CN114043379B - Full-automatic intelligent semiconductor substrate slice processing equipment - Google Patents
Full-automatic intelligent semiconductor substrate slice processing equipment Download PDFInfo
- Publication number
- CN114043379B CN114043379B CN202111335461.0A CN202111335461A CN114043379B CN 114043379 B CN114043379 B CN 114043379B CN 202111335461 A CN202111335461 A CN 202111335461A CN 114043379 B CN114043379 B CN 114043379B
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- CN
- China
- Prior art keywords
- silicon carbide
- carbide substrate
- ring body
- substrate sheet
- storage barrel
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/042—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with blades or wires mounted in a reciprocating frame
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses full-automatic intelligent semiconductor substrate slice processing equipment, which comprises a base, wherein a rotary driving assembly is arranged on the base, a rotary ring body is arranged at the output end of the rotary driving assembly, a plurality of silicon carbide substrate slice mounting seats are uniformly distributed on the surface of the rotary ring body around the circumference of the circle center of the rotary ring body, a silicon carbide substrate slice storage barrel fixedly connected with the base is arranged above one silicon carbide substrate slice mounting seat, a reciprocating movement cutting assembly capable of cutting the bottom of a silicon carbide substrate slice in the silicon carbide substrate slice storage barrel at one side of the silicon carbide substrate slice storage barrel in an equal thickness manner is arranged, the working procedure processing time between the cutting of the silicon carbide substrate slice into the silicon carbide substrate slice is reduced, the silicon carbide substrate slice is automatically fed into a grinding device for surface grinding treatment, the processing time is saved, the whole mechanical structure is arranged consistently, and the working efficiency is improved.
Description
Technical Field
The invention relates to silicon carbide substrate block cutting and grinding equipment, in particular to full-automatic intelligent semiconductor substrate slice processing equipment.
Background
The silicon carbide substrate block is cut and ground, the formed whole silicon carbide substrate block is required to be cut into silicon carbide substrate slices with equal thickness, and then batch silicon carbide substrate slices are conveyed into a grinding device to be ground smoothly on the surface, so that the subsequent semiconductor processing is facilitated.
Accordingly, there is a need for further improvements in existing silicon carbide substrate block cutting and grinding equipment.
Disclosure of Invention
The invention aims to provide full-automatic intelligent semiconductor substrate slice processing equipment, which can realize that each silicon carbide substrate slice is cut and then quickly enters a grinding process, so that a large amount of processing time is saved, and the processing process is more coherent.
In order to achieve the above purpose, the present invention adopts the following scheme:
the utility model provides a full-automatic intelligent semiconductor substrate piece processing equipment, includes the base, be provided with rotary driving subassembly on the base, rotary driving subassembly's output is provided with rotatory ring body, rotatory ring body surface is around rotatory ring body centre of a circle circumference equipartition has a plurality of carborundum substrate piece mount pad, one of them carborundum substrate piece mount pad top be provided with base fixed connection's carborundum substrate piece storage barrel, carborundum substrate piece storage barrel one side is provided with can be right carborundum substrate piece in the carborundum substrate piece storage barrel carries out the reciprocating cutting subassembly of bottom equal thickness cutting, be provided with on the reciprocating cutting subassembly and send the carborundum substrate piece after the cutting to one of them carborundum substrate piece mount pad in the feeding pushing subassembly, carborundum substrate piece storage barrel for the opposite side at rotatory ring body center is provided with the swash plate, carborundum substrate piece storage barrel with a plurality of between the swash plate carborundum substrate piece mount pad top is provided with carborundum substrate piece surface grinding device, be provided with on the base and be used for carrying out the carborundum substrate piece in the base and carry out reciprocating motion in the intermittent type rotary driving subassembly and the intermittent type is provided with the reciprocating motion in the base and is used for the carborundum substrate piece mount pad cutting assembly.
Further, the rotary driving assembly comprises a driving motor seat and a rotary ring mounting seat, wherein the driving motor seat and the rotary ring mounting seat are arranged on the base, a driving motor is arranged in the driving motor seat, a driving gear is arranged at the output end of the driving motor, the rotary ring body is arranged in the rotary ring mounting seat to rotate, an external gear is arranged on the circumferential outer wall of the rotary ring body, and the driving gear and the external gear are in meshed transmission.
