CN114589825A - Silicon rod cutting and grinding integrated machine and silicon rod cutting and grinding method - Google Patents
Silicon rod cutting and grinding integrated machine and silicon rod cutting and grinding method Download PDFInfo
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- CN114589825A CN114589825A CN202210277335.2A CN202210277335A CN114589825A CN 114589825 A CN114589825 A CN 114589825A CN 202210277335 A CN202210277335 A CN 202210277335A CN 114589825 A CN114589825 A CN 114589825A
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- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 196
- 239000010703 silicon Substances 0.000 title claims abstract description 196
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 195
- 238000005520 cutting process Methods 0.000 title claims abstract description 48
- 238000000034 method Methods 0.000 title claims abstract description 18
- 230000007246 mechanism Effects 0.000 claims abstract description 44
- 238000007599 discharging Methods 0.000 claims description 39
- 229910003460 diamond Inorganic materials 0.000 claims description 10
- 239000010432 diamond Substances 0.000 claims description 10
- 239000013078 crystal Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 8
- 239000002699 waste material Substances 0.000 claims description 3
- 238000012545 processing Methods 0.000 abstract description 16
- 229910021419 crystalline silicon Inorganic materials 0.000 abstract description 2
- 150000003376 silicon Chemical class 0.000 abstract 1
- 238000004804 winding Methods 0.000 description 7
- 239000010985 leather Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 230000004075 alteration Effects 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 241000606750 Actinobacillus Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention relates to the technical field of crystalline silicon processing, in particular to a silicon rod cutting and grinding integrated machine and a silicon rod cutting and grinding method. This silicon rod surely grinds all-in-one includes the evolution device, go up the unloading platform, the grinding machine device, base and the frame of setting on the base, evolution anchor clamps and grinding machine anchor clamps all set up on the slide rail of frame, evolution anchor clamps are used for carrying out the centre gripping and moving to the evolution position of evolution mechanism along the slide rail to the silicon rod of treating after the evolution, grinding machine anchor clamps are used for carrying out the centre gripping and moving to the grinding position of grinding machine mechanism along the slide rail to the silicon rod after the evolution, go up the unloading platform and be used for placing the silicon rod of treating, the silicon rod after the evolution and the silicon rod after the grinding, go up the unloading platform and can make the central line of the silicon rod of treating after the silicon rod and the evolution on same axis. The silicon rod cutting and grinding all-in-one machine improves the silicon rod processing efficiency, and meanwhile, the grinding allowance caused by secondary clamping can be effectively reduced, so that the silicon rod processing cost is reduced.
Description
Technical Field
The invention relates to the technical field of crystalline silicon processing, in particular to a silicon rod cutting and grinding integrated machine and a silicon rod cutting and grinding method.
Background
With the rapid expansion of the photovoltaic industry in recent years, the production capacity of silicon single crystals is continuously increasing. Common methods for preparing silicon single crystals include the Czochralski method, the float zone method and the like, and the silicon single crystals prepared by such methods are cylindrical silicon rods.
At present, the finished rod is produced by adopting the processes of firstly squaring and then grinding the square rod at home and abroad, namely, a round silicon rod is firstly cut into a square shape by a squaring machine, then the square rod is transferred to a grinding machine station by logistics transfer equipment, and then the square rod is ground into the finished rod by the grinding machine, so that the silicon rod needs to be frequently carried by manpower among equipment and is clamped and positioned before processing. The silicon rod is carried and clamped, so that positioning errors are brought, logistics work is increased, and the whole machining process is low in efficiency and long in consumed time.
Disclosure of Invention
Technical problem to be solved
In view of the above disadvantages and shortcomings of the prior art, the present invention provides a silicon rod cutting and grinding method and a silicon rod cutting and grinding integrated machine, which improve the silicon rod processing efficiency and reduce the silicon rod processing cost.
