CN114200212A - High-temperature pressure-bearing mud resistivity sensor - Google Patents
High-temperature pressure-bearing mud resistivity sensor Download PDFInfo
- Publication number
- CN114200212A CN114200212A CN202111262211.9A CN202111262211A CN114200212A CN 114200212 A CN114200212 A CN 114200212A CN 202111262211 A CN202111262211 A CN 202111262211A CN 114200212 A CN114200212 A CN 114200212A
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- Prior art keywords
- conductive copper
- copper ring
- pin
- ceramic insulator
- insulator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000012212 insulator Substances 0.000 claims abstract description 81
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 64
- 239000000919 ceramic Substances 0.000 claims abstract description 55
- 239000011521 glass Substances 0.000 claims abstract description 33
- 238000005245 sintering Methods 0.000 claims abstract description 9
- 238000009413 insulation Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 9
- 238000005219 brazing Methods 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 6
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 238000001465 metallisation Methods 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 4
- 229920002530 polyetherether ketone Polymers 0.000 claims description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 3
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011737 fluorine Substances 0.000 claims description 3
- 229910052731 fluorine Inorganic materials 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 239000003921 oil Substances 0.000 description 4
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- BIJOYKCOMBZXAE-UHFFFAOYSA-N chromium iron nickel Chemical compound [Cr].[Fe].[Ni] BIJOYKCOMBZXAE-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910000816 inconels 718 Inorganic materials 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
- G01R27/22—Measuring resistance of fluids
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
Abstract
The invention provides a high-temperature pressure-bearing mud resistivity sensor which comprises a shell, a contact pin, a glass insulator, a ceramic insulator and a conductive copper ring, wherein the shell is internally connected with a first contact pin and a second contact pin, the shell is internally connected with the first contact pin and positioned below the first contact pin and is connected with the first ceramic insulator, the first glass insulator and the second ceramic insulator, the bottom end of the second ceramic insulator is connected with the second glass insulator, the bottom of the second glass insulator is connected with the third ceramic insulator, and the bottom of the shell is respectively connected with the first conductive copper ring, the second conductive copper ring and the third conductive copper ring. The high-temperature pressure-bearing mud resistivity sensor provided by the invention is packaged in a glass sintering mode, has a simple structure, can be stably used at a high temperature of 230 ℃ and under a pressure of 200MPa, and has a use temperature range as follows: -40 ℃ to 230 ℃; the highest oil (water) pressure which can be borne by the sensor is 200 MPa.
Description
Technical Field
The invention relates to the field of sensors and electric connectors, in particular to a high-temperature pressure-bearing mud resistivity sensor.
Background
In the field of oil exploration or well logging, the measurement of the resistivity or the electrical property of liquid such as oil and the like needs a sensor for signal transmission, the existing sensor is usually packaged by adopting a high polymer material which can resist a certain temperature, such as polyetheretherketone and the like, but the sensor packaged by adopting the method cannot bear overhigh pressure, and the high polymer material has the risk of aging.
With the continuous increase of the logging depth, the pressure born by the logging instrument is also larger and larger, so that a sensor capable of bearing higher pressure is urgently needed, and the sensor adopting a glass sintering mode is more and more concerned by the logging field.
Therefore, it is necessary to provide a high-temperature pressure-bearing mud resistivity sensor to solve the above technical problems.
Disclosure of Invention
The invention aims to design a high-temperature pressure-bearing mud resistivity sensor, which is packaged in a glass sintering mode, has a simple structure and can be stably used at a high temperature of 230 ℃ and under a pressure of 200 MPa.
In order to achieve the purpose, the invention adopts the following technical scheme that the high-temperature pressure-bearing mud resistivity sensor comprises a shell, a contact pin, a glass insulator, a ceramic insulator and a conductive copper ring, wherein the shell is internally connected with a first contact pin and a second contact pin, the shell is internally connected with the first ceramic insulator, the first glass insulator and the second ceramic insulator which are positioned below the first contact pin, the bottom end of the second ceramic insulator is connected with the second glass insulator, the bottom of the second glass insulator is connected with the third ceramic insulator, and the bottom of the shell is respectively connected with the first conductive copper ring, the second conductive copper ring and the third conductive copper ring.
