CN114235843A - Defect detection device and method for semiconductor chip - Google Patents
Defect detection device and method for semiconductor chip Download PDFInfo
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- CN114235843A CN114235843A CN202210177266.8A CN202210177266A CN114235843A CN 114235843 A CN114235843 A CN 114235843A CN 202210177266 A CN202210177266 A CN 202210177266A CN 114235843 A CN114235843 A CN 114235843A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
- G01N25/72—Investigating presence of flaws
Abstract
The invention discloses a defect detection device and method of a semiconductor chip, belonging to the technical field of chip detection equipment, and the technical key points are as follows: including the conveyer belt, place the semiconductor chip who waits to detect on the conveyer belt, still include: the detection platform is internally provided with a detection module which is used for detecting the semiconductor chip; the clamping mechanism is used for clamping the semiconductor chip to the detection module for detection; and get and take the mechanism, get and take the mechanism and include the support, supporting component, power component, push the subassembly, runner assembly and transmission assembly, the support sets up in conveyer belt one side, the right side fixed connection supporting component of support, supporting component connects power component, push the subassembly, runner assembly and transmission assembly, power component is connected with push the subassembly and runner assembly, runner assembly connects transmission assembly, one side connection clamp of transmission assembly gets the mechanism, has the advantage that can the intellectual detection system chip.
Description
Technical Field
The invention relates to the technical field of chip detection equipment, in particular to a defect detection device and method of a semiconductor chip.
Background
A semiconductor chip: etching and wiring are performed on the semiconductor wafer to produce a semiconductor device capable of realizing a certain function. Semiconductor materials such as gallium arsenide and germanium are also commonly included, not just silicon chips. To meet the requirements of mass production, the electrical properties of semiconductors must be predictable and stable, and thus the purity of dopants and the quality of the semiconductor lattice structure are critical. Common quality problems include dislocations (dislocations), twinning planes (twins) or stacking faults (stacking faults), all of which affect the properties of the semiconductor material, and for a semiconductor device, defects (crystal defects) in the crystal lattice of the material are usually the main factors affecting the performance of the device.
At present, semiconductor chips are rapidly developed towards miniaturization, chip type and high performance, the defect detection of the semiconductor chips is a necessary premise, the detection of other appearance defects is the quality assurance of the semiconductor chips, the traditional manual rejection of unqualified products is still adopted on a plurality of production lines at present, and the automatic detection effect cannot be realized.
Disclosure of Invention
In view of the shortcomings in the prior art, an embodiment of the present invention provides a defect detection apparatus and method for a semiconductor chip to solve the above problems in the background art.
In order to achieve the purpose, the invention provides the following technical scheme:
a defect detection device and method of semiconductor chip includes a conveyor belt, and also includes:
the detection platform is internally provided with a detection module, and the detection module is used for detecting the semiconductor chip;
the clamping mechanism is used for clamping the semiconductor chip to the detection module;
the taking mechanism comprises a support, a supporting component, a power component, a pushing component, a rotating component and a transmission component, the support is arranged on one side of the conveying belt, the right side of the support is fixedly connected with the supporting component, the supporting component is respectively connected with the power component, the pushing component, the rotating component and the transmission component, the power component is respectively connected with the pushing component and the rotating component, the rotating component is connected with the transmission component, and one side of the transmission component is connected with the clamping mechanism;
the supporting assembly comprises a first supporting piece, a second supporting piece and a third supporting piece, and one end of each of the first supporting piece, the second supporting piece and the third supporting piece is fixedly connected with the support;
the power assembly comprises a first power piece, a disc, a shifting rod and a shifting sheet, the first power piece is arranged on one side of the first supporting piece and is connected with the disc, and the shifting rod and the shifting sheet are arranged outside the disc;
the pushing assembly comprises a first sliding groove, a first pushing piece, a second pushing piece and a sliding piece, the first sliding groove is arranged on one side of the third supporting piece, the first sliding groove is movably connected with the sliding piece, the first pushing piece and the second pushing piece are both movably connected with the second supporting piece, the second pushing piece is movably connected with the sliding piece, and the first pushing piece is connected with the disk;
the rotating assembly comprises a first mounting piece, a rotating shaft, a second sliding groove, a third sliding groove and a first guide piece, the first mounting piece is connected with the outer wall of the third supporting piece, the first mounting piece is connected with the rotating shaft, the rotating shaft is externally arranged at one end of the third supporting piece, the outer wall of the rotating shaft is provided with the second sliding groove, the first mounting piece is provided with the third sliding groove, the second sliding groove is movably connected with the shifting rod, the third sliding groove is movably connected with the shifting piece, the third supporting piece is internally provided with the first guide piece, and the first guide piece is connected with the rotating shaft;
the transmission assembly comprises a transmission part, a transmission rod, a second installation part and a second guide part, one end of the transmission part is connected with the first guide part, the other end of the transmission part is connected with the transmission rod, the transmission rod is externally provided with the second guide part, the transmission rod is connected with the second installation part, and one side of the second installation part is provided with a clamping mechanism.
