CN114051324B - Plasma cleaning and protecting device and method for soft and hard combined plate - Google Patents
Plasma cleaning and protecting device and method for soft and hard combined plate Download PDFInfo
- Publication number
- CN114051324B CN114051324B CN202111428575.XA CN202111428575A CN114051324B CN 114051324 B CN114051324 B CN 114051324B CN 202111428575 A CN202111428575 A CN 202111428575A CN 114051324 B CN114051324 B CN 114051324B
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- soft
- baffle
- plate
- plates
- hole
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- 238000004140 cleaning Methods 0.000 title claims abstract description 35
- 238000000034 method Methods 0.000 title claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 238000005553 drilling Methods 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 230000005587 bubbling Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Structure Of Printed Boards (AREA)
- Cleaning In General (AREA)
Abstract
The invention discloses and provides a plasma cleaning protection device and method for a soft and hard combined plate. The invention comprises two substrates, wherein a through hole area is arranged on the substrates, a baffle plate matched with a soft board is arranged in the through hole area, two ends of the baffle plate are connected to the hole wall of the through hole area, a plurality of positioning holes are arranged on the substrates and surround the through hole area, a hollow rivet is arranged on each positioning hole on one substrate, the positioning holes on the other substrate penetrate through the hollow rivet, so that the two substrates are overlapped, the soft and hard combined board is positioned between the two substrates when in use, the hard board of the soft and hard combined board is exposed to the outside through the through hole area, and the soft board of the soft and hard combined board is completely clamped by the baffle plates on the two substrates. The invention is applied to the technical field of PCB/FPC production.
Description
Technical Field
The invention relates to the technical field of PCB/FPC production, in particular to a plasma cleaning and protecting device and method for a rigid-flex printed circuit board.
Background
As electronic products are developed toward high density, miniaturization, and high reliability, flexible circuit boards (FPCs) having free bending, winding, and folding characteristics are receiving attention. The development of flexible circuit board and PCB hard board can promote the generation of new product of soft and hard combined board. The soft and hard combined board is a circuit board which is formed by combining a flexible circuit board and a hard circuit board together according to related technological requirements through the procedures of pressing and the like and has FPC characteristics and PCB characteristics. When producing the soft and hard combined plate, the soft plate area is free of an adhesive layer, the back scrapping is caused by easy foaming, and a very important working procedure is provided, namely the hole wall after drilling is clean, no matter mechanical drilling or laser drilling is needed, more processes for cleaning the hole wall are usually plasma cleaning, and when the soft plate area is larger, the plasma cleaning can often cause series of problems of bubbling, deformation, plate burning and the like of the soft plate area.
Disclosure of Invention
The invention aims to solve the technical problem of overcoming the defects of the prior art and provides a plasma cleaning and protecting device and method for a soft and hard combined plate, wherein the plasma cleaning and protecting device and method can well protect the soft and hard combined plate and prevent the soft and hard combined plate from being damaged during plasma cleaning.
The invention adopts the technical scheme that the flexible printed circuit board comprises two substrates, wherein a through hole area is arranged on each substrate, a baffle plate matched with a soft board is arranged in each through hole area, two ends of each baffle plate are connected to the wall of each through hole area, a plurality of positioning holes are formed in each substrate and surround each through hole area, a hollow rivet is arranged on each positioning hole on one substrate, the other positioning holes on the other substrate penetrate through the hollow rivets, so that the two substrates are overlapped, when the flexible printed circuit board is used, the rigid printed circuit board is positioned between the two substrates, the rigid printed circuit board of the rigid printed circuit board is exposed outside through the through hole area, and the flexible printed circuit board of the rigid printed circuit board is completely clamped by the baffle plates on the two substrates.
Further, the substrate is provided with a plurality of through hole areas, and each through hole area is provided with a baffle plate matched with the soft board.
Further, the through hole area is a square hole.
Further, both ends of the baffle are connected to the hole walls of the square holes, and the baffle divides the square holes into two small square holes with the same size.
Further, the baffle and the base plate are integrally provided.
Further, the baffle is rectangular shaped plate, both ends all are connected around the baffle on the pore wall in through-hole region, the left and right sides face of baffle is the inclined plane, the top on inclined plane is located the upper surface of baffle, the bottom on inclined plane is located the upper surface of baffle, the left and right sides of baffle the top on inclined plane is close to each other, the left and right sides of baffle the bottom on inclined plane is kept away from each other, during the use the lower surface subsides of baffle are in on the soft board of rigid-flex board.
