CN114002915B - Imprint substrate and imprint method - Google Patents
Imprint substrate and imprint method Download PDFInfo
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- CN114002915B CN114002915B CN202111366654.2A CN202111366654A CN114002915B CN 114002915 B CN114002915 B CN 114002915B CN 202111366654 A CN202111366654 A CN 202111366654A CN 114002915 B CN114002915 B CN 114002915B
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- glue
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- 239000000758 substrate Substances 0.000 title claims abstract description 107
- 238000000034 method Methods 0.000 title claims abstract description 53
- 230000000087 stabilizing effect Effects 0.000 claims abstract description 144
- 239000003292 glue Substances 0.000 claims abstract description 98
- 230000008569 process Effects 0.000 claims abstract description 32
- 230000003287 optical effect Effects 0.000 claims abstract description 19
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 14
- 239000011248 coating agent Substances 0.000 claims abstract description 9
- 238000000576 coating method Methods 0.000 claims abstract description 9
- 230000005484 gravity Effects 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims description 20
- 238000001723 curing Methods 0.000 claims description 18
- 239000000853 adhesive Substances 0.000 claims description 15
- 230000001070 adhesive effect Effects 0.000 claims description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 14
- 239000011521 glass Substances 0.000 claims description 13
- 238000001179 sorption measurement Methods 0.000 claims description 11
- 238000004049 embossing Methods 0.000 claims description 10
- 238000004528 spin coating Methods 0.000 claims description 10
- 238000005452 bending Methods 0.000 claims description 5
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 5
- 229920005591 polysilicon Polymers 0.000 claims description 5
- 239000010432 diamond Substances 0.000 claims description 4
- 229910003460 diamond Inorganic materials 0.000 claims description 4
- 239000010453 quartz Substances 0.000 claims description 4
- 229910052593 corundum Inorganic materials 0.000 claims description 3
- 239000010431 corundum Substances 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 230000007704 transition Effects 0.000 claims description 3
- 230000001680 brushing effect Effects 0.000 claims description 2
- 238000000016 photochemical curing Methods 0.000 claims 6
- 238000012797 qualification Methods 0.000 abstract description 4
- 239000000047 product Substances 0.000 description 14
- 238000013461 design Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000012545 processing Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 238000003698 laser cutting Methods 0.000 description 4
- 239000002861 polymer material Substances 0.000 description 4
- 239000003381 stabilizer Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000006124 Pilkington process Methods 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 230000006641 stabilisation Effects 0.000 description 2
- 238000011105 stabilization Methods 0.000 description 2
- CFOAUMXQOCBWNJ-UHFFFAOYSA-N [B].[Si] Chemical compound [B].[Si] CFOAUMXQOCBWNJ-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0012—Arrays characterised by the manufacturing method
- G02B3/0031—Replication or moulding, e.g. hot embossing, UV-casting, injection moulding
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/18—Diffraction gratings
- G02B5/1847—Manufacturing methods
- G02B5/1857—Manufacturing methods using exposure or etching means, e.g. holography, photolithography, exposure to electron or ion beams
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
Abstract
The present invention provides an imprint substrate for being fixed to a stage of an imprint apparatus, the imprint substrate being an imprint substrate for preparing a diffractive optical element or a microlens array, the imprint substrate comprising: the functional part is used for coating photo-setting or thermosetting glue, and is provided with an effective area with uniform thickness and an ineffective area surrounding the effective area, wherein the effective area is used as a bearing area of the nano-imprint pattern. The stabilizing part is fixedly arranged on the ineffective area of the functional part, and the thickness of the stabilizing part is larger than that of the functional part. The embodiment of the invention resists the inward shrinkage stress in the glue curing process by utilizing the gravity of the stabilizing part, avoids the warp deformation of the substrate, improves the qualification rate of the product, and further provides conditions for selecting the large-size ultrathin substrate. Meanwhile, the invention also provides an imprinting method which relies on the imprinting substrate to carry out nano imprinting.
Description
Technical Field
The present invention relates generally to the field of nanoimprint technology, and more particularly, to an imprint substrate and an imprint method.
Background
Nanoimprint technology is a technology of transferring a pattern onto a substrate through a template, and can be used to process nanoscale components, such as a diffraction optical element or a microlens array, by virtue of its high-precision characteristics. The nano-imprinting process is to form a layer of polymer material on the substrate, press the pattern on the template on the uncured polymer material layer by means of the mechanical force of the imprinting equipment, and form a structure which is completely opposite to the pattern of the template on the substrate after the polymer material layer is cured, so that the whole imprinting process is completed. The polymer material is usually selected from glue containing photo-setting or thermosetting resin, and the material shrinks in the setting process, and the substrate fixed with the material is also affected by the shrinkage stress of the glue. Under the condition that the structural strength of the substrate is enough, the shrinkage stress of the glue can not seriously affect the quality of the final product, but with the development of technology and the improvement of market demands, the requirements for reducing the thickness of the substrate and improving the size of the substrate are higher and higher, and particularly in the field of optical elements, the large-size ultrathin element has larger product competitiveness. However, as the thickness of the substrate is reduced, the size is increased, the structural strength of the substrate cannot resist the shrinkage stress of the glue, deformation and warping can be caused, the boundary position of the edge of the substrate and the glue coating is particularly obvious, the subsequent process yield is reduced, even the normal operation cannot be carried out, and the product quality is seriously affected.
