CN114507080A - 一种高韧性陶瓷薄板及其制备方法 - Google Patents
一种高韧性陶瓷薄板及其制备方法 Download PDFInfo
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- CN114507080A CN114507080A CN202210147372.1A CN202210147372A CN114507080A CN 114507080 A CN114507080 A CN 114507080A CN 202210147372 A CN202210147372 A CN 202210147372A CN 114507080 A CN114507080 A CN 114507080A
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- 239000000919 ceramic Substances 0.000 title claims abstract description 45
- 238000002360 preparation method Methods 0.000 title description 19
- 239000002070 nanowire Substances 0.000 claims abstract description 76
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 64
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 42
- 239000010439 graphite Substances 0.000 claims abstract description 42
- 238000005245 sintering Methods 0.000 claims abstract description 39
- 239000002131 composite material Substances 0.000 claims abstract description 36
- 239000000835 fiber Substances 0.000 claims abstract description 36
- 239000000843 powder Substances 0.000 claims abstract description 36
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 28
- 239000000463 material Substances 0.000 claims abstract description 20
- 239000004113 Sepiolite Substances 0.000 claims abstract description 18
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 18
- 239000002994 raw material Substances 0.000 claims abstract description 18
- 229910052624 sepiolite Inorganic materials 0.000 claims abstract description 18
- 235000019355 sepiolite Nutrition 0.000 claims abstract description 18
- 229910052878 cordierite Inorganic materials 0.000 claims abstract description 17
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 claims abstract description 17
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 17
- 239000000395 magnesium oxide Substances 0.000 claims abstract description 15
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims abstract description 15
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims abstract description 15
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 claims description 72
- 238000003756 stirring Methods 0.000 claims description 54
- 239000000440 bentonite Substances 0.000 claims description 43
- 229910000278 bentonite Inorganic materials 0.000 claims description 43
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 claims description 43
- 229910052751 metal Inorganic materials 0.000 claims description 32
- 239000002184 metal Substances 0.000 claims description 32
- 238000001354 calcination Methods 0.000 claims description 26
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 24
- 238000001035 drying Methods 0.000 claims description 24
- IXPNQXFRVYWDDI-UHFFFAOYSA-N 1-methyl-2,4-dioxo-1,3-diazinane-5-carboximidamide Chemical compound CN1CC(C(N)=N)C(=O)NC1=O IXPNQXFRVYWDDI-UHFFFAOYSA-N 0.000 claims description 20