(II) technical scheme
In order to achieve the purpose, the invention adopts the main technical scheme that:
the invention provides a silicon rod cutting and grinding integrated machine which comprises a squaring device, a feeding and discharging platform, a grinding machine device, a base and a frame arranged on the base, wherein the squaring device comprises a square rod, a grinding machine and a grinding machine; the feeding and discharging platform is arranged between the squaring device and the grinding machine device, the squaring device comprises a squaring clamp and a squaring mechanism, and the grinding machine device comprises a grinding machine clamp and a grinding machine mechanism; the squaring mechanism and the grinding machine mechanism are both arranged on the base, the squaring fixture and the grinding machine fixture are both arranged on a slide rail of the frame, and the slide rail extends along the length direction of the base and passes through the upper part of a placing working position of the feeding and discharging platform; the squaring fixture is used for clamping the silicon rod to be processed and moving the silicon rod to the squaring working position of the squaring mechanism along the slide rail; the grinding machine fixture is used for clamping the cut silicon rod and moving the silicon rod to a grinding working position of the grinding machine mechanism along the slide rail; the feeding and discharging platform is used for placing the silicon rod to be processed, the silicon rod after being cut and the silicon rod after being ground, and the feeding and discharging platform can enable the center lines of the silicon rod to be processed and the silicon rod after being cut to be on the same axis.
Preferably, the squaring mechanism comprises a pay-off wheel, a first rotating assembly, a second rotating assembly and a take-up wheel; the diamond wire on the pay-off wheel enters the take-up wheel after passing through the first rotating assembly and the second rotating assembly, and the first rotating assembly and the second rotating assembly are arranged oppositely; when the pay-off wheel and the take-up wheel work, the diamond wire on the first rotating component is used for cutting one side of the silicon rod to be processed on the open-square working position, and the diamond wire on the second rotating component is used for cutting the second side of the silicon rod to be processed on the open-square working position.
Preferably, the first rotating assembly includes a first rotating unit and a second rotating unit; the second rotating assembly comprises a third rotating unit and a fourth rotating unit; the first rotating unit and the second rotating unit are arranged at intervals, the third rotating unit and the fourth rotating unit are arranged at intervals, and the intervals are matched with the length of the silicon rod to be processed; the first rotating unit and the fourth rotating unit are arranged oppositely, and the second rotating unit and the third rotating unit are arranged oppositely.
Preferably, the first rotating unit, the second rotating unit, the third rotating unit and the fourth rotating unit have the same structure and comprise rotating heads, upright posts and first sliding tables; the rotating head is connected with the upright column in a sliding way and moves up and down along the upright column; first slip table sets up along the width direction of base, stand and first slip table sliding connection.
Preferably, the grinding machine mechanism comprises a rough grinding assembly and a fine grinding assembly arranged along the length direction of the base; the rough grinding assembly comprises a rough grinding head and a second sliding table driving the rough grinding head to move along the width direction of the base; the fine grinding assembly comprises a fine grinding head and a third sliding table driving the fine grinding head to move along the width direction of the base.
Preferably, go up unloading platform includes the guide rail that sets up along base width direction and with guide rail sliding connection's material loading unit and unloading unit.
Preferably, the loading and unloading platform further comprises a first driving part and a second driving part; the first driving piece is connected with the feeding unit to drive the feeding unit to slide along the guide rail; the second driving piece is connected with the blanking unit to drive the blanking unit to slide along the guide rail.
Preferably, the feeding unit comprises two clamping jaw units which are oppositely arranged at the left and the right; each clamping jaw unit comprises a first clamping jaw group and a second clamping group, the first clamping jaw group is used for clamping the silicon rod to be processed, and the second clamping group is used for clamping the silicon rod after being opened; the first clamping jaw group comprises two first clamping jaw plates which are oppositely arranged along the vertical direction and form an included angle of 135 degrees; the second clamping jaw group comprises two second clamping jaw plates which are oppositely arranged along the vertical direction and form an included angle of 45 degrees; the intersection point of the extension lines of the two first clamping jaw plates and the intersection point of the extension lines of the two second clamping jaw plates are on the same horizontal line.