The matters in the background section are only those known to the inventors and do not, of course, represent prior art in the field.
Disclosure of Invention
Aiming at one or more defects in the prior art, the invention provides an imprinting substrate which is used for preparing a diffraction optical element or a micro lens array, can effectively resist the shrinkage stress generated in the glue curing process, prevent the substrate from warping or deforming, and improve the qualification rate of products. The invention also provides an imprinting method for matching with the imprinting substrate.
In order to solve the technical problems, the invention adopts the following technical scheme:
an imprint substrate for being fixed to a stage of an imprint apparatus, the imprint substrate being an imprint substrate for preparing a diffractive optical element or a microlens array, the imprint substrate comprising:
the functional part is used for coating photo-setting or thermosetting glue, and is provided with an effective area with uniform thickness and an ineffective area surrounding the effective area, wherein the effective area is used as a bearing area of the nano-imprint pattern; and
The stabilizing part is fixedly arranged on the ineffective area of the functional part, and protrudes out of the functional part, and the gravity of the stabilizing part is used for counteracting or partially counteracting the inward shrinkage stress of the glue solidification deformation.
According to one aspect of the present invention, both sides of the functional part are flat planes, both sides can be used as an effective area for carrying the nanoimprint pattern, and the stabilizing part is disposed on one of the planes of the functional part or on both sides of the functional part.
According to one aspect of the invention, the stabilizing portion is disposed around an edge region of the functional portion, the thickness of the functional portion is not more than 0.55 mm, and the thickness of the stabilizing portion is 1-5 times the thickness of the functional portion.
According to one aspect of the invention, wherein the functional portion has a thickness of not more than 0.3 mm.
According to one aspect of the invention, wherein the functional part is made of one or more of glass, quartz, corundum, polysilicon, diamond and plastic.
According to one aspect of the invention, the functional part is a wafer glass.
According to one aspect of the invention, wherein the diameter of the functional portion is not less than 6 inches.
According to one aspect of the invention, the surface of the stabilizing part, which is far away from the functional part, is provided with one or more radial grooves for discharging the glue during embossing.
According to one aspect of the invention, the radial grooves are arc-shaped, and the arc-shaped bending direction of the grooves is consistent with the rotation direction of the spin coating process.
According to one aspect of the invention, the stabilizing section is placed towards a stage of the imprint apparatus, the stabilizing section being configured to be able to keep a face of the functional section for carrying the nanoimprint pattern parallel to the stage.
According to one aspect of the invention, wherein the functional portion and the stabilizing portion are integrally formed of the same material.
According to one aspect of the invention, there is a smooth transition region between the functional portion and the stabilizing portion.
According to one aspect of the invention, the functional part and the stabilizing part are attached and fixed by gluing.
According to one aspect of the invention, wherein the outer edge of the functional portion substantially coincides with the outer edge of the stabilizing portion.
According to an aspect of the present invention, the imprint substrate further includes a pad surrounded by the stabilizing portion, the pad being attached to the functional portion and interposed between the functional portion and the stage for supporting the functional portion.
According to one aspect of the invention, the backing plate has a through hole corresponding to a vacuum line on the stage.
The technical scheme of the invention also comprises an imprinting method, which comprises the following steps:
S101: preparing an imprinting substrate, wherein the imprinting substrate is used for preparing a diffraction optical element or a micro lens array, the imprinting substrate is provided with a functional part and a stabilizing part, the functional part is provided with an effective area with uniform thickness and an ineffective area surrounding the effective area, the effective area is used as a bearing area of a nano imprinting pattern, the stabilizing part is arranged on the ineffective area of the functional part, the stabilizing part protrudes out of the functional part, and the gravity of the stabilizing part is used for counteracting or partially counteracting the inward shrinkage stress of the glue solidification deformation;
s102: fixing one side of the imprinting substrate on an objective table of the imprinting device;
s103: coating photo-setting or thermosetting glue on the other side of the imprinting substrate;
s104: imprinting is completed on the glue by using imprinting equipment;
S105: and curing the glue.
According to one aspect of the present invention, the step S101 includes: and integrally forming the functional part and the stabilizing part.
According to one aspect of the present invention, the step S101 includes: and respectively preparing the functional part and the stabilizing part, attaching the stabilizing part to the functional part, and fixing the functional part by using adhesive.
According to one aspect of the present invention, the step S102 includes: the imprint substrate is fixed to a stage of the imprint apparatus by means of vacuum adsorption, electrostatic adsorption, or adhesive fixation.
According to one aspect of the present invention, the stabilizing portion is provided on one side of the functional portion, and the side of the functional portion having no stabilizing portion is attached to the stage.
