CN114554804A - Heat dissipation system and electronic equipment - Google Patents

Heat dissipation system and electronic equipment Download PDF

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CN114554804A
CN114554804A CN202210222480.0A CN202210222480A CN114554804A CN 114554804 A CN114554804 A CN 114554804A CN 202210222480 A CN202210222480 A CN 202210222480A CN 114554804 A CN114554804 A CN 114554804A
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cooling
heat
heat dissipation
cooling liquid
transfer shaft
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尹娜
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Lenovo Beijing Ltd
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02NELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N11/00Generators or motors not provided for elsewhere; Alleged perpetua mobilia obtained by electric or magnetic means
    • H02N11/002Generators
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318Condensers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208Liquid cooling with phase change
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本申请公开了一种散热系统和电子设备。该散热系统包括温差发电器,用于设置于待冷却电子设备的发热部位;冷却件,用于对待冷却电子设备进行冷却;其中,温差发电器与冷却件电连接,以向冷却件提供电能。

Figure 202210222480

The present application discloses a heat dissipation system and an electronic device. The heat dissipation system includes a thermoelectric generator, which is arranged on the heat generating part of the electronic equipment to be cooled; a cooling element is used for cooling the electronic equipment to be cooled; wherein, the thermoelectric generator is electrically connected with the cooling element to provide electrical energy to the cooling element.

Figure 202210222480

Description

一种散热系统和电子设备A cooling system and electronic equipment

技术领域technical field

本申请涉及散热系统技术领域,尤其涉及一种散热系统和电子设备。The present application relates to the technical field of heat dissipation systems, and in particular, to a heat dissipation system and electronic equipment.

背景技术Background technique

面对大数据时代的到来,电子设备比如服务器的配置越来越高,其散热问题成成为限制电子设备升级的技术难点。Facing the arrival of the era of big data, the configuration of electronic equipment such as servers is getting higher and higher, and the problem of heat dissipation has become a technical difficulty restricting the upgrading of electronic equipment.

因此,如何提升电子设备的散热效率,是本领域技术人员目前需要解决的技术问题。Therefore, how to improve the heat dissipation efficiency of the electronic device is a technical problem that needs to be solved by those skilled in the art.

发明内容SUMMARY OF THE INVENTION

有鉴于此,本申请的目的在于提供一种散热系统,包括:In view of this, the purpose of this application is to provide a heat dissipation system, including:

温差发电器,用于设置于所述待冷却电子设备的发热部位;a thermoelectric generator, which is used to be arranged on the heat generating part of the electronic device to be cooled;

冷却件,用于对所述待冷却电子设备进行冷却;a cooling member for cooling the electronic device to be cooled;

其中,所述温差发电器与所述冷却件电连接,以向所述冷却件提供电能。Wherein, the thermoelectric generator is electrically connected with the cooling element to provide electrical energy to the cooling element.

优选地,在上述散热系统中,还包括冷却液容器,所述冷却液容器中填充有冷却液,所述待冷却电子设备浸没在所述冷却液中。Preferably, in the above heat dissipation system, a cooling liquid container is further included, the cooling liquid container is filled with cooling liquid, and the electronic device to be cooled is immersed in the cooling liquid.

优选地,在上述散热系统中,所述冷却件包括与所述温差发电器电连接的扰流件。Preferably, in the above heat dissipation system, the cooling member includes a spoiler that is electrically connected to the thermoelectric generator.

优选地,在上述散热系统中,所述冷却件还包括传热轴,所述传热轴贯穿所述冷却液容器的内侧和外侧,至少用于将冷却液容器内的热量传递至所述冷却液容器的外侧。Preferably, in the above heat dissipation system, the cooling member further comprises a heat transfer shaft, the heat transfer shaft penetrates the inner and outer sides of the cooling liquid container, and is at least used to transfer the heat in the cooling liquid container to the cooling liquid container. outside of the liquid container.