Preferably, three sets of one-number through holes are formed in the shell, the thread blind hole, the sealing groove and the counter bore are respectively set, and the sealing groove of the shell is used for placing the O-shaped fluorine rubber sealing ring and the PEEK check ring.
Preferably, first contact pin is the columnar structure, and one end is the sphere, and another is the plane, the second contact pin is the columnar structure, and one end is the sphere, and another processing is threaded, first contact pin is insulating with the shell, the second contact pin switches on with the shell, be connected with the shell through the mode of sintering between first contact pin and first ceramic insulator, second ceramic insulator and the first glass insulator, the second contact pin is connected with the shell through the mode that the screw thread closes soon.
Preferably, the first glass insulator is of an annular columnar structure, and the second glass insulator is of a circular structure and is provided with three groups of second through holes.
Preferably, the third ceramic insulator is of a cylindrical structure, three groups of holes are formed in one end of the third ceramic insulator, three groups of annular grooves are formed in the other end of the third ceramic insulator, each group of holes is communicated with one group of grooves, and the surfaces of the side walls of the three groups of annular grooves formed in the third ceramic insulator are subjected to a metallization treatment process.
Preferably, the first conductive copper ring and the second conductive copper ring are of annular structures, and the third conductive copper ring is of a cylindrical structure.
Preferably, the first conductive copper ring, the second conductive copper ring and the third conductive copper ring are connected in a manner of brazing with the third ceramic insulator.
Preferably, the first contact pin is in contact conduction with the first conductive copper ring, and the surfaces of the first contact pin and the second contact pin are processed by a gold plating process.
Preferably, a layer of high-temperature-resistant organic solution is coated on the exposed sides of the first ceramic insulator and the third ceramic insulator.
Preferably, the insulation resistance between the first contact pin and the first conductive copper ring is less than 0.4 Ω, and the insulation resistance between the first conductive copper ring, the second conductive copper ring and the third conductive copper ring and the shell is greater than 500M Ω respectively.
Compared with the prior art, the high-temperature pressure-bearing mud resistivity sensor provided by the invention has the following beneficial effects:
the invention provides a high-temperature pressure-bearing mud resistivity sensor, which is packaged by adopting a glass sintering mode, has a simple structure, can be stably used at a high temperature of 230 ℃ and under a pressure of 200MPa, and has the following service temperature ranges: -40 ℃ to 230 ℃; the highest oil (water) pressure which can be borne by the sensor is 200 MPa; under the condition of normal temperature and pressure, the sensor is tested by a 500VDC megohmmeter, and the insulation resistance between the conductive copper rings and the shell is more than 500M omega; and the insulation resistance between the contact pin contacted with the conductive copper ring and the conductive copper ring is less than 0.4 omega.
Drawings
FIG. 1 is a schematic structural view of a preferred embodiment of a high temperature pressure-bearing mud resistivity sensor according to the present invention;
FIG. 2 is a schematic front view of the high temperature pressure mud resistivity sensor shown in FIG. 1;
FIG. 3 is a schematic top view of the high temperature pressure mud resistivity sensor shown in FIG. 1;
FIG. 4 is a bottom view of the high temperature pressure mud resistivity sensor of FIG. 1;
FIG. 5 is a schematic isometric view of a high temperature pressure bearing mud resistivity sensor of FIG. 1.
Reference numbers in the figures: 1. a housing; 2. a first pin; 3. a second pin; 4. a first ceramic insulator; 5. a first glass insulator; 6. a second ceramic insulator; 7. a second glass insulator; 8. a third ceramic insulator; 9. a first conductive copper ring; 10. a second conductive copper ring; 11. a third conductive copper ring.
Detailed Description
The invention is further described with reference to the following figures and embodiments.
