CN114156377A - LED packaging method without mold - Google Patents
LED packaging method without mold Download PDFInfo
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- CN114156377A CN114156377A CN202111452794.1A CN202111452794A CN114156377A CN 114156377 A CN114156377 A CN 114156377A CN 202111452794 A CN202111452794 A CN 202111452794A CN 114156377 A CN114156377 A CN 114156377A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 76
- 238000000034 method Methods 0.000 title claims abstract description 40
- 239000012530 fluid Substances 0.000 claims abstract description 77
- 239000003822 epoxy resin Substances 0.000 claims abstract description 74
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 74
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 39
- 239000000741 silica gel Substances 0.000 claims abstract description 39
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 39
- 238000005520 cutting process Methods 0.000 claims abstract description 21
- 238000003892 spreading Methods 0.000 claims abstract description 11
- 230000007480 spreading Effects 0.000 claims abstract description 11
- 229920002379 silicone rubber Polymers 0.000 claims abstract description 10
- 239000004945 silicone rubber Substances 0.000 claims abstract description 10
- 230000000712 assembly Effects 0.000 claims description 18
- 238000000429 assembly Methods 0.000 claims description 18
- 239000004593 Epoxy Substances 0.000 claims description 12
- 229920001296 polysiloxane Polymers 0.000 claims description 9
- 239000000499 gel Substances 0.000 claims description 7
- 238000010521 absorption reaction Methods 0.000 claims description 3
- 238000005452 bending Methods 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 230000014759 maintenance of location Effects 0.000 claims description 3
- 239000000178 monomer Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 abstract description 3
- 238000012858 packaging process Methods 0.000 abstract description 3
- 238000007789 sealing Methods 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 7
- 239000003292 glue Substances 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000012536 packaging technology Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000969 carrier Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The application provides a die-free LED packaging method, which comprises the following steps: paving fluid silica gel to a first preset height of the surface of the cutting area along the edge of the packaging area; the first preset height is larger than the thickness of the LED chip assembly; forming a silica gel fence after the fluid silica gel is solidified; spreading fluid epoxy resin to the top of the LED chip assembly inside the silicone rubber fence; and baking the LED prefabricated member paved with the fluid epoxy resin until the fluid epoxy resin is cured to form an epoxy resin layer, thereby obtaining the LED packaging module. The sealing performance of the LED packaging product can be effectively improved, and the LED packaging product is prevented from being affected with damp; in addition, a packaging mold is not needed in the packaging process, the steps of loading, unloading and cleaning the packaging mold are omitted, and the packaging efficiency of the LED chip can be effectively improved.
Description
Technical Field
The application relates to the technical field of LED packaging, in particular to a mould-free LED packaging method.
Background
The LED chip is a solid semiconductor device, also called an LED light-emitting chip, and is a core component of an LED lamp. The main function of the LED chip is to convert electric energy into light energy, the core light-emitting part of the LED chip is a PN junction tube core formed by a P-type semiconductor and an N-type semiconductor, when minority carriers injected into the PN junction are combined with majority carriers, visible light, ultraviolet light or near infrared light can be emitted, but photons emitted by the PN junction area are non-directional, namely, the photons are emitted to all directions with the same probability, so that not all light generated by the tube core can be released, and the LED chip mainly depends on the quality of semiconductor materials, the structure and the geometric shape of the tube core, the internal structure of a package, the packaging material and the like.
In the manufacturing process of the LED lamp, the LED chip needs to be packaged, and wafer level chip packaging is an effective method for reducing cost. The wafer level chip packaging technology is a technology for obtaining a single finished chip by cutting after a whole wafer is subjected to packaging test, and the size of the packaged chip is consistent with that of a bare chip. The wafer level chip packaging technology changes the traditional packaging technology and meets the increasingly light, thin, short, small and low-price requirements of the market on microelectronic products. The size of chips manufactured by the wafer level chip packaging technology reaches a high degree of miniaturization, and the cost is significantly reduced as the size of chips is reduced and the size of wafers is increased.