Preferably, the device also comprises an edge skin connecting trolley; the edge-connecting leather trolley is arranged on one side of the base, and moves along the length direction of the base to receive waste materials generated when the squaring device is squared.
The invention also provides a silicon rod cutting and grinding method, and the silicon rod cutting and grinding all-in-one machine comprises the following steps;
s1, placing a first silicon rod to be processed at a placing working position of an upper and lower material platform, clamping the first silicon rod by the upper and lower material platform from the width direction, clamping the first silicon rod by a squaring clamp from the length direction, loosening the first silicon rod by the upper and lower material platform, and driving the first silicon rod to rotate by the squaring clamp so as to position a crystal wire;
s2, after the first silicon rod crystal line is positioned, the squaring fixture drives the first silicon rod to move to a squaring working position of the squaring mechanism, and the squaring mechanism performs first squaring on the first side and the third side of the first silicon rod;
s3, rotating the first silicon rod subjected to the first squaring by 90 degrees through the squaring clamp, and performing second squaring on the second side and the fourth side of the first silicon rod through the squaring mechanism;
s4, rotating the first silicon rod after the second cutting by 45 degrees through the cutting clamp, driving the first silicon rod to move to a placing working position of an upper feeding platform through the cutting clamp, clamping the first silicon rod from the width direction through a feeding and discharging platform, loosening the first silicon rod through the cutting clamp, clamping the first silicon rod from the length direction through a grinding machine clamp, and loosening the first silicon rod through the feeding and discharging platform;
s5, the grinding machine fixture drives the first silicon rod after being unfolded to move to a grinding working position of the grinding mechanism, the grinding mechanism grinds the first silicon rod after being unfolded, at the moment, the second silicon rod to be processed is placed at a placing working position of the feeding and discharging platform, and the step S1 is repeated;
s6, the grinding machine fixture drives the ground first silicon rod to move to a placing work position of the upper discharging platform, the upper discharging platform discharges the ground first silicon rod, and the steps S2-S5 are repeated on the second silicon rod.
(III) advantageous effects
The beneficial effects of the invention are:
according to the silicon rod cutting and grinding all-in-one machine provided by the invention, as the squaring device, the feeding and discharging platform and the grinding machine device are arranged on the base, two silicon rods can be subjected to edge cutting and skin cutting operation at the squaring device and grinding, polishing and chamfering operation at the grinding machine device at the same time, and the silicon rod processing efficiency is improved. And because the squaring fixture and the grinding machine fixture are both arranged on the same linear slide rail of the frame, the clamping centers of the squaring fixture and the grinding machine fixture are ensured to be on the same straight line, and the feeding and discharging platform can enable the central lines of the silicon rod to be treated and the silicon rod after the squaring to be on the same axis, so that the grinding allowance caused by secondary clamping can be effectively reduced, and the cost of silicon rod processing is reduced.
According to the silicon rod cutting and grinding method provided by the invention, the silicon rod processing efficiency is improved, the grinding allowance increase caused by secondary clamping can be effectively reduced, and the silicon rod processing cost is further reduced.
Drawings
FIG. 1 is a top view of a silicon rod slicing and grinding all-in-one machine of the present invention;
FIG. 2 is a front view of a silicon rod slicing and grinding all-in-one machine of the present invention;
fig. 3 is a right side view of the feeding unit.
[ description of reference ]
1: a squaring device; 11: a square clamp is opened; 12: a squaring mechanism; 1201: a paying-off wheel; 1202: a take-up pulley; 1203: a first rotating unit; 1204: a second rotating unit; 1205: a third rotating unit; 1206: a fourth rotating unit; 1207: rotating the head; 1208: a column; 1209: a first sliding table; 1210: managing a left line; 1211: managing a right line; 1212: winding and passing through a wheel set;
2: a loading and unloading platform; 21: a guide rail; 22: a feeding unit; 221: a first jaw plate; 222: a second jaw plate; 23: a blanking unit; 24: a first driving member; 25: a second driving member;
3: a grinding machine device; 31: a grinding machine fixture; 32: a grinder mechanism; 321: a rough grinding assembly; 3211: a rough grinding head; 3212: a second sliding table; 322: a finish grinding assembly; 3221: a fine grinding head; 3222: a third sliding table;
4: a base;
5: a frame;
6: a slide rail;
7: a silicon rod;
8: a side skin connecting trolley;
9: the motor is driven.