- 229920001661 Chitosan Polymers 0.000 claims description 20
- 235000010413 sodium alginate Nutrition 0.000 claims description 20
- 229940005550 sodium alginate Drugs 0.000 claims description 20
- 239000000661 sodium alginate Substances 0.000 claims description 20
- 238000002156 mixing Methods 0.000 claims description 18
- 238000005406 washing Methods 0.000 claims description 18
- VYFYYTLLBUKUHU-UHFFFAOYSA-N dopamine Chemical compound NCCC1=CC=C(O)C(O)=C1 VYFYYTLLBUKUHU-UHFFFAOYSA-N 0.000 claims description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 14
- 230000004048 modification Effects 0.000 claims description 13
- 238000012986 modification Methods 0.000 claims description 13
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 12
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 239000004115 Sodium Silicate Substances 0.000 claims description 12
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 12
- 230000036632 reaction speed Effects 0.000 claims description 12
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims description 12
- 229910052911 sodium silicate Inorganic materials 0.000 claims description 12
- 238000000465 moulding Methods 0.000 claims description 11
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 10
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 10
- 239000011591 potassium Substances 0.000 claims description 10
- 229910052700 potassium Inorganic materials 0.000 claims description 10
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 10
- 229960003638 dopamine Drugs 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- 239000002202 Polyethylene glycol Substances 0.000 claims description 6
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 claims description 6
- 229960000583 acetic acid Drugs 0.000 claims description 6
- 229910001870 ammonium persulfate Inorganic materials 0.000 claims description 6
- 239000008367 deionised water Substances 0.000 claims description 6
- 229910021641 deionized water Inorganic materials 0.000 claims description 6
- 239000006185 dispersion Substances 0.000 claims description 6
- 239000012362 glacial acetic acid Substances 0.000 claims description 6
- 229920001223 polyethylene glycol Polymers 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 6
- 238000009210 therapy by ultrasound Methods 0.000 claims description 6
- 238000001132 ultrasonic dispersion Methods 0.000 claims description 6
- 238000000227 grinding Methods 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 8
- 239000013078 crystal Substances 0.000 description 8
- 239000011574 phosphorus Substances 0.000 description 8
- 229910052698 phosphorus Inorganic materials 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 6