In the existing dispensing process for wafer-level chips, a dispenser is used to directly dispense glue on the surface of an LED chip, and the surface tension of a molding compound is used to form a lens shape above the LED chip, so as to wrap the LED chip inside. The method has the disadvantages that the single LED chip needs to be subjected to glue dispensing in sequence, the shape of the lens completely depends on the surface tension of the plastic package glue, and the LED chip is easily coated unevenly or adhered to the substrate incompletely, so that the LED chip cannot work normally after being affected with damp; the other dispensing process adopting the packaging mold is characterized in that the packaging mold with a plurality of mold cavities is arranged on the surface of the LED chip, and then the plastic packaging glue is sequentially filled in the corresponding mold cavities, so that the solidified glue is the same in shape, but the use process of the packaging mold is more complicated and difficult to clean, and the packaging efficiency of the LED chip is lower.
Disclosure of Invention
In view of the problems, the present application is directed to providing a mold-less LED packaging method that overcomes or at least partially solves the problems, comprising:
a die-free LED packaging method is used for packaging an LED prefabricated member to obtain an LED packaging module; the LED prefabricated part comprises a bracket and a plurality of LED chip assemblies; the bracket comprises a packaging area and a cutting area which is arranged around the edge of the packaging area; the LED chip assemblies are arranged on the surface of the packaging area in an array mode, and gaps are formed between every two adjacent LED chip assemblies; the method comprises the following steps:
paving fluid silica gel to a first preset height of the surface of the cutting area along the edge of the packaging area; the first preset height is larger than the thickness of the LED chip assembly;
forming a silica gel fence after the fluid silica gel is solidified;
spreading fluid epoxy resin to the top of the LED chip assembly inside the silicone rubber fence;
and baking the LED prefabricated member paved with the fluid epoxy resin until the fluid epoxy resin is cured to form an epoxy resin layer, thereby obtaining the LED packaging module.
Preferably, the tiling of the fluid epoxy inside the silicone gel rail to the top of the LED chip assembly comprises:
spreading fluid epoxy resin to a second preset height on the top of the LED chip assembly inside the silica gel fence; the second predetermined height is 1/3-2 times the thickness of the LED chip assembly.
Preferably, the temperature of the LED pre-form is maintained at 50-80 ℃ while the fluid epoxy is spread on top of the LED chip assembly inside the silicone gel enclosure.
Preferably, the surface drying time of the fluid silica gel is 1-20 min; the hardness of the silica gel fence is 45-75 HA; the adhesive strength between the silica gel fence and the cutting area is more than or equal to 1 MPa.
Preferably, the baking treatment of the LED preform tiled with the fluid epoxy resin until the fluid epoxy resin is cured to form an epoxy resin layer includes:
and baking the LED prefabricated member paved with the fluid epoxy resin at the temperature of 130-150 ℃ until the fluid epoxy resin is cured to form an epoxy resin layer.
Preferably, the method further comprises the following steps:
cutting off the cutting area and the silica gel fence;
and along the arrangement direction of the LED chip assemblies, penetrating the epoxy resin layer between the adjacent LED chip assemblies to the bottom of the support to cut to obtain a plurality of LED packaging monomers.
Preferably, the fluid epoxy resin is a siloxane-modified epoxy resin; the viscosity of the fluid epoxy resin is 17000-38000cps, and the viscosity retention time is 0.15-3.5 h.
Preferably, the bending strength of the epoxy resin layer is not less than 13.9kg/mm2The hardness is 88-92HD, and the water absorption is less than 0.8 Wt%.
Preferably, the LED chip assemblies are arranged on the surface of the support in a manner of 10-20 rows by 25-50 columns.
Preferably, the gap is 1/2-1 times the width of the LED chip assembly.
The application has the following advantages:
in the embodiment of the application, the fluid silica gel is paved to a first preset height of the surface of the cutting area along the edge of the packaging area; the first preset height is larger than the thickness of the LED chip assembly; forming a silica gel fence after the fluid silica gel is solidified; spreading fluid epoxy resin to the top of the LED chip assembly inside the silicone rubber fence; baking the LED prefabricated member paved with the fluid epoxy resin until the fluid epoxy resin is cured to form an epoxy resin layer, so as to obtain the LED packaging module, wherein the epoxy resin layer is fully coated outside the LED chip assembly and is stably connected with the bracket, so that the sealing performance of the LED packaging product can be effectively improved, and the LED packaging product is prevented from being affected with damp; in addition, a packaging mold is not needed in the packaging process, the steps of loading, unloading and cleaning the packaging mold are omitted, and the packaging efficiency of the LED chip can be effectively improved.
Drawings
In order to more clearly illustrate the technical solutions of the present application, the drawings needed to be used in the description of the present application will be briefly introduced below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive labor.
