CN114124064B - Photoconductive switch packaging structure - Google Patents
Photoconductive switch packaging structure Download PDFInfo
- Publication number
- CN114124064B CN114124064B CN202111237510.7A CN202111237510A CN114124064B CN 114124064 B CN114124064 B CN 114124064B CN 202111237510 A CN202111237510 A CN 202111237510A CN 114124064 B CN114124064 B CN 114124064B
- Authority
- CN
- China
- Prior art keywords
- conductive
- insulating
- conductive shell
- photoconductive switch
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 10
- 238000007789 sealing Methods 0.000 claims description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 238000002347 injection Methods 0.000 claims description 6
- 239000007924 injection Substances 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 239000012790 adhesive layer Substances 0.000 claims description 4
- 230000000903 blocking effect Effects 0.000 claims description 4
- 239000011810 insulating material Substances 0.000 claims description 4
- 239000005304 optical glass Substances 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- -1 polytetrafluoroethylene Polymers 0.000 claims description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 238000012856 packing Methods 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000007888 film coating Substances 0.000 description 2
- 238000009501 film coating Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910018503 SF6 Inorganic materials 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- SFZCNBIFKDRMGX-UHFFFAOYSA-N sulfur hexafluoride Chemical compound FS(F)(F)(F)(F)F SFZCNBIFKDRMGX-UHFFFAOYSA-N 0.000 description 1
- 229960000909 sulfur hexafluoride Drugs 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
- H03K17/941—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated using an optical detector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/061—Hermetically-sealed casings sealed by a gasket held between a removable cover and a body, e.g. O-ring, packing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Switches Operated By Changes In Physical Conditions (AREA)
Abstract
The invention relates to a photoconductive switch packaging structure which comprises a transverse cylindrical conductive shell with two open ends, wherein the opening at the left end of the conductive shell is sealed by a light-transmitting sheet, a conductive circular ring sheet is arranged in the middle of the conductive shell, an insulating circular ring sheet is sealed and blocked at the right end of the conductive shell, and a conductive rod transversely penetrates through the center of the insulating circular ring sheet. The beneficial effects of the invention are as follows: the inside of the conductive shell can form a sealed space through the detachable assembly, and two electrodes of the photoconductive switch are respectively connected with the conductive annular sheet so as to be further connected with the conductive shell and the conductive rod to be directly led out, thereby realizing the electric connection between the photoconductive switch and an external circuit. And the transparent insulating medium is filled in the sealed space, so that the transparent insulating medium completely wraps the periphery of the photoconductive switch, and the compressive strength and the service life of the photoconductive switch are improved.
Description
Technical Field
The invention relates to a photoconductive switch packaging structure.
Background
The photoconductive switch is a novel ultra-fast semiconductor electronic device, is a key device for generating high-power ultra-short pulse, and realizes the on and off of the switch by controlling the conductivity of semiconductor materials through laser triggering. Compared with the switch in the traditional pulse power field, the photoconductive switch has the advantages of fast closing time (ps magnitude), small jitter time (ps magnitude), low switching inductance (sub-nH magnitude), high repetition frequency, no electromagnetic interference, light weight, small volume and the like, and can work with ultrahigh power capacity at ultrahigh repetition frequency. The packaging structure is critical to the high-voltage switch device and can protect the device. However, the light guide switch packaging structure has difficulty in ensuring stability and reliability in a high-voltage high-current working environment.
Disclosure of Invention
In order to solve the technical defects, the invention provides the photoconductive switch packaging structure, which realizes comprehensive protection of the photoconductive switch and improves the service life of the photoconductive switch and the working voltage of the whole device.
The invention is realized by the following measures:
the utility model provides a photoconductive switch packaging structure, includes horizontal columniform and both ends open-ended conductive shell, conductive shell left end opening sealing shutoff has the printing opacity piece, and the middle part is provided with conductive ring piece in the conductive shell, conductive ring piece outer periphery closely laminates with conductive shell's interior periphery, and conductive ring piece center is opened there is the through-hole, and conductive shell's right-hand member opening sealing shutoff has insulating ring piece, insulating ring piece center transversely wears to have the conducting rod, the conducting rod left end runs through the through-hole and leaves the interval space between conducting rod surface and the internal surface of through-hole, interval space department is provided with the photoconductive switch chip, conductive ring piece and conducting rod are connected respectively to two electrodes of photoconductive switch chip, and the right-hand member of conducting rod extends to insulating ring piece right side, between conductive ring piece and the printing opacity piece, in the interval space around the photoconductive switch chip and conductive shell intussuseption between conductive ring piece and the insulating ring piece is filled with transparent insulating medium.