- 238000002715 modification method Methods 0.000 description 5
- 239000004927 clay Substances 0.000 description 3
- 238000011049 filling Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000005543 nano-size silicon particle Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 241000446313 Lamella Species 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000010433 feldspar Substances 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 150000003017 phosphorus Chemical class 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
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Abstract
本发明公开了一种高韧性陶瓷薄板，包括以下重量份原料：堇青石40‑50份、碳化硅20‑30份、石墨烯纤维10‑20份、海泡石纤维10‑20份、改性磷片石墨5‑10份、纳米线复合粉2‑6份、杂化晶须体1‑3份、氧化镁烧结剂1‑5份。本发明高韧性陶瓷薄板采用堇青石、碳化硅配合石墨烯纤维、海泡石纤维和改性磷片石墨、纳米线复合粉、杂化晶须体等原料烧结成陶瓷薄板，制备的烧结料具有优异的韧性性能。
Description
技术领域
本发明涉及陶瓷薄板技术领域，具体涉及一种高韧性陶瓷薄板及其制备方法。
背景技术
陶瓷薄板(简称薄瓷板)是一种由高岭土黏土和其它无机非金属材料，经成形、经1200度高温煅烧等生产工艺制成的板状陶瓷制品。陶瓷薄板是由粘土和其他无机非金属材料经成型、高温烧成等工艺制备而成的板状陶瓷制品。陶瓷薄板的原料通常包含粘土、石英、长石等矿物，坯体经过高温烧成后形成以玻璃相、石英和莫来石为主要组成的致密体。
现有的陶瓷薄板韧性性能差，受到冲击后，容易损坏，限制了其使用效果，基于此，本发明提供一种高韧性陶瓷薄板。
发明内容
针对现有技术的缺陷，本发明的目的是提供一种高韧性陶瓷薄板及其制备方法，以解决上述背景技术中提出的问题。
本发明解决技术问题采用如下技术方案：
本发明提供了一种高韧性陶瓷薄板，包括以下重量份原料：
堇青石40-50份、碳化硅20-30份、石墨烯纤维10-20份、海泡石纤维10-20份、改性磷片石墨5-10份、纳米线复合粉2-6份、杂化晶须体1-3份、氧化镁烧结剂1-5份。
优选地，所述高韧性陶瓷薄板包括以下重量份原料：
堇青石40-50份、碳化硅20-30份、石墨烯纤维10-20份、海泡石纤维10-20份、改性磷片石墨5-10份、纳米线复合粉2-6份、杂化晶须体1-3份、氧化镁烧结剂1-5份。
优选地，所述改性磷片石墨的改性方法为：
S1：将冰醋酸与壳聚糖配比制成质量分数10%的壳聚糖溶液，然后将壳聚糖溶液按照重量比1:5加入到海藻酸钠溶液中，搅拌至充分，得到改性液；
S2：将膨润土送入到300-500℃下反应20-30min，反应结束，以1-3℃/min的速率降至70-90℃，然后加入到改性液中进行搅拌分散处理，搅拌转速为500r/min，搅拌时间为30-40min，搅拌结束，水洗、干燥，送入到研磨机中研磨过100-300目，得到膨润土剂；
S3：将10-20份磷片石墨送入到30-40份质量分数5%的盐酸溶液中浸泡20-30min，然后再加入1-5份过硫酸铵、1-3份十二烷基硫酸钠，随后再加入1-7份膨润土剂，于80-90℃下反应20-30min，反应转速为500-800r/min，反应结束，得到改性磷片石墨。
优选地，所述海藻酸钠溶液为海藻酸钠、乙醇、聚乙二醇按照重量比2:7:1配制而成。
优选地，所述纳米线复合粉的制备方法为：
将金属氧化锰纳米线进行改性处理，然后送入到1-2倍的纳米硅藻土中，再送入到去离子水中进行超声分散处理，超声功率为100-500W，超声时间为20-30min，超声结束，水洗、干燥，然后于管式炉中进行煅烧处理，煅烧温度为400-500℃，煅烧时间为30-40min，煅烧结束，得到纳米线复合粉。
优选地，所述改性处理的具体操作步骤为：
将金属氧化锰纳米线按照重量比1:5加入到硅酸钠溶液中，于65-75℃下反应20-30min，反应转速为400-600r/min，随后再加入盐酸调节pH至5.0，反应结束，再干燥，即可。
优选地，所述硅酸钠溶液的质量分数为20-30%。
优选地，所述杂化晶须体的制备方法为：
将氮化硅晶须、六钛酸钾晶须按照重量比3:1混合，然后加入到质量分数10-20%的多巴胺溶液中进行搅拌分散处理，搅拌转速为100-700r/min，搅拌时间为20-30min，搅拌结束，水洗、干燥，得到杂化晶须体。
本发明还提供了一种高韧性陶瓷薄板的制备方法，包括以下步骤：
步骤一，将堇青石、碳化硅、石墨烯纤维、海泡石纤维、改性磷片石墨、纳米线复合粉、杂化晶须体、氧化镁烧结剂依次搅拌混合至充分，得到待烧结料；
步骤二，将待烧结料压制成型，然后置于烧结炉中进行烧结处理，烧结温度为1350℃，烧结结束，得到高韧性陶瓷薄板。
优选地，所述压制成型的压力为20-30MPa。
与现有技术相比，本发明具有如下的有益效果：
1、本发明高韧性陶瓷薄板采用堇青石、碳化硅配合石墨烯纤维、海泡石纤维和改性磷片石墨、纳米线复合粉、杂化晶须体等原料烧结成陶瓷薄板，制备的烧结料具有优异的韧性性能。
2、通过石墨烯纤维、海泡石纤维的配合，引入纤维材料，提高产品的韧性性能，而磷片石墨具有磷片状，经过膨润土剂改性后，磷片石墨的韧性得到改进，这是由于膨润土剂采用壳聚糖、海藻酸钠柔化后，以及经过煅烧处理后，韧性增强，层间距可缓冲，再受到外界冲压后，磷片石墨穿插在片层中，相互配合，缓冲性能得到改进。
3、纳米线复合粉采用金属氧化锰纳米线改性处理，被高比表面积的纳米二氧化硅包覆，穿透到多孔的硅藻土，将其穿插串联，从而排列在原料中，提高原料之间的填充紧密度。
4、氮化硅晶须、六钛酸钾晶须经过多巴胺溶液改性后，与产品原料相容度提高，从而分布再产品中，性能得到进一步的改进。
具体实施方式
下面结合具体实施例，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
实施例1.