Fig. 1 is a flowchart illustrating steps of a method for encapsulating an LED without a mold according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of a silicone rubber fence and an LED preform in a mold-less LED packaging method according to an embodiment of the present disclosure;
fig. 3 is another schematic structural diagram of a silicone fence and an LED preform in a mold-less LED packaging method according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a silicone rubber fence, an LED preform and an epoxy layer in a mold-less LED packaging method according to an embodiment of the present disclosure.
The reference numbers in the drawings of the specification are as follows:
1. an LED prefabricated part; 11. a support; 111. a packaging region; 112. a cutting area; 12. an LED chip assembly; 2. a silica gel fence; 3. and an epoxy resin layer.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, the present application is described in further detail with reference to the accompanying drawings and the detailed description. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that, in any embodiment of the present application, the LED packaging method is used for packaging an LED preform 1 to obtain an LED packaging module; the LED prefabricated member 1 comprises a support 11 and a plurality of LED chip assemblies 12; the bracket 11 comprises a packaging area 111 and a cutting area 112 which is arranged around the edge of the packaging area 111; the plurality of LED chip assemblies 12 are arranged on the surface of the package region 111 in an array, and a gap is formed between adjacent LED chip assemblies 12.
Referring to fig. 1-4, in an embodiment of the present application, a method for mold-less LED packaging is provided;
the method comprises the following steps:
s110, paving fluid silica gel to a first preset height of the surface of the cutting area 112 along the edge of the packaging area 111; the first predetermined height is greater than the thickness of the LED chip assembly 12;
s120, forming a silica gel fence 2 after the fluid silica gel is solidified;
s130, spreading fluid epoxy resin on the top of the LED chip assembly 12 inside the silica gel fence 2;
s140, baking the LED prefabricated member 1 tiled with the fluid epoxy resin until the fluid epoxy resin is cured to form an epoxy resin layer 3, and obtaining the LED packaging module.
In the embodiment of the present application, the fluid silicone gel is spread to a first preset height of the surface of the cutting area 112 along the edge of the packaging area 111; the first predetermined height is greater than the thickness of the LED chip assembly 12; forming a silica gel fence 2 after the fluid silica gel is solidified; spreading a fluid epoxy resin inside the silicone rubber fence 2 to the top of the LED chip assembly 12; baking the LED prefabricated member 1 paved with the fluid epoxy resin until the fluid epoxy resin is cured to form an epoxy resin layer 3, so as to obtain the LED packaging module, wherein the epoxy resin layer 3 is fully coated outside the LED chip assembly 12 and is stably connected with the bracket 11, so that the sealing performance of the LED packaging product can be effectively improved, and the LED packaging product is prevented from being affected with damp; in addition, a packaging mold is not needed in the packaging process, the steps of loading, unloading and cleaning the packaging mold are omitted, and the packaging efficiency of the LED chip can be effectively improved.
Next, a method of encapsulating an LED without a mold in the present exemplary embodiment will be further described.
As described in the steps S110 and S120, fluid silicone gel is laid along the edge of the encapsulation area 111 to a first preset height on the surface of the cutting area 112; the first predetermined height is greater than the thickness of the LED chip assembly 12; and forming the silica gel fence 2 after the fluid silica gel is solidified.
Follow through the point gum machine encapsulation area 111's edge will fluid silica gel lays extremely cut out district 112 surface, make fluid silica gel's height does 4/3-3 times of LED chip module 12 thickness, and wait fluid silica gel solidification forms silica gel rail 2.
As stated in step S130, a fluid epoxy resin is spread on top of the LED chip assembly 12 inside the silicone rubber fence 2.
And (3) paving the fluid epoxy resin on the surface of the LED prefabricated member 1 through a glue dispenser. The fluid epoxy resin is flattened to fill the gap sufficiently and to cover the sides and top of the LED chip assembly 12.
In the step S140, the LED preform 1 tiled with the fluid epoxy resin is baked until the fluid epoxy resin is cured to form an epoxy resin layer 3, so as to obtain the LED package module.
And (3) making the LED prefabricated part 1 tiled with the fluid epoxy resin face up, placing the silica gel fence 2, the LED prefabricated part 1 and the integral structure formed by the fluid epoxy resin in a baking machine for baking treatment until the fluid epoxy resin is cured on the surface of the LED prefabricated part 1 to form the epoxy resin layer 3, and obtaining the LED packaging module.
