CN114190064A - Main control box - Google Patents

Main control box Download PDF

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Publication number
CN114190064A
CN114190064A CN202111626957.3A CN202111626957A CN114190064A CN 114190064 A CN114190064 A CN 114190064A CN 202111626957 A CN202111626957 A CN 202111626957A CN 114190064 A CN114190064 A CN 114190064A
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China
Prior art keywords
control box
main control
chassis
air duct
heat dissipation
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Pending
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CN202111626957.3A
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Chinese (zh)
Inventor
吴琼
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Shenzhen Ubtech Technology Co ltd
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Shenzhen Ubtech Technology Co ltd
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Priority to CN202111626957.3A priority Critical patent/CN114190064A/en
Publication of CN114190064A publication Critical patent/CN114190064A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本申请公开了一种主控箱,涉及电控设备技术领域。主控箱包括机箱、多个电控模组和散热风扇。所述机箱具有容纳腔和散热风道,所述容纳腔内沿所述机箱的顶部至其底部方向间隔设置有多个电控模组,相邻两个所述电控模组之间的间隙形成所述散热风道,每个所述电控模组的顶部分别设置有第一散热片;所述散热风扇设置于所述机箱上相对的两个侧板的其中一个所述侧板上,另一个所述侧板上设置有与所述散热风道连通的风槽孔。本申请提供的主控箱,电控模组产生的热量,一部分热量在散热风扇的作用下经过散热风道从风槽孔排出,另一部分热量由第一散热片传导散热,提高了散热效率。

Figure 202111626957

The application discloses a main control box, which relates to the technical field of electronic control equipment. The main control box includes a chassis, a plurality of electronic control modules and a cooling fan. The chassis has an accommodating cavity and a heat dissipation air duct, and a plurality of electric control modules are arranged in the accommodating cavity along the direction from the top to the bottom of the chassis, and the gap between two adjacent electric control modules is The cooling air duct is formed, and the top of each electronic control module is respectively provided with a first cooling fin; the cooling fan is arranged on one of the side panels of the two opposite side panels on the chassis, The other side plate is provided with an air slot hole communicating with the heat dissipation air duct. In the main control box provided by the present application, the heat generated by the electronic control module, part of the heat is discharged from the air slot through the cooling air duct under the action of the cooling fan, and the other part of the heat is conducted and dissipated by the first heat sink, which improves the heat dissipation efficiency.

