Disclosure of Invention
In view of this, the present application provides a master control box to solve the technical problem of poor heat dissipation effect caused by single heat dissipation of the master control box in the prior art.
The present application provides:
a master box, comprising:
the electronic control module comprises a case, wherein the case is provided with an accommodating cavity and a heat dissipation air channel, a plurality of electronic control modules are arranged in the accommodating cavity at intervals along the direction from the top to the bottom of the case, a gap between every two adjacent electronic control modules forms the heat dissipation air channel, and the top of each electronic control module is provided with a first cooling fin;
and the heat radiation fan is arranged on one of the two opposite side plates on the case, and the other side plate is provided with an air slot hole communicated with the heat radiation air channel.
In addition, the master control box according to the application can also have the following additional technical characteristics:
in some embodiments of the present application, a second heat sink is disposed on the side plate of the chassis on which the heat dissipation fan is disposed, and the second heat sink and the first heat sink are disposed perpendicular to each other.
In some embodiments of the present application, the first heat sink is disposed parallel to a flow direction of the air flow in the heat dissipation air duct.
In some embodiments of the present application, the main control box further includes a module mounting plate, the module mounting plate is connected to the back panel of the chassis, and the electronic control module is connected to the module mounting plate.
In some embodiments of the present application, the electronic control module includes an upper shell, a bottom plate, a circuit board and a panel, the upper shell, the bottom plate and the panel enclose to form an installation cavity of the circuit board, the opposite side edges of the circuit board are respectively provided with a heat conduction layer, and the bottom plate is provided with a third heat dissipation fin.
In some embodiments of the present application, the first heat sink is disposed on a side of the upper case away from the circuit board, and a top surface of the first heat sink and a top surface of the upper case are on a same plane.
In some embodiments of the present application, the first heat sink and the upper case are integrally formed of a material having a thermal conductivity of more than 380W/mK.
In some embodiments of the application, two opposite side plates on the case are provided with guide grooves, the upper shell is provided with locking strips matched with the guide grooves, and the panel is provided with through holes opposite to the locking strips.
In some embodiments of the present application, the edges of the two opposite sides of the upper shell are bent toward the bottom plate to form bent edges, the locking strip is fixed on the bent edges, and the top surface of the locking strip is lower than the top surface of the upper shell.
In some embodiments of the present application, the main control box further includes two baffles, and the two baffles are respectively connected to the two opposite side plates of the chassis and respectively abut against the panel.
Compared with the prior art, the beneficial effects of this application are: the application provides a master control box, through adjacent two clearance between the automatically controlled module forms quick-witted incasement portion's heat dissipation wind channel, simultaneously, every the top of automatically controlled module is provided with first fin respectively. The heat radiation fan is arranged on one of the two opposite side plates on the case, and the other side plate is provided with an air slot hole communicated with the heat radiation air duct. Therefore, part of heat generated by the electronic control module is discharged from the air duct hole through the heat dissipation air duct under the action of the heat dissipation fan, and the other part of heat is conducted and dissipated by the first heat dissipation sheet, so that the heat dissipation efficiency is improved.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present application.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
As shown in fig. 1 to 4, an embodiment of the present application provides a master control box 100, which is mainly used in an electric control device, such as a host server in a robot. The main control box 100 includes a chassis 10, a plurality of electronic control modules 20, and a heat dissipation fan 30.
The chassis 10 is provided with an accommodating cavity 11 and a heat dissipation air duct 12, a plurality of electronic control modules 20 are arranged in the accommodating cavity 11 at intervals along a direction from the top to the bottom of the chassis 10, a gap between every two adjacent electronic control modules 20 forms the heat dissipation air duct 12, a first cooling fin 211 is arranged at the top of each electronic control module 20, the number of the first cooling fins 211 can be multiple, and the plurality of first cooling fins 211 are arranged at the top of the electronic control modules 20 at intervals.
The heat dissipation fan 30 is disposed on one of the two opposite side plates 13 of the chassis 10, the other side plate 13 is provided with an air duct hole 133 communicated with the heat dissipation air duct 12, and cold air sucked by the heat dissipation fan 30 is exhausted from the air duct hole 133 through the heat dissipation air duct 12, so as to exhaust heat generated by the electronic control module 20.
In the use process of the main control box 100 provided in the embodiment of the present application, the heat dissipation air duct 12 inside the chassis 10 is formed by the gap between the two adjacent electronic control modules 20, and meanwhile, the top of each electronic control module 20 is provided with the first heat dissipation fins 211 respectively. The heat dissipation fan 30 is disposed on one of the two opposite side plates 13 on the chassis 10, and the other side plate 13 is provided with an air duct hole 133 communicated with the heat dissipation air duct, so that two sides of the two opposite side plates 13 form convective air circulation, thereby facilitating heat dissipation. In this way, a part of the heat generated by the electronic control module 20 is discharged from the air duct hole 133 through the heat dissipation air duct 12 under the action of the heat dissipation fan 30, and the other part of the heat is conducted and dissipated by the first heat dissipation fin 211, so that the heat dissipation efficiency is improved.