Further, the hole wall of the through hole area is inclined.
The plasma cleaning and protecting method of the plasma cleaning and protecting device using the soft and hard combined plate comprises the following steps:
a. Installing the hollow rivet in the positioning hole on the first substrate;
b. Positioning small holes on the soft and hard combined plate are sleeved on the hollow rivets, and the soft and hard combined plate is positioned on the first substrate through the hollow rivets;
c. the positioning hole of the other base plate is sleeved on the hollow rivet;
d. after the soft and hard combined plates are clamped by the two base plates, the hollow rivets are turned and riveted tightly, the hard plates of the soft and hard combined plates are exposed outside through the through hole areas, and the soft plates of the soft and hard combined plates are completely clamped by the baffle plates on the two base plates;
e. The drilling position on the hard plate is cleaned by plasma gas, so that the soft plate is prevented from being in direct contact with the plasma gas;
f. and after the cleaning is finished, removing the hollow rivet, removing the substrate, and taking out the soft and hard combined plate after the plasma cleaning.
Further, the nearest distance between the outer edge of the baffle plate and the outer edge of the soft plate is 0.5mm-100mm.
Further, the base plate and the soft and hard combined plate are drilled at the same time, so that the positioning small holes of the soft and hard combined plate are consistent with the positioning holes in size and position, and the drilling size is 0.5mm-10mm.
The invention has the beneficial effects that as the design of partition protection is adopted, the soft and hard combined plate can avoid the direct contact of the soft plate area and plasma gas when plasma cleaning is carried out, thereby solving the series of problems of bubbling, deformation, plate burning and the like of the soft plate area.
Drawings
FIG. 1 is a schematic view of a plasma cleaning protection device;
FIG. 2 is a schematic view of another view of a plasma cleaning protection device;
FIG. 3 is a schematic diagram of a rigid-flex board according to an embodiment;
FIG. 4 is a schematic diagram of drilling holes in a substrate and a rigid-flex board together
FIG. 5 is a schematic view of a slot of a processed substrate;
FIG. 6 is a schematic view of the blind rivet after installation on the substrate;
FIG. 7 is a schematic view of a substrate and rigid-flex board combined by blind rivets;
FIG. 8 is a schematic view of a base plate and a rigid-flex board after being riveted by a rivet flange after being combined;
FIG. 9 is a schematic view of the left and right sides of the baffle plate without being beveled;
FIG. 10 is a schematic view of the baffle plate with the left and right sides of the baffle plate being beveled;
Fig. 11 is a full process flow diagram of the present invention.
Detailed Description
As shown in fig. 1 and 2, in this embodiment, the present invention includes two substrates 1, a through hole area 2 is provided on the substrates 1, a baffle 3 adapted to a soft board is provided in the through hole area 2, two ends of the baffle 3 are connected to a hole wall of the through hole area 2, a plurality of positioning holes 4 are provided on the substrates 1 and around the through hole area 2, a hollow rivet 5 is provided on each positioning hole 4 on one of the substrates 1, the positioning holes 4 on the other substrate 1 pass through the hollow rivet 5, so that the two substrates 1 are overlapped, a soft and hard combined board 7 is located between the two substrates 1 when in use, the hard board 8 of the soft and hard combined board 7 is exposed to the outside through the through hole area 2, and the soft board 9 of the soft and hard combined board is completely clamped by the baffle 3 on the two substrates 1. In the present embodiment, the substrate 1 is cut as large as the rigid-flex board 7.
In this embodiment, four through hole areas 2 are disposed on the substrate 1, and each through hole area 2 is provided with a baffle 3 adapted to a flexible board.
In this embodiment, the through hole region 2 is a square hole.
In this embodiment, two ends of the baffle plate 3 are connected to the wall of the square hole, and the baffle plate 3 divides the square hole into two small square holes with the same size.
In this embodiment, the baffle 3 and the substrate 1 are integrally provided.
