CN114178247A - Heating device and cleaning device - Google Patents
Heating device and cleaning device Download PDFInfo
- Publication number
- CN114178247A CN114178247A CN202111647875.7A CN202111647875A CN114178247A CN 114178247 A CN114178247 A CN 114178247A CN 202111647875 A CN202111647875 A CN 202111647875A CN 114178247 A CN114178247 A CN 114178247A
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- heating
- barrel
- solution
- equalizing plate
- heating device
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H10P72/0416—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
本发明公开了一种加热装置及清洗装置，加热装置包括：用于盛装溶液的桶体，桶体内设有至少一个用于加热溶液的加热件，每个加热件的外表面套上设有隔液件，隔液件使加热件与溶液分隔。本发明提出的加热装置在加热件的外表面套设有隔液件，使溶液在加热的过程中与溶液并不直接接触而是通过热辐射的方式对溶液进行加热，防止溶液在清洗过程中受到污染。
The invention discloses a heating device and a cleaning device. The heating device comprises: a barrel for containing a solution, at least one heating element for heating the solution is arranged in the barrel, and a spacer is provided on the outer surface of each heating element The liquid part, the liquid barrier part separates the heating part from the solution. The heating device proposed by the present invention is provided with a liquid barrier on the outer surface of the heating element, so that the solution is not in direct contact with the solution during the heating process, but is heated by thermal radiation to prevent the solution from being washed during the cleaning process. contaminated.
Description
Technical Field
The invention relates to the field of semiconductor cleaning, in particular to a heating device and a cleaning device.
Background
The semiconductor IC process is developed based on four basic processes (ion implantation, diffusion, epitaxial growth and photolithography) invented after the 50 th of the 20 th century, and since each component and connection line in the chip are very fine, if contaminated by dust particles and metals, the circuit function in the chip is easily damaged, and a short circuit or an open circuit is formed, which results in the failure of the chip. Therefore, in the chip manufacturing process, except for removing external pollution sources, wet cleaning or dry cleaning is required in chip manufacturing steps such as high-temperature diffusion, before ion implantation and the like. The dry and wet cleaning processes effectively remove the residual impurities of micro-dust, metal ions and organic matters on the wafer by using chemical solution or gas without damaging the surface characteristics and electrical characteristics of the wafer.
In wet cleaning processes, when some solutions require heating and incubation, the solutions are typically heated by direct contact with a heating source. However, the solution may be contaminated by direct contact with the heating source, so that the cleanliness of the solution does not meet the use requirement, and the results of poor cleaning effect and chip contamination are caused.
Disclosure of Invention
The invention provides a heating device and a cleaning device, aiming at solving the technical problem that in the prior art, solution directly contacts with a heating source to heat and pollute the solution in the chip cleaning process.
The technical scheme adopted by the invention is as follows:
the invention provides a heating device and a cleaning device, wherein the heating device comprises: a staving for splendid attire solution is equipped with at least one in the staving and is used for heating the heating member of solution, and the surface of every heating member all is equipped with the separation liquid spare, and the separation liquid spare makes the heating member with solution is separated.
Through set up the liquid separation spare at heating member surface, can keep apart heating member and the solution in the barrel, avoided solution and heating member direct contact, influence the cleanliness factor of solution. The heating element is used as a heat source and can be hot water, hot air, an electric heating wire or heat exchange liquid. If the solution is directly contacted with the solution, the solution is polluted. Optionally, the heating element is an infrared heating tube, and has the advantages of small installation space and easiness in operation.
The liquid-isolating member separates one of the heating members from the solution, meaning that a liquid-isolating member is sleeved outside each heating member. For example, when a heating element is a single infrared heating tube, each infrared heating tube is externally sleeved with a liquid isolating element; if a heating element is an integral body formed by a plurality of infrared heating pipes, a liquid isolating piece contains the heating element formed by the plurality of infrared heating pipes. Preferably, a heating element comprises only one infrared heating tube, because a plurality of infrared heating tubes are arranged in a liquid-proof element, the problems of uneven heat radiation and local over-high heat can be caused.
Optionally, the liquid isolating piece is a heat insulating pipe sleeved on the infrared heating pipe.