优选地,在上述散热系统中,所述冷却件还包转动散热件,所述转动散热件设置于所述传热轴露出所述冷却液容器的一端,所述扰流件设置于所述传热轴位于所述冷却液容器的一端,所述传热轴转动连接于所述冷却液容器,以通过所述扰流件带动所述传热轴和所述转动散热件转动。Preferably, in the above heat dissipation system, the cooling member further includes a rotating heat dissipation member, and the rotating heat dissipation member is disposed at the end of the heat transfer shaft that exposes the cooling liquid container, and the spoiler is disposed at the heat transfer shaft. The heat shaft is located at one end of the cooling liquid container, and the heat transfer shaft is rotatably connected to the cooling liquid container, so as to drive the heat transfer shaft and the rotating heat dissipation member to rotate through the spoiler.

优选地,在上述散热系统中,还包括密封件,设置于所述冷却液容器安装所述传热轴的部位。Preferably, in the above-mentioned heat dissipation system, a sealing member is further included, which is arranged at the part where the cooling liquid container is installed with the heat transfer shaft.

优选地,在上述散热系统中,所述传热轴的外壁设置有导热薄膜,所述导热薄膜贯穿所述冷却液容器的内侧和外侧。Preferably, in the above heat dissipation system, a thermally conductive film is provided on the outer wall of the heat transfer shaft, and the thermally conductive film penetrates the inner and outer sides of the cooling liquid container.

优选地,在上述散热系统中,所述冷却件在所述冷却液容器内的高度能够调节。Preferably, in the above heat dissipation system, the height of the cooling element in the cooling liquid container can be adjusted.

优选地,在上述散热系统中,所述冷却液为气液两相冷却液,所述散热系统还包括设置于所述冷却液的上方的冷凝器。Preferably, in the above cooling system, the cooling liquid is a gas-liquid two-phase cooling liquid, and the cooling system further includes a condenser disposed above the cooling liquid.

一种电子设备,应用如上任意一项所述的散热系统。An electronic device applies the heat dissipation system described in any one of the above.

附图说明Description of drawings

为了更清楚地说明本申请实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本申请的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the accompanying drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only These are some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without any creative effort.

图1为本申请实施例所提供的一种散热系统的正面结构示意图;1 is a schematic diagram of a front structure of a heat dissipation system provided by an embodiment of the application;

图2为本申请实施例所提供的一种散热系统的透视结构示意图;FIG. 2 is a perspective structural schematic diagram of a heat dissipation system provided by an embodiment of the present application;

图3为本申请实施例所提供的另一种散热系统的透视结构示意图。FIG. 3 is a perspective structural schematic diagram of another heat dissipation system provided by an embodiment of the present application.

其中,100为温差发电器,200为冷却件,201为扰流件,202为传热轴,203为转动散热件,300为待冷却电子设备,400为冷却液容器,500为冷凝器。Among them, 100 is a thermoelectric generator, 200 is a cooling element, 201 is a spoiler, 202 is a heat transfer shaft, 203 is a rotating heat sink, 300 is an electronic device to be cooled, 400 is a coolant container, and 500 is a condenser.

具体实施方式Detailed ways

有鉴于此,本申请的核心在于提供一种散热系统,以提升电子设备的散热效率。In view of this, the core of the present application is to provide a heat dissipation system to improve the heat dissipation efficiency of an electronic device.

下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本申请一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of this application.

如图1至图3所示,本申请实施例公开了一种散热系统,包括温差发电器100和冷却件200。As shown in FIGS. 1 to 3 , an embodiment of the present application discloses a heat dissipation system, including a thermoelectric generator 100 and a cooling member 200 .

其中,温差发电器100用于设置于待冷却电子设备300的发热部位;冷却件200用于对待冷却电子设备300进行冷却;温差发电器100与冷却件200电连接,以向冷却件200提供电能。Wherein, the thermoelectric generator 100 is used to be disposed on the heat generating part of the electronic device 300 to be cooled; the cooling member 200 is used to cool the electronic device 300 to be cooled; the thermoelectric generator 100 is electrically connected to the cooling member 200 to provide electrical energy to the cooling member 200 .

