CN114267626A - Etching device capable of being rapidly cleaned for manufacturing semiconductor chip substrate - Google Patents
Etching device capable of being rapidly cleaned for manufacturing semiconductor chip substrate Download PDFInfo
- Publication number
- CN114267626A CN114267626A CN202111576929.5A CN202111576929A CN114267626A CN 114267626 A CN114267626 A CN 114267626A CN 202111576929 A CN202111576929 A CN 202111576929A CN 114267626 A CN114267626 A CN 114267626A
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- Prior art keywords
- wall
- etching
- substrate
- electric
- fixing frame
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- 239000000758 substrate Substances 0.000 title claims abstract description 61
- 238000005530 etching Methods 0.000 title claims abstract description 48
- 239000004065 semiconductor Substances 0.000 title claims abstract description 22
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 238000004140 cleaning Methods 0.000 claims abstract description 24
- 238000011010 flushing procedure Methods 0.000 claims abstract description 8
- 238000001035 drying Methods 0.000 claims abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 20
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000007921 spray Substances 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims description 4
- 238000010168 coupling process Methods 0.000 claims description 4
- 238000005859 coupling reaction Methods 0.000 claims description 4
- 239000012295 chemical reaction liquid Substances 0.000 abstract description 10
- 238000006243 chemical reaction Methods 0.000 abstract description 6
- 238000005406 washing Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 8
- 244000309464 bull Species 0.000 description 4
- 238000009434 installation Methods 0.000 description 3
- 125000003003 spiro group Chemical group 0.000 description 3
- 238000005485 electric heating Methods 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 241001124569 Lycaenidae Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 235000014987 copper Nutrition 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 235000016804 zinc Nutrition 0.000 description 1
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses an etching device capable of being quickly cleaned for manufacturing a semiconductor chip substrate, which comprises a fixing frame, wherein supporting plates are welded on two sides of the outer wall of the bottom of the fixing frame, an etching box is placed on the inner wall of the bottom of the fixing frame, a cleaning box is placed on the inner wall of the bottom of the fixing frame, a flushing box is placed on the inner wall of the bottom of the fixing frame, a sliding groove is formed in the inner wall of the top of the fixing frame, a servo motor is installed on the inner wall of the top of the sliding groove, an output shaft of the servo motor is connected with a screw rod through a coupler, and a sliding block is screwed on the screw rod. The invention can put the substrate into the etching box for etching reaction, and after the etching is finished, the substrate is cleaned, the residual reaction liquid on the substrate is cleaned, so that the transitional etching is avoided, after the substrate is cleaned, the substrate can be washed again, the reaction liquid is ensured to be completely washed away, after the washing is finished, the substrate can be dried, and the phenomenon that the production efficiency is influenced by the natural drying of the substrate is avoided.
Description
Technical Field
The invention relates to the technical field of semiconductor chip substrate manufacturing, in particular to an etching device capable of being quickly cleaned for manufacturing a semiconductor chip substrate.
Background
Etching is a technique in which material is removed using a chemical reaction or physical impact. The etching technique can be classified into wet etching and dry etching. The method can be used for manufacturing printing embossing plates such as coppers, zincs and the like at the earliest time, and is also widely used for processing weight-reducing instrument paneling, nameplates, thin workpieces which are difficult to process by the traditional processing method and the like; through continuous improvement and development of process equipment, the method can also be used for processing precision etching products of electronic thin-sheet parts in aviation, machinery and chemical industries, and particularly, etching is an indispensable technology in semiconductor manufacturing processes. However, in general, when etching is performed, reaction liquid remains on a semiconductor substrate, and if the reaction liquid is not cleaned in time, excessive etching occurs, which seriously increases the defective rate.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides an etching device for manufacturing a semiconductor chip substrate, which can be cleaned quickly.