In addition, it should be noted that the heat dissipation fan 30 may include a first fan 31, a second fan 32, and a third fan 33, and may also include a fourth fan, etc. The first fan 31, the second fan 32 and the third fan 33 are arranged at intervals along the height direction of the chassis 10, correspondingly, the number of the heat dissipation air ducts is equal to that of the fans, each heat dissipation air duct 12 is correspondingly provided with an air duct hole 133 communicated with the heat dissipation air duct 12, and one heat dissipation air duct 12 can be correspondingly communicated with a plurality of air duct holes 133. The wind slot holes 133 may be formed in a racetrack shape or a rectangular shape, or may be circular holes. Specifically, the design can be performed according to actual needs.
As shown in fig. 3, in an embodiment of the present application, optionally, a second heat sink 132 is disposed on the side plate 13 of the chassis 10 on which the heat dissipation fan 30 is disposed, and the second heat sink 132 and the first heat sink 211 are disposed perpendicular to each other.
In the present embodiment, the second heat sink 132 is disposed on the side plate 13 where the heat dissipation fan 30 is disposed, so that the heat conducted from the first heat sink 211 on the electronic control module 20 to the chassis 10 is conducted to the air through the second heat sink 132, thereby dissipating the heat of the chassis 10. Meanwhile, the second heat sink 132 and the first heat sink 211 are perpendicular to each other, so that heat is conducted in the direction of crossing the two, which is more beneficial for heat dissipation, thereby improving heat dissipation efficiency.
In an embodiment of the present application, further, the first heat sink 211 is disposed in parallel with the airflow flowing direction in the heat dissipation air duct 12. It is understood that the number of the first heat dissipation fins 211 may be plural, a plurality of the first heat dissipation fins 211 are arranged at intervals, a gap is provided between two adjacent first heat dissipation fins 211, and the heat on the first heat dissipation fins 211 is dissipated through the air flow at the gap. Meanwhile, the first heat sink 211 is parallel to the flow direction of the air flow in the heat dissipation air duct, so that when the air at normal temperature passes through the heat dissipation air duct 12, the contact area with the first heat sink 211 is larger, and the heat of the first heat sink 211 is conveniently transferred out.
In addition, the air blown by the heat dissipation fan 30 can be divided into two parts, one part of the air blown by the heat dissipation air duct 12 through the air slot 133 is a first air direction, the other part of the air blown by the second heat dissipation fins 132 on the side plate 13 of the chassis 10 is blocked by the side surface of the electronic control module 20 to dissipate the heat, and the air blown by the heat dissipation fan can be set to a second direction.
As shown in fig. 3, in an embodiment of the present application, optionally, the master control box 100 further includes a module mounting plate 26, the module mounting plate 26 is connected to the back panel 14 of the chassis 10, and the plurality of electronic control modules 20 are connected to the module mounting plate 26. Specifically, be provided with a plurality of interfaces on the module mounting panel 26, be provided with on the automatically controlled module 20 a plurality of with the socket that the interface was pegged graft mutually to the realization is fixed a plurality of automatically controlled modules 20 on module mounting panel 26, and the module mounting panel 26 of being convenient for is connected with external power source, in order to realize circular telegram and the communication to a plurality of automatically controlled modules 20.
As shown in fig. 5 to 7, in an embodiment of the present application, optionally, the electronic control module 20 includes an upper shell 21, a bottom plate 22, a circuit board 23 and a panel 24.
Referring to fig. 8 and 9, the upper case 21, the bottom plate 22 and the panel 24 enclose a mounting cavity for mounting the circuit board 23, and two opposite side edges of the circuit board 23 are respectively provided with a heat conduction layer 231. The heat conductive layer 231 may be made of a material having high heat dissipation efficiency, and preferably, the heat conductive layer 231 is a copper layer. In addition, the bottom plate 22 is provided with a third heat sink 221, so that heat generated by the circuit board 23 can be transferred to the first heat sink 211 of the upper case 21, and can also be transferred to the third heat sink 221 at the bottom plate 22, thereby improving heat dissipation efficiency.
Specifically, during mounting, the position of the chip on the circuit board 23 is coated with the heat conductive gel, and then the upper case 21, the circuit board 23 and the bottom plate 22 are fixed together by screws, so that the chip is tightly attached to the first heat sink 211 of the upper case 21. In order to conduct more heat of the upper shell 21 of the electronic control module 20, a copper layer is plated on the upper surface and the lower surface of the two sides of the circuit board 23, so that the heat of the upper shell 21 and the bottom plate 22 which are connected with the circuit board 23 can be conducted, and the heat dissipation efficiency is improved.
As shown in fig. 6, in an embodiment of the present application, optionally, the first heat sink 211 is disposed on a side of the upper casing 21 away from the circuit board 23, and a top surface of the first heat sink 211 is on the same plane as a top surface of the upper casing 21.