本申请所公开的散热系统,将温差发电器100设置于待冷却电子设备300的发热部位,温差发电器100靠近发热部位的一侧与温差发电器100远离发热部位的一侧产生温差,通过帕尔贴效应的逆过程产生电能,由于温差发电器100与冷却件200电连接,因此,温差发电器100产生电能后,能够向冷却件200提供电能,使冷却件200对待冷却电子设备300进行冷却,不需要对冷却件200额外设置电力驱动装置,在不增加能源消耗的前提下,实现了散热效果。In the heat dissipation system disclosed in the present application, the thermoelectric generator 100 is arranged on the heat-generating part of the electronic device 300 to be cooled. The reverse process of the Meltier effect generates electric energy. Since the thermoelectric generator 100 is electrically connected to the cooling element 200 , after the thermoelectric generator 100 generates electric energy, it can provide electric energy to the cooling element 200 , so that the cooling element 200 can cool the electronic device 300 to be cooled. , the cooling element 200 does not need to be additionally provided with an electric drive device, and the heat dissipation effect is achieved on the premise of not increasing the energy consumption.

应当理解,上述温差发电器100的温差电材料可以是硅锗合金、碲化铅或者碲化铋等半导体热电材料,只要是能够满足使用需求的材料类型均属于本申请保护范围,实际应用中,可以根据待冷却电子设备300的热面温度适应性选择温差发电器100的材料类型。It should be understood that the thermoelectric material of the above-mentioned thermoelectric generator 100 may be a semiconductor thermoelectric material such as silicon germanium alloy, lead telluride or bismuth telluride. The material type of the thermoelectric generator 100 may be adaptively selected according to the temperature of the hot surface of the electronic device 300 to be cooled.

另外,本申请对上述冷却件200的数量和具体安装位置不作具体限定,实际应用中,可以根据待冷却电子设备300的散热强度和散热分布适应性调整冷却件200的数量和安装位置,只要是能够满足冷却需求的数量和安装位置均属于本申请保护范围内。In addition, the present application does not specifically limit the number and specific installation positions of the above-mentioned cooling members 200. In practical applications, the number and installation positions of the cooling members 200 can be adaptively adjusted according to the heat dissipation intensity and heat dissipation distribution of the electronic device 300 to be cooled. The number and installation positions that can meet the cooling requirements are all within the scope of protection of the present application.

进一步地,该散热系统还包括冷却液容器400,冷却液容器400中填充有冷却液,待冷却电子设备300浸没在冷却液中,以便于在冷却液浸没冷却和冷却件200的双重冷却作用下,进一步提高散热系统的冷却效率。Further, the heat dissipation system further includes a cooling liquid container 400, the cooling liquid container 400 is filled with cooling liquid, and the electronic device 300 to be cooled is immersed in the cooling liquid, so as to be immersed in the cooling liquid for cooling and under the dual cooling effect of the cooling element 200 , to further improve the cooling efficiency of the cooling system.

应当理解,本申请对上述冷却液容器400的形状和容积等参数均不作具体限定,实际应用中,可以根据待冷却电子设备300的形状和体积等参数适应性调整冷却液容器400的各项参数,只要是能够满足使用要求即可。It should be understood that the parameters such as the shape and volume of the cooling liquid container 400 are not specifically limited in this application. In practical applications, various parameters of the cooling liquid container 400 can be adaptively adjusted according to parameters such as the shape and volume of the electronic device 300 to be cooled. , as long as it can meet the usage requirements.