Detailed Description
In order to better understand the above technical solutions, exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the invention are shown in the drawings, it should be understood that the invention can be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
Example one
As shown in fig. 1-2, the embodiment provides a silicon rod cutting and grinding integrated machine, which includes an squaring device 1, a feeding and discharging platform 2, a grinding machine device 3, a base 4, and a frame 5 disposed on the base 4.
Wherein, go up unloading platform 2 and set up between evolution device 1 and grinding machine device 3, evolution device 1 includes evolution anchor clamps 11 and evolution mechanism 12, grinding machine device 3 includes grinding machine anchor clamps 31 and grinding machine mechanism 32, evolution mechanism 12 and grinding machine mechanism 32 all set up on base 4, evolution anchor clamps 11 and grinding machine anchor clamps 31 all set up on the slide rail 6 of frame 5, and slide rail 6 extends and through the top of the work position of placing of going up unloading platform 2 along the length direction of base 4. The squaring fixture 11 is used for clamping the silicon rod 7 to be processed and moving the silicon rod 7 to the squaring working position of the squaring mechanism 12 along the slide rail 6, the grinding machine fixture 31 is used for clamping the silicon rod 7 after the squaring and moving the silicon rod 7 to the grinding working position of the grinding machine mechanism 32 along the slide rail 6, the feeding and discharging platform 2 is used for placing the silicon rod 7 to be processed, the silicon rod 7 after the squaring and the silicon rod 7 after the grinding, and the feeding and discharging platform 2 can enable the center lines of the silicon rod 7 to be processed and the silicon rod 7 after the squaring to be on the same axis. It should be noted that, in the present embodiment, the silicon rod 7 to be processed has a circular cross section, and the silicon rod 7 after the squaring process has a square cross section.
According to the silicon rod cutting and grinding all-in-one machine provided by the embodiment, the squaring device 1, the feeding and discharging platform 2 and the grinding machine device 3 are arranged on the base 4, so that the two silicon rods 7 can be simultaneously subjected to edge cutting and skin trimming operation at the squaring device 1 and grinding, polishing and chamfering at the grinding machine device 3, and the silicon rod 7 processing efficiency is improved. And because the squaring clamp 11 and the grinding machine clamp 31 are both arranged on the same linear slide rail 6 of the frame 5, the clamping centers of the squaring clamp 11 and the grinding machine clamp 31 are ensured to be on the same straight line, and the feeding and discharging platform 2 can enable the central lines of the silicon rod 7 to be processed and the silicon rod 7 after the squaring to be on the same axis, so that the grinding allowance caused by secondary clamping can be effectively reduced, and the processing cost of the silicon rod 7 is further reduced.
As shown in fig. 1, the squaring mechanism 12 includes an unwinding wheel 1201, a first rotating assembly, a second rotating assembly and a winding wheel 1202, a diamond wire on the unwinding wheel 1201 enters the winding wheel 1202 after passing through the first rotating assembly and the second rotating assembly, the first rotating assembly and the second rotating assembly are arranged oppositely, that is, the first rotating assembly and the second rotating assembly are respectively arranged at two sides of the base 4 in the length direction, wherein the first rotating assembly and the unwinding wheel 1201 are at the same side, and the second rotating assembly and the winding wheel 1202 are at the same side. When the paying-off wheel 1201 and the take-up wheel 1202 work, the diamond wire on the first rotating assembly is used for cutting one side of the silicon rod 7 to be processed on the opening working position, and the diamond wire on the second rotating assembly is used for cutting the second side of the silicon rod 7 to be processed on the opening working position.