As a further aspect of the present invention, the gripping mechanism includes:
the mounting plate is arranged on one side of the clamping plate, and the clamping plate is fixedly connected with the transmission rod;
the clamping assembly is movably connected with a limiting assembly, and the limiting assembly is arranged on one side of the mounting plate;
the clamping piece is movably connected with the mounting plate and movably connected with the limiting assembly;
and one end of the elastic piece is fixedly connected with the clamping piece, and the other end of the elastic piece is fixedly connected with the clamping assembly.
As a further aspect of the present invention, the gripping assembly includes:
the pushing plate is connected with the output end of the power assembly, the pushing plate is fixedly connected with the elastic piece, and the pushing plate is symmetrically arranged relative to the mounting plate;
and the connecting rod is fixedly connected with the pushing plate and movably connected with the limiting assembly.
As a further aspect of the present invention, the position limiting assembly comprises:
the first limiting piece is fixedly connected with the second limiting piece;
the third limiting part is fixedly connected with the first limiting part and movably connected with the elastic part;
and the fourth limiting part is fixedly connected with the first limiting part and movably connected with the connecting rod.
As a further scheme of the invention, a placing mechanism is arranged in the detection table and used for supporting the semiconductor chip.
As a further aspect of the present invention, the placing mechanism includes:
the third power part is connected with the detection table and drives the telescopic assembly to move;
the support frame is fixedly connected with the telescopic assembly, one end of the support frame is fixedly connected with a placing plate, and the placing plate is used for placing a semiconductor chip;
and the fixing frame is connected with the third power part, and the telescopic assembly is connected with the fixing frame.
As a further aspect of the present invention, the telescopic assembly comprises:
one end of the adjusting piece is connected with the output end of the third power piece, and the other end of the adjusting piece is provided with a gear;
the rack is movably connected with the gear and fixedly connected with the supporting frame;
and the third guide piece is fixedly connected with the fixed frame and movably connected with the rack.
As a further scheme of the invention, the method comprises the following steps: irradiating infrared light onto a workpiece to be detected of a transmission device, wherein the workpiece is a semiconductor chip; acquiring an infrared image of a workpiece by using an infrared camera, or acquiring the infrared image and a common optical image of the workpiece by using the infrared camera and a common optical lens simultaneously so as to serve as an image to be detected; and transmitting the acquired image to be detected to an image analysis device, and analyzing and judging whether the workpiece has defects or not by the image analysis device.