并且,上述冷却液可以是单相冷却液或者气液两相冷却液中的任意一种,只要是能够浸没待冷却电子设备300,对待冷却电子设备300进行浸没式冷却的冷却液均属于本申请保护范围内;可选地,本申请实施例所提供的冷却液为气液两相冷却液,并且散热系统还包括设置于冷却液的上方的冷凝器500,以通过气液两相冷却液的相变吸收热量,实现对待冷却电子设备300的降温作用,液态的冷却液吸收热量后变为气态,并通过冷凝器500冷凝后变成液态重新进入冷却液容器400中,重新吸收待冷却电子设备300的热量。In addition, the above-mentioned cooling liquid may be any one of single-phase cooling liquid or gas-liquid two-phase cooling liquid, as long as it is capable of immersing the electronic device 300 to be cooled, the cooling liquid for immersion cooling of the electronic device 300 to be cooled belongs to the present application within the protection range; optionally, the cooling liquid provided in the embodiment of the present application is a gas-liquid two-phase cooling liquid, and the heat dissipation system further includes a condenser 500 arranged above the cooling liquid to pass the gas-liquid two-phase cooling liquid. The phase change absorbs heat and realizes the cooling effect of the electronic device 300 to be cooled. The liquid cooling liquid absorbs heat and turns into a gaseous state, and after being condensed by the condenser 500, it becomes a liquid state and then enters the cooling liquid container 400 to reabsorb the electronic device to be cooled. 300 calories.

具体地,本申请所提供的冷却件200包括与温差发电器100电连接的扰流件201,以通过温差发电器100向扰流件201提供电能,使扰流件201能够运动,对冷却液容器400中的冷却液就行扰流,提高散热效率。Specifically, the cooling member 200 provided in the present application includes a spoiler 201 electrically connected to the thermoelectric generator 100, so as to provide electrical energy to the spoiler 201 through the thermoelectric generator 100, so that the spoiler 201 can move, and the cooling liquid The cooling liquid in the container 400 can be disturbed to improve the heat dissipation efficiency.

上述扰流件201的运动可以是转动、摆动或者滚动等类型,只要是能够对冷却液容器400中的冷却液进行扰流,提高散热效率的运动类型均属于本申请保护范围内。The movement of the spoiler 201 may be of rotation, swing or rolling, as long as it can disrupt the cooling liquid in the cooling liquid container 400 and improve the heat dissipation efficiency, it falls within the protection scope of the present application.

并且,上述扰流件201可以是扰流风扇、扰流板或者扰流球等类型,只要是在与温差发电器100电连接后能够发生扰流运动,对冷却液容器400中的冷却液进行扰流,提高散热效率的零件类型均属于本申请保护范围内;可选地,本申请实施例所提供的扰流件201为扰流风扇,扰流风扇的运动为转动。In addition, the spoiler 201 can be a spoiler fan, spoiler or spoiler ball, etc., as long as it can generate a spoiler motion after being electrically connected to the thermoelectric generator 100 , the cooling liquid in the cooling liquid container 400 can be affected by The types of parts that disturb the flow and improve the heat dissipation efficiency belong to the protection scope of the present application; optionally, the spoiler 201 provided in the embodiment of the present application is a spoiler fan, and the movement of the spoiler fan is rotation.

进一步地,冷却件200还包括传热轴202,传热轴202贯穿冷却液容器400的内侧和外侧,至少用于将冷却液容器400内的热量传递至冷却液容器400的外侧,进一步提高该散热系统的散热效率。Further, the cooling member 200 further includes a heat transfer shaft 202, the heat transfer shaft 202 penetrates the inner side and the outer side of the cooling liquid container 400, and is at least used for transferring the heat in the cooling liquid container 400 to the outer side of the cooling liquid container 400, so as to further improve the The cooling efficiency of the cooling system.