According to one aspect of the present invention, one or more radial grooves are formed on a side of the stabilizing portion away from the functional portion, wherein the grooves are arc-shaped, and the step S103 includes: and brushing photo-setting or thermosetting glue by adopting a spin coating process, wherein the arc bending direction of the groove is consistent with the rotation direction of the spin coating process.
According to an aspect of the present invention, the stabilizing portion is disposed on one side or both sides of the functional portion, and a side of the functional portion having the stabilizing portion is fixed to the stage, and the step S102 further includes placing a pad between the functional portion and the stage, or carrying the imprint substrate using a stage having a boss matched with an effective area of the functional portion to support the functional portion.
According to an aspect of the present invention, when the imprinting substrate is fixed by vacuum suction in the step S102, the pad has a through hole corresponding to a vacuum line on the stage.
Compared with the prior art, the embodiment of the invention provides the imprinting substrate which is used for preparing the diffraction optical element or the micro lens array, and the gravity of the stabilizing part is utilized to resist the inward shrinkage stress in the glue curing process, so that the warp deformation of the substrate is avoided, the qualification rate of products is improved, and further, the condition is provided for selecting a large-size ultrathin substrate. Meanwhile, the invention also provides an imprinting method which relies on the imprinting substrate to carry out nano imprinting.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate the invention and together with the embodiments of the invention, serve to explain the invention. In the drawings:
FIG. 1 is a schematic cross-sectional view of an imprint substrate mated with an imprint apparatus with a stabilization portion facing a stage in one embodiment of the present invention;
FIG. 2 is an exploded schematic view of an embossed substrate in one embodiment of the invention;
FIG. 3 is an exploded schematic view of an embossed substrate in one embodiment of the invention;
FIG. 4 is a schematic cross-sectional view of an imprint substrate mated with an imprint apparatus with a stabilization portion facing a template in one embodiment of the present invention;
FIG. 5 is a top view of one embodiment of the present invention;
FIG. 6 is a cross-sectional view of one embodiment of the present invention;
FIG. 7 is a schematic flow diagram of an embossing process in one embodiment of the present invention;
FIG. 8 is a schematic flow diagram of an imprinting method including removal of stabilizers in one embodiment of the invention.
In the figure: 1. the substrate is stamped, 10, functional parts, 11, active areas, 12, inactive areas, 20, stabilizing parts, 21, grooves, 30, glue, 40, stage, 41, vacuum lines, 50, templates, 60, backing plates, 61, through holes.
Detailed Description
Hereinafter, only certain exemplary embodiments are briefly described. As will be recognized by those of skill in the pertinent art, the described embodiments may be modified in various different ways without departing from the spirit or scope of the present invention. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, and may be mechanically connected, electrically connected, or may communicate with each other, for example; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is less level than the second feature.
The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. In order to simplify the present disclosure, components and arrangements of specific examples are described below. They are, of course, merely examples and are not intended to limit the invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.
The preferred embodiments of the present invention will be described below with reference to the accompanying drawings, it being understood that the preferred embodiments described herein are for illustration and explanation of the present invention only, and are not intended to limit the present invention.
Fig. 1 shows a mating relationship of an embossed substrate 1 and an embossing apparatus according to an embodiment of the present invention, fig. 2 and 3 show schematic structural views of the embossed substrate 1 according to an embodiment of the present invention, and are described in detail below with reference to fig. 1,2 and 3.
As shown in fig. 1, the imprint substrate 1 in the present embodiment is used for preparing a diffractive optical element or a microlens array, and the imprint substrate 1 includes a functional portion 10 and a stabilizing portion 20, wherein the functional portion 10 is used for coating a photo-setting or thermosetting glue 30. As shown in fig. 2 and 3, the functional part 10 has an effective region 11 having a uniform thickness and an ineffective region 12 surrounding the effective region 11, wherein the effective region 11 serves as a bearing region of the nanoimprint pattern, i.e., a region coated with the glue 30. The effective area 11 in fig. 2 and 3 is the middle area of the functional portion 10, but the effective area 11 may be distributed in other positions of the functional portion 10 according to different design requirements. The ineffective area 12 is distributed around the effective area 11, the ineffective area 12 does not need to be coated with glue 30, and is not used as a working area of a nano-imprinting finished product, a connection basis can be provided for matching the functional part 10 with other structures or devices, for example, an optical element is prepared by using a nano-imprinting technology, the ineffective area 12 can be used for matching with a mounting structure, and light only passes through the effective area 11 in normal operation.