本实施例的一种高韧性陶瓷薄板，包括以下重量份原料：
堇青石40份、碳化硅20份、石墨烯纤维10份、海泡石纤维10份、改性磷片石墨5份、纳米线复合粉2份、杂化晶须体1份、氧化镁烧结剂1份。
本实施例的改性磷片石墨的改性方法为：
S1：将冰醋酸与壳聚糖配比制成质量分数10%的壳聚糖溶液，然后将壳聚糖溶液按照重量比1:5加入到海藻酸钠溶液中，搅拌至充分，得到改性液；
S2：将膨润土送入到300℃下反应20min，反应结束，以1℃/min的速率降至70℃，然后加入到改性液中进行搅拌分散处理，搅拌转速为500r/min，搅拌时间为30min，搅拌结束，水洗、干燥，送入到研磨机中研磨过100目，得到膨润土剂；
S3：将10份磷片石墨送入到30份质量分数5%的盐酸溶液中浸泡20min，然后再加入1份过硫酸铵、1份十二烷基硫酸钠，随后再加入1份膨润土剂，于80℃下反应20min，反应转速为500r/min，反应结束，得到改性磷片石墨。
本实施例的海藻酸钠溶液为海藻酸钠、乙醇、聚乙二醇按照重量比2:7:1配制而成。
本实施例的纳米线复合粉的制备方法为：
将金属氧化锰纳米线进行改性处理，然后送入到1倍的纳米硅藻土中，再送入到去离子水中进行超声分散处理，超声功率为100W，超声时间为20min，超声结束，水洗、干燥，然后于管式炉中进行煅烧处理，煅烧温度为400℃，煅烧时间为30min，煅烧结束，得到纳米线复合粉。
本实施例的改性处理的具体操作步骤为：
将金属氧化锰纳米线按照重量比1:5加入到硅酸钠溶液中，于65℃下反应20min，反应转速为400r/min，随后再加入盐酸调节pH至5.0，反应结束，再干燥，即可。
本实施例的硅酸钠溶液的质量分数为20%。
本实施例的杂化晶须体的制备方法为：
将氮化硅晶须、六钛酸钾晶须按照重量比3:1混合，然后加入到质量分数10%的多巴胺溶液中进行搅拌分散处理，搅拌转速为100r/min，搅拌时间为20min，搅拌结束，水洗、干燥，得到杂化晶须体。
本实施例的一种高韧性陶瓷薄板的制备方法，包括以下步骤：
步骤一，将堇青石、碳化硅、石墨烯纤维、海泡石纤维、改性磷片石墨、纳米线复合粉、杂化晶须体、氧化镁烧结剂依次搅拌混合至充分，得到待烧结料；
步骤二，将待烧结料压制成型，然后置于烧结炉中进行烧结处理，烧结温度为1350℃，烧结结束，得到高韧性陶瓷薄板。
本实施例的压制成型的压力为20MPa。
实施例2.
本实施例的一种高韧性陶瓷薄板，包括以下重量份原料：
堇青石50份、碳化硅30份、石墨烯纤维20份、海泡石纤维20份、改性磷片石墨10份、纳米线复合粉6份、杂化晶须体3份、氧化镁烧结剂5份。
本实施例的改性磷片石墨的改性方法为：
S1：将冰醋酸与壳聚糖配比制成质量分数10%的壳聚糖溶液，然后将壳聚糖溶液按照重量比1:5加入到海藻酸钠溶液中，搅拌至充分，得到改性液；
S2：将膨润土送入到500℃下反应30min，反应结束，以3℃/min的速率降至90℃，然后加入到改性液中进行搅拌分散处理，搅拌转速为500r/min，搅拌时间为40min，搅拌结束，水洗、干燥，送入到研磨机中研磨过300目，得到膨润土剂；
S3：将20份磷片石墨送入到40份质量分数5%的盐酸溶液中浸泡30min，然后再加入5份过硫酸铵、3份十二烷基硫酸钠，随后再加入7份膨润土剂，于90℃下反应30min，反应转速为800r/min，反应结束，得到改性磷片石墨。
本实施例的海藻酸钠溶液为海藻酸钠、乙醇、聚乙二醇按照重量比2:7:1配制而成。
本实施例的纳米线复合粉的制备方法为：
将金属氧化锰纳米线进行改性处理，然后送入到2倍的纳米硅藻土中，再送入到去离子水中进行超声分散处理，超声功率为500W，超声时间为30min，超声结束，水洗、干燥，然后于管式炉中进行煅烧处理，煅烧温度为500℃，煅烧时间为40min，煅烧结束，得到纳米线复合粉。
本实施例的改性处理的具体操作步骤为：
将金属氧化锰纳米线按照重量比1:5加入到硅酸钠溶液中，于75℃下反应30min，反应转速为600r/min，随后再加入盐酸调节pH至5.0，反应结束，再干燥，即可。
本实施例的硅酸钠溶液的质量分数为30%。
本实施例的杂化晶须体的制备方法为：
将氮化硅晶须、六钛酸钾晶须按照重量比3:1混合，然后加入到质量分数20%的多巴胺溶液中进行搅拌分散处理，搅拌转速为700r/min，搅拌时间为30min，搅拌结束，水洗、干燥，得到杂化晶须体。
本实施例的一种高韧性陶瓷薄板的制备方法，包括以下步骤：
步骤一，将堇青石、碳化硅、石墨烯纤维、海泡石纤维、改性磷片石墨、纳米线复合粉、杂化晶须体、氧化镁烧结剂依次搅拌混合至充分，得到待烧结料；
步骤二，将待烧结料压制成型，然后置于烧结炉中进行烧结处理，烧结温度为1350℃，烧结结束，得到高韧性陶瓷薄板。
本实施例的压制成型的压力为30MPa。
实施例3.