应当理解,上述传热轴202可仅用于将冷却液容器400内的热量传递至冷却液容器400的外侧,也可以在将冷却液容器400内的热量传递至冷却液容器400外侧时,兼顾支撑扰流件201的作用;可选地,本申请所提供的传热轴202一方面用于将冷却液容器400内的热量传递至冷却液容器400的外侧,另一方面,用于支撑扰流件201,起到一件多用,不需要额外设置用于支撑扰流件201的支撑件的作用。It should be understood that the above-mentioned heat transfer shaft 202 can only be used to transfer the heat in the cooling liquid container 400 to the outside of the cooling liquid container 400 , and can also take into account when transferring the heat in the cooling liquid container 400 to the outside of the cooling liquid container 400 The function of supporting the spoiler 201; optionally, the heat transfer shaft 202 provided in the present application is used to transfer the heat in the cooling liquid container 400 to the outside of the cooling liquid container 400 on the one hand, and, on the other hand, is used to support the spoiler The flow piece 201 serves as a multi-purpose piece, and there is no need to additionally provide a supporting piece for supporting the spoiler 201 .

冷却件200还包转动散热件203,转动散热件203设置于传热轴202露出冷却液容器400的一端,扰流件201设置于传热轴202位于冷却液容器400的一端,传热轴202转动连接于冷却液容器400,以通过扰流件201带动传热轴202和转动散热件203转动,通过转动散热件203的转动加快传热轴202露出冷却液容器400一端的空气流动,防止局部过热影响散热效果。The cooling member 200 also includes a rotating heat dissipation member 203. The rotating heat dissipation member 203 is disposed on the end of the heat transfer shaft 202 that exposes the cooling liquid container 400, and the spoiler 201 is disposed on the heat transfer shaft 202 at one end of the cooling liquid container 400. The heat transfer shaft 202 It is rotatably connected to the cooling liquid container 400 to drive the heat transfer shaft 202 and the rotating heat dissipation member 203 to rotate through the spoiler 201, and the rotation of the rotating heat dissipation member 203 accelerates the air flow of the end of the heat transfer shaft 202 exposed to the cooling liquid container 400, preventing local Overheating affects the cooling effect.

本申请所提供的散热系统还包括密封件,密封件设置于冷却液容器400安装传热轴202的部位,以对冷却液容器400起到密封作用,防止漏液。The heat dissipation system provided by the present application further includes a sealing member, which is disposed at the position where the cooling liquid container 400 is installed with the heat transfer shaft 202 to seal the cooling liquid container 400 and prevent liquid leakage.

上述密封件可以是橡胶密封件、机械密封件或者密封胶等类型,只要是能够满足密封要求的类型均属于本申请保护范围内。The above-mentioned seals may be of types such as rubber seals, mechanical seals, or sealants, as long as they can meet the sealing requirements, they all fall within the scope of protection of the present application.

另外,本申请所提供的传热轴202的外壁设置有导热薄膜,导热薄膜贯穿冷却液容器400的内侧和外侧,以便于通过导热薄膜的高导热性,将冷却液容器400内的热量带出冷却液容器400外,进一步提高散热效率。In addition, the outer wall of the heat transfer shaft 202 provided by the present application is provided with a thermally conductive film, and the thermally conductive film penetrates the inner and outer sides of the cooling liquid container 400, so that the heat in the cooling liquid container 400 can be taken out through the high thermal conductivity of the thermally conductive film. In addition to the cooling liquid container 400, the heat dissipation efficiency is further improved.

应当理解,上述导热薄膜可以是石墨烯薄膜、聚酰亚胺与石墨烯复合膜或者石墨烯与纳米纤维素复合膜等类型,只要是具有高导热性,有利于将冷却液容器400内的热量带出冷却液容器400外的材料类型均属于本申请保护范围内。It should be understood that the above-mentioned thermally conductive film can be a graphene film, a polyimide and graphene composite film, or a graphene and nanocellulose composite film. The types of materials taken out of the coolant container 400 all fall within the scope of protection of the present application.