The stabilizing portion 20 is fixedly disposed on the inactive area 12 of the functional portion 10, and the stabilizing portion 20 protrudes from the functional portion 10, for example, the functional portion 10 is a thin sheet with uniform thickness, and the stabilizing portion 20 is disposed opposite to one side of the functional portion 10 coated with the glue 30, so that the one side of the functional portion 10 coated with the glue 30 is a flat plane, and the other side is a plane as shown in fig. 1, and the stabilizing portion 20 protrudes from the plane of the functional portion 10 at the position of the inactive area 12. The weight of the stabilizing portion 20 is used to counteract or partially counteract the shrinkage stress of the curing deformation of the glue 30. After imprinting is finished, the glue can shrink inwards in the curing process, and as the glue is adhered and fixed with the substrate, the substrate can tilt upwards and deform along with the shrinkage of the glue, and even the substrate made of a material with higher hardness can be broken. In this embodiment, the stabilizing portion 20 is thickened at the position of the ineffective area 12 of the functional portion 10, so that the gravity of the stabilizing portion 20 can be used to resist the upward warping of the functional portion 10, so that the overall flatness of the functional portion 10 after imprinting is completed meets the requirement of subsequent processing. Meanwhile, the stable part 20 arranged in the ineffective area 12 does not affect the usability of the effective area 11, and the stable part 20 can be removed by other technical means after the curing of the glue 30 is completed. Further, according to a preferred embodiment of the present invention, the functional part 10 and the stabilizing part 20 may be made of the same material, so as to facilitate processing and maintain the same thermal expansion coefficient.
According to a preferred embodiment of the present invention, both sides of the functional part 10 are flat planes, and both sides can be used as the effective areas 11 carrying the embossed patterns, and the stabilizing parts 20 are provided on one of the planes of the functional part 10 or on both sides of the functional part 10. For example, the stabilizing section 20 may be disposed on the same side of the functional section 10 as the active region 11 as shown in fig. 2, or the stabilizing section 20 may be disposed on the other side of the functional section 10 coated with glue 30 as shown in fig. 3, although the stabilizing section 20 may be disposed on both sides of the functional section 10.
The inventors found that, in actual production, the thinner the thickness of the functional part 10, the greater the warp deformation generated after the glue 30 is cured, and the position where the deformation is most serious is mainly located at the edge of the functional part 10. According to a preferred embodiment of the present invention, in which the stabilizing portion 20 is disposed around the edge region of the functional portion 10, the thickness of the functional portion 10 is not more than 0.55 mm, the thickness of the stabilizing portion 20 is 1-5 times the thickness of the functional portion 10, and in the case where the material of the functional portion 10 is determined, the thinner the thickness of the functional portion 10 is, the less the structural strength thereof is enough to resist the shrinkage stress during curing of the glue 30, in order to ensure that the gravity of the stabilizing portion 20 can balance the shrinkage stress of the curing of the glue 30, in a preferred embodiment of the present invention, the thickness of the stabilizing portion 20 is not less than the thickness of the functional portion 10, and at the same time, the thickness of the stabilizing portion 20 is not more than 5 times the thickness of the functional portion 10 in order to avoid processing difficulties and material waste. Further, the thickness of the functional part 10 is not more than 0.3 mm.
One or more of glass, quartz, corundum, polysilicon, diamond, and plastic are selected as materials for manufacturing the functional part 10 in some embodiments of the present invention, such as quartz glass, a modified PET (polyethylene terephthalate) film, a polyimide film, a polycarbonate film, a diamond film-coated glass, sapphire, a polysilicon wafer, and the like. The specific choice of materials for the functional part 10 can be adjusted according to the requirements of use, and the deformation of the functional part 10 when the glue 30 is cured is also related to the characteristics of the materials of the functional part 10. According to a preferred embodiment of the present invention, the functional part 10 may be selected from wafer glass, which is a thin piece processed into a round shape, and is made of quartz, polysilicon or high boron silicon, which has good flatness and optical properties. The inventors have also found that the larger the size of the wafer glass, the more pronounced the edge deformation thereof during curing of the glue 30, and that the yield of the stamped finished product is severely reduced when the diameter of the wafer glass is not less than 6 inches, and the subsequent production process and product quality cannot be ensured.
The inventors found through comparative tests that the imprint substrate 1 provided with the stabilizer 20 has a significantly reduced degree of warpage as compared with the conventional substrate.
Under the condition that the used glues are the same, baking and curing are carried out for 100 minutes in an environment of 100 ℃ after imprinting is finished, and the inventors obtain the following table after measuring the maximum value of the warping degree:
The warp degree in the above table is tested by the thickness gauge, the conventional substrate is used in both comparative example 1 and comparative example 2, the stabilizing part is not arranged, the functional parts 10 of examples 1-4 are tested by selecting different materials and different size thicknesses, the stabilizing part 20 is arranged at the edge position of the functional part 10, the warp degree of the substrate can be greatly reduced by the stabilizing part 20 according to the above table, the requirement of the subsequent production process is completely met, and the qualification rate of products is improved.
As shown in fig. 5, the surface of the stabilizing portion 20 remote from the functional portion 10 is provided with one or more radial grooves 21 for discharging glue during embossing. When the stabilizing portion 20 is disposed on one side of the functional portion 10 coated with the glue 30, as shown in fig. 4, during the embossing process, due to the extrusion of the mold 50 and the redundancy during the coating of the glue 30, part of the glue overflows outwards, so as to prevent the stabilizing portion 20 from limiting the redundant glue in the effective area 11 of the functional portion 10, thereby causing pollution to the effective area 11, in this embodiment, radial grooves 21 are formed on the stabilizing portion 20, the redundant glue is discharged by the grooves 21, so as to avoid accumulation and retention of the redundant glue in the effective area 11, and the grooves 21 can be made by laser or chemical etching process according to the material of the stabilizing portion 20. Further, as shown in fig. 5, according to a preferred embodiment of the present invention, the radial grooves 21 in the stabilizer 20 are arc-shaped, and the arc-shaped bending direction of the grooves 21 coincides with the rotation direction of the spin coating process. The application of glue on the active area 11 of the functional portion 10 generally adopts a spin coating process, and in order to prevent insufficient use of glue and incomplete impression, a certain amount of redundancy needs to be provided, and in order to facilitate the discharge of glue, the grooves 21 of the stabilizing portion 20 are provided in an arc shape consistent with the rotation direction of the spin coating process in this embodiment.