In summary, compared with the prior art, the embodiment of the invention has the following beneficial effects:
the first supporting piece and the second supporting piece are both supporting rods, the third supporting piece is a hollow supporting column, the first power piece is an electric rotating shaft, the first power piece is arranged on one side of the first supporting piece, the poking piece is of an arc-shaped structure and controls the rotating speed of the first mounting piece, the first pushing piece and the second pushing piece are both pushing rods, the sliding piece is a sliding block, the first mounting piece is a mounting plate, the second sliding groove is of an X shape, so that the second mounting piece can rotate back and forth at a right angle to complete the taking out and putting back of the semiconductor chip, the first guiding piece is a guide rod, the transmission piece is of a plate shape, the second mounting piece is a mounting plate, and the second guiding piece is a guide rod;
the first power piece drives the disc, the disc drives the shifting rod and the shifting sheet to rotate, the shifting rod drives the rotating shaft to rotate by a mode of shifting the second chute, the rotating shaft drives the first installation piece to rotate, the shifting sheet controls the first installation piece by a mode of connecting the third chute, so that the first installation piece rotates at right angle, the first installation piece drives the rotating shaft to rotate at right angle, the rotating shaft drives the first guide piece to rotate, the first guide piece drives the transmission piece to rotate, the transmission piece drives the transmission rod to rotate by a mode of driving the second guide piece, the transmission rod drives the clamping mechanism to rotate, the semiconductor chip is moved to one side of the detection table from the conveying belt after the detection is finished, and then the semiconductor chip is placed back to the conveying belt;
the disc drives the first pushing part to rotate, the first pushing part drives the second pushing part to rotate, the second pushing part pushes the sliding part to move up and down under the limit of the first sliding groove, the sliding part drives the first guide part to move, the first guide part drives the transmission part to move, the transmission part drives the transmission rod to move in a mode of driving the second guide part, the transmission rod drives the clamping mechanism to move, and the semiconductor chip after detection is placed back on the conveying belt again.
To more clearly illustrate the structural features and effects of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of the invention.
Fig. 2 is a schematic structural diagram of the picking mechanism in the embodiment of the invention.
Fig. 3 is a schematic structural diagram of a pick in the embodiment of the invention.
Fig. 4 is a schematic structural view of the clamping plate in the embodiment of the invention.
Fig. 5 is a schematic structural view of the gripping mechanism in the embodiment of the invention.
Fig. 6 is a schematic structural diagram of a placement mechanism in an embodiment of the invention.
Reference numerals: 1-conveyor belt, 2-taking mechanism, 21-support, 22-support component, 221-first support component, 222-second support component, 223-third support component, 23-power component, 231-first power component, 232-circular disk, 233-deflector rod, 234-deflector piece, 24-pushing component, 241-first chute, 242-first pusher piece, 243-second pusher piece, 244-sliding piece, 25-rotating component, 251-first mounting piece, 252-rotating shaft, 253-second chute, 254-third chute, 255-first guide piece, 26-transmission component, 261-transmission piece, 262-transmission rod, 263-second mounting piece, 264-second guide piece, 3-clamping plate, The device comprises a 4-clamping mechanism, a 41-mounting plate, a 42-power assembly, a 421-sleeve, a 422-second power member, a 43-clamping assembly, a 431-pushing plate, a 432-connecting rod, a 44-limiting assembly, a 441-first limiting member, a 442-second limiting member, a 443-third limiting member, a 444-fourth limiting member, a 45-clamping member, a 46-elastic member, a 5-placing mechanism, a 51-third power member, a 52-telescopic assembly, a 521-adjusting member, a 522-gear, a 523-rack, a 524-third guiding member, a 53-supporting frame, a 54-fixing frame, a 55-placing plate, a 6-detection table and a 7-detection module.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Specific implementations of the present invention are described in detail below with reference to specific embodiments.