本申请所提供的冷却件200在冷却液容器400内的高度能够调节,以便于根据不同的待冷却电子设备300调节冷却液容器400内的冷却液高度后,适应性调节冷却件200的高度,使冷却件200位于适合散热的最佳高度,便于提高散热效率。The height of the cooling member 200 provided in the present application in the cooling liquid container 400 can be adjusted, so that after adjusting the height of the cooling liquid in the cooling liquid container 400 according to different electronic devices 300 to be cooled, the height of the cooling member 200 can be adjusted adaptively, The cooling member 200 is located at an optimum height suitable for heat dissipation, so as to improve the heat dissipation efficiency.

具体地,本申请一具体实施例中,可以将传热轴202设计为伸缩轴,实现高度调整,本申请另一具体实施例中,冷却件200通过额外设置的支架支撑,通过将支架设计为伸缩支架实现高度调整。Specifically, in a specific embodiment of the present application, the heat transfer shaft 202 can be designed as a telescopic shaft to realize height adjustment. In another specific embodiment of the present application, the cooling element 200 is supported by an additionally provided bracket, and the bracket is designed as Telescopic stand for height adjustment.

将待冷却电子设备300应用于该散热系统时,第一,将待冷却电子设备300的发热源浸入冷却液中,利用冷却液的相变进行降温,实现对待冷却电子设备300的散热;第二,温差发电器100设置在待冷却电子设备300的高温部位,温差发电器100的两侧分别吸收热量和放出热量,温差产生电压,从而带动扰流风扇转动,通过传热轴202的连接,使扰流风扇和转动散热件203为同轴,扰流风扇转动带动转动散热件203转动,实现在不增加外部能源消耗的前提下,利用电子设备本身的热量转化为扰流风扇的动能,提高散热效率;第三,利用传热轴202上设置的导热薄膜,将冷却液容器400内的热量带出冷却液容器400外,进一步提高散热效率。When the electronic device 300 to be cooled is applied to the cooling system, first, the heat source of the electronic device 300 to be cooled is immersed in the cooling liquid, and the phase change of the cooling liquid is used to cool down, so as to realize the heat dissipation of the electronic device 300 to be cooled; second , the thermoelectric generator 100 is arranged at the high temperature part of the electronic device 300 to be cooled, the two sides of the thermoelectric generator 100 absorb heat and release heat respectively, and the temperature difference generates a voltage, thereby driving the spoiler fan to rotate, and through the connection of the heat transfer shaft 202, the The spoiler fan and the rotating heat sink 203 are coaxial, and the rotation of the spoiler fan drives the rotation of the rotating heat sink 203, so that the heat of the electronic device itself can be converted into the kinetic energy of the spoiler fan without increasing the external energy consumption, and the heat dissipation can be improved. Efficiency; thirdly, the heat in the cooling liquid container 400 is taken out of the cooling liquid container 400 by using the thermally conductive film provided on the heat transfer shaft 202 to further improve the heat dissipation efficiency.

此外,本申请还公开了一种电子设备,应用如上任意一项所述的散热系统,因此,兼顾了上述散热系统的所有技术效果,本文在此不再一一赘述。In addition, the present application also discloses an electronic device that applies the heat dissipation system described in any one of the above. Therefore, all the technical effects of the above heat dissipation system are taken into account, which will not be repeated here.

应当理解,上述电子设备可以是服务器、主机或者机柜等类型,因此,本申请对该散热系统的应用领域不作具体限定。It should be understood that the above-mentioned electronic device may be a server, a host, or a cabinet, and therefore, the application field of the cooling system is not specifically limited in this application.

本申请的说明书和权利要求书及上述附图中的术语“第一”和“第二”等是用于区别不同的对象,而不是用于描述特定的顺序。此外术语“包括”和“具有”以及他们任何变形,意图在于覆盖不排他的包含。例如包含了一系列步骤或单元的过程、方法、系统、产品或设备没有设定于已列出的步骤或单元,而是可包括没有列出的步骤或单元。The terms "first" and "second" in the description and claims of the present application and the above drawings are used to distinguish different objects, rather than to describe a specific order. Furthermore, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or elements is not provided with the listed steps or elements, but may include unlisted steps or elements.