In nanoimprinting using the imprinting substrate 1, it is necessary to secure the imprinting substrate 1 to the stage 40 of the imprinting apparatus, and the conventional imprinting substrate has a flat shape and can be directly secured to the stage, and the imprinting substrate 1 in this embodiment includes the stabilizer 20. To ensure imprint quality, when the stabilizing portion 20 faces the stage 40, or both sides of the functional portion 10 are provided with the stabilizing portion 20, as shown in fig. 1, the stabilizing portion 20 is configured to be able to keep the side of the functional portion 10 for carrying the nanoimprint pattern parallel to the stage 40. For example, the thickness of the stabilizing portion 20 is uniform at different positions, or the stabilizing portion 20 has a plurality of support points on the same plane, and the plane is parallel to the plane of the effective area 11 in the functional portion 10, so as to ensure that when the stabilizing portion 20 directly contacts the stage 40, the plane of the stage 40 is parallel to the plane of the effective area 11 in the functional portion 10, so that the template 50 can be uniformly pressed on the glue 30.
According to a preferred embodiment of the present invention, as shown in fig. 6, in which the functional part 10 and the stabilizing part 20 may be integrally formed of the same material, for example, the functional part 10 and the stabilizing part 20 are made of glass, the shape shown in fig. 6 is obtained by combining a float process with a casting method, the functional part 10 and the stabilizing part 20 may be obtained by a CMP process (chemical mechanical polishing process), and mechanical friction is performed after chemical etching to obtain the shape shown in fig. 6, and the use requirements of the functional part 10 and the stabilizing part 20 are satisfied. For example, the functional portion 10 is a wafer glass having a diameter of 8 inches, and the stabilizing portion 20 is provided at an edge position of the functional portion 10, and may be an annular region having a width of 10 to 15 mm, and a middle position of the annular region corresponds to the effective region 11 of the functional portion 10. Further, according to a preferred embodiment of the present invention, a smooth transition region is further provided between the functional part 10 and the stabilizing part 20, as shown in fig. 6, for the convenience of processing and preventing damage to the template 50 or the imprint substrate 1 when the template 50 is misaligned.
In addition to the method of integral molding provided in the foregoing embodiment, according to a preferred embodiment of the present invention, the functional portion 10 and the stabilizing portion 20 may be manufactured separately, and the functional portion 10 and the stabilizing portion 20 may be attached and adhesively fixed, in which case the materials of the functional portion 10 and the stabilizing portion 20 may be the same or different, as shown in fig. 2, the functional portion 10 is a wafer glass having a diameter of 8 inches, the stabilizing portion 20 is a ring-shaped structure, the width of the ring may be 18-30 mm, the outer diameter is 8 inches, the space in the middle of the stabilizing portion 20 is left free from the effective area 11 of the functional portion 10, and the side attaching edges of the functional portion 10 and the stabilizing portion 20 are aligned and attached together using adhesive. After testing, the inventor finds that the functional part 10 and the stabilizing part 20 do not need to be completely aligned at the edges, the deviation is controlled to be 0.2-1 mm, the service performance of the product is not affected, and the outer edges of the functional part and the stabilizing part are basically coincident. According to a preferred embodiment of the present invention, a releasable adhesive may be used for the functional part 10 and the stabilizing part 20, such as a UV (ultraviolet) releasable adhesive, in order to achieve separation of the functional part 10 and the stabilizing part 20 after curing of the embossed pattern on the glue 30 is completed. According to a preferred embodiment of the present invention, the stabilizing portion 20 may be cut from the same diameter wafer glass as the functional portion 10 to simplify the manufacturing process and reduce the manufacturing cost.