Figure 202111626957

Description

Main control box
Technical Field
The application relates to the technical field of electric control equipment, in particular to a master control box.
Background
At present, the application field of the robot is more and more, and the arrangement of the electric control module in the main control box is designed more and more along with the increase of the function of the robot. Install the master control case of these automatically controlled modules and generally include the box, the inside of box is equipped with the cavity, automatically controlled module is installed in this cavity, when the robot operation, automatically controlled module can produce a large amount of heats, this just needs in time to distribute away the heat in the cavity, and take away this part of heat through the fin among the prior art, because the fin all sets up in the box with automatically controlled module usually, the box can not be discharged completely to the heat that gives off by the fin, lead to the thermal diffusivity of equipment relatively poor.
Disclosure of Invention
In view of this, the present application provides a master control box to solve the technical problem of poor heat dissipation effect caused by single heat dissipation of the master control box in the prior art.
The present application provides:
a master box, comprising:
the electronic control module comprises a case, wherein the case is provided with an accommodating cavity and a heat dissipation air channel, a plurality of electronic control modules are arranged in the accommodating cavity at intervals along the direction from the top to the bottom of the case, a gap between every two adjacent electronic control modules forms the heat dissipation air channel, and the top of each electronic control module is provided with a first cooling fin;
and the heat radiation fan is arranged on one of the two opposite side plates on the case, and the other side plate is provided with an air slot hole communicated with the heat radiation air channel.
In addition, the master control box according to the application can also have the following additional technical characteristics:
in some embodiments of the present application, a second heat sink is disposed on the side plate of the chassis on which the heat dissipation fan is disposed, and the second heat sink and the first heat sink are disposed perpendicular to each other.
In some embodiments of the present application, the first heat sink is disposed parallel to a flow direction of the air flow in the heat dissipation air duct.
In some embodiments of the present application, the main control box further includes a module mounting plate, the module mounting plate is connected to the back panel of the chassis, and the electronic control module is connected to the module mounting plate.
In some embodiments of the present application, the electronic control module includes an upper shell, a bottom plate, a circuit board and a panel, the upper shell, the bottom plate and the panel enclose to form an installation cavity of the circuit board, the opposite side edges of the circuit board are respectively provided with a heat conduction layer, and the bottom plate is provided with a third heat dissipation fin.
In some embodiments of the present application, the first heat sink is disposed on a side of the upper case away from the circuit board, and a top surface of the first heat sink and a top surface of the upper case are on a same plane.
In some embodiments of the present application, the first heat sink and the upper case are integrally formed of a material having a thermal conductivity of more than 380W/mK.
In some embodiments of the application, two opposite side plates on the case are provided with guide grooves, the upper shell is provided with locking strips matched with the guide grooves, and the panel is provided with through holes opposite to the locking strips.
In some embodiments of the present application, the edges of the two opposite sides of the upper shell are bent toward the bottom plate to form bent edges, the locking strip is fixed on the bent edges, and the top surface of the locking strip is lower than the top surface of the upper shell.
In some embodiments of the present application, the main control box further includes two baffles, and the two baffles are respectively connected to the two opposite side plates of the chassis and respectively abut against the panel.
Compared with the prior art, the beneficial effects of this application are: the application provides a master control box, through adjacent two clearance between the automatically controlled module forms quick-witted incasement portion's heat dissipation wind channel, simultaneously, every the top of automatically controlled module is provided with first fin respectively. The heat radiation fan is arranged on one of the two opposite side plates on the case, and the other side plate is provided with an air slot hole communicated with the heat radiation air duct. Therefore, part of heat generated by the electronic control module is discharged from the air duct hole through the heat dissipation air duct under the action of the heat dissipation fan, and the other part of heat is conducted and dissipated by the first heat dissipation sheet, so that the heat dissipation efficiency is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.