In this embodiment, the spreading the fluid epoxy resin on the top of the LED chip assembly 12 inside the silicone rubber fence 2 includes:
spreading fluid epoxy resin to a second preset height on the top of the LED chip assembly 12 inside the silicone rubber fence 2; the second predetermined height is 1/3-2 times, preferably 1/3, 1 or 2 times the thickness of the LED chip assembly 12.
In this embodiment, the temperature of the LED pre-form 1 is maintained at 50-80 ℃ while the fluid epoxy is spread on top of the LED chip assembly 12 inside the silicone enclosure 2.
Specifically, the bottom of the LED preform 1 is heated to be kept at 50 to 80 ℃ when the fluid epoxy resin is filled, and the fluid epoxy resin is biased to liquid state in the flowing state in the temperature environment, so that the fluidity of the fluid epoxy resin on the surface of the LED preform 1 can be improved, and the flattening efficiency can be accelerated.
In this embodiment, the surface drying time of the fluid silica gel is 1-20 min; the hardness of the silica gel fence 2 is 45-75 HA; the bonding strength between the silica gel fence 2 and the cutting area 112 is more than or equal to 1 MPa.
In this embodiment, the baking the LED preform 1 tiled with the fluid epoxy resin until the fluid epoxy resin is cured to form the epoxy resin layer 3 includes:
and baking the LED prefabricated member 1 tiled with the fluid epoxy resin at the temperature of 130-150 ℃ until the fluid epoxy resin is cured to form an epoxy resin layer 3. Specifically, the baking temperature was set to 150 ℃.
In this embodiment, the method further includes:
cutting off the cutting area 112 and the silica gel fence 2;
and along the arrangement direction of the LED chip assemblies 12, penetrating the epoxy resin layer 3 between the adjacent LED chip assemblies 12 to the bottom of the support 11 to obtain a plurality of LED packaging monomers.
In this embodiment, the fluid epoxy resin is a siloxane-modified epoxy resin; the viscosity of the fluid epoxy resin is 17000-38000cps, and the viscosity retention time is 0.15-3.5 h. Specifically, the fluid epoxy resin can be selected from epoxy resin with the trademark DER 331.
In this example, the bending strength of the epoxy resin layer 3 was 13.9kg/mm or more2The hardness is 88-92HD, and the water absorption is less than 0.8 Wt%. The epoxy resin layer 3 has good toughness and moisture-proof and waterproof performance.
In the present embodiment, the LED chip assemblies 12 are arranged on the surface of the support 11 in 10-20 rows by 25-50 columns, preferably 10 rows by 25 columns, 15 rows by 35 columns or 20 rows by 50 columns.
In the present embodiment, the gap is 1/2-1 times, preferably 1/2, 3/4 or 1 times the width of the LED chip assembly 12.
While preferred embodiments of the present application have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including the preferred embodiment and all such alterations and modifications as fall within the true scope of the embodiments of the application.
Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or terminal that comprises the element.
The above detailed description is provided for the die-less LED packaging method, and specific examples are applied herein to explain the principle and the implementation of the present application, and the above description of the embodiments is only used to help understand the method and the core idea of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. A die-free LED packaging method is used for packaging an LED prefabricated member to obtain an LED packaging module; the LED prefabricated part comprises a bracket and a plurality of LED chip assemblies; the bracket comprises a packaging area and a cutting area which is arranged around the edge of the packaging area; the LED chip assemblies are arranged on the surface of the packaging area in an array mode, and gaps are formed between every two adjacent LED chip assemblies; it is characterized by comprising:
paving fluid silica gel to a first preset height of the surface of the cutting area along the edge of the packaging area; the first preset height is larger than the thickness of the LED chip assembly;
forming a silica gel fence after the fluid silica gel is solidified;
spreading fluid epoxy resin to the top of the LED chip assembly inside the silicone rubber fence;
and baking the LED prefabricated member paved with the fluid epoxy resin until the fluid epoxy resin is cured to form an epoxy resin layer, thereby obtaining the LED packaging module.
2. The LED packaging method of claim 1, wherein said spreading a fluid epoxy inside said silicone gel fence on top of said LED chip assembly comprises:
spreading fluid epoxy resin to a second preset height on the top of the LED chip assembly inside the silica gel fence; the second predetermined height is 1/3-2 times the thickness of the LED chip assembly.