The outer side of the light-transmitting sheet is sleeved with a cap, the edges of the cap are buckled on the outer side of the end part of the conductive shell and are connected together through threads, an observation window is formed in the center of the end part of the conductive shell, and a sealing ring is arranged between the light-transmitting sheet and the end face around the opening of the left end of the conductive shell.
An injection hole is formed in the insulating annular sheet, a detachable blocking screw is plugged into the injection hole, and an insulating curing adhesive layer is coated on the right end face of the insulating annular sheet.
The inner circumferential surface of the conductive shell is provided with threads, and the outer circumferential surface of the conductive circular ring sheet and the outer circumferential surface of the insulating circular ring sheet are connected with the inner circumferential surface of the conductive shell through threads.
The end face around the opening at the left end of the conductive shell is provided with a circular groove, the sealing ring is embedded in the groove, and the thickness of the sealing ring is larger than the depth of the groove.
The transparent insulating medium adopts transparent insulating gas or transparent insulating liquid, the conductive shell, the conductive circular ring sheet and the conductive rod adopt pure copper materials, the insulating circular ring sheet adopts materials with certain strength and good insulativity, and the light-transmitting sheet adopts high-light-transmission optical glass.
Preferably, the insulating circular ring sheet is made of AlN ceramic and polytetrafluoroethylene insulating material.
The invention has the technical characteristics and advantages that:
the inside of the conductive shell can form a sealed space through the detachable assembly, and two electrodes of the photoconductive switch are respectively connected with the conductive annular sheet so as to be further connected with the conductive shell and the conductive rod to be directly led out, thereby realizing the electric connection between the photoconductive switch and an external circuit. And the transparent insulating medium is filled in the sealed space, so that the transparent insulating medium completely wraps the periphery of the photoconductive switch, and the compressive strength and the service life of the photoconductive switch are improved.
Drawings
FIG. 1 is a schematic diagram of a front view of the present invention;
in the figure: 1. capping; 2. a light transmitting sheet; 3. a seal ring; 4. a photoconductive switch chip; 5. conductive ring pieces; 6. a conductive housing; 7. an insulating annular sheet; 8. plugging a screw; 9. a conductive rod; 10. a transparent insulating medium; 11. and (5) insulating and curing the adhesive layer.
Detailed Description
The invention is described in further detail below with reference to the accompanying drawings:
as shown in fig. 1, a photoconductive switch packaging structure comprises a conductive shell 6 with a transverse cylindrical shape and two open ends, wherein a transparent sheet 2 is sealed and blocked at the left end opening of the conductive shell 6, a conductive circular ring sheet 5 is arranged at the middle part in the conductive shell 6, the outer circumferential surface of the conductive circular ring sheet 5 is tightly attached to the inner circumferential surface of the conductive shell 6, a through hole is formed in the center of the conductive circular ring sheet 5, an insulating circular ring sheet 7 is sealed and blocked at the right end opening of the conductive shell 6, a conductive rod 9 transversely penetrates through the center of the insulating circular ring sheet 7, a gap is reserved between the left end of the conductive rod 9 and the inner surface of the through hole, a photoconductive switch chip 4 is arranged at the gap, two electrodes of the photoconductive switch chip 4 are respectively connected with the conductive circular ring sheet 5 and the conductive rod 9, the right end of the conductive rod 9 extends to the right side of the insulating circular ring sheet 7, and transparent insulating media 10 are filled in the conductive shell 6 between the conductive circular ring sheet 5 and the transparent sheet 2, the gap around the photoconductive switch chip 4 and the conductive circular ring sheet 5. The coplanar electrode design of the photoconductive switch chip 4 and the back-emitted laser triggering mode, one electrode of the photoconductive switch chip 4 is welded on the conductive circular ring sheet 5 and then combined with the conductive shell 6 through threads, and the other electrode of the photoconductive switch chip 4 is welded with the conductive rod 9, so that two leading-out ends can be respectively electrically connected. The conductive ring piece 5 and the conductive rod 9 are welded with the electrodes of the photoconductive switch chip 4 successively through welding. The transparent insulating medium 10 is filled in the sealed space, so that the transparent insulating medium 10 completely wraps the periphery of the photoconductive switch, and the service life of the photoconductive switch and the working voltage of the whole device are improved.