Further, the silicon carbide substrate sheet mounting seat is a detachable collar arranged on the rotary ring body.
Further, the silicon carbide substrate piece storage barrel is arranged on the outer side of one of the silicon carbide substrate piece mounting seats.
Further, the bottom of the silicon carbide substrate block storage barrel is provided with a lower opening and a supporting plate for supporting the lower end of the silicon carbide substrate block, and the bottom of one side of the silicon carbide substrate block storage barrel, which is close to the rotating ring body, is provided with a side opening.
Further, reciprocating motion cutting element include with backup pad fixed connection's pivot seat, the last rotation of pivot seat is provided with the pivot body, pivot body upper end is provided with the rotary disk, the rotary disk up end is provided with eccentric articulated shaft, the backup pad orientation the side opening direction is provided with the slide rail, the slide rail internalization is provided with can towards the inside diamond cutter who feeds the smear metal of side opening, be provided with the articulated seat on the diamond cutter, eccentric articulated shaft with articulated between the seat has the connecting rod.
Further, the feeding pushing assembly comprises a supporting plate arranged below the diamond cutting knife, the supporting plate and the diamond cutting knife are arranged at intervals up and down, the supporting plate and the diamond cutting knife are far away from a connecting plate arranged between the side openings, a push rod is arranged between the supporting plate and the diamond cutting knife, the push rod is fixedly connected with the supporting plate, and a blanking through hole which is communicated with one of the silicon carbide substrate sheet mounting seats is formed in the supporting plate below the push rod.
Further, the automatic detection upper pushing component comprises a push rod motor arranged on the base, an ejection block is arranged at the output end of the push rod motor, an inclined surface is arranged on the surface of the ejection block, the push rod motor is connected with a processor in a communication manner, infrared emitters are respectively arranged in the silicon carbide substrate sheet mounting seats, an infrared receiver capable of being matched with a plurality of the infrared emitters to receive signals is arranged in the base, and the infrared receiver is connected with the processor in a communication manner.
Further, the intermittent reciprocating linkage mechanism comprises a plurality of groups of meshing tooth groups arranged on the inner wall of the rotary ring body, the plurality of groups of meshing tooth groups are uniformly distributed on the inner wall of the rotary ring body around the center circumference of the rotary ring body, the plurality of groups of meshing tooth groups are arranged at intervals, a driving gear is arranged at the lower end of the rotary shaft body, and the driving gear is meshed with the plurality of meshing tooth groups in turn.
In summary, compared with the prior art, the invention has the following beneficial effects:
the invention solves the defects existing in the existing silicon carbide substrate block cutting and grinding equipment, and has the advantages that the working procedure processing time between cutting the silicon carbide substrate block into the silicon carbide substrate sheet and grinding is reduced, the silicon carbide substrate block can be regularly arranged in the corresponding silicon carbide substrate sheet mounting seat after being cut into the silicon carbide substrate sheet and automatically sent into the grinding device for surface grinding treatment, the processing time is saved, the whole mechanical structure is consistent, the working efficiency is improved, and meanwhile, only one driving element is arranged, so that a plurality of mechanical actions are realized, the manufacturing cost and the maintenance cost are saved, the structure is simple, and the use is convenient.
