CN113873828A - Compensation type embedded heat dissipation device - Google Patents
Compensation type embedded heat dissipation device Download PDFInfo
- Publication number
- CN113873828A CN113873828A CN202111040206.3A CN202111040206A CN113873828A CN 113873828 A CN113873828 A CN 113873828A CN 202111040206 A CN202111040206 A CN 202111040206A CN 113873828 A CN113873828 A CN 113873828A
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- Prior art keywords
- heat
- heat dissipation
- copper sheet
- die chip
- embedded
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a compensation type embedded heat dissipation device, which comprises: the heat dissipation structure comprises a heat dissipation copper sheet, a heat dissipation structural member with a pillar, the pillar and a heat conduction pipe; the table column is arranged on one side of the heat dissipation structural part with the table column, a groove is formed in the middle of the table column, and the heat dissipation copper sheet is installed in the groove; the heat-conducting pipe is embedded in the heat-radiating structural part, and the heat-radiating copper sheet is connected with the heat-conducting pipe. The device improves the heat dissipation performance while not greatly increasing the quality and the cost.
Description
Technical Field
The present invention relates to conductive heat dissipation structures, and more particularly, to compensating embedded heat sinks.
Background
The heat dissipation of the equipment directly affects the stability of the system operation, and is a key factor for measuring the reliability of the equipment. With the higher integration of chips, the power consumption of a single chip is obviously increased, and most of the chips with large power consumption are covered with a Die with smaller area, which is also the area where the heat is most concentrated when the chips work.
The common heat dissipation modes of the equipment include conduction, air cooling, liquid cooling and the like, but no matter what heat dissipation mode is adopted, the heat generated when a device with high integration level and large power consumption works is effectively transferred in time and is the basis of the heat dissipation consideration of the equipment. Desktop or open system devices often use heat dissipation by adding heat sinks and fans to the high power chips. In an embedded system, a heat dissipation pressure plate or a raised stand column on an equipment shell is often contacted with a chip Die, so that the heat of the chip can be transferred to a heat conduction cold plate or the shell through the stand column, and then the heat is dissipated integrally through an air cooling mode and a liquid cooling mode. The air cooling and liquid cooling costs are high, and the heat conduction effect of the aluminum raised table column is poor.
Patent document CN101605442B relates to a heat dissipation device, which includes a base, a heat sink arranged on the base, a fan mounted on the base and located on one side of the heat sink, and a cover covering the fan and the heat sink, a soaking plate embedded in the base and covering the top of the electronic component completely, the heat sink includes a box body sandwiched between the top of the cover and the soaking plate and a honeycomb structure formed in the box body, one end opening of an airflow channel formed in the honeycomb structure faces the fan, and the other end opening is communicated with the environment outside the box body. The fan that this patent adopted dispels the heat, and its structure is complicated, and the cost is higher.
Patent document CN201226635Y relates to a liquid cooling heat dissipation device using heat pipes to concentrate heat source, which includes a cold plate disposed on a heat source, and one or more heat pipes disposed between the heat source and the cold plate, wherein the heat pipes are fully contacted with the heat source, and one end of each heat pipe is fixedly connected with the cold plate. The heat pipe is a sealed cavity, and the inside of the cavity contains a capillary material and a vapor-liquid working medium. The cold source that this patent adopted conducts heat, and its same structure is complicated, and the cost is higher.
Disclosure of Invention
In view of the defects in the prior art, the present invention provides a compensation type embedded heat sink.
The invention provides a compensation type embedded heat dissipation device, which comprises: the heat dissipation structure comprises a heat dissipation copper sheet, a heat dissipation structural member with a pillar, the pillar and a heat conduction pipe;
the table column is arranged on one side of the heat dissipation structural part with the table column, a groove is formed in the middle of the table column, and the heat dissipation copper sheet is installed in the groove;
the heat-conducting pipe is embedded in the heat-radiating structural part, and the heat-radiating copper sheet is connected with the heat-conducting pipe.
Preferably, the heat dissipation copper sheet is adhered to the bottom of the groove through heat conduction glue.
Preferably, the heat dissipation copper sheet is flush with the edge of the groove.
Preferably, one side of the heat dissipation copper sheet close to the edge of the groove covers one side of the Die chip;
the heat dissipation copper sheet is larger than the Die chip and completely covers the Die chip.
Preferably, the Die chip is mounted on the printed board through a chip package at the other side.
Preferably, the heat dissipation copper sheet is provided with a heat conduction phase change material towards one side of the Die chip.
Preferably, the heat-conducting phase-change material is an elastic material, and when the heat-radiating copper sheet covers the Die chip, the heat-conducting phase-change material plays a role in buffering and is tightly attached to the side face of the Die chip through deformation.
Preferably, the plane area of the heat-conducting phase-change material is larger than that of the Die chip and completely covers the Die chip.
Preferably, the heat-conducting phase-change material and the heat-conducting glue are heat-conducting materials.
Preferably, the heat dissipation copper sheet has detachability.
Preferably, the heat dissipation structural member with the table column is made of aluminum.