FIG. 1 illustrates a perspective view of one embodiment of a master control box in some embodiments of the present application;
FIG. 2 illustrates a schematic view of a master control box in some embodiments of the present application;
FIG. 3 is a schematic sectional view taken along line A-A in FIG. 2;
FIG. 4 shows an exploded view of the master control box shown in FIG. 1;
fig. 5 is a schematic perspective view of an electronic control module in a main control box according to some embodiments of the present disclosure;
FIG. 6 is a schematic view of an exploded structure of the electronic control module shown in FIG. 5;
FIG. 7 is a schematic perspective view of a base plate of an electronic control module according to some embodiments of the present disclosure;
FIG. 8 is a schematic view of a circuit board of an electronic control module according to some embodiments of the present disclosure;
fig. 9 is a schematic view illustrating another perspective structure of the circuit board of the electronic control module according to some embodiments of the present application.
Description of the main element symbols:
100-a master control box; 10-a chassis; 11-a containment chamber; 12-a heat dissipation air duct; 13-side plate; 131-a guide groove; 132-a second heat sink; 133-wind slot holes; 14-back panel; 15-a top plate; 16-a bottom cover; 17-a baffle; 20-an electronic control module; 21-upper shell; 211-a first heat sink; 212-a bent edge; 22-a base plate; 221-a third heat sink; 23-a circuit board; 231-a thermally conductive layer; 24-a panel; 241-a through hole; 25-a locking strip; 26-module mounting plate; 30-a heat dissipation fan; 31-a first fan; 32-a second fan; 33-third fan.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present application.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
As shown in fig. 1 to 4, an embodiment of the present application provides a master control box 100, which is mainly used in an electric control device, such as a host server in a robot. The main control box 100 includes a chassis 10, a plurality of electronic control modules 20, and a heat dissipation fan 30.
The chassis 10 is provided with an accommodating cavity 11 and a heat dissipation air duct 12, a plurality of electronic control modules 20 are arranged in the accommodating cavity 11 at intervals along a direction from the top to the bottom of the chassis 10, a gap between every two adjacent electronic control modules 20 forms the heat dissipation air duct 12, a first cooling fin 211 is arranged at the top of each electronic control module 20, the number of the first cooling fins 211 can be multiple, and the plurality of first cooling fins 211 are arranged at the top of the electronic control modules 20 at intervals.
The heat dissipation fan 30 is disposed on one of the two opposite side plates 13 of the chassis 10, the other side plate 13 is provided with an air duct hole 133 communicated with the heat dissipation air duct 12, and cold air sucked by the heat dissipation fan 30 is exhausted from the air duct hole 133 through the heat dissipation air duct 12, so as to exhaust heat generated by the electronic control module 20.
In the use process of the main control box 100 provided in the embodiment of the present application, the heat dissipation air duct 12 inside the chassis 10 is formed by the gap between the two adjacent electronic control modules 20, and meanwhile, the top of each electronic control module 20 is provided with the first heat dissipation fins 211 respectively. The heat dissipation fan 30 is disposed on one of the two opposite side plates 13 on the chassis 10, and the other side plate 13 is provided with an air duct hole 133 communicated with the heat dissipation air duct, so that two sides of the two opposite side plates 13 form convective air circulation, thereby facilitating heat dissipation. In this way, a part of the heat generated by the electronic control module 20 is discharged from the air duct hole 133 through the heat dissipation air duct 12 under the action of the heat dissipation fan 30, and the other part of the heat is conducted and dissipated by the first heat dissipation fin 211, so that the heat dissipation efficiency is improved.
In addition, it should be noted that the heat dissipation fan 30 may include a first fan 31, a second fan 32, and a third fan 33, and may also include a fourth fan, etc. The first fan 31, the second fan 32 and the third fan 33 are arranged at intervals along the height direction of the chassis 10, correspondingly, the number of the heat dissipation air ducts is equal to that of the fans, each heat dissipation air duct 12 is correspondingly provided with an air duct hole 133 communicated with the heat dissipation air duct 12, and one heat dissipation air duct 12 can be correspondingly communicated with a plurality of air duct holes 133. The wind slot holes 133 may be formed in a racetrack shape or a rectangular shape, or may be circular holes. Specifically, the design can be performed according to actual needs.
As shown in fig. 3, in an embodiment of the present application, optionally, a second heat sink 132 is disposed on the side plate 13 of the chassis 10 on which the heat dissipation fan 30 is disposed, and the second heat sink 132 and the first heat sink 211 are disposed perpendicular to each other.