Drawings
FIG. 1 is one of the perspective views of the present invention;
FIG. 2 is a second perspective view of the present invention;
FIG. 3 is a third perspective view of the present invention;
FIG. 4 is a front view of the present invention;
FIG. 5 is a cross-sectional view taken along line A-A of FIG. 4;
FIG. 6 is a cross-sectional view taken along line B-B of FIG. 5;
FIG. 7 is a schematic view of an automatic detection upper pushing assembly according to the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to FIGS. 1-7, the present invention provides
The full-automatic intelligent semiconductor substrate slice processing equipment comprises a base 1, wherein a rotary driving assembly 2 is arranged on the base 1, a rotary ring body 3 is arranged at the output end of the rotary driving assembly 2, a plurality of silicon carbide substrate slice mounting seats 4 are uniformly distributed on the surface of the rotary ring body 3 around the circle center of the rotary ring body 3, a silicon carbide substrate slice storage barrel 5 fixedly connected with the base 1 is arranged above one of the silicon carbide substrate slice mounting seats 4, a reciprocating cutting assembly 6 capable of cutting silicon carbide substrate slices in the silicon carbide substrate slice storage barrel 5 at the bottom in equal thickness is arranged on one side of the silicon carbide substrate slice storage barrel 5, a feeding pushing assembly 7 capable of conveying the cut silicon carbide substrate slices to one of the silicon carbide substrate slice mounting seats 4 is arranged on the reciprocating cutting assembly 6, a discharging 8 is arranged on the other side of the silicon carbide substrate slice storage barrel 5 opposite to the center of the rotary ring body 3, a plurality of silicon carbide substrate slice storage barrels 5 and the discharging 8 are fixedly connected with each other, a reciprocating mechanism is arranged on the other side of the silicon carbide substrate slice mounting seats 4, and the reciprocating pushing assembly 4 is arranged on the rotary ring body 3, and the reciprocating cutting assembly 4 is used for intermittent grinding and is used for carrying out intermittent motion, and the intermittent motion is arranged on the reciprocating cutting assembly 10, and the reciprocating cutting assembly is arranged in the reciprocating assembly 4, and the reciprocating assembly is used for carrying out intermittent motion between the silicon carbide substrate slice and the silicon carbide slice mounting seat 4;
structural principle:
before working, the processed monolithic columnar silicon carbide substrate blocks are placed in the silicon carbide substrate block storage barrel 5 for storage, the rotary driving assembly 2 is started, the rotary driving assembly 2 drives the rotary ring body 3 to rotate, a plurality of silicon carbide substrate sheet mounting seats 4 are driven by the rotary ring body 3 to rotate around the center of the rotary ring body 3, the intermittent reciprocating linkage mechanism 10 drives the reciprocating cutting assembly 6 to perform intermittent reciprocating feeding action in the rotating process of the rotary ring body 3, the bottom of the monolithic columnar silicon carbide substrate blocks is cut in the process of feeding each time of the reciprocating cutting assembly 6, the cut bottom silicon carbide substrate sheet is conveyed to one of the silicon carbide substrate sheet mounting seats 4 by the feeding pushing assembly 7 for placement in the retracting process of the reciprocating cutting assembly 6, and the reciprocating cutting assembly 6 stops moving for a period of time after the action is completed; the rotating ring body 3 drives the silicon carbide substrate to move into the grinding device 11 to perform surface grinding, and the ground silicon carbide substrate is sent out and finally sent to the position of the automatic detection upper pushing and sending component 9, and the automatic detection upper pushing and sending component 9 ejects the silicon carbide substrate to the discharging inclined plate 8 to be sent out after detecting that the silicon carbide substrate moves to the current position.
The rotary driving assembly 2 comprises a driving motor seat 201 and a rotary ring mounting seat 202 which are arranged on a base 1, wherein a driving motor 203 is arranged in the driving motor seat 201, a driving gear 204 is arranged at the output end of the driving motor 203, a rotary ring body 3 is arranged in the rotary ring mounting seat 202 to rotate, an external gear 205 is arranged on the circumferential outer wall of the rotary ring body 3, and the driving gear 204 and the external gear 205 are meshed for transmission;
the above structure principle:
the driving motor 203 drives the driving gear 204 to rotate, the driving gear 204 drives the external gear 205 to be meshed and driven, and the external gear 205 enables the rotating ring body 3 to rotate;
the silicon carbide substrate sheet mounting seat 4 is a detachable collar arranged on the rotary ring body 3, the diameter of the detachable collar can be changed, and the diameter size of the detachable collar can be changed according to the diameter size of the silicon carbide substrate sheet.
The silicon carbide substrate block storage barrel 5 is arranged on the outer side of one of the silicon carbide substrate block mounting seats 4.