As shown in fig. 1, according to a preferred embodiment of the present invention, the imprint substrate 1 further includes a pad 60 surrounded by the stabilizing portion 20, the pad 60 being attached to the functional portion 10 and being placed between the functional portion 10 and the stage 40 for supporting the functional portion 10. In the nanoimprint process, the template 50 presses the glue 30 coated on the effective area 11 of the functional part 10, when the stabilizing part 20 faces the objective table 40, or both sides of the functional part 10 are provided with the stabilizing part 20, the back side of the functional part 10 coated with the glue 30 is not in plane contact with the objective table 40 due to the existence of the stabilizing part 20, that is, cannot be effectively supported, in order to prevent the functional part 10 from being deformed or damaged under the pressing action of the template 50, in this embodiment, a cushion plate 60 is provided between the functional part 10 and the objective table 40, the thickness of the cushion plate 60 is similar to the thickness of the stabilizing part 20, and the size and shape of the cushion plate 60 are similar to the size and shape of the gap in the stabilizing part 20. According to a preferred embodiment of the present invention, the stage 40 fixes the imprint substrate 1 by vacuum suction, a plurality of vacuum lines 41 are provided on the stage 40 for forming a negative pressure environment between the imprint substrate 1 and the stage 40, and in order to secure the position fixing of the imprint substrate 1, when a pad 60 is provided between the functional part 10 and the stage 40, through holes 61 are provided on the pad 60, and the positions of the through holes 61 correspond to the positions of the vacuum lines 41 on the stage 40.
Fig. 7 shows an imprint method 100 according to an embodiment of the present invention, an imprint process is completed with an imprint apparatus, the imprint method 100 comprising:
in step S101, an imprint substrate is prepared. The imprinting substrate is used for preparing the diffraction optical element or the micro lens array, and is provided with a functional part and a stabilizing part, wherein the functional part is provided with an effective area with uniform thickness and an ineffective area surrounding the effective area. The effective area is used as a bearing area of the nano-imprint pattern, for example, the effective area is arranged on a round area at the central position of the functional part, the stabilizing part is arranged on an ineffective area of the functional part, for example, the effective area is positioned at the edge position of the functional part, the stabilizing part protrudes out of the functional part, and the gravity of the stabilizing part is used for counteracting or partially counteracting the inward shrinkage stress of the glue solidification deformation.
The stabilizing portion does not act as a working area for the product after imprinting is completed, for example in a diffractive optical element or a microlens array, light passes through only the functional portion, and the optical properties of the stabilizing portion do not affect the function and effect of the product. The stabilizing portion and the functional portion may be integrally formed of the same material, for example, quartz glass may be manufactured by a float process in a pre-designed mold. The stabilizing part and the functional part can be manufactured respectively, the stabilizing part and the functional part are correspondingly attached together after the manufacturing is finished, and are fixed by using adhesive, for example, the functional part and the stabilizing part are glued by using UV dissociating adhesive, 1-3 drops of UV dissociating adhesive are only required to be evenly dripped on the central line of the stabilizing part, then the stabilizing part and the functional part are attached in an alignment mode, and the stabilizing part and the functional part are heated and cured, wherein the curing temperature is 80 ℃, and the curing time is 10 minutes.
In step S102, one side of the imprint substrate is fixed to a stage of an imprint apparatus. In order to prevent the imprinting pattern from deviating from the design position, the imprinting substrate needs to be fixedly connected with the objective table, and furthermore, the position of the effective area can be corresponding to the template position of the imprinting device under the cooperation of the positioning mark or the positioning structure. The fixing mode of the objective table and the imprinting substrate can be vacuum adsorption, electrostatic adsorption or adhesive fixing, wherein the vacuum adsorption is to form a negative pressure area between the objective table and the imprinting substrate, the imprinting substrate is fixed at a specific position of the objective table by utilizing atmospheric pressure, and a vacuum line for forming negative pressure is arranged on the objective table. Electrostatic adsorption is to fix the imprinting substrate on the stage by utilizing the characteristic of mutual attraction of opposite charges, and adhesive fixation is to adsorb the imprinting substrate and the stage together by using dissociable glue.
When the stabilizing part is arranged on one side of the functional part, one side of the functional part without the stabilizing part can be adsorbed on the objective table, and the functional part has uniform thickness and a flat plane and can be directly adsorbed by adopting the adsorption mode. When the stabilizing portion faces the objective table, or the stabilizing portion is disposed on both sides of the functional portion, a cavity exists between the functional portion and the plane of the objective table, and meanwhile, since the thickness of the functional portion is thinner, the structural strength thereof is limited, in order to prevent the functional portion from being damaged by compression, in this case, a backing plate can be disposed between the functional portion and the objective table, and an objective table having a boss matched with the effective area of the functional portion can be selected to carry the embossed substrate, and the functional portion is supported by the boss of the outer objective table. Under the condition of setting the backing plate, when adopting vacuum adsorption's mode to fix the impression substrate, in order to guarantee to form effectual adsorption affinity between objective table and the impression substrate, offered the through-hole on the backing plate to the position of through-hole corresponds with the position of vacuum line on the objective table, makes the backing plate can enough provide the support for functional part, can not hinder the vacuum line to form the negative pressure between functional part and objective table again.
In step S103, a photo-setting or thermosetting glue is applied on the other side of the imprint substrate. When the nano imprinting technology is adopted to manufacture the diffraction optical element or the micro lens array, photo-setting or thermosetting glue is used as a carrier for bearing the imprinted pattern, and higher requirements on optical performance are met, such as refractive index of the glue material and thickness of the glue layer. In order to ensure that the thickness of the glue layer is uniform, a spin coating process can be used for coating the glue on the effective area of the functional part, for example, the rotating speed is set to be 500-5000 r/min, and the glue is spin-coated for two times. Meanwhile, in order to prevent the glue layer from covering the design area completely, redundancy is generally set when the glue is coated in a spin mode, when the stabilizing portion is arranged on one surface of the functional portion, which is provided with the effective area, the stabilizing portion surrounds the effective area, if the redundant glue cannot be discharged, the redundant glue may pollute the stamping pattern in the curing process, so that the product cannot meet the design requirement. Further, the grooves of the stabilizing portions are all disposed toward the same arc shape, and the bending direction of the arc shape coincides with the rotation direction of the spin coating process.