Specifically, the first rotating assembly comprises a first rotating unit 1203 and a second rotating unit 1204, the second rotating assembly comprises a third rotating unit 1205 and a fourth rotating unit 1206, wherein the first rotating unit 1203, the second rotating unit 1204, the third rotating unit 1205 and the fourth rotating unit 1206 are detachably connected with the base 4, the first rotating unit 1203 and the fourth rotating unit 1206 are oppositely arranged, the second rotating unit 1204 and the third rotating unit 1205 are oppositely arranged, the first rotating unit 1203 and the second rotating unit 1204 are arranged at intervals, the third rotating unit 1205 and the fourth rotating unit 1206 are arranged at intervals, and the length of the interval is matched with the length of the silicon rod 7 to be processed, so that the silicon rods 7 with different lengths can be adapted.
As shown in fig. 2, the first rotating unit 1203, the second rotating unit 1204, the third rotating unit 1205 and the fourth rotating unit 1206 have the same structure, and each of them includes a rotating head 1207, a vertical column 1208 and a first sliding table 1209. Rotate head 1207 and stand 1208 sliding connection and along stand 1208 elevating movement, first slip table 1209 sets up along the width direction of base 4, stand 1208 and first slip table 1209 sliding connection are equipped with left side spool reason 1210 and wire winding break pulley 1212 between first rotation unit 1203 and actinobacillus wheel 1201, are equipped with right side spool reason 1211 between fourth rotation unit 1206 and take-up pulley 1202. In the practical application process, the diamond wire in the wire releasing wheel 1201 passes through the left wire management 1210 and the wire winding passing wheel set 1212, sequentially passes through the rotating heads 1207 on the first rotating unit 1203, the second rotating unit 1204, the third rotating unit 1205 and the fourth rotating unit 1206, and then enters the wire winding wheel 1202 through the right wire management 1211, and when the squaring mechanism 12 performs squaring, the rotating heads 1207 on the columns 1208 simultaneously descend along the columns 1208 to square the silicon rod 7 to be processed. Due to the arrangement of the first sliding table 1209, the distance between the rotating heads 1207 in the first rotating unit 1203 and the fourth rotating unit 1206 and the distance between the rotating heads 1207 in the second rotating unit 1204 and the third rotating unit 1205 can be adjusted according to the diameter of the silicon rod 7, so that the silicon rods 7 with different diameters can be adapted.
As shown in fig. 1, the grinding machine mechanism 32 includes a rough grinding assembly 321 and a fine grinding assembly 322 arranged along the length direction of the base 4, the rough grinding assembly 321 includes a rough grinding head 3211 and a second sliding table 3212 driving the rough grinding head 3211 to move along the width direction of the base 4, the rough grinding head 3211 performs rough grinding on the silicon rod 7 after opening, the fine grinding assembly 322 includes a fine grinding head 3221 and a third sliding table 3222 driving the fine grinding head 3221 to move along the width direction of the base 4, and the fine grinding head 3221 performs fine grinding on the silicon rod 7 after rough grinding.
Specifically, the feeding and discharging platform 2 comprises a guide rail 21 arranged along the width direction of the base 4, and a feeding unit 22 and a discharging unit 23 which are connected with the guide rail 21 in a sliding manner, wherein the feeding unit 22 is used for placing the silicon rod 7 to be processed after the silicon rod 7 is cut, and the discharging unit 23 is used for placing the ground silicon rod 7. The loading and unloading platform 2 further comprises a first driving member 24 and a second driving member 25, the first driving member 24 is connected with the loading unit 22 to drive the loading unit 22 to slide along the guide rail 21, and the second driving member 25 is connected with the unloading unit 23 to drive the unloading unit 23 to slide along the guide rail 21. In this embodiment, the placing position of the loading and unloading platform 2 is located in the middle of the guide rail 21, at the initial position, the loading unit 22 and the unloading unit 23 are respectively located at two ends of the guide rail 21, when loading, the first driving member 24 drives the loading unit 22 to slide to the placing position, and when unloading, the second driving member 25 drives the unloading unit 23 to slide to the placing position.
