23 | 东莞市凯昶德电子科技股份有限公司 | An automatic film sticking machine |
| WO2017156775A1 (en) * | 2016-03-18 | 2017-09-21 | 深圳市艾励美特科技有限公司 | Multi-unit lamination machine |
| CN210026297U (en) * | 2019-03-18 | 2020-02-07 | 广东思沃精密机械有限公司 | Film releasing device |
| CN111710622A (en) * | 2019-03-18 | 2020-09-25 | 广东思沃精密机械有限公司 | laminating machine |
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