3. The LED packaging method of claim 1, wherein the temperature of the LED pre-form is maintained at 50-80 ℃ while the fluid epoxy is spread inside the silicone gel enclosure on top of the LED chip assembly.
4. The LED packaging method according to claim 1, wherein the surface drying time of the fluid silicone gel is 1-20 min; the hardness of the silica gel fence is 45-75 HA; the adhesive strength between the silica gel fence and the cutting area is more than or equal to 1 MPa.
5. The LED packaging method of claim 1, wherein said baking said LED pre-form tiled with said fluid epoxy until said fluid epoxy cures to form an epoxy layer comprises:
and baking the LED prefabricated member paved with the fluid epoxy resin at the temperature of 130-150 ℃ until the fluid epoxy resin is cured to form an epoxy resin layer.
6. The LED packaging method of claim 1, further comprising:
cutting off the cutting area and the silica gel fence;
and along the arrangement direction of the LED chip assemblies, penetrating the epoxy resin layer between the adjacent LED chip assemblies to the bottom of the support to cut to obtain a plurality of LED packaging monomers.
7. The LED packaging method of claim 1, wherein the fluid epoxy is a siloxane-modified epoxy; the viscosity of the fluid epoxy resin is 17000-38000cps, and the viscosity retention time is 0.15-3.5 h.
8. The LED packaging method of claim 1, wherein the epoxy layer has a bending strength of 13.9kg/mm or more2The hardness is 88-92HD, and the water absorption is less than 0.8 Wt%.
9. The LED packaging method of claim 1, wherein the LED chip assemblies are arranged on the surface of the support in 10-20 rows by 25-50 columns.
10. The LED packaging method of claim 1, wherein the gap is 1/2-1 times the width of the LED chip assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111452794.1A CN114156377A (en) | 2021-11-30 | 2021-11-30 | LED packaging method without mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111452794.1A CN114156377A (en) | 2021-11-30 | 2021-11-30 | LED packaging method without mold |
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| Publication Number | Publication Date |
|---|---|
| CN114156377A true CN114156377A (en) | 2022-03-08 |
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|---|---|---|---|
| CN202111452794.1A Pending CN114156377A (en) | 2021-11-30 | 2021-11-30 | LED packaging method without mold |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201036200A (en) * | 2009-03-20 | 2010-10-01 | Everlight Electronics Co Ltd | Light emitting diode package structure and manufacturing method thereof |
| KR20110109425A (en) * | 2010-03-31 | 2011-10-06 | 에버라이트 일렉트로닉스 컴패니 리미티드 | Light emitting diode package structure and manufacturing method thereof |
| WO2011160521A1 (en) * | 2010-06-23 | 2011-12-29 | 方方 | Light emitting diode packaging structure and manufacturing method thereof |
| US20130161657A1 (en) * | 2011-12-27 | 2013-06-27 | Advanced Optoelectronic Technology, Inc. | Light emitting diode package and method for making same |
| CN107068840A (en) * | 2016-09-30 | 2017-08-18 | 深圳市玲涛光电科技有限公司 | Bar shaped light-emitting component, backlight module and electronic equipment |
| CN113380645A (en) * | 2021-07-06 | 2021-09-10 | 深圳市德明新微电子有限公司 | Packaging product and preparation method thereof |
-
2021
- 2021-11-30 CN CN202111452794.1A patent/CN114156377A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201036200A (en) * | 2009-03-20 | 2010-10-01 | Everlight Electronics Co Ltd | Light emitting diode package structure and manufacturing method thereof |
| KR20110109425A (en) * | 2010-03-31 | 2011-10-06 | 에버라이트 일렉트로닉스 컴패니 리미티드 | Light emitting diode package structure and manufacturing method thereof |
| WO2011160521A1 (en) * | 2010-06-23 | 2011-12-29 | 方方 | Light emitting diode packaging structure and manufacturing method thereof |
| US20130161657A1 (en) * | 2011-12-27 | 2013-06-27 | Advanced Optoelectronic Technology, Inc. | Light emitting diode package and method for making same |
| CN107068840A (en) * | 2016-09-30 | 2017-08-18 | 深圳市玲涛光电科技有限公司 | Bar shaped light-emitting component, backlight module and electronic equipment |
| CN113380645A (en) * | 2021-07-06 | 2021-09-10 | 深圳市德明新微电子有限公司 | Packaging product and preparation method thereof |
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