As shown in fig. 3, the feeding unit 22 includes two jaw units disposed opposite to each other in the left-right direction, each jaw unit includes a first jaw group and a second clamping group, the first jaw groups of the two jaw units are used for clamping the silicon rod 7 to be processed, and the second clamping groups of the two jaw units are used for clamping the silicon rod 7 after being opened. Wherein, first clamping jaw group includes two first clamping jaw boards 221, two first clamping jaw boards 221 are placed and form 135 contained angles along vertical direction relatively, and then better centre gripping circular pending silicon rod 7, second clamping jaw group includes two second clamping jaw boards 222, two second clamping jaw boards 222 are placed and form 45 contained angles along vertical direction relatively, and then better centre gripping silicon rod 7 after the evolution, the nodical point of two first clamping jaw board 221 extension lines and the nodical point of two second clamping jaw board 222 extension lines are on same horizontal line, the axis of pending silicon rod 7 and silicon rod 7 after the evolution has been guaranteed on same axis, with setting up the silicon rod on same linear guide 21 evolution anchor clamps 11 and grinding machine anchor clamps 31 cooperation, the grinding allowance that can effectual reduction secondary clamping caused increases, and then silicon rod 7 processing's cost has been reduced.
Of course, in the process of practical application, the cutting edge device further comprises an edge leather trolley 8 and a driving motor 9 for driving the edge leather trolley 8, the edge leather trolley 8 is arranged on one side of the base 4, and the driving motor 9 drives the edge leather trolley 8 to move along the length direction of the base 4 so as to receive waste materials generated when the squaring device 1 is squared.
Example two
The embodiment provides a silicon rod cutting and grinding method, which adopts the silicon rod cutting and grinding all-in-one machine in the first embodiment and comprises the following steps;
s1, placing a first silicon rod to be processed at a placing working position of the feeding and discharging platform 2, clamping the first silicon rod by the feeding and discharging platform 2 from the width direction, clamping the first silicon rod by the squaring clamp 11 from the length direction, loosening the first silicon rod by the feeding and discharging platform 2, and driving the first silicon rod to rotate by the squaring clamp 11 so as to position a crystal wire;
s2, after the first silicon rod crystal line is positioned, the squaring clamp 11 drives the first silicon rod to move to a squaring working position of the squaring mechanism 12, and the squaring mechanism 12 performs first squaring on the first side and the third side of the first silicon rod;
s3, rotating the first silicon rod subjected to the first squaring by 90 degrees through the squaring clamp 11, and performing second squaring on the second side and the fourth side of the first silicon rod through the squaring mechanism 12;
s4, rotating the first silicon rod after the second cutting by 45 degrees through the cutting clamp 11, driving the first silicon rod to move to a placing working position of the upper feeding platform 2 through the cutting clamp 11, clamping the first silicon rod from the width direction through the feeding and discharging platform 2, loosening the first silicon rod through the cutting clamp 11, clamping the first silicon rod from the length direction through the grinding machine clamp 31, and loosening the first silicon rod through the feeding and discharging platform 2;
s5, the grinding machine clamp 31 drives the first silicon rod after being unfolded to move to a grinding working position of the grinding mechanism, the grinding mechanism grinds the first silicon rod after being unfolded, at the moment, the second silicon rod to be processed is placed at a placing working position of the feeding and blanking platform 2, and the step S1 is repeated;
s6, the grinding machine clamp 31 drives the ground first silicon rod to move to the placing work position of the upper discharging platform 2, the feeding and discharging platform 2 discharges the ground first silicon rod, and the step S2-S5 is repeated on the second silicon rod.
Of course, the same applies for more than two silicon rods, and the first silicon rod and the second silicon rod are only illustrated in this embodiment.