At least one heating element for heating the solution is arranged in the barrel body, at least one heating element can be one, or two, or three or more heating elements, and the heating elements can be reasonably arranged according to the actual size of the barrel body.
Further, the barrel body is arranged along the first direction, a liquid inlet is formed in the bottom of the barrel body, liquid outlet is formed in the top of the barrel body, and the heating element is connected with the side face of the barrel body.
The shape of the barrel body can be one of a cylinder, a cuboid, a cube, a prism or a circular truncated cone, and the first direction refers to a direction parallel to the center line of the bottom surface of the barrel body.
Preferably, the barrel body is a cylinder, the first direction is parallel to a center line passing through two bottom surfaces of the cylinder, the barrel body is arranged along the first direction, that is, the barrel body is placed along the center line passing through two bottom surfaces of the cylinder, and the first direction may be horizontal or approximately horizontal.
Furthermore, a flow equalizing plate is arranged in the barrel body and arranged along a first direction, the heating elements are located above or below the flow equalizing plate, and when the number of the heating elements is multiple, the heating elements are arranged above and below the flow equalizing plate. The flow equalizing plate is arranged and used for dispersing the solution, so that the solution can be uniformly heated in the barrel body.
Further, a gap is formed between the peripheral side of the flow equalizing plate and the barrel body; or one end of the flow equalizing plate is connected with the barrel body, and a gap is formed between the rest part of the flow equalizing plate and the barrel body. Namely, the setting modes of the flow equalizing plate are two types:
(1) the first method comprises the following steps: a gap is formed between the peripheral side of the flow equalizing plate and the barrel body, namely, the peripheral side of the flow equalizing plate is not in contact with the barrel body;
(2) and the second method comprises the following steps: one end of the flow equalizing plate is connected with the end part of the barrel body without a gap, and gaps are reserved between the rest parts of the flow equalizing plate and the barrel body, namely one end of the flow equalizing plate is contacted with the barrel body.
In both modes, the flow equalizing plate can be arranged on the side wall and/or two ends of the barrel body in a supporting or hanging mode.
By arranging the gap, the solution dispersed by the flow equalizing plate can roll along the side wall of the barrel body, the liquid isolating piece and the flow equalizing plate
Flow, finally discharge through the liquid outlet, make the liquid medicine heating more even, avoid the solution that is detained for a long time and is heated in the staving.
Further, the flow equalizing plate is a solid plate and is V-shaped, the angle of the V-shaped is 90-150 degrees, and the V-shaped opening of the flow equalizing plate faces the bottom of the barrel body. Furthermore, a first sealing cover and a second sealing cover are arranged on two sides of the barrel body, the liquid inlet is close to the first sealing cover of the barrel body, and the liquid outlet is close to the second sealing cover of the barrel body. The length of the gap between the flow equalizing plate and the sealing cover at one end is less than or equal to the length of the gap between the liquid inlet and the first sealing cover.
The first sealing cover and the second sealing cover are arranged on two sides of the barrel body, so that the barrel body forms a liquid containing space, meanwhile, the first sealing cover and the second sealing cover are also used for installing and arranging a heating element and a flow equalizing plate, and optionally, the first sealing cover and the second sealing cover are integrally arranged with the barrel body of the barrel body.
Specifically, the manner for providing the heating element on the first cover and/or the second cover includes at least the following two ways:
(1) the opening has been seted up to the symmetry on first closing cap and the second closing cap, and two openings run through, and it has liquid trap (liquid trap spare) to communicate two openings for install the heating member.
(2) The opening has been seted up on first closing cap or the second closing cap, along the first aspect, with opening an organic whole be provided with liquid proof pipe (liquid proof spare), installation heating member, the liquid proof pipe is kept away from open-ended one end and is provided with the bottom, and liquid proof pipe does not run through first closing cap and second closing cap promptly.
In addition, the two modes can be combined, the number of the openings can be set according to the actual situation, and optionally, three openings are set.
The gap length between the flow equalizing plate and the first end sealing cover is less than or equal to the gap length between the liquid inlet and the first sealing cover, part of the solution entering from the liquid inlet can directly enter the upper area of the flow equalizing plate through the gap, and part of the solution can be blocked by the flow equalizing plate to be mixed with the solution below the flow equalizing plate again below the flow equalizing plate.