对所公开的实施例的上述说明,使本领域专业技术人员能够实现或使用本申请。对这些实施例的多种修改对本领域的专业技术人员来说将是显而易见的,本文中所定义的一般原理可以在不脱离本申请的精神或范围的情况下,在其它实施例中实现。因此,本申请将不会被限制于本文所示的这些实施例,而是要符合与本文所公开的原理和新颖特点相一致的最宽的范围。The above description of the disclosed embodiments enables any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, this application is not intended to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (10)

1. A heat dissipation system, comprising:
the thermoelectric generator is arranged at a heating part of the electronic equipment to be cooled;
the cooling piece is used for cooling the electronic equipment to be cooled;
wherein the thermoelectric generator is electrically connected with the cooling member to supply electric power to the cooling member.
2. The heat dissipation system as defined in claim 1, further comprising a coolant container filled with a coolant in which the electronic device to be cooled is immersed.
3. The heat dissipating system of claim 2, the cooling element comprising a spoiler electrically connected to the thermoelectric generator.
4. The heat dissipating system of claim 3, the cooling element further comprising a heat transfer shaft extending through the inside and outside of the coolant container at least for transferring heat within the coolant container to the outside of the coolant container.
5. The heat dissipation system of claim 4, wherein the cooling element further comprises a rotational heat sink disposed at an end of the heat transfer shaft exposed from the cooling liquid container, and the spoiler is disposed at an end of the heat transfer shaft located at the cooling liquid container, and the heat transfer shaft is rotationally connected to the cooling liquid container to drive the heat transfer shaft and the rotational heat sink to rotate via the spoiler.
6. The heat dissipating system of claim 5, further comprising a seal disposed at a location of the coolant container where the heat transfer shaft is mounted.
7. The heat dissipating system of claim 4, the outer wall of the heat transfer shaft being provided with thermally conductive films that extend through the inside and outside of the coolant container.
8. The heat dissipating system of claim 2, wherein a height of the cooling element within the cooling fluid container is adjustable.
9. The heat dissipating system of claim 2, the coolant being a gas-liquid two-phase coolant, further comprising a condenser disposed above the coolant.
10. An electronic device to which the heat dissipation system according to any one of claims 1 to 9 is applied.
CN202210222480.0A 2022-03-09 2022-03-09 Heat dissipation system and electronic equipment Pending CN114554804A (en)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202649906U (en) * 2012-05-24 2013-01-02 东华大学 Notebook thermal preservation device provided with modified structure and based on temperature difference power generation
CN104638982A (en) * 2015-03-05 2015-05-20 广州威能机电有限公司 Thermoelectric generator
CN108684197A (en) * 2018-07-26 2018-10-19 京东方科技集团股份有限公司 A kind of electronic equipment and its cooling control method
CN111782024A (en) * 2020-08-21 2020-10-16 黄河水利职业技术学院 A heat dissipation structure for a computer
CN113253819A (en) * 2021-05-17 2021-08-13 西安交通大学 Waste heat recovery type submergence formula phase transition cooling system
CN114007381A (en) * 2021-10-25 2022-02-01 苏州浪潮智能科技有限公司 An immersion liquid cooling system

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202649906U (en) * 2012-05-24 2013-01-02 东华大学 Notebook thermal preservation device provided with modified structure and based on temperature difference power generation
CN104638982A (en) * 2015-03-05 2015-05-20 广州威能机电有限公司 Thermoelectric generator
CN108684197A (en) * 2018-07-26 2018-10-19 京东方科技集团股份有限公司 A kind of electronic equipment and its cooling control method
CN111782024A (en) * 2020-08-21 2020-10-16 黄河水利职业技术学院 A heat dissipation structure for a computer
CN113253819A (en) * 2021-05-17 2021-08-13 西安交通大学 Waste heat recovery type submergence formula phase transition cooling system
CN114007381A (en) * 2021-10-25 2022-02-01 苏州浪潮智能科技有限公司 An immersion liquid cooling system

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