According to the silicon rod cutting and grinding method provided by the embodiment, the silicon rod processing efficiency is improved, the grinding allowance increase caused by secondary clamping can be effectively reduced, and the silicon rod processing cost is further reduced.
In the description of the present invention, it is to be understood that the terms "first", "second" and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium; either as communication within the two elements or as an interactive relationship of the two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, a first feature may be "on" or "under" a second feature, and the first and second features may be in direct contact, or the first and second features may be in indirect contact via an intermediate. Also, a first feature "on," "above," and "over" a second feature may be directly or obliquely above the second feature, or simply mean that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the second feature, or may simply mean that the first feature is at a lower level than the second feature.
Although embodiments of the present invention have been shown and described above, it should be understood that the above embodiments are exemplary and not to be construed as limiting the present invention and that those skilled in the art may make modifications, alterations, substitutions and alterations to the above embodiments within the scope of the present invention.
Claims (10)
1. A silicon rod cutting and grinding integrated machine is characterized by comprising a squaring device, a feeding and discharging platform, a grinding machine device, a base and a frame arranged on the base;
the feeding and discharging platform is arranged between the squaring device and the grinding machine device, the squaring device comprises a squaring clamp and a squaring mechanism, and the grinding machine device comprises a grinding machine clamp and a grinding machine mechanism; the squaring mechanism and the grinding machine mechanism are both arranged on the base, the squaring fixture and the grinding machine fixture are both arranged on a slide rail of the frame, and the slide rail extends along the length direction of the base and passes through the upper part of a placing working position of the feeding and discharging platform;
the squaring fixture is used for clamping the silicon rod to be processed and moving the silicon rod to the squaring working position of the squaring mechanism along the slide rail;
the grinding machine clamp is used for clamping the cut silicon rod and moving the silicon rod to a grinding working position of the grinding machine mechanism along the slide rail;
the feeding and discharging platform is used for placing the silicon rod to be processed, the silicon rod after being cut and the ground silicon rod, and the feeding and discharging platform can enable the center lines of the silicon rod to be processed and the silicon rod after being cut to be on the same axis.
2. The silicon rod cutting and grinding all-in-one machine as recited in claim 1,
the squaring mechanism comprises a pay-off wheel, a first rotating assembly, a second rotating assembly and a take-up wheel;
the diamond wire on the pay-off wheel enters the take-up wheel after passing through the first rotating assembly and the second rotating assembly, and the first rotating assembly and the second rotating assembly are arranged oppositely;
when the pay-off wheel and the take-up wheel work, the diamond wire on the first rotating component is used for cutting one side of the silicon rod to be processed on the opening working position, and the diamond wire on the second rotating component is used for cutting the second side of the silicon rod to be processed on the opening working position.
3. The silicon rod cutting and grinding all-in-one machine as recited in claim 2,
the first rotating assembly comprises a first rotating unit and a second rotating unit;
the second rotating assembly comprises a third rotating unit and a fourth rotating unit;
the first rotating unit and the second rotating unit are arranged at intervals, the third rotating unit and the fourth rotating unit are arranged at intervals, and the intervals are matched with the length of the silicon rod to be processed;
the first rotating unit and the fourth rotating unit are arranged oppositely, and the second rotating unit and the third rotating unit are arranged oppositely.
4. The silicon rod cutting and grinding all-in-one machine as recited in claim 3,
the first rotating unit, the second rotating unit, the third rotating unit and the fourth rotating unit have the same structure and respectively comprise a rotating head, an upright post and a first sliding table;
the rotating head is connected with the upright column in a sliding manner and moves up and down along the upright column;
the first sliding table is arranged along the width direction of the base, and the stand column is connected with the first sliding table in a sliding mode.
5. The silicon rod cutting and grinding all-in-one machine as recited in claim 1,
the grinding machine mechanism comprises a rough grinding assembly and a fine grinding assembly which are arranged along the length direction of the base;
the rough grinding assembly comprises a rough grinding head and a second sliding table which drives the rough grinding head to move along the width direction of the base;
the fine grinding assembly comprises a fine grinding head and a third sliding table driving the fine grinding head to move along the width direction of the base.