In order to achieve the purpose, the invention adopts the following technical scheme:
the utility model provides a semiconductor chip substrate makes with etching device that can carry out quick cleanness, has all welded the mount of backup pad including bottom outer wall both sides, the etching case has been placed to mount bottom inner wall, and mount bottom inner wall has placed and has rinsed the case, the flushing tank has been placed to mount bottom inner wall, and the mount top inner wall opens there is the spout, servo motor is installed to spout top inner wall, and the servo motor output shaft has the lead screw through the coupling joint, the spiro union has the slider on the lead screw, and slider bottom outer wall installs first electric putter, first electric putter piston rod end is fixed with fixture, and mount one side inner wall installs second electric putter, second electric putter piston rod end is fixed with stoving mechanism.
Preferably, fixture includes fixed frame, and fixed frame top inner wall installs electronic revolving stage, and fixed frame bottom inner wall has pegged graft through the bearing and has the bull stick, and electronic revolving stage rotates the piece and is connected with the bull stick, and electrically conductive sliding ring is installed to the bull stick outer wall, and the outer wall welding of bull stick bottom has the mounting bracket, and electronic clamping jaw is installed to mounting bracket top inner wall, and two holder bottoms of electronic clamping jaw all are fixed with splint.
Preferably, the drying mechanism comprises a mounting frame, an electric fan is mounted on the inner wall of the mounting frame, and heating wires distributed at equal intervals are mounted on the inner wall of the mounting frame.
Preferably, the inner wall of one side of the flushing tank is provided with a spray head, and the bottom of the inner wall of one side of the flushing tank is connected with a drain pipe.
Preferably, a water pump is installed on the outer wall of one side of the flushing tank, the water inlet end of the water pump is connected with a water inlet pipe, and the water outlet end of the water pump is connected with the spray head through a water outlet pipe.
Preferably, the inner wall of the sliding groove is connected with a sliding block in a sliding mode, a threaded through hole is formed in the outer wall of one side of the sliding block, and the sliding block is connected to the screw rod in a threaded mode.
Preferably, servo motor, first electric putter, second electric putter, electronic revolving stage, electrically conductive sliding ring, electronic clamping jaw, electric fan and heating wire all are connected with the switch through the wire, and the switch is connected with external power source through the power cord.
The invention has the beneficial effects that:
1. the substrate can be placed in an etching box for etching reaction, after etching is finished, the substrate is placed in a cleaning box, the substrate is clamped by an electric clamping jaw, the substrate is driven to rotate rapidly by an electric rotating platform for cleaning, and residual reaction liquid on the substrate is cleaned, so that transitional etching is avoided;
2. through the electrically conductive slip ring that sets up can make electronic clamping jaw along with the base plate in-process that fast turn-round can not appear the winding problem of wire, after having washd the base plate, can wash the base plate again, ensure that reaction liquid is washed away completely, wash the completion back, can dry the base plate, avoid the base plate to dry naturally, influence production efficiency.
Drawings
FIG. 1 is a front sectional view of an etching apparatus for rapidly cleaning a semiconductor substrate according to the present invention;
FIG. 2 is a side view of an etching apparatus for rapid cleaning in semiconductor substrate fabrication according to the present invention;
FIG. 3 is an enlarged view of a portion of an etching apparatus for rapidly cleaning a semiconductor substrate according to the present invention;
FIG. 4 is a front view of an etching apparatus for rapidly cleaning a semiconductor substrate according to the present invention.