The bottom of the silicon carbide substrate block storage barrel 5 is provided with a lower opening and a supporting plate 100 for supporting the lower end of the silicon carbide substrate block, and the bottom of one side of the silicon carbide substrate block storage barrel 5, which is close to the rotating ring body 3, is provided with a side opening 200.
The reciprocating cutting assembly 6 comprises a rotating shaft seat 601 fixedly connected with a supporting plate 100, a rotating shaft body 602 is rotatably arranged on the rotating shaft seat 601, a rotating disc 603 is arranged at the upper end of the rotating shaft body 602, an eccentric hinging shaft 604 is arranged on the upper end surface of the rotating disc 603, a sliding rail 605 is arranged in the direction of the supporting plate 100 towards the side opening 200, a diamond cutting knife 606 capable of feeding chips towards the inside of the side opening 200 is movably arranged in the sliding rail 605, a hinging seat 607 is arranged on the diamond cutting knife 606, and a connecting rod 608 is hinged between the eccentric hinging shaft 604 and the hinging seat 607;
the diamond cutter 606 feeds toward the side opening 200, performs a dicing operation on the bottom of the silicon carbide substrate block, cuts the silicon carbide substrate block into silicon carbide substrate slices, breaks away from the silicon carbide substrate block and falls on the supporting plate 701, drives the silicon carbide substrate slices to move in the process that the supporting plate 701 is far away from the side opening 200, and the silicon carbide substrate slices on the jacking surface after moving to the ejector rods 703 fall into the blanking through holes 704, and fall into the silicon carbide substrate slice mounting seat 4 from the blanking through holes 704 for mounting.
The feeding and pushing assembly 7 of the present invention comprises a supporting plate 701 arranged below the diamond cutter 606, wherein the supporting plate 701 and the diamond cutter 606 are arranged at intervals up and down, a connecting plate 702 is arranged between the supporting plate 701 and the diamond cutter 606 far away from the side opening 200, a push rod 703 is arranged between the supporting plate 701 and the diamond cutter 606, the push rod 703 is fixedly connected with the supporting plate 100, and a blanking through hole 704 which is communicated with one of the silicon carbide substrate mounting seats 4 is arranged on the supporting plate 100 below the push rod 703.
The automatic detection upper pushing and conveying component 9 comprises a push rod motor 905 arranged on a base 1, an ejection block 901 is arranged at the output end of the push rod motor 905, an inclined surface 902 is arranged on the surface of the ejection block 901, the push rod motor 905 is in communication connection with a processor 906, infrared emitters 903 are respectively arranged in each silicon carbide substrate mounting seat 4, an infrared receiver 904 capable of being matched with a plurality of the infrared emitters 903 to receive signals is arranged in the base 1, and the infrared receiver 904 is in communication connection with the processor 906.
The intermittent reciprocating linkage mechanism 10 of the invention comprises a plurality of groups of occluding tooth groups 1001 arranged on the inner wall of the rotating ring body 3, wherein the plurality of groups of occluding tooth groups 1001 are uniformly distributed on the inner wall of the rotating ring body 3 around the central circumference of the rotating ring body 3, the plurality of groups of occluding tooth groups 1001 are arranged at intervals, the lower end of the rotating shaft body 602 is provided with a driving gear 1002, and the driving gear 1002 is meshed with the plurality of occluding tooth groups 1001 in turn;
the plurality of engagement tooth sets 1001 intermittently drive the rotary ring body 3 to intermittently rotate the rotary shaft 602, and the rotary shaft 602 drives the reciprocating cutting assembly 6 to intermittently feed and cut and take out the silicon carbide substrate to the upper surface of the silicon carbide substrate mounting seat 4.