6. The silicon rod cutting and grinding all-in-one machine as recited in claim 1,
go up the unloading platform include follow the guide rail that the base width direction set up and with guide rail sliding connection's material loading unit and unloading unit.
7. The silicon rod cutting and grinding all-in-one machine as recited in claim 6,
the feeding and discharging platform further comprises a first driving piece and a second driving piece;
the first driving piece is connected with the feeding unit to drive the feeding unit to slide along the guide rail;
the second driving piece is connected with the blanking unit to drive the blanking unit to slide along the guide rail.
8. The silicon rod cutting and grinding all-in-one machine as recited in claim 7,
the feeding unit comprises two clamping jaw units which are oppositely arranged at the left and the right;
each clamping jaw unit comprises a first clamping jaw group and a second clamping group, the first clamping jaw group is used for clamping the silicon rod to be processed, and the second clamping group is used for clamping the silicon rod after being opened;
the first clamping jaw group comprises two first clamping jaw plates which are oppositely arranged along the vertical direction and form an included angle of 135 degrees;
the second clamping jaw group comprises two second clamping jaw plates which are oppositely arranged along the vertical direction and form an included angle of 45 degrees;
the intersection point of the extension lines of the two first clamping jaw plates and the intersection point of the extension lines of the two second clamping jaw plates are on the same horizontal line.
9. The silicon rod cutting and grinding all-in-one machine as recited in claim 1,
the device also comprises a side skin connecting trolley;
the edge skin connecting trolley is arranged on one side of the base, and moves along the length direction of the base to receive waste materials generated when the squaring device is squared.
10. A silicon rod slicing and grinding method characterized in that the silicon rod slicing and grinding all-in-one machine as set forth in any one of claims 1 to 9 is used, comprising the steps of;
s1, placing a first silicon rod to be processed at a placing working position of an upper and lower material platform, clamping the first silicon rod by the upper and lower material platform from the width direction, clamping the first silicon rod by an open clamp from the length direction, releasing the first silicon rod by the upper and lower material platform, and driving the first silicon rod to rotate by the open clamp so as to position a crystal wire;
s2, after the first silicon rod crystal line is positioned, the squaring fixture drives the first silicon rod to move to a squaring working position of a squaring mechanism, and the squaring mechanism performs first squaring on a first side and a third side of the first silicon rod;
s3, the squaring fixture rotates the first silicon rod after the first squaring by 90 degrees, and the squaring mechanism performs second squaring on the second side and the fourth side of the first silicon rod;
s4, the squaring clamp rotates the first silicon rod after the second squaring by 45 degrees, the squaring clamp drives the first silicon rod to move to a placing working position of the feeding and discharging platform, the feeding and discharging platform clamps the first silicon rod from the width direction, the squaring clamp loosens the first silicon rod, and the feeding and discharging platform loosens the first silicon rod after the grinding machine clamp clamps the first silicon rod from the length direction;
s5, the grinding machine clamp drives the first silicon rod after being unfolded to move to a grinding working position of a grinding mechanism, the grinding mechanism grinds the first silicon rod after being unfolded, at the moment, a second silicon rod to be processed is placed at a placing working position of an feeding and discharging platform, and the step S1 is repeated;
s6, the grinding machine clamp drives the ground first silicon rod to move to a placing working position of the feeding and discharging platform, the feeding and discharging platform discharges the ground first silicon rod, and the step S2-S5 is repeated on the second silicon rod.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210277335.2A CN114589825A (en) | 2022-03-10 | 2022-03-10 | Silicon rod cutting and grinding integrated machine and silicon rod cutting and grinding method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210277335.2A CN114589825A (en) | 2022-03-10 | 2022-03-10 | Silicon rod cutting and grinding integrated machine and silicon rod cutting and grinding method |
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