CN113977441A - Double-sided polishing machine capable of automatically compressing and used for processing electronic element - Google Patents
Double-sided polishing machine capable of automatically compressing and used for processing electronic element Download PDFInfo
- Publication number
- CN113977441A CN113977441A CN202111349760.XA CN202111349760A CN113977441A CN 113977441 A CN113977441 A CN 113977441A CN 202111349760 A CN202111349760 A CN 202111349760A CN 113977441 A CN113977441 A CN 113977441A
- Authority
- CN
- China
- Prior art keywords
- polishing machine
- fixedly connected
- machine body
- rotating shaft
- rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0046—Column grinding machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
- B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
本发明公开了一种可自动压紧的电子元件加工用双面抛光机,其技术方案是:包括抛光机本体,所述抛光机本体内部设有抛光机本体构和控制机构,所述抛光机本体顶部固定设有电机,所述抛光机本体构包括第一伸缩杆,所述第一伸缩杆固定连接在电机输出端,所述抛光机本体顶部开设有第一空腔,所述第一伸缩杆底端贯穿第一空腔并延伸至抛光机本体内部,所述第一伸缩杆底端固定连接有抛光头,所述抛光机本体一侧固定连接有传动盒,所述传动盒内部嵌设有第一转轴,本发明的有益效果是:本发明提高了对电子元件抛光的效率,同时也防止抛光头对使用者手指造成伤害,通过夹板对电子元件进行夹持,使得对电子元件固定的效果更好。
The invention discloses a double-sided polishing machine for processing electronic components that can be automatically compressed. A motor is fixed on the top of the body, the polishing machine body structure includes a first telescopic rod, the first telescopic rod is fixedly connected to the output end of the motor, a first cavity is opened on the top of the polishing machine body, and the first telescopic rod is The bottom end of the rod penetrates the first cavity and extends into the interior of the polishing machine body, the bottom end of the first telescopic rod is fixedly connected with a polishing head, and one side of the polishing machine body is fixedly connected with a transmission box, which is embedded in the transmission box. There is a first rotating shaft, the beneficial effects of the present invention are: the present invention improves the polishing efficiency of electronic components, and also prevents the polishing head from causing damage to the user's fingers, and clamps the electronic components through the splint, so that the electronic components are fixed. Better results.
Description
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111349760.XA CN113977441B (en) | 2021-11-15 | 2021-11-15 | Double-sided polishing machine capable of automatically compressing and used for processing electronic element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111349760.XA CN113977441B (en) | 2021-11-15 | 2021-11-15 | Double-sided polishing machine capable of automatically compressing and used for processing electronic element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113977441A true CN113977441A (en) | 2022-01-28 |
| CN113977441B CN113977441B (en) | 2022-08-23 |
Family
ID=79748598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111349760.XA Active CN113977441B (en) | 2021-11-15 | 2021-11-15 | Double-sided polishing machine capable of automatically compressing and used for processing electronic element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113977441B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114675375A (en) * | 2022-04-07 | 2022-06-28 | 江西明鸿光电科技有限公司 | Packaging structure of PLC planar waveguide type optical splitter and splitter |
| CN114800139A (en) * | 2022-04-14 | 2022-07-29 | 九江金鹰科技有限公司 | Billiard ball edge grinding machine with cooling device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0752035A (en) * | 1993-03-17 | 1995-02-28 | Ryobi Motor Prod Corp | Vibration spindle polishing machine |
| CN212601114U (en) * | 2020-06-24 | 2021-02-26 | 安徽华昕铸业有限公司 | A casting polishing device |
| CN213795879U (en) * | 2020-08-31 | 2021-07-27 | 泉州市永春龙翔工艺品有限公司 | Burnishing device of processing that pottery teabowl was used |
| CN214445458U (en) * | 2020-12-17 | 2021-10-22 | 通达艺(辽宁)数控机电设备有限公司 | Surface polishing equipment for vertical machining center |
| CN214559899U (en) * | 2020-11-02 | 2021-11-02 | 苏州译品芯半导体有限公司 | Tangent plane burnishing device is used in wafer processing |
-
2021
- 2021-11-15 CN CN202111349760.XA patent/CN113977441B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0752035A (en) * | 1993-03-17 | 1995-02-28 | Ryobi Motor Prod Corp | Vibration spindle polishing machine |
| CN212601114U (en) * | 2020-06-24 | 2021-02-26 | 安徽华昕铸业有限公司 | A casting polishing device |
| CN213795879U (en) * | 2020-08-31 | 2021-07-27 | 泉州市永春龙翔工艺品有限公司 | Burnishing device of processing that pottery teabowl was used |
| CN214559899U (en) * | 2020-11-02 | 2021-11-02 | 苏州译品芯半导体有限公司 | Tangent plane burnishing device is used in wafer processing |
| CN214445458U (en) * | 2020-12-17 | 2021-10-22 | 通达艺(辽宁)数控机电设备有限公司 | Surface polishing equipment for vertical machining center |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114675375A (en) * | 2022-04-07 | 2022-06-28 | 江西明鸿光电科技有限公司 | Packaging structure of PLC planar waveguide type optical splitter and splitter |
| CN114675375B (en) * | 2022-04-07 | 2023-04-07 | 江西明鸿光电科技有限公司 | Packaging structure of PLC planar waveguide type optical splitter and splitter |
| CN114800139A (en) * | 2022-04-14 | 2022-07-29 | 九江金鹰科技有限公司 | Billiard ball edge grinding machine with cooling device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113977441B (en) | 2022-08-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A double-sided polishing machine for electronic component processing that can automatically compress Effective date of registration: 20230703 Granted publication date: 20220823 Pledgee: Lushan Sub branch of Postal Savings Bank of China Co.,Ltd. Pledgor: JIUJIANG JANNY NEW MATERIAL Co.,Ltd. Registration number: Y2023980047207 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20220823 Pledgee: Lushan Sub branch of Postal Savings Bank of China Co.,Ltd. Pledgor: JIUJIANG JANNY NEW MATERIAL Co.,Ltd. Registration number: Y2023980047207 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A double-sided polishing machine for electronic component processing that can automatically compress Granted publication date: 20220823 Pledgee: Bank of China Limited Jiujiang Branch Pledgor: JIUJIANG JANNY NEW MATERIAL Co.,Ltd. Registration number: Y2025980044506 |