In one embodiment, an apparatus and a method for detecting defects of semiconductor chips, referring to fig. 1 to 4, includes a conveyor belt 1, on which semiconductor chips to be detected are placed, and is characterized by further including:
the detection device comprises a detection table 6, wherein a detection module 7 is arranged in the detection table 6, and the detection module 7 is used for detecting a semiconductor chip;
the clamping mechanism 4 is used for clamping the semiconductor chip to the detection module 7 for detection;
the taking mechanism 2 comprises a support 21, a support component 22, a power component 23, a pushing component 24, a rotating component 25 and a transmission component 26, the support 21 is arranged on one side of the conveyor belt 1, the support component 22 is fixedly connected to the right side of the support 21, the support component 22 is connected with the power component 23, the pushing component 24, the rotating component 25 and the transmission component 26, the power component 23 is connected with the pushing component 24 and the rotating component 25, the rotating component 25 is connected with the transmission component 26, and one side of the transmission component 26 is connected with the clamping mechanism 4;
the support assembly 22 comprises a first support 221, a second support 222 and a third support 223, and one end of each of the first support 221, the second support 222 and the third support 223 is fixedly connected with the support 21;
the power assembly 23 comprises a first power member 231, a disc 232, a shift lever 233 and a shifting sheet 234, the first power member 231 is arranged on one side of the first support member 221, the first power member 231 is connected with the disc 232, and the shift lever 233 and the shifting sheet 234 are arranged outside the disc 232;
the pushing assembly 24 includes a first sliding slot 241, a first pushing member 242, a second pushing member 243 and a slider 244, the first sliding slot 241 is disposed on one side of the third support 223, the first sliding slot 241 is movably connected to the slider 244, both the first pushing member 242 and the second pushing member 243 are movably connected to the second support 222, the second pushing member 243 is movably connected to the slider 244, and the first pushing member 242 is connected to the disk 232;
the rotating assembly 25 comprises a first mounting member 251, a rotating shaft 252, a second sliding groove 253, a third sliding groove 254 and a first guiding member 255, the first mounting member 251 is connected with the outer wall of the third support 223, the first mounting member 251 is connected with the rotating shaft 252, the rotating shaft 252 is externally arranged on one side of the third support 223, the outer wall of the rotating shaft 252 is provided with the second sliding groove 253, the first mounting member 251 is provided with the third sliding groove 254, the second sliding groove 253 is movably connected with the shifting rod 233, the third sliding groove 254 is movably connected with the shifting rod 234, the third support 223 is internally provided with the first guiding member 255, and the first guiding member 255 is connected with the rotating shaft 252;
the transmission assembly 26 comprises a transmission member 261, a transmission rod 262, a second installation member 263 and a second guide member 264, wherein one end of the transmission member 261 is connected with the first guide member 255, the other end of the transmission member 261 is connected with the transmission rod 262, the transmission rod 262 is externally provided with the second guide member 264, the transmission rod 262 is connected with the second installation member 263, and one side of the second installation member 263 is provided with the clamping mechanism 4;
the first power part 231 drives the disc 232 to rotate, the disc 232 drives the shift lever 233 and the shift piece 234 to rotate, the shift lever 233 drives the rotating shaft 252 to rotate by shifting the second chute 253, the rotating shaft 252 drives the first mounting part 251 to rotate, the shift piece 234 controls the first mounting part 251 by connecting the third chute 254, so that the first mounting part 251 rotates at right angle, the first mounting part 251 drives the rotating shaft 252 to rotate at right angle, the rotating shaft 252 drives the first guide part 255 to rotate, the first guide part 255 drives the transmission part 261 to rotate, the transmission part 261 drives the transmission rod 262 to rotate by driving the second guide part 264, the transmission rod 262 drives the clamping mechanism 4 to rotate, and the semiconductor chip is moved from the conveyor belt 1 to one side of the detection table 6;
the disc 232 drives the first pushing member 242 to rotate, the first pushing member 242 drives the second pushing member 243 to rotate, the second pushing member 243 pushes the sliding member 244 to move up and down under the limit of the first sliding groove 241, the sliding member 244 drives the first guiding member 255 to move, the first guiding member 255 drives the transmission member 261 to move, the transmission member 261 drives the transmission rod 262 to move by driving the second guiding member 264, the transmission rod 262 drives the clamping mechanism 4 to move, and the semiconductor chip after detection is placed back on the conveyor belt 1 again.