Furthermore, a temperature measuring part is arranged in the barrel body and used for detecting the temperature of the solution flowing out of the liquid outlet.
Optionally, the temperature measuring part is a K-type thermocouple and is directly attached to the barrel body;
optionally, the temperature measuring element is a thermal resistance temperature measuring needle inserted into the temperature measuring protective tube, the temperature measuring protective tube can be a liquid isolating element sleeved on the heating element,
further, the liquid inlet is provided with a leakage detecting assembly for detecting leakage of the solution, and the leakage detecting assembly comprises a wire for detecting leakage and a fixing piece for fixing the wire.
Fixing two lead fixing rings on the liquid inlet; judging whether liquid leakage exists or not according to the on-off of the lead;
furthermore, the heating element is an infrared heating tube, and the liquid isolating element is a transparent quartz protective sleeve; the staving includes: the quartz ladle body, set up the heat preservation in quartz ladle body surface, the surface of heat preservation still is equipped with the protective housing.
The staving is quartzy, and outside parcel heat preservation is cotton, as the lagging casing, prevents calorific loss, and stainless steel shell or plastic slab shell (or adopt anticorrosive plastic slab to contain and be not limited to the plastic slab of different anticorrosive specifications such as PP, PVC) are established to the cotton dustcoat of heat preservation, play the guard action, avoid external object collision, cause the fracture of quartz capsule.
The barrel body is made of quartz, and the first sealing cover, the second sealing cover, the liquid inlet pipe at the liquid inlet and the liquid outlet pipe at the liquid outlet are made of quartz materials preferably.
The heating member is infrared heating pipe, and the liquid separation piece is transparent quartz protective sheath, through the high light transmissivity that utilizes quartzy, carries out the light radiation indirect heating to solution with infrared heating pipe, makes the liquid medicine rapid heating up.
A cleaning device for cleaning the component to be cleaned with a solution and heating the solution using the heating device described above.
Compared with the prior art, the heating device provided by the invention has the advantages that the liquid isolating piece is sleeved on the outer surface of the heating piece, so that the solution is heated in a heat radiation mode instead of being directly contacted with the solution in the heating process, and the solution is prevented from being polluted in the cleaning process.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
FIG. 1 is a sectional view of a heating apparatus and a solution flow diagram in an embodiment of the present invention;
FIG. 2 is a cross-sectional view of another angle of a heating device in an embodiment of the present invention;
FIG. 3 is a first schematic perspective view of a heating apparatus according to an embodiment of the present invention;
FIG. 4 is a schematic perspective view of a second embodiment of a heating device according to the present invention;
1. a barrel body; 11. a liquid inlet pipe; 12. a liquid outlet pipe; 13. a first cover; 14. a second cover; 15. a heat-insulating layer; 16. a protective shell; 2. a heating member; 3. a liquid barrier; 4. a flow equalizing plate; 5. a temperature measuring part; 6. a leak detection assembly; 61. a wire; 62. a fixing member; 7. a support; 8. a quartz adapter; a gap L; the gap R.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
In the description of the present invention, it is to be understood that the terms "center", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
With the rapid development of integrated circuits, the demand for chips has increased greatly. Because the manufacturing cost of the chip is high, the integration level is high, the requirement of the manufacturing process of the chip on the cleanliness is very high, and the damage of the circuit function in the wafer caused by the pollution of the chip in the manufacturing process is prevented. Therefore, in addition to removing external contamination sources during the manufacturing process, wet cleaning or dry cleaning is required for chip manufacturing steps such as high temperature diffusion, ion implantation, etc. The dry and wet cleaning processes effectively remove the residual impurities of micro-dust, metal ions and organic matters on the wafer by using chemical solution or gas without damaging the surface characteristics and electrical characteristics of the wafer.
In wet cleaning processes, when some solutions require heating and incubation, the solutions are typically heated by direct contact with a heating source. However, the solution may be contaminated by direct contact with the heating source, so that the cleanliness of the solution does not meet the use requirement, and further, the cleaning effect is poor and the chip is contaminated.