In the figure: 1. a fixed mount; 2. etching the box; 3. a cleaning tank; 4. a flushing tank; 5. a chute; 6. a servo motor; 7. a screw rod; 8. a slider; 9. a first electric push rod; 10. a second electric push rod; 11. a fixing frame; 12. an electric rotating table; 13. a rotating rod; 14. a conductive slip ring; 15. a mounting frame; 16. an electric jaw; 17. a splint; 18. installing a frame; 19. an electric fan; 20. an electric heating wire; 21. a water pump; 22. and (4) a spray head.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Embodiment 1, referring to fig. 1-4, an etching apparatus for manufacturing a semiconductor chip substrate capable of performing rapid cleaning, includes a fixing frame 1 and a clamping mechanism, wherein supporting plates are welded on both sides of the outer wall of the bottom of the fixing frame 1, the clamping mechanism includes a fixing frame 11, an electric rotary table 12 is installed on the inner wall of the top of the fixing frame 11, a rotary rod 13 is inserted into the inner wall of the bottom of the fixing frame 11 through a bearing, a rotary member of the electric rotary table 12 is connected with the rotary rod 13, a conductive slip ring 14 is installed on the outer wall of the rotary rod 13, an installation frame 15 is welded on the outer wall of the bottom of the rotary rod 13, an electric clamping jaw 16 is installed on the inner wall of the top of the installation frame 15, a clamping plate 17 is fixed on the bottoms of two clamping members of the electric clamping jaw 16, a substrate can be placed on the inner wall of the bottom of the installation frame 15, a lead screw 7 can be driven by a servo motor 6 to rotate, the horizontal position of the substrate can be adjusted, the vertical position of the substrate can be adjusted by the extension and retraction of a first electric push rod 9, the substrate can be placed in the etching box 2 for etching reaction, after etching is finished, the substrate is placed in the cleaning box 3 and clamped by the electric clamping jaws 16, the substrate is driven to rotate rapidly by the electric rotating platform 12 for cleaning, residual reaction liquid on the substrate is cleaned, and transitional etching is avoided;
all weld the mount 1 of backup pad including bottom outer wall both sides, etching case 2 has been placed to 1 bottom inner wall of mount, and 1 bottom inner wall of mount has placed washing case 3, flush tank 4 has been placed to 1 bottom inner wall of mount, and 1 top inner wall of mount is opened there is spout 5, servo motor 6 is installed to 5 top inner walls of spout, and servo motor 6 output shaft has lead screw 7 through coupling joint, the spiro union has slider 8 on the lead screw 7, and 8 bottom outer walls of slider install first electric putter 9, 9 piston rods of first electric putter are terminal to be fixed with fixture, and 1 one side inner wall of mount installs second electric putter 10, 10 piston rods of second electric putter are terminal to be fixed with stoving mechanism.
Pouring reaction liquid into the etching box 2, pouring water into the cleaning box 3, placing a substrate on the inner wall of the bottom of the mounting frame 15, driving the screw rod 7 to rotate through the servo motor 6, adjusting the horizontal position of the substrate, adjusting the vertical position of the substrate through the extension of the piston rod of the first electric push rod 9, placing the substrate into the etching box 2 for etching reaction, placing the substrate into the cleaning box 3 to clamp the substrate through the electric clamping jaw 16 after etching is finished, driving the substrate to rotate rapidly through the electric rotary table 12 to clean, cleaning the residual reaction liquid on the substrate, avoiding transitional etching, moving the substrate into the rinsing box 4 after cleaning the substrate, pumping water by using the water pump 21 to spray the substrate from the spray head 22 to clean the substrate, ensuring that the reaction liquid is washed off completely, moving the substrate out of the rinsing box 4 after cleaning is finished, the mounting frame 18 is pushed to the middle of the two clamping pieces of the electric clamping jaw 16 through the second electric push rod 10, and after the electric heating wire 20 is heated by blowing air through the electric fan 19 to form hot air, the substrate is dried.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (7)
1. The etching device capable of being quickly cleaned for manufacturing the semiconductor chip substrate comprises a fixing frame (1) with supporting plates welded on two sides of the outer wall of the bottom, and is characterized in that an etching box (2) is placed on the inner wall of the bottom of the fixing frame (1), a cleaning box (3) is placed on the inner wall of the bottom of the fixing frame (1), a flushing box (4) is placed on the inner wall of the bottom of the fixing frame (1), a sliding groove (5) is formed in the inner wall of the top of the fixing frame (1), a servo motor (6) is installed on the inner wall of the top of the sliding groove (5), an output shaft of the servo motor (6) is connected with a lead screw (7) through a coupling, a sliding block (8) is connected onto the lead screw (7) in a threaded manner, a first electric push rod (9) is installed on the outer wall of the bottom of the sliding block (8), a clamping mechanism is fixed at the tail end of a piston rod of the first electric push rod (9), and a second electric push rod (10) is installed on the inner wall of one side of the fixing frame (1), and a drying mechanism is fixed at the tail end of a piston rod of the second electric push rod (10).