In the present embodiment, the second heat sink 132 is disposed on the side plate 13 where the heat dissipation fan 30 is disposed, so that the heat conducted from the first heat sink 211 on the electronic control module 20 to the chassis 10 is conducted to the air through the second heat sink 132, thereby dissipating the heat of the chassis 10. Meanwhile, the second heat sink 132 and the first heat sink 211 are perpendicular to each other, so that heat is conducted in the direction of crossing the two, which is more beneficial for heat dissipation, thereby improving heat dissipation efficiency.
In an embodiment of the present application, further, the first heat sink 211 is disposed in parallel with the airflow flowing direction in the heat dissipation air duct 12. It is understood that the number of the first heat dissipation fins 211 may be plural, a plurality of the first heat dissipation fins 211 are arranged at intervals, a gap is provided between two adjacent first heat dissipation fins 211, and the heat on the first heat dissipation fins 211 is dissipated through the air flow at the gap. Meanwhile, the first heat sink 211 is parallel to the flow direction of the air flow in the heat dissipation air duct, so that when the air at normal temperature passes through the heat dissipation air duct 12, the contact area with the first heat sink 211 is larger, and the heat of the first heat sink 211 is conveniently transferred out.
In addition, the air blown by the heat dissipation fan 30 can be divided into two parts, one part of the air blown by the heat dissipation air duct 12 through the air slot 133 is a first air direction, the other part of the air blown by the second heat dissipation fins 132 on the side plate 13 of the chassis 10 is blocked by the side surface of the electronic control module 20 to dissipate the heat, and the air blown by the heat dissipation fan can be set to a second direction.
As shown in fig. 3, in an embodiment of the present application, optionally, the master control box 100 further includes a module mounting plate 26, the module mounting plate 26 is connected to the back panel 14 of the chassis 10, and the plurality of electronic control modules 20 are connected to the module mounting plate 26. Specifically, be provided with a plurality of interfaces on the module mounting panel 26, be provided with on the automatically controlled module 20 a plurality of with the socket that the interface was pegged graft mutually to the realization is fixed a plurality of automatically controlled modules 20 on module mounting panel 26, and the module mounting panel 26 of being convenient for is connected with external power source, in order to realize circular telegram and the communication to a plurality of automatically controlled modules 20.
As shown in fig. 5 to 7, in an embodiment of the present application, optionally, the electronic control module 20 includes an upper shell 21, a bottom plate 22, a circuit board 23 and a panel 24.
Referring to fig. 8 and 9, the upper case 21, the bottom plate 22 and the panel 24 enclose a mounting cavity for mounting the circuit board 23, and two opposite side edges of the circuit board 23 are respectively provided with a heat conduction layer 231. The heat conductive layer 231 may be made of a material having high heat dissipation efficiency, and preferably, the heat conductive layer 231 is a copper layer. In addition, the bottom plate 22 is provided with a third heat sink 221, so that heat generated by the circuit board 23 can be transferred to the first heat sink 211 of the upper case 21, and can also be transferred to the third heat sink 221 at the bottom plate 22, thereby improving heat dissipation efficiency.
Specifically, during mounting, the position of the chip on the circuit board 23 is coated with the heat conductive gel, and then the upper case 21, the circuit board 23 and the bottom plate 22 are fixed together by screws, so that the chip is tightly attached to the first heat sink 211 of the upper case 21. In order to conduct more heat of the upper shell 21 of the electronic control module 20, a copper layer is plated on the upper surface and the lower surface of the two sides of the circuit board 23, so that the heat of the upper shell 21 and the bottom plate 22 which are connected with the circuit board 23 can be conducted, and the heat dissipation efficiency is improved.
As shown in fig. 6, in an embodiment of the present application, optionally, the first heat sink 211 is disposed on a side of the upper casing 21 away from the circuit board 23, and a top surface of the first heat sink 211 is on the same plane as a top surface of the upper casing 21.
In the present embodiment, specifically, the first heat sink 211 is formed in the upper case 21 and is formed by a groove wall in which the strip-shaped groove of the upper case 21 is formed. The top surface of the first heat sink 211 is on the same plane as the top surface of the upper case 21, so that the blocking of the air flow in the heat dissipation air duct can be avoided.
In the above embodiment of the present application, optionally, the first heat sink 211 and the upper case 21 are integrally formed of a material having a thermal conductivity of more than 380W/mK. Preferably, the material may be copper, which has a good heat conduction effect and improves the overall structural strength of the upper case 21. It is understood that the first heat sink 211 and the upper shell 21 may be integrally formed by using other materials with high heat conduction efficiency.