本实施例的一种高韧性陶瓷薄板，包括以下重量份原料：
堇青石40-50份、碳化硅20-30份、石墨烯纤维10-20份、海泡石纤维10-20份、改性磷片石墨5-10份、纳米线复合粉2-6份、杂化晶须体1-3份、氧化镁烧结剂1-5份。
本实施例的改性磷片石墨的改性方法为：
S1：将冰醋酸与壳聚糖配比制成质量分数10%的壳聚糖溶液，然后将壳聚糖溶液按照重量比1:5加入到海藻酸钠溶液中，搅拌至充分，得到改性液；
S2：将膨润土送入到400℃下反应25min，反应结束，以2℃/min的速率降至80℃，然后加入到改性液中进行搅拌分散处理，搅拌转速为500r/min，搅拌时间为35min，搅拌结束，水洗、干燥，送入到研磨机中研磨过200目，得到膨润土剂；
S3：将15份磷片石墨送入到35份质量分数5%的盐酸溶液中浸泡25min，然后再加入3份过硫酸铵、2份十二烷基硫酸钠，随后再加入1-7份膨润土剂，于85℃下反应25min，反应转速为650r/min，反应结束，得到改性磷片石墨。
本实施例的海藻酸钠溶液为海藻酸钠、乙醇、聚乙二醇按照重量比2:7:1配制而成。
本实施例的纳米线复合粉的制备方法为：
将金属氧化锰纳米线进行改性处理，然后送入到1.5倍的纳米硅藻土中，再送入到去离子水中进行超声分散处理，超声功率为300W，超声时间为25min，超声结束，水洗、干燥，然后于管式炉中进行煅烧处理，煅烧温度为450℃，煅烧时间为35min，煅烧结束，得到纳米线复合粉。
本实施例的改性处理的具体操作步骤为：
将金属氧化锰纳米线按照重量比1:5加入到硅酸钠溶液中，于70℃下反应25min，反应转速为500r/min，随后再加入盐酸调节pH至5.0，反应结束，再干燥，即可。
本实施例的硅酸钠溶液的质量分数为25%。
本实施例的杂化晶须体的制备方法为：
将氮化硅晶须、六钛酸钾晶须按照重量比3:1混合，然后加入到质量分数15%的多巴胺溶液中进行搅拌分散处理，搅拌转速为350r/min，搅拌时间为25min，搅拌结束，水洗、干燥，得到杂化晶须体。
本实施例的一种高韧性陶瓷薄板的制备方法，包括以下步骤：
步骤一，将堇青石、碳化硅、石墨烯纤维、海泡石纤维、改性磷片石墨、纳米线复合粉、杂化晶须体、氧化镁烧结剂依次搅拌混合至充分，得到待烧结料；
步骤二，将待烧结料压制成型，然后置于烧结炉中进行烧结处理，烧结温度为1350℃，烧结结束，得到高韧性陶瓷薄板。
本实施例的压制成型的压力为25MPa。
实施例4.