2. The etching device for rapidly cleaning the semiconductor chip substrate according to claim 1, wherein the clamping mechanism comprises a fixed frame (11), an electric rotating platform (12) is installed on the inner wall of the top of the fixed frame (11), a rotating rod (13) is inserted into the inner wall of the bottom of the fixed frame (11) through a bearing, a rotating part of the electric rotating platform (12) is connected with the rotating rod (13), a conductive sliding ring (14) is installed on the outer wall of the rotating rod (13), a mounting frame (15) is welded on the outer wall of the bottom of the rotating rod (13), an electric clamping jaw (16) is installed on the inner wall of the top of the mounting frame (15), and a clamping plate (17) is fixed on the bottom of each of two clamping parts of the electric clamping jaw (16).
3. The etching apparatus for rapidly cleaning a semiconductor chip substrate according to claim 1, wherein the drying mechanism comprises a mounting frame (18), and an electric fan (19) is mounted on an inner wall of the mounting frame (18), and heating wires (20) are equidistantly mounted on an inner wall of the mounting frame (18).
4. The etching apparatus for rapidly cleaning a semiconductor chip substrate according to claim 1, wherein a shower head (22) is installed on an inner wall of the rinse tank (4), and a drain pipe is connected to a bottom portion of the inner wall of the rinse tank (4).
5. The etching apparatus for rapidly cleaning a semiconductor chip substrate according to claim 1, wherein a water pump (21) is installed on an outer wall of one side of the rinsing tank (4), a water inlet pipe is connected to a water inlet end of the water pump (21), and a water outlet end of the water pump (21) is connected to the spray head (22) through a water outlet pipe.
6. The etching apparatus for rapidly cleaning a semiconductor chip substrate according to claim 1, wherein a sliding block (8) is slidably connected to an inner wall of the sliding groove (5), a threaded through hole is formed in an outer wall of one side of the sliding block (8), and the sliding block (8) is screwed on the screw rod (7).
7. The etching apparatus for rapidly cleaning a semiconductor chip substrate according to claim 1, wherein the servo motor (6), the first electric push rod (9), the second electric push rod (10), the electric rotary table (12), the conductive slip ring (14), the electric clamping jaw (16), the electric fan (19) and the heating wire (20) are all connected with a switch through wires, and the switch is connected with an external power supply through a power line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111576929.5A CN114267626A (en) | 2021-12-22 | 2021-12-22 | Etching device capable of being rapidly cleaned for manufacturing semiconductor chip substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111576929.5A CN114267626A (en) | 2021-12-22 | 2021-12-22 | Etching device capable of being rapidly cleaned for manufacturing semiconductor chip substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114267626A true CN114267626A (en) | 2022-04-01 |
Family
ID=80828547
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111576929.5A Withdrawn CN114267626A (en) | 2021-12-22 | 2021-12-22 | Etching device capable of being rapidly cleaned for manufacturing semiconductor chip substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114267626A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116666271A (en) * | 2023-06-02 | 2023-08-29 | 江苏晟驰微电子有限公司 | A device for improving the etching resistance of photoresist and its application method |
| CN118106279A (en) * | 2024-04-08 | 2024-05-31 | 赣州正和磁业有限公司 | Cleaning device for sintered NdFeB permanent magnets |
| CN118518530A (en) * | 2024-07-19 | 2024-08-20 | 深圳晶恒宇环境科技有限公司 | Etching rate testing device for etching liquid |
-
2021
- 2021-12-22 CN CN202111576929.5A patent/CN114267626A/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116666271A (en) * | 2023-06-02 | 2023-08-29 | 江苏晟驰微电子有限公司 | A device for improving the etching resistance of photoresist and its application method |
| CN116666271B (en) * | 2023-06-02 | 2025-01-14 | 江苏晟驰微电子有限公司 | Equipment for improving etching resistance of photoresist and application method thereof |
| CN118106279A (en) * | 2024-04-08 | 2024-05-31 | 赣州正和磁业有限公司 | Cleaning device for sintered NdFeB permanent magnets |
| CN118518530A (en) * | 2024-07-19 | 2024-08-20 | 深圳晶恒宇环境科技有限公司 | Etching rate testing device for etching liquid |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20220401 |
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| WW01 | Invention patent application withdrawn after publication |