In addition, the first heat sink 211 and the upper case 21 are integrally formed, so that the structural strength between the two is ensured, and the connection reliability is improved. On the other hand, the two are integrally formed, so that the production and the manufacturing are convenient, the production efficiency is improved, the production cost is reduced, and further the market competitiveness of the master control box 100 is improved.
As shown in fig. 4, in an embodiment of the present application, optionally, two opposite side plates 13 on the chassis 10 are provided with guide grooves 131, the upper shell 21 is provided with a locking bar 25 matched with the guide grooves 131, and the panel 24 is provided with a through hole 241 opposite to the locking bar 25. In the embodiment, through the matching of the locking strip 25 and the guide groove 131, the operation of the electric control assembly is easier during assembly, and the assembly efficiency is improved.
As shown in fig. 6, in the above embodiment of the present application, further, the edges of the two opposite sides of the upper shell 21 are bent toward the bottom plate 22 to form bent edges 212, the locking strip 25 is fixed on the bent edges 212, and the top surface of the locking strip 25 is lower than the top surface of the upper shell 21.
In the present embodiment, the edge of the upper case 21 is bent to form a bent edge 212, and the locking bar 25 is fixed to the bent edge 212 by a screw. Meanwhile, the top surface of the locking strip 25 is lower than the top surface of the upper shell 21, so that the locking strip 25 can be prevented from blocking the airflow of the heat dissipation air duct, and the heat dissipation effect is improved.
As shown in fig. 1 and 4, in an embodiment of the present application, optionally, the master control box 100 further includes two baffles 17, and the two baffles 17 are respectively connected to two opposite side plates 13 of the chassis 10 and respectively abut against the panel 24.
In the present embodiment, the baffle 17 is fixed to the housing of the enclosure 10 by screws, and the baffle 17 abuts against the panel 24 of the electronic control module 20, so that the impact resistance of the entire main control box 100 can be increased, and the design can withstand an impact vibration test with an acceleration of 10 g.
As shown in fig. 1 to 4, in an embodiment of the present application, the enclosure 10 of the master control box 100 is made of aluminum alloy, and is light in weight, and the enclosure 10 weighs about 0.9 kg. The enclosure 10 includes two side panels 13, a top panel 15, a back panel 14, and a bottom panel 16, and the four sides of the enclosure 10 are hollow. The accommodating cavity 11 is formed with 8 mounting slots for the electronic control modules 20, and can accommodate 8 electronic control modules 20, wherein there are 1 power supply mounting slot and 7 extended mounting slots. The overall outer envelope size can be designed as follows: 190mm 155mm 132mm, whole high integration makes full use of space to design.
The whole rated power of the main control box 100 can be 200W and is uniformly distributed to 8 mounting slots, and the power of each electric control module 20 is 25W; the environmental temperature is normal temperature (25 ℃), and under the condition of 200W, the temperature of the upper shell 21 contacted with the chip in the electronic control module 20 in the case 10 is controlled within 70 ℃, so that the chip in the main control box 100 can normally work.
The top of each electrical control module 20 is provided with a first heat sink 211, the bottom thereof is provided with a third heat sink 221, the material of the upper shell 21 and the bottom plate 22 of the electrical control module 20 is copper, and the length and width of each electrical control module 20 is 125mm x 118 mm. The thickness of the electric control module 20 of the 7 extended installation slots is the same and is 22 mm; it should be noted that the thickness of the electronic control module 20 can be customized according to the size of the internal circuit board 23, and the front and rear panels 24 can also be customized according to different external terminals. Compared with the existing master control box, the volume of the master control box is the same, and more electronic control modules 20 can be used.
In summary, the present application provides a main control box 100, a heat dissipation air duct 12 inside a chassis 10 is formed by a gap between two adjacent electronic control modules 20, and a first heat dissipation fin 211 is disposed on a top of each of the electronic control modules 20. The heat dissipation fan 30 is disposed on one side plate 13 of two opposite side plates 13 on the chassis 10, and an air duct hole 133 communicating with the heat dissipation air duct 12 is disposed on the other side plate 13. In this way, a part of the heat generated by the electronic control module 20 is discharged from the air duct hole 133 through the heat dissipation air duct 12 under the action of the heat dissipation fan 30, and the other part of the heat is conducted and dissipated by the first heat dissipation fin 211, so that the heat dissipation efficiency is improved.
In the description herein, reference to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations may be made to the above embodiments by those of ordinary skill in the art within the scope of the present application.