In the present embodiment, specifically, the first heat sink 211 is formed in the upper case 21 and is formed by a groove wall in which the strip-shaped groove of the upper case 21 is formed. The top surface of the first heat sink 211 is on the same plane as the top surface of the upper case 21, so that the blocking of the air flow in the heat dissipation air duct can be avoided.
In the above embodiment of the present application, optionally, the first heat sink 211 and the upper case 21 are integrally formed of a material having a thermal conductivity of more than 380W/mK. Preferably, the material may be copper, which has a good heat conduction effect and improves the overall structural strength of the upper case 21. It is understood that the first heat sink 211 and the upper shell 21 may be integrally formed by using other materials with high heat conduction efficiency.
In addition, the first heat sink 211 and the upper case 21 are integrally formed, so that the structural strength between the two is ensured, and the connection reliability is improved. On the other hand, the two are integrally formed, so that the production and the manufacturing are convenient, the production efficiency is improved, the production cost is reduced, and further the market competitiveness of the master control box 100 is improved.
As shown in fig. 4, in an embodiment of the present application, optionally, two opposite side plates 13 on the chassis 10 are provided with guide grooves 131, the upper shell 21 is provided with a locking bar 25 matched with the guide grooves 131, and the panel 24 is provided with a through hole 241 opposite to the locking bar 25. In the embodiment, through the matching of the locking strip 25 and the guide groove 131, the operation of the electric control assembly is easier during assembly, and the assembly efficiency is improved.
As shown in fig. 6, in the above embodiment of the present application, further, the edges of the two opposite sides of the upper shell 21 are bent toward the bottom plate 22 to form bent edges 212, the locking strip 25 is fixed on the bent edges 212, and the top surface of the locking strip 25 is lower than the top surface of the upper shell 21.
In the present embodiment, the edge of the upper case 21 is bent to form a bent edge 212, and the locking bar 25 is fixed to the bent edge 212 by a screw. Meanwhile, the top surface of the locking strip 25 is lower than the top surface of the upper shell 21, so that the locking strip 25 can be prevented from blocking the airflow of the heat dissipation air duct, and the heat dissipation effect is improved.
As shown in fig. 1 and 4, in an embodiment of the present application, optionally, the master control box 100 further includes two baffles 17, and the two baffles 17 are respectively connected to two opposite side plates 13 of the chassis 10 and respectively abut against the panel 24.
In the present embodiment, the baffle 17 is fixed to the housing of the enclosure 10 by screws, and the baffle 17 abuts against the panel 24 of the electronic control module 20, so that the impact resistance of the entire main control box 100 can be increased, and the design can withstand an impact vibration test with an acceleration of 10 g.
As shown in fig. 1 to 4, in an embodiment of the present application, the enclosure 10 of the master control box 100 is made of aluminum alloy, and is light in weight, and the enclosure 10 weighs about 0.9 kg. The enclosure 10 includes two side panels 13, a top panel 15, a back panel 14, and a bottom panel 16, and the four sides of the enclosure 10 are hollow. The accommodating cavity 11 is formed with 8 mounting slots for the electronic control modules 20, and can accommodate 8 electronic control modules 20, wherein there are 1 power supply mounting slot and 7 extended mounting slots. The overall outer envelope size can be designed as follows: 190mm 155mm 132mm, whole high integration makes full use of space to design.
The whole rated power of the main control box 100 can be 200W and is uniformly distributed to 8 mounting slots, and the power of each electric control module 20 is 25W; the environmental temperature is normal temperature (25 ℃), and under the condition of 200W, the temperature of the upper shell 21 contacted with the chip in the electronic control module 20 in the case 10 is controlled within 70 ℃, so that the chip in the main control box 100 can normally work.
The top of each electrical control module 20 is provided with a first heat sink 211, the bottom thereof is provided with a third heat sink 221, the material of the upper shell 21 and the bottom plate 22 of the electrical control module 20 is copper, and the length and width of each electrical control module 20 is 125mm x 118 mm. The thickness of the electric control module 20 of the 7 extended installation slots is the same and is 22 mm; it should be noted that the thickness of the electronic control module 20 can be customized according to the size of the internal circuit board 23, and the front and rear panels 24 can also be customized according to different external terminals. Compared with the existing master control box, the volume of the master control box is the same, and more electronic control modules 20 can be used.
In summary, the present application provides a main control box 100, a heat dissipation air duct 12 inside a chassis 10 is formed by a gap between two adjacent electronic control modules 20, and a first heat dissipation fin 211 is disposed on a top of each of the electronic control modules 20. The heat dissipation fan 30 is disposed on one side plate 13 of two opposite side plates 13 on the chassis 10, and an air duct hole 133 communicating with the heat dissipation air duct 12 is disposed on the other side plate 13. In this way, a part of the heat generated by the electronic control module 20 is discharged from the air duct hole 133 through the heat dissipation air duct 12 under the action of the heat dissipation fan 30, and the other part of the heat is conducted and dissipated by the first heat dissipation fin 211, so that the heat dissipation efficiency is improved.
In the description herein, reference to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations may be made to the above embodiments by those of ordinary skill in the art within the scope of the present application.