The outer side of the light-transmitting sheet 2 is sleeved with a cap 1, the edges of the cap 1 are buckled on the outer side of the end part of the conductive shell 6 and are connected together through threads, an observation window is formed in the center of the end part of the conductive shell 6, and a sealing ring 3 is arranged between the light-transmitting sheet 2 and the end face around the opening of the left end of the conductive shell 6. In order to improve the tightness, an annular groove is formed in the end face around the opening of the left end of the conductive shell 6, and the sealing ring 3 is embedded in the groove. The cap 1 is provided with a window which can be combined with the light-transmitting sheet 2 to form a light-transmitting sealing window; the cap 1 can be screwed with one end of the conductive shell 6 with external threads, and the good sealing effect of the port is realized through the tight contact between the transparent sheet 2 and the sealing ring 3. The material of the light-transmitting sheet 2 can be a high-light-transmitting optical glass sheet, and the glass sheet can be subjected to film coating treatment aiming at different laser wavelengths.
An injection hole is formed in the insulating annular sheet 7, a detachable blocking screw 8 is plugged into the injection hole, and an insulating curing adhesive layer 11 is coated on the end face of the right side of the insulating annular sheet 7. The inner circumferential surface of the conductive shell 6 is provided with threads, and the outer circumferential surface of the conductive circular ring sheet 5 and the outer circumferential surface of the insulating circular ring sheet 7 are connected with the inner circumferential surface of the conductive shell 6 through threads. The conductive annular sheet 5 is provided with a spacing gap larger than the size of the photoconductive switch chip 4, so that the transparent insulating medium 10 can conveniently circulate and the conductive annular sheet 5 can be screwed in and screwed out in the conductive shell 6. The size of the central through hole of the insulating circular ring sheet 7 is consistent with the size of the bottom surface of the conductive rod 9, and the conductive rod 9 and the insulating circular ring sheet 7 can be fixed and sealed at the relative position by designing corresponding threaded fit or using curing materials such as sealant, so that the position of the insulating circular ring sheet 7 in the shell is moved to realize the control of the position of the conductive rod 9 to realize good welding. The insulating annular sheet 7 also has a threaded hole with a length equal to the wall thickness, where the transparent insulating medium 10 can be filled, and after the filling is completed, the insulating annular sheet 7 can be sealed by a screw first, and then the insulating curing medium is used for curing on the outer surface of the insulating annular sheet 7. The insulating circular ring sheet 7 and the conductive rod 9 can be integrally formed through threads or sealant.
The cap 1, the conductive shell 6, the conductive circular ring piece 5 and the conductive rod 9 are all made of pure copper materials. The pure copper is also called red copper, namely copper with the highest copper content, the copper content is 99.5-99.95%, and the copper has the characteristics of good weldability, plasticity, corrosion resistance, excellent conductive property and the like.
The insulating ring sheet 7 may be made of an insulating material such as AlN ceramic or polytetrafluoroethylene. The light-transmitting sheet 2 is a high-light-transmitting optical glass sheet, and can be subjected to film coating treatment aiming at different laser wavelengths. The blocking screw 8 may be a metal screw or a plastic screw. The sealing ring 3 can be a sealing ring 3 made of materials such as fluorine rubber, silica gel and the like. The insulating and curing glue can be epoxy resin glue and the like. The transparent insulating medium 10 may be a transparent insulating material such as a transparent insulating gas or a transparent insulating liquid. The transparent insulating gas can be sulfur hexafluoride; the insulating liquid can be fluorinated liquid, liquid silica gel or insulating oil.
The foregoing is merely a preferred embodiment of the present patent, and it should be noted that modifications and substitutions will now occur to those skilled in the art without departing from the technical principles of the present patent, and such modifications and substitutions should also be considered to be within the scope of the present patent.