In this embodiment, the first supporting member 221 and the second supporting member 222 both adopt supporting rods, the third supporting member 223 adopts a hollow supporting column, the first power member 231 adopts an electric rotating shaft, the first power member 231 is disposed on one side of the first supporting member 221, the shifting sheet 234 adopts an arc-shaped structure to control the rotating speed of the first mounting member 251, the first pushing member 242 and the second pushing member 243 both adopt pushing rods, the sliding member 244 adopts a sliding block, the first mounting member 251 adopts a mounting plate, the second sliding groove 253 adopts an X-shaped structure, so that the second mounting member 263 can rotate back and forth at a right angle to complete the taking out and the replacement of the semiconductor chip, the first guiding member 255 adopts a guiding rod, the transmission member 261 adopts a plate shape, the second mounting member 263 adopts a mounting plate, and the second guiding member 264 adopts a guiding rod;
the first power part 231 drives the disc 232, the disc 232 drives the shift lever 233 and the shift piece 234 to rotate, the shift lever 233 drives the rotating shaft 252 to rotate by shifting the second chute 253, the rotating shaft 252 drives the first mounting part 251 to rotate, the shift piece 234 controls the first mounting part 251 by connecting the third chute 254, so that the first mounting part 251 rotates at right angle, the first mounting part 251 drives the rotating shaft 252 to rotate at right angle, the rotating shaft 252 drives the first guide part 255 to rotate, the first guide part 255 drives the transmission part 261 to rotate, the transmission part 261 drives the transmission rod 262 to rotate by driving the second guide part 264, the transmission rod 262 drives the clamping mechanism 4 to rotate, the semiconductor chip is moved from the conveyor belt 1 to one side of the detection table 6, and after the detection is completed, the semiconductor chip is placed back to the conveyor belt 1;
the disc 232 drives the first pushing member 242 to rotate, the first pushing member 242 drives the second pushing member 243 to rotate, the second pushing member 243 pushes the sliding member 244 to move up and down under the limit of the first sliding groove 241, the sliding member 244 drives the first guiding member 255 to move, the first guiding member 255 drives the transmission member 261 to move, the transmission member 261 drives the transmission rod 262 to move by driving the second guiding member 264, the transmission rod 262 drives the clamping mechanism 4 to move, and the semiconductor chip is placed back on the conveyor belt 1 again after the detection of the semiconductor chip is completed.
In one embodiment, referring to fig. 4 to 5, the gripping mechanism 4 includes:
the mounting plate 41 is arranged on one side of the clamping plate 3, and the clamping plate 3 is fixedly connected with the transmission rod 262;
the power assembly 42 is connected with the clamping assembly 43 at the output of the power assembly 42, the clamping assembly 43 is movably connected with the limiting assembly 44, and the limiting assembly 44 is arranged on one side of the mounting plate 41;
the clamping piece 45 is movably connected with the mounting plate 41, and the clamping piece 45 is movably connected with the limiting component 44;
and one end of the elastic piece 46 is fixedly connected with the clamping piece 45, and the other end of the elastic piece 46 is fixedly connected with the clamping assembly 43.
Further, referring to fig. 4 to 5, the grasping assembly 43 includes:
a push plate 431, wherein the push plate 431 is connected with the output end of the power assembly 42, the push plate 431 is fixedly connected with the elastic member 46, and the push plate 431 is symmetrically arranged about the mounting plate 41;
and the connecting rod 432 is fixedly connected with the pushing plate 431, and the connecting rod 432 is movably connected with the limiting assembly 44.
Further, referring to fig. 4 to 5, the limiting assembly 44 includes:
the first limiting piece 441 is fixedly connected to the second limiting piece 442;
the third limiting member 443, the third limiting member 443 is fixedly connected to the first limiting member 441, and the third limiting member 443 is movably connected to the elastic member 46;
and a fourth limiting member 444, the fourth limiting member 444 is fixedly connected to the first limiting member 441, and the fourth limiting member 444 is movably connected to the connecting rod 432.