Referring to fig. 1, fig. 2, fig. 3, fig. 4 and fig. 5, wherein fig. 1 is a schematic structural diagram of a resistivity sensor of high-temperature pressure-bearing mud according to a preferred embodiment of the present invention; FIG. 2 is a schematic front view of the high temperature pressure mud resistivity sensor shown in FIG. 1; FIG. 3 is a schematic top view of the high temperature pressure mud resistivity sensor shown in FIG. 1; FIG. 4 is a bottom view of the high temperature pressure mud resistivity sensor of FIG. 1; FIG. 5 is a schematic isometric view of a high temperature pressure bearing mud resistivity sensor of FIG. 1. The utility model provides a high temperature pressure-bearing mud resistivity sensor, including shell 1, the material of shell 1 can be nickel base alloy, such as Inconel 718, the internal connection of shell 1 has first contact pin 2 and second contact pin 3, the material of first contact pin 2 and second contact pin 3 can be iron cobalt nickel or iron chromium nickel alloy, such as kovar alloy, the inside of shell 1 just is located the below of first contact pin 2 and is connected with first ceramic insulator 4, first glass insulator 5 and second ceramic insulator 6, the bottom of second ceramic insulator 6 is connected with second glass insulator 7, the bottom of second glass insulator 7 is connected with third ceramic insulator 8, the material of first glass insulator 5 and second glass insulator 7 can be DM305 and DM308, the bottom of shell 1 is connected with first electrically conductive copper ring 9 respectively, second electrically conductive copper ring 10 and third electrically conductive copper ring 11.
Three sets of one number through holes have been seted up to shell 1's inside, and screw thread blind hole, seal groove and counter bore are respectively a set of, and the seal groove of shell 1 is used for placing O type fluorine rubber seal and PEEK retaining ring.
The first contact pin 2 is of a cylindrical structure, one end of the first contact pin is of a spherical surface, the other end of the first contact pin is of a plane, the second contact pin 3 is of a cylindrical structure, one end of the second contact pin is of a spherical surface, threads are machined at the other end of the second contact pin, the first contact pin 2 is insulated from the shell 1, the second contact pin 3 is communicated with the shell 1, the first contact pin 2 is connected with the shell 1 through a sintering mode, glass-metal sintering can be performed in an atmosphere-protected chain furnace or a box-type resistance furnace, and the second contact pin 3 is connected with the shell 1 through a thread screwing mode.
The first glass insulator 5 is of an annular columnar structure, and the second glass insulator 7 is of a circular structure and is provided with three groups of through holes and two numbers of through holes.
The third ceramic insulator 8 is of a cylindrical structure, three groups of holes are formed in one end of the third ceramic insulator, three groups of annular grooves are formed in the other end of the third ceramic insulator, each group of holes are communicated with one group of grooves respectively, the side wall surfaces of the three groups of annular grooves formed in the third ceramic insulator 8 are subjected to metallization treatment, and the first ceramic insulator 4, the second ceramic insulator 6 and the third ceramic insulator 8 can be made of zirconia ceramics and the like.
The first conductive copper ring 9 and the second conductive copper ring 10 are ring structures, and the third conductive copper ring 11 is a cylindrical structure.
The first conductive copper ring 9, the second conductive copper ring 10 and the third conductive copper ring 11 are connected by means of brazing with the third ceramic insulator 8, the materials of the first conductive copper ring 9, the second conductive copper ring 10 and the third conductive copper ring 11 can be oxygen-free copper and the like, all the brazing materials can be Ag72Cu28 and the like, and the brazing can be carried out in a vacuum chain brazing furnace.
The first pin 2 is in contact conduction with the first conductive copper ring 9, and the surfaces of the first pin 2 and the second pin 3 are processed by a gold plating process.
The exposed sides of the first ceramic insulator 4 and the third ceramic insulator 8 are coated with a layer of high-temperature-resistant organic solution to prevent the ceramic insulators from absorbing moisture, such as organic silicon solution.