Therefore, in order to solve the above technical problem of pollution caused by the solution directly contacting and heating with the heating source during the chip cleaning process in the prior art, the present invention provides a heating device, comprising: a staving 1 for splendid attire solution is equipped with at least one heating member 2 that is used for heating solution in the staving 1, and the surface cover of every heating member 2 is equipped with liquid proof 3, and liquid proof 3 makes heating member 2 and solution separate.
According to the heating device provided by the invention, the liquid isolating piece is sleeved on the outer surface of the heating piece, so that the solution is heated in a heat radiation mode instead of being directly contacted with the solution in the heating process, and the solution is prevented from being polluted in the cleaning process.
The principles and construction of the present invention will be described in detail below with reference to the drawings and examples.
As shown in fig. 1 to 4, the barrel 1 for containing solution is cylindrical, the two ends are a first cover 13 and a second cover 14 integrally disposed with the barrel 1, the barrel 1 is erected on the bracket 7 and placed along a first direction, which is a horizontal direction in this embodiment, i.e., the barrel 1 is placed horizontally. A liquid inlet is arranged at the bottom of the barrel body 1, and a liquid inlet pipe 11 made of quartz and integrally arranged with the barrel body 1 is arranged on the liquid inlet of the barrel body 1; a liquid outlet is arranged at the top of the barrel body 1, a liquid outlet pipe 12 made of quartz materials and integrated with the barrel body 1 is arranged at the liquid outlet, and a liquid inlet pipe 11 is vertically arranged and close to a first sealing cover 13, and a liquid outlet pipe 12 is vertically arranged and close to a second sealing cover 14. The design of lower inlet and upper outlet can ensure that the air in the barrel body can be discharged upwards, so that the barrel body is uniformly filled with solution without dead angles. And for making the feed liquor more convenient, be equipped with a quartz adapter 8 in feed liquor pipe 11 department, the quartz adapter can adjust, make things convenient for the feed liquor with the feed liquor direction of feed liquor pipe according to the in-service use situation.
Furthermore, the barrel body is internally provided with three heating elements 2 which are distributed in a triangular shape, each heating element is an infrared heating pipe, and two ends of each heating element 2 (each infrared heating pipe) are vertically connected with the first sealing cover 13 and the second sealing cover 14 of the barrel body, namely, the heating elements 2 (each infrared heating pipe) are horizontally arranged. In this embodiment, for convenience of production, installation and maintenance, the first and second covers 13 and 14 are provided with openings for placing the heating member 2, and the openings are sealed after the heating member 2 is fixed to prevent the solution from flowing out of the openings. Simultaneously, in order to prevent heating member 2 and solution direct contact, the surface cover of heating member 2 (infrared heating pipe) is equipped with a liquid separation piece 3, and liquid separation piece 3 is transparent quartz protective sheath, and the light that heating member 2 (infrared heating pipe) launches sees through quartz protective sheath and heats solution through the mode of heat radiation.
Further, in order to make the solution more uniform when heated, a flow equalizing plate 4 is further arranged in the barrel body 1, and the flow equalizing plate 4 is a V-shaped solid plate with a folding angle of 90-150 degrees. In this embodiment, one end of the flow equalizing plate 4 is connected to the first cover 13, a gap L exists between the other end of the flow equalizing plate 4 and the second cover 14, the flow equalizing plate 4 is perpendicular to the first cover 13, the heating members 2 are disposed above and below the flow equalizing plate 4, and the V-shaped opening of the flow equalizing plate 4 faces downward and directly faces the heating member 2 below.
Further, the length of the gap L is less than or equal to the distance from the liquid inlet pipe 11 to the first cover 13. Meanwhile, a gap R exists between the other two ends of the flow equalizing plate 4 and the barrel body 1.
Solution just can follow the drain pipe outflow of top after filling solution in the staving after the feed liquor pipe inflow staving of below, and the solution that has just passed through the heating in this process can be mixed by the low temperature solution that flows in next moment, leads to whole solution heating insufficient. And the existence of the flow equalizing plate can enable part of solution to collide with the flow equalizing plate and return to the lower part of the flow equalizing plate in the process that the solution flows from the lower part to the upper part after entering the barrel body, and then the solution is heated by the heating element below the flow equalizing plate, so that the heating is ensured to be full, after the heated solution and the unheated solution are mixed, one part of the solution flows upwards from the gap R, and the other part of the solution is heated again under the blocking effect of the flow equalizing plate. In addition, because the flow speed of the solution is high in the actual process, the solution can be dispersed in time, heated fully and smoothly flows due to the existence of the gap L.