In this embodiment, as shown in fig. 10, the baffle 3 is a strip-shaped plate, the front and rear ends of the baffle 3 are all connected to the hole wall of the through hole area 2, the left and right sides of the baffle 3 are inclined planes 6, the top of the inclined planes 6 is located on the upper surface of the baffle 3, the bottom of the inclined planes 6 is located on the upper surface of the baffle 3, the tops of the inclined planes 6 on the left and right sides of the baffle 3 are close to each other, the bottoms of the inclined planes 6 on the left and right sides of the baffle 3 are far away from each other, and when in use, the lower surface of the baffle 3 is attached to the soft board 9 of the soft and hard combined plate 7, and the hole wall of the through hole area 2 is inclined. Through the design of inclined plane 6, the clearance that assurance plasma body can not get into between baffle 3 and the soft board 9 that not only can avoid damaging the soft and hard combined board because of two base plate 1 uses too big clamp force, can avoid soft board district and plasma gas direct contact again, and then solved soft board district bubble, warp, burn a series of problems such as board. As shown in fig. 9, if the left and right sides of the baffle 3 are not inclined surfaces 6, high-pressure vortex gas is formed at right angles, and the high-pressure vortex gas more easily enters the gap between the baffle 3 and the flexible board 9, so that the flexible board area is in direct contact with the plasma gas, and the flexible board 9 is most likely to be damaged.
As shown in fig. 3 to 8, the plasma cleaning and protecting method of the plasma cleaning and protecting device using the soft and hard combined plate comprises the following steps:
a. mounting the blind rivet 5 in the positioning hole 4 on the first base plate 1;
b. Positioning small holes on the soft and hard combined plate 7 are sleeved on the hollow rivets 5, and the soft and hard combined plate 7 is positioned on the first substrate 1 through the positioning of the hollow rivets 5;
c. the other positioning hole 4 of the base plate 1 is sleeved on the hollow rivet 5;
d. After the two base plates 1 clamp the soft and hard combined plates 7, the hollow rivets 5 are turned and riveted, the hard plates 8 of the soft and hard combined plates 7 are exposed to the outside through the through hole areas 2, and the soft plates 9 of the soft and hard combined plates are completely clamped by the baffle plates 3 on the two base plates 1;
e. The drilling position on the hard plate 8 is cleaned by plasma gas, so that the soft plate 9 is prevented from being in direct contact with the plasma gas;
f. after the cleaning is finished, the hollow rivet 5 is removed, the substrate 1 is removed, and the soft and hard combined plate 7 is taken out after the plasma cleaning.
In this embodiment, the nearest distance between the outer edge of the baffle 3 and the outer edge of the flexible board 9 is 0.5mm-100mm.
In this embodiment, the substrate 1 and the rigid-flex board 7 are drilled at the same time, so that the positioning small holes of the rigid-flex board 7 and the positioning holes 4 are identical in size and position, and the drilling size is 0.5mm-10mm.
As shown in fig. 11, firstly, determining the size of the soft and hard combined board, defining the soft board area, preparing two substrates (the material of the substrate can be arbitrary) as large as the soft and hard combined board, then drilling holes on the soft and hard combined board and the substrate together, wherein the drilling holes are required to be uniformly distributed in the soft board area, then cutting the hard board position corresponding to the soft and hard combined board on the substrate by using laser cutting, and the cutting position is smaller than the hard board, especially the soft and hard joint position, and is required to be far away from the soft board area as far as possible. Then, a hollow rivet with the same size as the drilled hole is arranged on the base plate 1, then the soft and hard combined plate and the two base plates 1 are connected together through the hollow rivet, and then the hollow rivet is turned and riveted tightly, so that the base plate can be sent into plasma cleaning equipment for cleaning. When the soft and hard combined plate is subjected to plasma cleaning, the soft plate area is prevented from being in direct contact with plasma gas, and the series of problems of bubbling, deformation, plate burning and the like of the soft plate area are further solved.
While the embodiments of this invention have been described in terms of practical aspects, they are not to be construed as limiting the meaning of this invention, and modifications to the embodiments and combinations with other aspects thereof will be apparent to those skilled in the art from this description.