In this embodiment, the second power member 422 is an electric telescopic rod, the first position-limiting member 441, the second position-limiting member 442, the third position-limiting member 443 and the fourth position-limiting member 444 are position-limiting members, the clamping member 45 is a clamping member, and the elastic member 46 is a spring;
the power assembly 42 comprises a sleeve 421 and a second power member 422, the sleeve 421 is arranged on one side of the mounting plate 41, the second power member 422 is movably connected with the inner wall of the sleeve 421, and the pushing plate 431 is movably connected with the mounting plate 41;
the second power member 422 drives the pushing plate 431 to move, the pushing plate 431 drives the pushing plate 431 on the other side to move by driving the connecting rod 432 to move, the pushing plate 431 drives the clamping member 45 to move by extruding the elastic member 46, and the clamping member 45 stops under the limiting action of the first limiting member 441 and the second limiting member 442;
the clamping member 45 then reversely extrudes the elastic member 46, and at the same time, the second power member 422 stops working, so that the elastic member 46 pushes the pushing plate 431 to move in the opposite direction, and the pushing plate 431 drives the pushing plate 431 on the other side to move in the opposite direction by driving the connecting rod 432 to move, so that the symmetrically arranged clamping members 45 complete opposite movement, and the clamping of the clamping member 45 to the semiconductor chip is completed.
In one embodiment, referring to fig. 1 and 6, a placing mechanism 5 is disposed in the inspection station 6, and the placing mechanism 5 is used for holding a semiconductor chip.
Further, referring to fig. 1 and 6, the placing mechanism 5 includes:
the third power part 51, the third power part 51 is connected with the detection table 6, and the third power part 51 drives the telescopic assembly 52 to move;
the supporting frame 53 is fixedly connected with the telescopic assembly 52, one end of the supporting frame 53 is fixedly connected with a placing plate 55, and the placing plate 55 is used for placing a semiconductor chip;
and the fixed frame 54 is connected with the third power part 51, and the telescopic assembly 52 is connected with the fixed frame 54.
Further, referring to fig. 1 and 6, the retraction assembly 52 includes:
one end of the adjusting member 521 is connected with the output end of the third power member 51, and the other end of the adjusting member 521 is provided with a gear 522;
the rack 523, the rack 523 is movably connected with the gear 522, and the rack 523 is fixedly connected with the support frame 53;
and a third guiding element 524, wherein the third guiding element 524 is fixedly connected to the fixing frame 54, and the third guiding element 524 is movably connected to the rack 523.
In this embodiment, the third power member 51 is a hydraulic cylinder, the adjusting member 521 is a hydraulic rod, and the third guiding member 524 is a guiding block;
the third power part 51 drives the adjusting part 521 to move upwards, the adjusting part 521 drives the gear 522 to move upwards, the rack 523 moves in a manner of engaging with the gear 522, the rack 523 drives the supporting frame 53 to move, and the supporting frame 53 drives the placing plate 55 to move.
In one embodiment, referring to fig. 1-6, the method comprises the following steps: irradiating infrared light onto a workpiece to be detected of a transmission device, wherein the workpiece is a semiconductor chip; acquiring an infrared image of a workpiece by using an infrared camera, or acquiring the infrared image and a common optical image of the workpiece by using the infrared camera and a common optical lens simultaneously so as to serve as an image to be detected; and transmitting the acquired image to be detected to an image analysis device, and analyzing and judging whether the workpiece has defects or not by the image analysis device.
In this embodiment, it gets mechanism 4 and the placing mechanism 5 that corresponds with it to set up a plurality of clamps, to wait to detect semiconductor chip and press from both sides from conveyer belt 1 and get to when examining test table 6 top, second power piece 422 drives and presss from both sides and gets 45 and loosen, make semiconductor chip place and place on the board 55, through detection module 7 to the omnidirectional detection of semiconductor chip, it has the problem such as damage or crackle to detect out semiconductor chip, reach quality requirement's semiconductor chip, lift up by placing board 55, press from both sides and get 45 and press from both sides semiconductor chip once more and place on conveyer belt 1, detect unqualified semiconductor chip, move down through placing board 55, place unqualified semiconductor chip and examine test table 6 inside, accomplish the recovery of waste material.