While there has been shown and described what is at present considered to be the fundamental principles and the main features of the invention and the advantages thereof, it will be understood by those skilled in the art that the present invention is not limited to the foregoing embodiments, but is described in the foregoing description merely illustrates the principles of the invention, and various changes and modifications may be made therein without departing from the spirit and scope of the invention as hereinafter claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (5)
1. Full-automatic intelligent semiconductor substrate slice processing equipment, including base (1), its characterized in that: the rotary drive assembly (2) is arranged on the base (1), the rotary drive assembly (2) is provided with a rotary ring body (3) at the output end, a plurality of silicon carbide substrate sheet mounting seats (4) are uniformly distributed on the surface of the rotary ring body (3) around the circumference of the circle center of the rotary ring body (3), one of the silicon carbide substrate sheet mounting seats (4) is provided with a silicon carbide substrate sheet storage barrel (5) fixedly connected with the base (1), one side of the silicon carbide substrate sheet storage barrel (5) is provided with a reciprocating movement cutting assembly (6) capable of carrying out bottom equal thickness cutting on the silicon carbide substrate sheet in the silicon carbide substrate sheet storage barrel (5), the reciprocating movement cutting assembly (6) is provided with a feeding pushing assembly (7) capable of conveying cut silicon wafers to one of the silicon carbide substrate sheet mounting seats (4), the other side of the center of the silicon carbide substrate sheet storage barrel (5) is provided with a discharging inclined plate (8) relative to the silicon carbide substrate sheet mounting seats (4) between the silicon carbide substrate sheet storage barrel (5), an automatic detection upper pushing and conveying assembly (9) for pushing out the silicon carbide substrate in one of the silicon carbide substrate mounting seats (4) to the upper part of the unloading inclined plate (8) is arranged on the base (1), and an intermittent reciprocating linkage mechanism (10) for intermittently driving the reciprocating cutting assembly (6) to reciprocate in the rotating process of the rotating ring body (3) is arranged between the rotating ring body (3) and the reciprocating cutting assembly (6);
the bottom of the silicon carbide substrate block storage barrel (5) is provided with a supporting plate (100) for supporting the lower end of the silicon carbide substrate block, and a side opening (200) is formed in the bottom of one side, close to the rotating ring body (3), of the silicon carbide substrate block storage barrel (5);
the reciprocating cutting assembly (6) comprises a rotating shaft seat (601) fixedly connected with the supporting plate (100), a rotating shaft body (602) is rotatably arranged on the rotating shaft seat (601), a rotating disc (603) is arranged at the upper end of the rotating shaft body (602), an eccentric hinging shaft (604) is arranged on the upper end face of the rotating disc (603), a sliding rail (605) is arranged on the supporting plate (100) towards the side opening (200), a diamond cutting knife (606) capable of feeding chips towards the inside of the side opening (200) is movably arranged in the sliding rail (605), a hinging seat (607) is arranged on the diamond cutting knife (606), and a connecting rod (608) is hinged between the eccentric hinging shaft (604) and the hinging seat (607);
the feeding and pushing assembly (7) comprises a supporting plate (701) arranged below the diamond cutting knife (606), the supporting plate (701) and the diamond cutting knife (606) are arranged at intervals up and down, a connecting plate (702) is arranged between the supporting plate (701) and the diamond cutting knife (606) far away from the side opening (200), a push rod (703) is arranged between the supporting plate (701) and the diamond cutting knife (606), the push rod (703) is fixedly connected with the supporting plate (100), and a blanking through hole (704) which is communicated with one of the silicon carbide substrate sheets (4) is formed in the supporting plate (100) below the push rod (703);
the automatic detect push up send subassembly (9) including set up in push rod motor (905) on base (1), push rod motor (905) output is provided with ejecting piece (901), ejecting piece (901) surface is provided with inclined plane (902), push rod motor (905) communication is connected with processor (906), every respectively be provided with infrared transmitter (903) in carborundum substrate piece mount pad (4), be provided with in base (1) can with a plurality of infrared transmitter (903) assorted received signal's infrared receiver (904), infrared receiver (904) communication connect in processor (906).
2. The fully automatic intelligent semiconductor substrate sheet processing apparatus of claim 1, wherein: the rotary driving assembly (2) comprises a driving motor seat (201) and a rotary ring mounting seat (202) which are arranged on the base (1), a driving motor (203) is arranged in the driving motor seat (201), a driving gear (204) is arranged at the output end of the driving motor (203), the rotary ring body (3) is arranged in the rotary ring mounting seat (202) to rotate, an external gear (205) is arranged on the circumferential outer wall of the rotary ring body (3), and the driving gear (204) and the external gear (205) are in meshed transmission.
