CN113905558A - 一种有利于散热的线路板保护壳 - Google Patents
一种有利于散热的线路板保护壳 Download PDFInfo
- Publication number
- CN113905558A CN113905558A CN202111152276.8A CN202111152276A CN113905558A CN 113905558 A CN113905558 A CN 113905558A CN 202111152276 A CN202111152276 A CN 202111152276A CN 113905558 A CN113905558 A CN 113905558A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- block
- groove
- rod
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000001681 protective effect Effects 0.000 title claims abstract description 48
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 35
- 230000009286 beneficial effect Effects 0.000 title claims abstract description 15
- 230000007246 mechanism Effects 0.000 claims abstract description 8
- 238000009423 ventilation Methods 0.000 claims abstract description 8
- 230000002349 favourable effect Effects 0.000 description 11
- 238000001816 cooling Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000011960 computer-aided design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0213—Venting apertures; Constructional details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
- H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20127—Natural convection
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111152276.8A CN113905558B (zh) | 2021-09-29 | 2021-09-29 | 一种有利于散热的线路板保护壳 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202111152276.8A CN113905558B (zh) | 2021-09-29 | 2021-09-29 | 一种有利于散热的线路板保护壳 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN113905558A true CN113905558A (zh) | 2022-01-07 |
CN113905558B CN113905558B (zh) | 2023-07-07 |
Family
ID=79189238
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202111152276.8A Active CN113905558B (zh) | 2021-09-29 | 2021-09-29 | 一种有利于散热的线路板保护壳 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN113905558B (zh) |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2439163Y (zh) * | 2000-08-23 | 2001-07-11 | 王世荣 | 电路板固持装置 |
US20060092616A1 (en) * | 2004-10-29 | 2006-05-04 | Yi George Y | Methods and apparatus for holding circuit boards together |
CN209002286U (zh) * | 2018-09-06 | 2019-06-18 | 无锡市辉英电力电子有限公司 | 一种电子电路控制板支架 |
CN210781519U (zh) * | 2019-11-22 | 2020-06-16 | 深圳市洲旭电路科技有限公司 | 一种稳定的印刷线路板组件 |
CN211481618U (zh) * | 2020-03-20 | 2020-09-11 | 昆山威尔欣光电科技有限公司 | 一种pcb生产中的小尺寸板框架治具 |
CN213906151U (zh) * | 2020-11-23 | 2021-08-06 | 广西电网有限责任公司 | 一种无人机输电线路用固定装置 |
CN213960565U (zh) * | 2020-11-19 | 2021-08-13 | 信丰精钻科技有限公司 | 一种适应性强的线路板插板架 |
CN113316344A (zh) * | 2021-07-28 | 2021-08-27 | 深圳市宏泰欣电子技术有限公司 | 一种拆卸方便的防触电线路板装置 |
-
2021
- 2021-09-29 CN CN202111152276.8A patent/CN113905558B/zh active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2439163Y (zh) * | 2000-08-23 | 2001-07-11 | 王世荣 | 电路板固持装置 |
US20060092616A1 (en) * | 2004-10-29 | 2006-05-04 | Yi George Y | Methods and apparatus for holding circuit boards together |
CN209002286U (zh) * | 2018-09-06 | 2019-06-18 | 无锡市辉英电力电子有限公司 | 一种电子电路控制板支架 |
CN210781519U (zh) * | 2019-11-22 | 2020-06-16 | 深圳市洲旭电路科技有限公司 | 一种稳定的印刷线路板组件 |
CN211481618U (zh) * | 2020-03-20 | 2020-09-11 | 昆山威尔欣光电科技有限公司 | 一种pcb生产中的小尺寸板框架治具 |
CN213960565U (zh) * | 2020-11-19 | 2021-08-13 | 信丰精钻科技有限公司 | 一种适应性强的线路板插板架 |
CN213906151U (zh) * | 2020-11-23 | 2021-08-06 | 广西电网有限责任公司 | 一种无人机输电线路用固定装置 |
CN113316344A (zh) * | 2021-07-28 | 2021-08-27 | 深圳市宏泰欣电子技术有限公司 | 一种拆卸方便的防触电线路板装置 |
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Publication number | Publication date |
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CN113905558B (zh) | 2023-07-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20230616 Address after: 215324 building a, No. 99, Jincan Road, Jinxi Town, Kunshan City, Suzhou City, Jiangsu Province Applicant after: KUNSHAN SHEMAO ELECTRONIC TECHNOLOGY Co.,Ltd. Address before: Guangdong Institute of science and technology, 99 Xihu Road, Nancheng District, Dongguan City, Guangdong Province, 523000 Applicant before: Zhang Qingtao |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A circuit board protective shell that is beneficial for heat dissipation Effective date of registration: 20231030 Granted publication date: 20230707 Pledgee: Bank of Jiangsu Co.,Ltd. Suzhou Branch Pledgor: KUNSHAN SHEMAO ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2023980063153 |