Claims (6)
1. A photoconductive switch packaging structure is characterized in that: including horizontal cylindrical and both ends open-ended conductive shell, conductive shell left end opening sealing shutoff has the printing opacity piece, and the middle part is provided with conductive ring piece in the conductive shell, conductive ring piece outer circumference closely laminates with conductive shell's interior circumference, and conductive ring piece center is opened there is the through-hole, and conductive shell's right-hand member opening sealing shutoff has insulating ring piece, insulating ring piece center transversely wears to have the conducting rod, the conducting rod left end runs through-hole and leaves the interval space between conducting rod surface and the internal surface of through-hole, interval space department is provided with the photoconductive switch chip, conductive ring piece and conducting rod are connected respectively to two electrodes of photoconductive switch chip, and the right-hand member of conducting rod extends to insulating ring piece right side, and the packing has transparent insulating medium in the conductive shell between conductive ring piece and the insulating ring piece between conductive ring piece and the printing opacity piece between the interval space around the photoconductive switch chip.
2. The photoconductive switch package structure of claim 1, wherein: the transparent sheet is sleeved with a cover cap outside, the edges of the cover cap are buckled outside the end part of the conductive shell and are connected together through threads, an observation window is formed in the center of the end part of the conductive shell, and a sealing ring is arranged between the transparent sheet and the end face around the opening of the left end of the conductive shell.
3. The photoconductive switch package structure of claim 1, wherein: an injection hole is formed in the insulating annular sheet, a detachable blocking screw is plugged into the injection hole, and an insulating curing adhesive layer is coated on the end face of the right side of the insulating annular sheet.
4. The photoconductive switch package structure of claim 1, wherein: the inner circumferential surface of the conductive shell is provided with threads, and the outer circumferential surface of the conductive circular ring sheet and the outer circumferential surface of the insulating circular ring sheet are connected with the inner circumferential surface of the conductive shell through threads.
5. The photoconductive switch package structure of claim 2, wherein: the end face around the opening at the left end of the conductive shell is provided with a circular groove, and the sealing ring is embedded in the groove, so that the sealing effect is achieved.
6. The photoconductive switch package structure of claim 1, wherein: the transparent insulating medium can be transparent insulating gas, insulating liquid or insulating glue, the conductive shell, the conductive circular ring sheet and the conductive rod can be made of metal conductive materials such as pure copper, titanium and gold, the insulating circular ring sheet can be made of insulating materials such as AlN ceramic and polytetrafluoroethylene, and the light-transmitting sheet is made of high-light-transmission optical glass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111237510.7A CN114124064B (en) | 2021-10-22 | 2021-10-22 | Photoconductive switch packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111237510.7A CN114124064B (en) | 2021-10-22 | 2021-10-22 | Photoconductive switch packaging structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114124064A CN114124064A (en) | 2022-03-01 |
| CN114124064B true CN114124064B (en) | 2024-03-26 |
Family
ID=80376400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111237510.7A Active CN114124064B (en) | 2021-10-22 | 2021-10-22 | Photoconductive switch packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114124064B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1499687A (en) * | 2002-11-06 | 2004-05-26 | 三菱电机株式会社 | Metallic locking shutter |
| CN201417350Y (en) * | 2008-12-17 | 2010-03-03 | 福建福晶科技股份有限公司 | Electro-optical switch with adjustable optical window sheets |
| CN201984991U (en) * | 2011-04-22 | 2011-09-21 | 常州盛士达传感器有限公司 | Pressure switch |
| CN107743031A (en) * | 2017-11-30 | 2018-02-27 | 大连理工大学 | A kind of laser triggering multi-stage vacuum switch |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7041413B2 (en) * | 2000-02-02 | 2006-05-09 | Quallion Llc | Bipolar electronics package |
-
2021
- 2021-10-22 CN CN202111237510.7A patent/CN114124064B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1499687A (en) * | 2002-11-06 | 2004-05-26 | 三菱电机株式会社 | Metallic locking shutter |
| CN201417350Y (en) * | 2008-12-17 | 2010-03-03 | 福建福晶科技股份有限公司 | Electro-optical switch with adjustable optical window sheets |
| CN201984991U (en) * | 2011-04-22 | 2011-09-21 | 常州盛士达传感器有限公司 | Pressure switch |
| CN107743031A (en) * | 2017-11-30 | 2018-02-27 | 大连理工大学 | A kind of laser triggering multi-stage vacuum switch |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114124064A (en) | 2022-03-01 |
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