Claims (6)
1. A plasma cleaning and protecting device for soft and hard combined plates is characterized by comprising two base plates (1), wherein a through hole area (2) is arranged on each base plate (1), a baffle plate (3) matched with a soft plate is arranged in each through hole area (2), two ends of each baffle plate (3) are connected to the hole wall of each through hole area (2), a plurality of positioning holes (4) are formed in each base plate (1) and surround the through hole area (2), a hollow rivet (5) is arranged on each positioning hole (4) on one base plate (1), the other positioning holes (4) on the other base plate (1) penetrate through the hollow rivet (5), so that the two base plates (1) are overlapped, when the soft and hard combined plates (7) are positioned between the two base plates (1), the hard plates (8) of the soft and hard combined plates (7) are exposed to the outside through the through hole areas (2), the soft plates (9) of the soft and hard combined plates are clamped by the two base plates (1) and the baffle plates (3) are completely clamped by the plurality of the baffle plates (1), the flexible printed circuit board comprises a flexible printed circuit board (7), wherein each through hole area (2) is provided with a baffle (3) matched with the flexible printed circuit board, each through hole area (2) is a square hole, the baffle (3) and the base plate (1) are integrally arranged, each baffle (3) is a strip-shaped plate, the front end and the rear end of each baffle (3) are connected to the hole wall of each through hole area (2), the left side surface and the right side surface of each baffle (3) are inclined surfaces (6), the top of each inclined surface (6) is located on the upper surface of each baffle (3), the bottoms of the inclined surfaces (6) on the left side and the right side of each baffle (3) are close to each other, the bottoms of the inclined surfaces (6) on the left side and the right side of each baffle (3) are far away from each other, and the lower surface of each baffle (3) is attached to the flexible printed circuit board (9) on the flexible printed circuit board (7) when the flexible printed circuit board is used.
2. The plasma cleaning and protecting device for the soft and hard combined plate according to claim 1, wherein two ends of the baffle plate (3) are connected to the wall of the square hole, and the baffle plate (3) divides the square hole into two small square holes with the same size.
3. The plasma cleaning and protecting device for a soft and hard combined plate according to claim 1 or 2, wherein the hole wall of the through hole area (2) is inclined.
4. A plasma cleaning and protecting method using the plasma cleaning and protecting device for a rigid-flex board according to claim 1, characterized in that said plasma cleaning and protecting method comprises the following steps:
a. -mounting said blind rivet (5) in said positioning hole (4) in a first of said base plates (1);
b. positioning small holes on the soft and hard combined plate (7) are sleeved on the hollow rivets (5), and the soft and hard combined plate (7) is positioned on the first substrate (1) through the hollow rivets (5);
c. the other positioning hole (4) of the base plate (1) is sleeved on the hollow rivet (5);
d. After the soft and hard combined plates (7) are clamped by the two base plates (1), the hollow rivets (5) are turned and riveted tightly, the hard plates (8) of the soft and hard combined plates (7) are exposed outside through the through hole areas (2), and the soft plates (9) of the soft and hard combined plates are completely clamped by the baffle plates (3) on the two base plates (1);
e. The drilling position on the hard plate (8) is cleaned by plasma gas, so that the soft plate (9) is prevented from being in direct contact with the plasma gas;
f. after cleaning, the hollow rivet (5) is removed, the substrate (1) is removed, and the soft and hard combined plate (7) is taken out after plasma cleaning and cleaning.
5. The plasma cleaning and protecting method according to claim 4, wherein the nearest distance between the outer edge of the baffle plate (3) and the outer edge of the soft board (9) is 0.5mm-100mm.
6. The plasma cleaning and protecting method according to claim 4, wherein the base plate (1) and the rigid-flex board (7) are drilled simultaneously, so that the positioning small holes of the rigid-flex board (7) are consistent with the positioning holes (4) in size and position, and the drilled holes are 0.5mm-10mm in size.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111428575.XA CN114051324B (en) | 2021-11-29 | 2021-11-29 | Plasma cleaning and protecting device and method for soft and hard combined plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111428575.XA CN114051324B (en) | 2021-11-29 | 2021-11-29 | Plasma cleaning and protecting device and method for soft and hard combined plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114051324A CN114051324A (en) | 2022-02-15 |
| CN114051324B true CN114051324B (en) | 2024-12-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111428575.XA Active CN114051324B (en) | 2021-11-29 | 2021-11-29 | Plasma cleaning and protecting device and method for soft and hard combined plate |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN216673417U (en) * | 2021-11-29 | 2022-06-03 | 珠海中京元盛电子科技有限公司 | Plasma cleaning protection device of rigid-flex board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101590566B1 (en) * | 2014-08-22 | 2016-02-02 | (주)젠 | Plasma apparatus for vapor phase etching and cleaning |
| CN111010820A (en) * | 2019-12-27 | 2020-04-14 | 上海嘉捷通电路科技股份有限公司 | Method for manufacturing rigid-flex board with overlapped flexible board area |
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- 2021-11-29 CN CN202111428575.XA patent/CN114051324B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN216673417U (en) * | 2021-11-29 | 2022-06-03 | 珠海中京元盛电子科技有限公司 | Plasma cleaning protection device of rigid-flex board |
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| CN114051324A (en) | 2022-02-15 |
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