本实施例的一种高韧性陶瓷薄板，包括以下重量份原料：
堇青石42份、碳化硅22份、石墨烯纤维13份、海泡石纤维13份、改性磷片石墨6份、纳米线复合粉3份、杂化晶须体1.2份、氧化镁烧结剂2份。
本实施例的改性磷片石墨的改性方法为：
S1：将冰醋酸与壳聚糖配比制成质量分数10%的壳聚糖溶液，然后将壳聚糖溶液按照重量比1:5加入到海藻酸钠溶液中，搅拌至充分，得到改性液；
S2：将膨润土送入到350℃下反应22min，反应结束，以1.2℃/min的速率降至75℃，然后加入到改性液中进行搅拌分散处理，搅拌转速为500r/min，搅拌时间为32min，搅拌结束，水洗、干燥，送入到研磨机中研磨过120目，得到膨润土剂；
S3：将12份磷片石墨送入到33份质量分数5%的盐酸溶液中浸泡22min，然后再加入2份过硫酸铵、2份十二烷基硫酸钠，随后再加入2份膨润土剂，于82℃下反应23min，反应转速为550r/min，反应结束，得到改性磷片石墨。
本实施例的海藻酸钠溶液为海藻酸钠、乙醇、聚乙二醇按照重量比2:7:1配制而成。
本实施例的纳米线复合粉的制备方法为：
将金属氧化锰纳米线进行改性处理，然后送入到1-2倍的纳米硅藻土中，再送入到去离子水中进行超声分散处理，超声功率为200W，超声时间为22min，超声结束，水洗、干燥，然后于管式炉中进行煅烧处理，煅烧温度为420℃，煅烧时间为33min，煅烧结束，得到纳米线复合粉。
本实施例的改性处理的具体操作步骤为：
将金属氧化锰纳米线按照重量比1:5加入到硅酸钠溶液中，于67℃下反应23min，反应转速为450r/min，随后再加入盐酸调节pH至5.0，反应结束，再干燥，即可。
本实施例的硅酸钠溶液的质量分数为22%。
本实施例的杂化晶须体的制备方法为：
将氮化硅晶须、六钛酸钾晶须按照重量比3:1混合，然后加入到质量分数13%的多巴胺溶液中进行搅拌分散处理，搅拌转速为200r/min，搅拌时间为23min，搅拌结束，水洗、干燥，得到杂化晶须体。
本实施例的一种高韧性陶瓷薄板的制备方法，包括以下步骤：
步骤一，将堇青石、碳化硅、石墨烯纤维、海泡石纤维、改性磷片石墨、纳米线复合粉、杂化晶须体、氧化镁烧结剂依次搅拌混合至充分，得到待烧结料；
步骤二，将待烧结料压制成型，然后置于烧结炉中进行烧结处理，烧结温度为1350℃，烧结结束，得到高韧性陶瓷薄板。
本实施例的压制成型的压力为23MPa。
对比例1.
与实施例3不同是未加入改性磷片石墨。
对比例2.
与实施例3不同是未加入纳米线复合粉。
对比例3.
与实施例3不同是未加入纳米线复合粉和杂化晶须体。
对比例4.
与实施例3不同是改性磷片石墨制备中未加入膨润土。
本发明实施例1-4及对比例1-4的产品强度性能如下
从实施例1-4及对比例1-4可看出，本发明产品具有优异的韧性性能，通过纳米线复合粉和杂化晶须体的配合使用，可显著增强产品的韧性性能。
磷片石墨具有磷片状，经过膨润土剂改性后，磷片石墨的韧性得到改进，这是由于膨润土剂采用壳聚糖、海藻酸钠柔化后，以及经过煅烧处理后，韧性增强，层间距可缓冲，再受到外界冲压后，磷片石墨穿插在片层中，相互配合，缓冲性能得到改进；纳米线复合粉采用金属氧化锰纳米线改性处理，被高比表面积的纳米二氧化硅包覆，穿透到多孔的硅藻土，将其穿插串联，从而排列在原料中，提高原料之间的填充紧密度；而氮化硅晶须、六钛酸钾晶须经过多巴胺溶液改性后，与产品原料相容度提高，从而分布再产品中，性能得到进一步的改进。
对于本领域技术人员而言，显然本发明不限于上述示范性实施例的细节，而且在不背离本发明的精神或基本特征的情况下，能够以其他的具体形式实现本发明。因此，无论从哪一点来看，均应将实施例看作是示范性的，而且是非限制性的，本发明的范围由所附权利要求而不是上述说明限定，因此旨在将落在权利要求的等同要件的含义和范围内的所有变化囊括在本发明内。