3. The fully automatic intelligent semiconductor substrate sheet processing apparatus of claim 2, wherein: the silicon carbide substrate sheet mounting seat (4) is a detachable lantern ring arranged on the rotary ring body (3).
4. A fully automatic intelligent semiconductor substrate sheet processing apparatus according to claim 3, wherein: the silicon carbide substrate block storage barrel (5) is arranged on the outer side of one of the silicon carbide substrate sheet mounting seats (4).
5. The fully automatic intelligent semiconductor substrate sheet processing apparatus of claim 4, wherein: intermittent type back and forth link gear (10) including set up in interlock tooth group (1001) of multiunit of rotatory ring body (3) inner wall, multiunit interlock tooth group (1001) centers on rotatory ring body (3) center circumference equipartition in rotatory ring body (3) inner wall, multiunit interlock tooth group (1001) interval sets up, pivot body (602) lower extreme is provided with driving gear (1002), driving gear (1002) mesh in turn in a plurality of interlock tooth group (1001).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111335461.0A CN114043379B (en) | 2021-11-11 | 2021-11-11 | Full-automatic intelligent semiconductor substrate slice processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111335461.0A CN114043379B (en) | 2021-11-11 | 2021-11-11 | Full-automatic intelligent semiconductor substrate slice processing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114043379A CN114043379A (en) | 2022-02-15 |
| CN114043379B true CN114043379B (en) | 2024-03-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111335461.0A Active CN114043379B (en) | 2021-11-11 | 2021-11-11 | Full-automatic intelligent semiconductor substrate slice processing equipment |
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| CN (1) | CN114043379B (en) |
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| CN211566051U (en) * | 2019-12-24 | 2020-09-25 | 广东智源机器人科技有限公司 | Automatic slicing mechanism |
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| CN213412132U (en) * | 2020-07-27 | 2021-06-11 | 苏州沃亿品机电设备有限公司 | Quick slicer for biological medicine |
| CN214025996U (en) * | 2020-09-28 | 2021-08-24 | 京来盐务科技(海南)有限公司 | Cutting and partial shipment sesame oil processing equipment |
| CN113386195A (en) * | 2021-06-25 | 2021-09-14 | 广州富港万嘉智能科技有限公司 | Slicer and automatic drink machine |
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2021
- 2021-11-11 CN CN202111335461.0A patent/CN114043379B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004223657A (en) * | 2003-01-23 | 2004-08-12 | Emura Tekkosho:Kk | Round blade body of vegetable cutting machine and its round blade |
| JP2006245493A (en) * | 2005-03-07 | 2006-09-14 | Disco Abrasive Syst Ltd | Semiconductor wafer electrode processing method |
| CN209579180U (en) * | 2019-03-07 | 2019-11-05 | 同辉电子科技股份有限公司 | A kind of grinding device for silicon carbide wafer |
| CN211566051U (en) * | 2019-12-24 | 2020-09-25 | 广东智源机器人科技有限公司 | Automatic slicing mechanism |
| CN213226412U (en) * | 2020-06-28 | 2021-05-18 | 湖北辰美中药有限公司 | Reciprocating type herbal pieces-cutting device |
| CN213412132U (en) * | 2020-07-27 | 2021-06-11 | 苏州沃亿品机电设备有限公司 | Quick slicer for biological medicine |
| CN214025996U (en) * | 2020-09-28 | 2021-08-24 | 京来盐务科技(海南)有限公司 | Cutting and partial shipment sesame oil processing equipment |
| CN112692583A (en) * | 2021-03-24 | 2021-04-23 | 新乡职业技术学院 | Rotating disc type automatic machining device |
| CN113386195A (en) * | 2021-06-25 | 2021-09-14 | 广州富港万嘉智能科技有限公司 | Slicer and automatic drink machine |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114043379A (en) | 2022-02-15 |
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