CN114424099A - 光波导封装件以及发光装置 - Google Patents

光波导封装件以及发光装置 Download PDF

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Publication number
CN114424099A
CN114424099A CN202080065201.3A CN202080065201A CN114424099A CN 114424099 A CN114424099 A CN 114424099A CN 202080065201 A CN202080065201 A CN 202080065201A CN 114424099 A CN114424099 A CN 114424099A
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CN
China
Prior art keywords
optical waveguide
waveguide package
view
plan
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080065201.3A
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English (en)
Chinese (zh)
Inventor
板仓祥哲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
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Kyocera Corp
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Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of CN114424099A publication Critical patent/CN114424099A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/424—Mounting of the optical light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4206—Optical features
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4244—Mounting of the optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/4257—Details of housings having a supporting carrier or a mounting substrate or a mounting plate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • H01S5/0071—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for beam steering, e.g. using a mirror outside the cavity to change the beam direction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4012—Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02253—Out-coupling of light using lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4087—Array arrangements, e.g. constituted by discrete laser diodes or laser bar emitting more than one wavelength
    • H01S5/4093—Red, green and blue [RGB] generated directly by laser action or by a combination of laser action with nonlinear frequency conversion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)
  • Semiconductor Lasers (AREA)
  • Led Device Packages (AREA)
CN202080065201.3A 2019-09-30 2020-09-29 光波导封装件以及发光装置 Pending CN114424099A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2019-180925 2019-09-30
JP2019180925 2019-09-30
JP2020110002 2020-06-25
JP2020-110002 2020-06-25
PCT/JP2020/037008 WO2021065948A1 (ja) 2019-09-30 2020-09-29 光導波路パッケージおよび発光装置

Publications (1)

Publication Number Publication Date
CN114424099A true CN114424099A (zh) 2022-04-29

Family

ID=75336933

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080065201.3A Pending CN114424099A (zh) 2019-09-30 2020-09-29 光波导封装件以及发光装置

Country Status (5)

Country Link
US (1) US20220390689A1 (https=)
EP (1) EP4040516A4 (https=)
JP (1) JP7300794B2 (https=)
CN (1) CN114424099A (https=)
WO (1) WO2021065948A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI876500B (zh) * 2022-08-31 2025-03-11 日商京瓷股份有限公司 光波導封裝

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111323878B (zh) * 2020-04-01 2021-10-15 联合微电子中心有限责任公司 一种激光器芯片与硅基光电子芯片的耦合对准装置及方法
EP4350401A4 (en) * 2021-05-28 2025-04-30 Kyocera Corporation Light source module
EP4350402A1 (en) * 2021-05-28 2024-04-10 Kyocera Corporation Light source module
US20250023001A1 (en) * 2021-09-01 2025-01-16 Kyocera Corporation Optical waveguide package and light-emitting device
WO2023100927A1 (ja) * 2021-11-30 2023-06-08 京セラ株式会社 光導波路パッケージおよび光源モジュール
DE102022106948A1 (de) * 2022-03-24 2023-09-28 Ams-Osram International Gmbh Optoelektronisches bauelement
WO2025070158A1 (ja) * 2023-09-28 2025-04-03 京セラ株式会社 光導波路基板、電子素子収納用パッケージ、電子モジュール及び電子デバイス

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08110446A (ja) * 1994-10-12 1996-04-30 Hitachi Ltd 光伝送モジュール
EP1378777A2 (en) * 2002-07-02 2004-01-07 Omron Corporation Optical waveguide device, manufacturing method thereof, and optical communication apparatus
US20040057653A1 (en) * 2002-09-25 2004-03-25 Sumitomo Electric Industries, Ltd. Integrated optical element, integrated optical element fabrication method, and light source module
CN1670546A (zh) * 2004-03-17 2005-09-21 欧姆龙株式会社 光波导装置和光波导装置的制造方法以及光波导装置的中间体
JP2011099921A (ja) * 2009-11-04 2011-05-19 Sumitomo Bakelite Co Ltd 光素子搭載基板、光電気混載基板および電子機器
US20150370015A1 (en) * 2014-06-19 2015-12-24 Fujitsu Limited Optical module, manufacturing method of optical module, and optical device

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6146911A (ja) 1984-08-10 1986-03-07 Nippon Telegr & Teleph Corp <Ntt> 導波形光モジユ−ル
JP3125385B2 (ja) * 1991-12-12 2001-01-15 日本電気株式会社 光結合回路
DE4232608C2 (de) * 1992-09-29 1994-10-06 Bosch Gmbh Robert Verfahren zum Herstellen eines Deckels für eine integriert optische Schaltung
DE19503929A1 (de) * 1995-02-07 1996-08-08 Ldt Gmbh & Co Farbbilderzeugungssysteme
JPH0961651A (ja) * 1995-06-14 1997-03-07 Nippon Telegr & Teleph Corp <Ntt> ハイブリッド光集積回路
DE19917325C2 (de) * 1999-04-16 2001-06-21 Siemens Ag Fassung für opto-elektronische Bauelemente
JP3709313B2 (ja) * 1999-12-15 2005-10-26 日本オプネクスト株式会社 双方向通信光モジュール用素子及びその検査方法
JP3954510B2 (ja) * 2003-02-25 2007-08-08 Ｔｄｋ株式会社 埋込型光部品及びその製造方法並びに埋込型光部品を用いた光回路
US7221277B2 (en) * 2004-10-05 2007-05-22 Tracking Technologies, Inc. Radio frequency identification tag and method of making the same
JP4579868B2 (ja) * 2006-06-08 2010-11-10 日本電信電話株式会社 光集積回路
JP6940749B2 (ja) * 2016-04-28 2021-09-29 日亜化学工業株式会社 発光装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08110446A (ja) * 1994-10-12 1996-04-30 Hitachi Ltd 光伝送モジュール
EP1378777A2 (en) * 2002-07-02 2004-01-07 Omron Corporation Optical waveguide device, manufacturing method thereof, and optical communication apparatus
US20040057653A1 (en) * 2002-09-25 2004-03-25 Sumitomo Electric Industries, Ltd. Integrated optical element, integrated optical element fabrication method, and light source module
CN1670546A (zh) * 2004-03-17 2005-09-21 欧姆龙株式会社 光波导装置和光波导装置的制造方法以及光波导装置的中间体
JP2011099921A (ja) * 2009-11-04 2011-05-19 Sumitomo Bakelite Co Ltd 光素子搭載基板、光電気混載基板および電子機器
US20150370015A1 (en) * 2014-06-19 2015-12-24 Fujitsu Limited Optical module, manufacturing method of optical module, and optical device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI876500B (zh) * 2022-08-31 2025-03-11 日商京瓷股份有限公司 光波導封裝

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JPWO2021065948A1 (https=) 2021-04-08
US20220390689A1 (en) 2022-12-08
WO2021065948A1 (ja) 2021-04-08
EP4040516A4 (en) 2023-11-15
JP7300794B2 (ja) 2023-06-30
EP4040516A1 (en) 2022-08-10

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Application publication date: 20220429