Furthermore, a temperature measuring piece 5 for detecting the temperature of the solution is arranged in the barrel body 1, and the temperature measuring piece 5 is a K-type thermocouple and can be directly attached to the barrel body 1. Or the temperature measuring part 5 is a thermal resistance temperature measuring needle, and the outer surface of the thermal resistance temperature measuring needle is also provided with a liquid isolating part 3 (a quartz protective sleeve).
As shown in fig. 1 and 2, the temperature measuring member 5 is located above the uppermost heating member 2 (infrared heating pipe) and close to the liquid outlet pipe 12, and detects whether the temperature of the solution to be heated and flowing out from the liquid outlet pipe 12 reaches the standard. And inlet department is equipped with the leak hunting subassembly 6 that detects the solution seepage, and leak hunting subassembly 6 is including setting up wire 61, the mounting 62 of fixed wire outside feed liquor pipe 11, whether there is the solution seepage through the electric leakage judgement of detection wire.
As shown in fig. 3 and 4, in the present embodiment, the barrel 1 includes an innermost quartz barrel, an insulating layer 15 wrapped outside the quartz barrel, and a protective shell 16 covering the insulating layer 15. The heat-insulating layer 15 is made of heat-insulating cotton to prevent heat loss; the material of protective housing 16 can be anticorrosive and the big material of hardness such as stainless steel, polypropylene, polyvinyl chloride, and protective housing 16 plays the guard action, avoids external object collision to cause staving and the internal part of staving to break.
Fig. 3 is an integrated protective casing, and optionally, the protective casing is made of a polypropylene shell.
Fig. 4 is a protective shell sleeved outside the barrel body, protective covers are arranged at two ends of the protective shell, and optionally, the protective shell is made of stainless steel.
In another embodiment, the heating element may be coated with a liquid barrier on the outer surface thereof to prevent direct contact between the solution and the heating element. For example, the outer wall of the heating element is provided with a plurality of air outlet devices, and when the solution flows into the barrel body, the solution is separated from the heating element and does not contact with the heating element by using the pressure produced by the air outlet devices.
In other embodiments, the placement direction of the bucket body is not limited, and the bucket body can be vertically placed. The number of each heating element in the barrel is not limited, and for example, one heating element may be an integral body of a plurality of infrared heating pipes. The position distribution of the heating elements is not limited, and the heating elements can be distributed in a square shape. The fixing mode of the heating element and the barrel body is not limited, a groove for placing and fixing the heating element can be arranged in the barrel body, and an opening for placing the heating element is not required to be arranged on the sealing cover. Meanwhile, the types of the heating element and the temperature measuring element are not limited in other embodiments, and the heating element and the temperature measuring element can be infrared quartz carbon fiber heating pipes, thermal resistance temperature measuring needles and the like.
The invention also proposes a cleaning device which uses a solution to clean the component to be cleaned and which uses the heating device proposed above to heat the used solution.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included therein.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111647875.7A CN114178247A (en) | 2021-12-30 | 2021-12-30 | Heating device and cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111647875.7A CN114178247A (en) | 2021-12-30 | 2021-12-30 | Heating device and cleaning device |
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| CN114178247A true CN114178247A (en) | 2022-03-15 |
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| CN202111647875.7A Pending CN114178247A (en) | 2021-12-30 | 2021-12-30 | Heating device and cleaning device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117329699A (en) * | 2023-10-20 | 2024-01-02 | 江阴市辉龙电热电器有限公司 | A kind of acid liquid heating cylinder for wafer etching |
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|---|---|---|---|---|
| CN117329699A (en) * | 2023-10-20 | 2024-01-02 | 江阴市辉龙电热电器有限公司 | A kind of acid liquid heating cylinder for wafer etching |
| CN117329699B (en) * | 2023-10-20 | 2025-10-24 | 江阴市辉龙电热电器有限公司 | Acid heating cylinder for wafer etching |
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Application publication date: 20220315 |
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