The working principle of the invention is as follows:
the first power part 231 drives the disc 232, the disc 232 drives the shift lever 233 and the shift piece 234 to rotate, the shift lever 233 drives the rotating shaft 252 to rotate by shifting the second chute 253, the rotating shaft 252 drives the first mounting part 251 to rotate, the shift piece 234 controls the first mounting part 251 by connecting the third chute 254, so that the first mounting part 251 rotates at right angle, the first mounting part 251 drives the rotating shaft 252 to rotate at right angle, the rotating shaft 252 drives the first guide part 255 to rotate, the first guide part 255 drives the transmission part 261 to rotate, the transmission part 261 drives the transmission rod 262 to rotate by driving the second guide part 264, the transmission rod 262 drives the clamping mechanism 4 to rotate, the semiconductor chip is moved from the conveyor belt 1 to one side of the detection table 6, and after the detection is completed, the semiconductor chip is placed back to the conveyor belt 1;
the disc 232 drives the first pushing member 242 to rotate, the first pushing member 242 drives the second pushing member 243 to rotate, the second pushing member 243 pushes the sliding member 244 to move up and down under the limit of the first sliding groove 241, the sliding member 244 drives the first guiding member 255 to move, the first guiding member 255 drives the transmission member 261 to move, the transmission member 261 drives the transmission rod 262 to move by driving the second guiding member 264, the transmission rod 262 drives the clamping mechanism 4 to move, and the semiconductor chip after detection is placed back on the conveyor belt 1 again;
the second power member 422 drives the pushing plate 431 to move, the pushing plate 431 drives the pushing plate 431 on the other side to move by driving the connecting rod 432 to move, the pushing plate 431 drives the clamping member 45 to move by extruding the elastic member 46, and the clamping member 45 stops under the limiting action of the first limiting member 441 and the second limiting member 442;
the clamping member 45 then reversely extrudes the elastic member 46, and at the same time, the second power member 422 stops working, so that the elastic member 46 pushes the pushing plate 431 to reversely move, and the pushing plate 431 drives the pushing plate 431 on the other side to reversely move in a manner of driving the connecting rod 432 to move, so that the symmetrically arranged clamping members 45 finish opposite movement, and the clamping of the clamping member 45 to the semiconductor chip is finished.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (8)
1. A defect detecting apparatus for a semiconductor chip, comprising a conveyor belt, characterized by further comprising:
the detection platform is internally provided with a detection module, and the detection module is used for detecting the semiconductor chip;
the clamping mechanism is used for clamping the semiconductor chip to the detection module;
the taking mechanism comprises a support, a supporting component, a power component, a pushing component, a rotating component and a transmission component, the support is arranged on one side of the conveying belt, the right side of the support is fixedly connected with the supporting component, the supporting component is respectively connected with the power component, the pushing component, the rotating component and the transmission component, the power component is respectively connected with the pushing component and the rotating component, the rotating component is connected with the transmission component, and one side of the transmission component is connected with the clamping mechanism;
the supporting assembly comprises a first supporting piece, a second supporting piece and a third supporting piece, and one end of each of the first supporting piece, the second supporting piece and the third supporting piece is fixedly connected with the support;
the power assembly comprises a first power piece, a disc, a shifting rod and a shifting sheet, the first power piece is arranged on one side of the first supporting piece and is connected with the disc, and the shifting rod and the shifting sheet are arranged outside the disc;
the pushing assembly comprises a first sliding groove, a first pushing piece, a second pushing piece and a sliding piece, the first sliding groove is arranged on one side of the third supporting piece, the first sliding groove is movably connected with the sliding piece, the first pushing piece and the second pushing piece are both movably connected with the second supporting piece, the second pushing piece is movably connected with the sliding piece, and the first pushing piece is connected with the disk;
the rotating assembly comprises a first mounting piece, a rotating shaft, a second sliding groove, a third sliding groove and a first guide piece, the first mounting piece is connected with the outer wall of the third supporting piece, the first mounting piece is connected with the rotating shaft, the rotating shaft is externally arranged at one end of the third supporting piece, the outer wall of the rotating shaft is provided with the second sliding groove, the first mounting piece is provided with the third sliding groove, the second sliding groove is movably connected with the shifting rod, the third sliding groove is movably connected with the shifting piece, the third supporting piece is internally provided with the first guide piece, and the first guide piece is connected with the rotating shaft;
the transmission assembly comprises a transmission part, a transmission rod, a second installation part and a second guide part, one end of the transmission part is connected with the first guide part, the other end of the transmission part is connected with the transmission rod, the transmission rod is externally provided with the second guide part, the transmission rod is connected with the second installation part, and one side of the second installation part is provided with a clamping mechanism.