Preferably, the heat dissipation copper sheet, the pillars and the heat conduction pipe are provided with a plurality of groups.
Compared with the prior art, the invention has the following beneficial effects:
1. the device improves the heat dissipation performance while not greatly increasing the quality and the cost;
2. the device adopts the heat-conducting phase-change material, does not damage the Die chip and is in full contact with the Die chip for heat conduction;
3. the heat dissipation copper sheet of the device has detachability and is convenient and fast to replace.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a front view of a compensating embedded heat sink;
FIG. 2 is a bottom view of a heat dissipating structure with a pillar;
shown in the figure:
Detailed Description
The present invention will be described in detail with reference to specific examples. The following examples will assist those skilled in the art in further understanding the invention, but are not intended to limit the invention in any way. It should be noted that it would be obvious to those skilled in the art that various changes and modifications can be made without departing from the spirit of the invention. All falling within the scope of the present invention.
Example 1
As shown in fig. 1 and 2, a compensation type embedded heat sink includes: the heat dissipation structure comprises a heat dissipation copper sheet 5, a heat dissipation structural part 7 with a pillar, pillars 8 and a heat conduction pipe 9; take heat radiation structure 7 one side of stylobate to set up stylobate 8, set up the recess in the middle of the stylobate 8, installation heat dissipation copper sheet 5 in the recess, heat pipe 9 is inlayed to heat radiation structure 7, and heat dissipation copper sheet 5 connects heat pipe 9. The heat dissipation copper sheet 5 is adhered to the bottom of the groove through the heat conduction glue 6, the heat dissipation copper sheet 5 is flush with the edge of the groove, and the heat conduction phase change material 4 is installed on one side, facing the Die chip 3, of the heat dissipation copper sheet 5.
One side, close to the edge of the groove, of the radiating copper sheet 5 covers one side of the Die chip 3, the radiating copper sheet 5 is larger than the Die chip 3 and completely covers the Die chip 3, and the other side of the Die chip 3 is installed on the printed board 1 through the chip package 2. The heat-conducting phase-change material 4 is made of an elastic material, when the heat-radiating copper sheet 5 covers the Die chip 3, the heat-conducting phase-change material 4 plays a buffering role and is tightly attached to the side face of the Die chip 3 through deformation, and the plane area of the heat-conducting phase-change material 4 is larger than that of the Die chip 3 and completely covers the Die chip 3.
Example 2
Example 2 is a preferred example of example 1.
The device starts from the aspects of modifying a heat radiation structure, increasing the heat radiation area, replacing a heat conduction material to reduce the thermal resistance coefficient and the like at the same time so as to achieve the best heat radiation effect, and the device is specifically realized as follows:
as shown in fig. 1 and 2, a groove with a certain area and a certain depth is hollowed in a table column 8 of an aluminum heat dissipation structural member 7 with a table column; a heat dissipation copper sheet 5 is arranged in the groove, the heat dissipation copper sheet 5 is made of brass with a heat conduction coefficient better than that of aluminum, the machining size of the heat dissipation copper sheet 5 is slightly smaller than the area of the groove, and the thickness of the heat dissipation copper sheet is flush with the edge of the pillar 8 after the heat dissipation copper sheet is placed; the radiating copper sheet 5 rapidly transfers heat to the radiating structural member 7 with the table columns through the heat conduction pipe 9.
A chip package 2 is installed on the printed board 1, a Die chip 3 is installed on the chip package 2, the bottom surface of a radiating copper sheet 5 covers the Die chip 3, and the area of the radiating copper sheet 5 is larger than that of the Die chip 3. Fill heat conduction phase change material 4 that coefficient of heat conductivity is higher between the Die chip 3 that needs the heat dissipation and heat dissipation copper sheet 5, heat conduction phase change material 4 is elastic material, when heat dissipation copper sheet 5 drove heat conduction phase change material 4 and cover on Die chip 3, heat conduction phase change material 4 plays the cushioning effect on the one hand, on the other hand takes place to deform and makes Die chip 3 sink in heat conduction phase change material 4 to better fully contact with Die chip 3, fill heat conduction glue 6 of high coefficient of heat conductivity between heat dissipation copper sheet 5 and stage post 8. The structural modification can enable heat generated on the Die chip 3 to be transferred to the heat dissipation copper sheet 5 as soon as possible, which is equivalent to increase the heat dissipation area of the Die chip 3, the heat is conducted to the heat dissipation structural member 7 with the table columns through the heat dissipation copper sheet 5 and the heat conduction pipe 9, and the heat is finally transferred out through natural air heat dissipation, so that the temperature in the chip can be effectively reduced, and the stable operation of the system is ensured.
Running state comparison
The test comparison result shows that the internal junction temperature of the chip adopting the device can be reduced by more than 25 ℃, the temperature on the Die can be reduced by 7-10 ℃, and the temperature on the shell of the equipment is increased by about 1 ℃, which shows that the heat generated by the chip can be well transferred to the shell of the equipment, thereby reducing the junction temperature of the chip, ensuring the stability of the system operation and proving that the modification is effective and feasible.