In step S104, embossing is completed on the glue using an embossing device. The imprinting equipment is fixedly provided with a template above the objective table, and after the imprinting substrate is fixed on the objective table, the effective area coated with glue corresponds to the template. The template is pressed on the uncured glue under the driving of the imprinting equipment, the design graph on the template is reversely imprinted on the glue, and the product with the design optical performance can be formed on the imprinting substrate after the glue is cured.
In step S105, the glue is cured. According to the performance and design requirements of the glue, a proper environment and time are selected to cure the glue, for example, the glue is baked for 100 minutes in a clean oven set at 100 ℃. After the glue is solidified, the element meeting the design requirement is obtained, and after the test is qualified, the subsequent processing or sorting and packaging can be performed.
Fig. 8 shows an embossing method 200 according to a further embodiment of the present invention, wherein steps S201, S202, S203, S204 and S205 are substantially the same as steps S101, S102, S103, S104 and S105, and after curing of the glue is completed, step S206 may be provided to facilitate processing, remove the stabilizing portion, which is not flat due to protruding the stabilizing portion from the surface of the functional portion, and which cannot be directly used in part of the equipment mechanism or in subsequent processing, and thus requires removal of the stabilizing portion. According to the foregoing embodiment, the functional portion and the stabilizing portion may be integrally formed of the same material, in which case the stabilizing portion may be removed by laser cutting, and when the stabilizing portion is located on the side of the functional portion coated with glue, in order to prevent damage to the glue layer bearing the embossed pattern, the pre-cutting film may be first coated by using a vacuum laminator, and then laser cutting may be performed, and when the stabilizing portion is located on the side of the functional portion coated with glue, laser cutting may be directly performed. Since the effective area is not provided with the stabilizing part, the laser cutting does not interfere with the optical performance of the functional part and does not influence the effect of the product. The functional part and the stabilizing part can be respectively stuck and fixed after being prepared, the UV dissociating adhesive can be selected for conveniently removing the stabilizing part, the UV dissociating adhesive can be rapidly removed after the glue is solidified, the stabilizing part is taken down, and the service performance of the functional part is not affected. And after the stabilizing part is removed, the subsequent process or sorting and packaging can be performed.
Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present invention, and the present invention is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present invention has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (24)
1. An imprinting substrate for being fixed on a stage of an imprinting apparatus,
The imprint substrate is an imprint substrate for preparing a diffractive optical element or a microlens array,
The imprint substrate includes:
the functional part is used for coating photo-curing glue or thermosetting glue, the functional part is provided with an effective area with uniform thickness and an ineffective area surrounding the effective area, the photo-curing glue or the thermosetting glue is coated on the effective area, the effective area is used as a bearing area of a nano-imprinting pattern, and the nano-imprinting pattern is obtained after the photo-curing glue or the thermosetting glue is imprinted and cured; and
The stabilizing part is fixedly arranged on the invalid area of the functional part, and protrudes out of the functional part, and the gravity of the stabilizing part is used for counteracting or partially counteracting the inward shrinkage stress generated by inward shrinkage in the curing process of the photo-curing glue or the thermosetting glue; the thickness of the stabilizing part is not smaller than the thickness of the functional part.
2. The embossed substrate of claim 1, wherein both sides of the functional part are flat planes, both sides can be used as effective areas for carrying nanoimprint patterns, and the stabilizing part is disposed on one of the planes of the functional part or both sides of the functional part.
3. The imprint substrate of claim 1, wherein the stabilizing portion is disposed around an edge region of the functional portion, a thickness of the functional portion is not more than 0.55 mm, and a thickness of the stabilizing portion is 1-5 times a thickness of the functional portion.
4. The imprint substrate of claim 3 wherein the functional portion has a thickness of no more than 0.3 millimeters.
5. The imprint substrate of claim 1 wherein the functional portion is made of one or more of glass, quartz, corundum, polysilicon, diamond, and plastic.
6. The imprint substrate of claim 5 wherein the functional portion is wafer glass.
7. The imprint substrate of claim 6 wherein the functional portion has a diameter of not less than 6 inches.
8. An embossed substrate according to claim 3 or 4, wherein the surface of the stabilizing portion remote from the functional portion is provided with one or more radial grooves for expelling glue during embossing.
9. The imprint substrate of claim 8 wherein the radial trench is arcuate, the arcuate curvature of the trench being in a direction that coincides with the direction of rotation of the spin-on process.
10. The imprint substrate of claim 1, wherein the stabilizing portion is placed toward a stage of an imprint apparatus, the stabilizing portion being configured to be able to keep a face of the functional portion for carrying a nanoimprint pattern parallel to the stage.