2. The apparatus of claim 1, wherein the gripper mechanism comprises:
the mounting plate is arranged on one side of the clamping plate, and the clamping plate is fixedly connected with the transmission rod;
the clamping assembly is movably connected with a limiting assembly, and the limiting assembly is arranged on one side of the mounting plate;
the clamping piece is movably connected with the mounting plate and movably connected with the limiting assembly;
and one end of the elastic piece is fixedly connected with the clamping piece, and the other end of the elastic piece is fixedly connected with the clamping assembly.
3. The apparatus of claim 2, wherein the clamping assembly comprises:
the pushing plate is connected with the output end of the power assembly, the pushing plate is fixedly connected with the elastic piece, and the pushing plate is symmetrically arranged relative to the mounting plate;
and the connecting rod is fixedly connected with the pushing plate and movably connected with the limiting assembly.
4. The apparatus of claim 3, wherein the limiting member comprises:
the first limiting piece is fixedly connected with the second limiting piece;
the third limiting part is fixedly connected with the first limiting part and movably connected with the elastic part;
and the fourth limiting part is fixedly connected with the first limiting part and movably connected with the connecting rod.
5. The apparatus of claim 1, wherein a placement mechanism is disposed in the inspection station, and the placement mechanism is configured to hold a semiconductor chip.
6. The apparatus of claim 5, wherein the placement mechanism comprises:
the third power part is connected with the detection table and drives the telescopic assembly to move;
the support frame is fixedly connected with the telescopic assembly, one end of the support frame is fixedly connected with a placing plate, and the placing plate is used for placing a semiconductor chip;
and the fixing frame is connected with the third power part, and the telescopic assembly is connected with the fixing frame.
7. The apparatus of claim 6, wherein the expansion assembly comprises:
one end of the adjusting piece is connected with the output end of the third power piece, and the other end of the adjusting piece is provided with a gear;
the rack is movably connected with the gear and fixedly connected with the supporting frame;
and the third guide piece is fixedly connected with the fixed frame and movably connected with the rack.
8. The inspection method of the defect inspection apparatus for semiconductor chips as set forth in any one of claims 1 to 7, comprising the steps of: irradiating infrared light onto a workpiece to be detected of a transmission device, wherein the workpiece is a semiconductor chip; acquiring an infrared image of a workpiece by using an infrared camera, or acquiring the infrared image and a common optical image of the workpiece by using the infrared camera and a common optical lens simultaneously so as to serve as an image to be detected; and transmitting the acquired image to be detected to an image analysis device, and analyzing and judging whether the workpiece has defects or not by the image analysis device.
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| CN209065004U (en) * | 2018-08-24 | 2019-07-05 | 广州倬粤动力新能源有限公司 | Clamp device |
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| JP2018128339A (en) * | 2017-02-08 | 2018-08-16 | 住友化学株式会社 | Surface inspection device for semiconductor wafer and surface inspection method for semiconductor wafer |
| CN107064148A (en) * | 2017-05-25 | 2017-08-18 | 东莞市联洲知识产权运营管理有限公司 | A kind of plates of automobile middle plane testing agency |
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Address after: B610, Zhongdi building, industry university research base, China University of Geosciences, No.8, Yuexing Third Road, South District, high tech Zone, Nanshan District, Shenzhen, Guangdong 518000 Patentee after: Shenzhen Saiyuan Microelectronics Co.,Ltd. Address before: 518063 b610, Zhongdi building, industry university research base, China University of Geosciences, No. 8, Yuexing Third Road, South District, high tech Zone, Nanshan District, Shenzhen, Guangdong Province Patentee before: SHENZHEN SINONE CHIP ELECTRONIC Co.,Ltd. |