The insulation resistance between the first pin 2 and the first conductive copper ring 9 is less than 0.4 omega, and the insulation resistance between the first conductive copper ring 9, the second conductive copper ring 10 and the third conductive copper ring 11 and the shell 1 is more than 500M omega under normal temperature and normal pressure.
The working principle of the high-temperature pressure-bearing mud resistivity sensor provided by the invention is as follows:
the shell 1 is made of a nickel-based alloy, such as Inconel 718, the first pin 2 and the second pin 3 are made of iron-cobalt-nickel or iron-chromium-nickel alloy, such as kovar alloy, the first glass insulator 5 and the second glass insulator 7 are made of DM305 and DM308, the first ceramic insulator 4, the second ceramic insulator 6 and the third ceramic insulator 8 are made of zirconia ceramic, the first conductive copper ring 9, the second conductive copper ring 10 and the third conductive copper ring 11 are made of oxygen-free copper, exposed sides of the first ceramic insulator 4 and the third ceramic insulator 8 are coated with a layer of high-temperature-resistant organic solution, side wall surfaces of three groups of annular grooves formed in the third ceramic insulator 8 are subjected to a metallization process, and surfaces of the first pin 2 and the second pin 3 are subjected to a gold plating process.
Compared with the prior art, the high-temperature pressure-bearing mud resistivity sensor provided by the invention has the following beneficial effects:
the sensor is packaged by adopting a glass sintering mode, the sensor is simple in structure and can be stably used at a high temperature of 230 ℃ and under a pressure of 200MPa, and the use temperature range of the sensor is as follows: -40 ℃ to 230 ℃; the highest oil (water) pressure which can be borne by the sensor is 200 MPa; under the condition of normal temperature and pressure, the sensor is tested by a 500VDC megohmmeter, and the insulation resistance between the conductive copper rings and the shell is more than 500M omega; and the insulation resistance between the contact pin contacted with the conductive copper ring and the conductive copper ring is less than 0.4 omega.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. The utility model provides a high temperature pressure-bearing mud resistivity sensor, includes shell (1), its characterized in that: the utility model discloses a lead frame, including shell (1), the inside of shell (1) is connected with first contact pin (2) and second contact pin (3), the inside below that just is located first contact pin (2) of shell (1) is connected with first ceramic insulator (4), first glass insulator (5) and second ceramic insulator (6), the bottom of second ceramic insulator (6) is connected with second glass insulator (7), the bottom of second glass insulator (7) is connected with third ceramic insulator (8), the bottom of shell (1) is connected with first electrically conductive copper ring (9), second electrically conductive copper ring (10) and third electrically conductive copper ring (11) respectively.
2. The high-temperature pressure-bearing mud resistivity sensor according to claim 1, characterized in that three groups of first through holes, a threaded blind hole, a sealing groove and a counter bore are formed in the housing (1), and the sealing groove of the housing (1) is used for placing an O-shaped fluorine rubber sealing ring and a PEEK check ring.
3. The high-temperature pressure-bearing mud resistivity sensor according to claim 1, wherein the first pin (2) is of a cylindrical structure, one end of the first pin is of a spherical surface, the other end of the first pin is of a plane surface, the second pin (3) is of a cylindrical structure, one end of the second pin is of a spherical surface, the other end of the second pin is provided with a thread, the first pin (2) is insulated from the housing (1), the second pin (3) is communicated with the housing (1), the first pin (2) is connected with the housing (1) through a sintering mode, the second pin (6) is connected with the first ceramic insulator (4), the first glass insulator (5) through a thread screwing mode, and the second pin (3) is connected with the housing (1).
4. The high-temperature pressure-bearing mud resistivity sensor according to claim 1, wherein the first glass insulator (5) is of an annular columnar structure, and the second glass insulator (7) is of a circular structure and is provided with three groups of through holes of the second type.