11. The imprint substrate of any one of claims 1-7, wherein the functional portion and the stabilizing portion are integrally formed from the same material.
12. The imprint substrate of claim 11 wherein the functional portion and the stabilizing portion have a smooth transition region therebetween.
13. The imprint substrate of any one of claims 1-7, wherein the functional portion and the stabilizing portion are attached and fixed by adhesive.
14. The imprint substrate of claim 13, wherein an outer edge of the functional portion substantially coincides with an outer edge of the stabilizing portion.
15. The imprint substrate according to claim 3 or 4, further comprising a pad surrounded by the stabilizing portion, the pad being fitted to the functional portion and interposed between the functional portion and the stage for supporting the functional portion.
16. The imprint substrate of claim 15, the pad having a through hole corresponding to a vacuum line on the stage.
17. An embossing method, comprising:
S101: preparing an imprinting substrate, wherein the imprinting substrate is used for preparing a diffraction optical element or a micro lens array, the imprinting substrate is provided with a functional part and a stabilizing part, the functional part is provided with an effective area with uniform thickness and an ineffective area surrounding the effective area, the effective area is used as a bearing area of a nano imprinting pattern, the stabilizing part is arranged on the ineffective area of the functional part, and the stabilizing part protrudes out of the functional part;
s102: fixing one side of the imprinting substrate on an objective table of the imprinting device;
s103: coating photo-curing glue or thermosetting glue on the other side of the imprinting substrate;
s104: imprinting is completed on the glue by using imprinting equipment;
s105: curing the glue;
The light-cured glue or the heat-cured glue is coated on the effective area, the nano-imprint pattern is obtained after the light-cured glue or the heat-cured glue is imprinted and cured, and the gravity of the stabilizing part is used for counteracting or partially counteracting the inward shrinkage stress generated by inward shrinkage in the curing process of the light-cured glue or the heat-cured glue.
18. The imprint method of claim 17, wherein the S101 includes: and integrally forming the functional part and the stabilizing part.
19. The imprint method of claim 17, wherein the S101 includes: and respectively preparing the functional part and the stabilizing part, attaching the stabilizing part to the functional part, and fixing the functional part by using adhesive.
20. The imprint method of any one of claims 17-19, wherein the S102 includes: the imprint substrate is fixed to a stage of the imprint apparatus by means of vacuum adsorption, electrostatic adsorption, or adhesive fixation.
21. The imprint method of claim 20, wherein the stabilizing portion is provided on a side of the functional portion, and a side of the functional portion having no stabilizing portion is adsorbed on the stage.
22. The imprint method of claim 21, wherein a side of the stabilizing portion remote from the functional portion is provided with one or more radial grooves, wherein the grooves are arc-shaped, and S103 includes: and brushing photo-curing glue or thermosetting glue by adopting a spin coating process, wherein the arc bending direction of the groove is consistent with the rotation direction of the spin coating process.
23. The imprint method of claim 20, wherein the stabilizing portion is provided on one side or both sides of the functional portion, a side of the functional portion having the stabilizing portion is fixed to the stage, and the step S102 further comprises placing a pad between the functional portion and the stage, or carrying the imprint substrate using a stage having a boss matched with an effective area of the functional portion to support the functional portion.
24. The imprint method of claim 23, wherein the pad has a through hole corresponding to a vacuum line on the stage when the imprint substrate is fixed by vacuum suction in the S102.
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| CN216647081U (en) * | 2021-11-18 | 2022-05-31 | 北京驭光科技发展有限公司 | Imprint substrate |
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| JP5664471B2 (en) * | 2010-06-28 | 2015-02-04 | 信越化学工業株式会社 | Method for producing synthetic quartz glass substrate for semiconductor |
| CN102591143B (en) * | 2012-02-29 | 2014-04-16 | 青岛理工大学 | Large-area nano-imprint lithography device and method |
| JP6647027B2 (en) * | 2015-12-03 | 2020-02-14 | キヤノン株式会社 | Imprint apparatus and article manufacturing method |
| TWI672212B (en) * | 2016-08-25 | 2019-09-21 | 國立成功大學 | Nano imprinting assembly and imprinting method thereof |
| CN117806119B (en) * | 2016-12-02 | 2025-05-27 | 分子印记公司 | Configuring optical layers in imprint lithography processes |
| JP7336373B2 (en) * | 2019-12-10 | 2023-08-31 | キヤノン株式会社 | Method for manufacturing mold, mold, imprint method, imprint apparatus, and method for manufacturing article |
| CN113126188A (en) * | 2021-04-26 | 2021-07-16 | 中国科学院长春光学精密机械与物理研究所 | Curved fly-eye lens and preparation method thereof |
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| CN111308858A (en) * | 2020-04-09 | 2020-06-19 | 华天慧创科技（西安）有限公司 | Interface disc for preventing photoresist overflow |
| CN216647081U (en) * | 2021-11-18 | 2022-05-31 | 北京驭光科技发展有限公司 | Imprint substrate |
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