此外，应当理解，虽然本说明书按照实施方式加以描述，但并非每个实施方式仅包含一个独立的技术方案，说明书的这种叙述方式仅仅是为清楚起见，本领域技术人员应当将说明书作为一个整体，各实施例中的技术方案也可以经适当组合，形成本领域技术人员可以理解的其他实施方式。
Claims (10)
1.一种高韧性陶瓷薄板，其特征在于，包括以下重量份原料：
堇青石40-50份、碳化硅20-30份、石墨烯纤维10-20份、海泡石纤维10-20份、改性磷片石墨5-10份、纳米线复合粉2-6份、杂化晶须体1-3份、氧化镁烧结剂1-5份。
2.根据权利要求1所述高韧性陶瓷薄板，其特征在于，所述高韧性陶瓷薄板包括以下重量份原料：
堇青石40-50份、碳化硅20-30份、石墨烯纤维10-20份、海泡石纤维10-20份、改性磷片石墨5-10份、纳米线复合粉2-6份、杂化晶须体1-3份、氧化镁烧结剂1-5份。
3.根据权利要求2所述高韧性陶瓷薄板，其特征在于，所述改性磷片石墨的改性方法为：
S1：将冰醋酸与壳聚糖配比制成质量分数10%的壳聚糖溶液，然后将壳聚糖溶液按照重量比1:5加入到海藻酸钠溶液中，搅拌至充分，得到改性液；
S2：将膨润土送入到300-500℃下反应20-30min，反应结束，以1-3℃/min的速率降至70-90℃，然后加入到改性液中进行搅拌分散处理，搅拌转速为500r/min，搅拌时间为30-40min，搅拌结束，水洗、干燥，送入到研磨机中研磨过100-300目，得到膨润土剂；
S3：将10-20份磷片石墨送入到30-40份质量分数5%的盐酸溶液中浸泡20-30min，然后再加入1-5份过硫酸铵、1-3份十二烷基硫酸钠，随后再加入1-7份膨润土剂，于80-90℃下反应20-30min，反应转速为500-800r/min，反应结束，得到改性磷片石墨。
4.根据权利要求3所述高韧性陶瓷薄板，其特征在于，所述海藻酸钠溶液为海藻酸钠、乙醇、聚乙二醇按照重量比2:7:1配制而成。
5.根据权利要1所述高韧性陶瓷薄板，其特征在于，所述纳米线复合粉的制备方法为：
将金属氧化锰纳米线进行改性处理，然后送入到1-2倍的纳米硅藻土中，再送入到去离子水中进行超声分散处理，超声功率为100-500W，超声时间为20-30min，超声结束，水洗、干燥，然后于管式炉中进行煅烧处理，煅烧温度为400-500℃，煅烧时间为30-40min，煅烧结束，得到纳米线复合粉。
6.根据权利要5所述高韧性陶瓷薄板，其特征在于，所述改性处理的具体操作步骤为：
将金属氧化锰纳米线按照重量比1:5加入到硅酸钠溶液中，于65-75℃下反应20-30min，反应转速为400-600r/min，随后再加入盐酸调节pH至5.0，反应结束，再干燥，即可。
7.根据权利要6所述高韧性陶瓷薄板，其特征在于，所述硅酸钠溶液的质量分数为20-30%。
8.根据权利要1所述高韧性陶瓷薄板，其特征在于，所述杂化晶须体的制备方法为：
将氮化硅晶须、六钛酸钾晶须按照重量比3:1混合，然后加入到质量分数10-20%的多巴胺溶液中进行搅拌分散处理，搅拌转速为100-700r/min，搅拌时间为20-30min，搅拌结束，水洗、干燥，得到杂化晶须体。
9.一种如权利要求1-8任一项所述高韧性陶瓷薄板的制备方法，包括以下步骤：
步骤一，将堇青石、碳化硅、石墨烯纤维、海泡石纤维、改性磷片石墨、纳米线复合粉、杂化晶须体、氧化镁烧结剂依次搅拌混合至充分，得到待烧结料；
步骤二，将待烧结料压制成型，然后置于烧结炉中进行烧结处理，烧结温度为1350℃，烧结结束，得到高韧性陶瓷薄板。
10.根据权利要9所述高韧性陶瓷薄板的制备方法，其特征在于，所述压制成型的压力为20-30MPa。
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