5. The resistivity sensor of high-temperature pressure-bearing mud as claimed in claim 1, wherein the third ceramic insulator (8) is a cylindrical structure, three groups of holes are formed at one end, three groups of annular grooves are formed at the other end, each group of holes are respectively communicated with one group of grooves, and the surfaces of the side walls of the three groups of annular grooves formed in the third ceramic insulator (8) are subjected to a metallization treatment process.
6. The high-temperature pressure-bearing mud resistivity sensor according to claim 1, wherein the first conductive copper ring (9) and the second conductive copper ring (10) are of annular structures, and the third conductive copper ring (11) is of a cylindrical structure.
7. The high-temperature pressure-bearing mud resistivity sensor according to claim 1, characterized in that the first conductive copper ring (9), the second conductive copper ring (10) and the third conductive copper ring (11) are connected by means of brazing with the third ceramic insulator (8).
8. The high-temperature pressure-bearing mud resistivity sensor according to claim 1, characterized in that the first pin (2) is in contact conduction with a first conductive copper ring (9), and the surfaces of the first pin (2) and the second pin (3) are processed by a gold plating process.
9. The high-temperature pressure-bearing mud resistivity sensor according to claim 1, characterized in that the exposed sides of the first ceramic insulator (4) and the third ceramic insulator (8) are coated with a layer of high-temperature-resistant organic solution.
10. The high-temperature pressure-bearing mud resistivity sensor according to claim 1, characterized in that the insulation resistance between the first contact pin (2) and the first conductive copper ring (9) is less than 0.4 Ω, and the insulation resistance between the first conductive copper ring (9), the second conductive copper ring (10) and the third conductive copper ring (11) and the outer shell (1) is more than 500M Ω.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111262211.9A CN114200212A (en) | 2021-10-28 | 2021-10-28 | High-temperature pressure-bearing mud resistivity sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111262211.9A CN114200212A (en) | 2021-10-28 | 2021-10-28 | High-temperature pressure-bearing mud resistivity sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114200212A true CN114200212A (en) | 2022-03-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111262211.9A Pending CN114200212A (en) | 2021-10-28 | 2021-10-28 | High-temperature pressure-bearing mud resistivity sensor |
Country Status (1)
| Country | Link |
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| CN (1) | CN114200212A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5245136A (en) * | 1989-10-06 | 1993-09-14 | International Business Machines Corporation | Hermetic package for an electronic device |
| CN103474831A (en) * | 2013-09-23 | 2013-12-25 | 苏州华旃航天电器有限公司 | Glass sintered high temperature and high pressure sealing electric connector |
| CN205303776U (en) * | 2015-12-29 | 2016-06-08 | 西安赛尔电子材料科技有限公司 | Glass sealing multicore connector of nai pressurization |
| CN112736586A (en) * | 2020-12-28 | 2021-04-30 | 西安赛尔电子材料科技有限公司 | Non-magnetic multi-pin temperature-resistant pressure-bearing electric connector |
| CN112768982A (en) * | 2020-12-28 | 2021-05-07 | 西安赛尔电子材料科技有限公司 | Temperature-resistant pressure-bearing electric connector for liquid resistivity sensor |
-
2021
- 2021-10-28 CN CN202111262211.9A patent/CN114200212A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5245136A (en) * | 1989-10-06 | 1993-09-14 | International Business Machines Corporation | Hermetic package for an electronic device |
| CN103474831A (en) * | 2013-09-23 | 2013-12-25 | 苏州华旃航天电器有限公司 | Glass sintered high temperature and high pressure sealing electric connector |
| CN205303776U (en) * | 2015-12-29 | 2016-06-08 | 西安赛尔电子材料科技有限公司 | Glass sealing multicore connector of nai pressurization |
| CN112736586A (en) * | 2020-12-28 | 2021-04-30 | 西安赛尔电子材料科技有限公司 | Non-magnetic multi-pin temperature-resistant pressure-bearing electric connector |
| CN112768982A (en) * | 2020-12-28 | 2021-05-07 | 西安赛尔电子材料科技有限公司 | Temperature-resistant pressure-bearing electric connector for liquid resistivity sensor |
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