Claims (10)

1.一种主控箱,其特征在于,包括:1. a main control box, is characterized in that, comprises: 机箱,所述机箱具有容纳腔和散热风道,所述容纳腔内沿所述机箱的顶部至其底部方向间隔设置有多个电控模组,相邻两个所述电控模组之间的间隙形成所述散热风道,每个所述电控模组的顶部分别设置有第一散热片;A chassis, the chassis has an accommodating cavity and a cooling air duct, and a plurality of electronic control modules are spaced in the accommodating cavity along the direction from the top to the bottom of the chassis, and between two adjacent electronic control modules The gap formed by the cooling air duct, and the top of each electronic control module is respectively provided with a first cooling fin; 散热风扇,所述散热风扇设置于所述机箱上相对的两个侧板的其中一个所述侧板上,另一个所述侧板上设置有与所述散热风道连通的风槽孔。The cooling fan is arranged on one of the two opposite side plates on the chassis, and the other side plate is provided with an air slot which communicates with the cooling air duct. 2.根据权利要求1所述的主控箱,其特征在于,所述机箱上设置有所述散热风扇的所述侧板上设置有第二散热片,所述第二散热片与所述第一散热片互相垂直设置。2 . The main control box according to claim 1 , wherein a second cooling fin is arranged on the side plate on which the cooling fan is arranged on the box, and the second cooling fin is connected to the first cooling fin. 3 . A heat sink is arranged perpendicular to each other. 3.根据权利要求1所述的主控箱,其特征在于,所述第一散热片与所述散热风道内的气流流动方向平行设置。3 . The main control box according to claim 1 , wherein the first cooling fins are arranged in parallel with the airflow direction in the cooling air duct. 4 . 4.根据权利要求1所述的主控箱,其特征在于,还包括模组安装板,所述模组安装板与所述机箱的后围板连接,多个所述电控模组与所述模组安装板连接。4 . The main control box according to claim 1 , further comprising a module mounting plate, the module mounting plate is connected to the rear wall of the chassis, and a plurality of the electronic control modules are connected to the connected to the module mounting plate. 5.根据权利要求4所述的主控箱,其特征在于,所述电控模组包括上壳、底板、电路板和面板,所述上壳、底板和所述面板围成安装所述电路板的安装腔,且所述电路板的相对两侧边缘分别设置有导热层,所述底板上设置有第三散热片。5 . The main control box according to claim 4 , wherein the electric control module comprises an upper casing, a bottom plate, a circuit board and a panel, and the upper casing, the bottom plate and the panel enclose the installation of the circuit. 6 . The mounting cavity of the board is provided, and the opposite side edges of the circuit board are respectively provided with heat conducting layers, and the bottom plate is provided with a third heat sink. 6.根据权利要求5所述的主控箱,其特征在于,所述第一散热片设置于所述上壳远离所述电路板的一侧,所述第一散热片的顶面与所述上壳的顶面处于同一平面上。6 . The main control box according to claim 5 , wherein the first heat sink is disposed on a side of the upper case away from the circuit board, and the top surface of the first heat sink is connected to the The top surface of the upper shell is on the same plane. 7.根据权利要求6所述的主控箱,其特征在于,所述第一散热片和所述上壳为热传导率大于380W/mK的材料一体成型制成。7 . The main control box according to claim 6 , wherein the first heat sink and the upper shell are integrally formed from a material with a thermal conductivity greater than 380W/mK. 8 . 8.根据权利要求5所述的主控箱,其特征在于,所述机箱上相对的两个所述侧板上设置有导向槽,所述上壳上设置有与所述导向槽相配合的锁紧条,所述面板上开设有与所述锁紧条相对的通孔。8. The main control box according to claim 5, characterized in that, two opposite side plates on the chassis are provided with guide grooves, and the upper shell is provided with a guide groove matched with the guide grooves. A locking bar, the panel is provided with a through hole opposite to the locking bar. 9.根据权利要求8所述的主控箱,其特征在于,所述上壳的相对两侧的边缘向所述底板的方向弯折形成弯折边,所述锁紧条固定于所述弯折边上,且所述锁紧条的顶面低于所述上壳的顶面。9 . The main control box according to claim 8 , wherein the edges of opposite sides of the upper shell are bent toward the bottom plate to form bent edges, and the locking strips are fixed on the bent edges. 10 . on the folded edge, and the top surface of the locking strip is lower than the top surface of the upper shell. 10.根据权利要求5至8中任一项所述的主控箱,其特征在于,还包括两个挡板,两个所述挡板分别与所述机箱上相对的两个所述侧板连接,且分别抵接于所述面板上。10. The main control box according to any one of claims 5 to 8, further comprising two baffles, the two baffles are respectively opposite to the two side panels on the chassis connected and respectively abutted on the panels.
CN202111626957.3A 2021-12-28 2021-12-28 Main control box Pending CN114190064A (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201221036A (en) * 2010-11-05 2012-05-16 Inventec Corp Server rack
CN102478899A (en) * 2010-11-30 2012-05-30 英业达股份有限公司 server
CN204179076U (en) * 2014-10-21 2015-02-25 山东鲁能智能技术有限公司 A kind of reinforcing radiating module structure
CN212628708U (en) * 2020-06-05 2021-02-26 武汉兴图新科电子股份有限公司 A pluggable system chassis with conduction-assisted cooling
CN216532433U (en) * 2021-12-28 2022-05-13 深圳市优必选科技股份有限公司 Main control box

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201221036A (en) * 2010-11-05 2012-05-16 Inventec Corp Server rack
CN102478899A (en) * 2010-11-30 2012-05-30 英业达股份有限公司 server
CN204179076U (en) * 2014-10-21 2015-02-25 山东鲁能智能技术有限公司 A kind of reinforcing radiating module structure
CN212628708U (en) * 2020-06-05 2021-02-26 武汉兴图新科电子股份有限公司 A pluggable system chassis with conduction-assisted cooling
CN216532433U (en) * 2021-12-28 2022-05-13 深圳市优必选科技股份有限公司 Main control box

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