In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application.
The foregoing description of specific embodiments of the present invention has been presented. It is to be understood that the present invention is not limited to the specific embodiments described above, and that various changes or modifications may be made by one skilled in the art within the scope of the appended claims without departing from the spirit of the invention. The embodiments and features of the embodiments of the present application may be combined with each other arbitrarily without conflict.
Claims (8)
1. A compensating embedded heat sink, comprising: the heat dissipation structure comprises heat dissipation copper sheets (5), a heat dissipation structural part (7) with a column, columns (8) and a heat conduction pipe (9);
the table column (8) is arranged on one side of the heat dissipation structural part (7) with the table column, a groove is formed in the middle of the table column (8), and the heat dissipation copper sheet (5) is installed in the groove;
the heat-radiating structural part (7) is embedded with the heat-conducting pipe (9), and the heat-radiating copper sheet (5) is connected with the heat-conducting pipe (9).
2. The compensating embedded heat sink of claim 1, wherein: the heat dissipation copper sheet (5) is adhered to the bottom of the groove through heat conduction glue (6).
3. The compensating embedded heat sink of claim 1, wherein: the heat dissipation copper sheet (5) is flush with the edge of the groove.
4. The compensating embedded heat sink of claim 3, wherein: one side, close to the edge of the groove, of the radiating copper sheet (5) covers one side of the Die chip (3);
the heat dissipation copper sheet (5) is larger than the Die chip (3) and completely covers the Die chip (3).
5. The compensating embedded heat sink of claim 4, wherein: the other side of the Die chip (3) is mounted on the printed board (1) through a chip package (2).
6. The compensating embedded heat sink of claim 4, wherein: and the heat-conducting phase-change material (4) is arranged on one side of the heat-radiating copper sheet (5) facing the Die chip (3).
7. The compensating embedded heat sink of claim 6, wherein: the heat-conducting phase-change material (4) is an elastic material, and when the heat-radiating copper sheet (5) covers the Die chip (3), the heat-conducting phase-change material (4) plays a buffering role and is tightly attached to the side face of the Die chip (3) through deformation.
8. The compensating embedded heat sink of claim 6, wherein: the plane area of the heat-conducting phase-change material (4) is larger than that of the Die chip (3) and completely covers the Die chip (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111040206.3A CN113873828A (en) | 2021-09-06 | 2021-09-06 | Compensation type embedded heat dissipation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111040206.3A CN113873828A (en) | 2021-09-06 | 2021-09-06 | Compensation type embedded heat dissipation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113873828A true CN113873828A (en) | 2021-12-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111040206.3A Pending CN113873828A (en) | 2021-09-06 | 2021-09-06 | Compensation type embedded heat dissipation device |
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| Country | Link |
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| CN (1) | CN113873828A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070062676A1 (en) * | 2005-09-20 | 2007-03-22 | Grand Power Sources Inc. | Heat sink module |
| CN201226635Y (en) * | 2008-07-04 | 2009-04-22 | 北京奇宏科技研发中心有限公司 | Centralized heat source type liquid-cooling radiating device using hot pipe |
| CN101605442A (en) * | 2008-06-13 | 2009-12-16 | 富准精密工业(深圳)有限公司 | Heat abstractor |
| CN202634976U (en) * | 2012-04-19 | 2012-12-26 | 京信通信系统（中国）有限公司 | Heat dissipation device |
| CN103107276A (en) * | 2012-12-07 | 2013-05-15 | 孙雪刚 | Light-emitting diode (LED) packaging structure |
| CN203120368U (en) * | 2013-03-11 | 2013-08-07 | 广东欧珀移动通信有限公司 | A cooling device for electronic equipment |
| CN203607389U (en) * | 2013-12-04 | 2014-05-21 | 中国航天科技集团公司第九研究院第七七一研究所 | Reinforced chip conduction radiator |
| CN107254297A (en) * | 2017-06-13 | 2017-10-17 | 中国科学技术大学 | A kind of flexible phase-change material for electronic equipment thermal control |
| CN107771011A (en) * | 2017-09-28 | 2018-03-06 | 深圳市英威腾电气股份有限公司 | A kind of flexible phase-change heat radiating device |
| CN108329893A (en) * | 2018-03-11 | 2018-07-27 | 深圳市驭晟新能源科技有限公司 | A kind of compliant thermal interface phase transformation compound foil material and preparation method thereof |
-
2021
- 2021-09-06 CN CN202111040206.3A patent/CN113873828A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070062676A1 (en) * | 2005-09-20 | 2007-03-22 | Grand Power Sources Inc. | Heat sink module |
| CN101605442A (en) * | 2008-06-13 | 2009-12-16 | 富准精密工业(深圳)有限公司 | Heat abstractor |
| CN201226635Y (en) * | 2008-07-04 | 2009-04-22 | 北京奇宏科技研发中心有限公司 | Centralized heat source type liquid-cooling radiating device using hot pipe |
| CN202634976U (en) * | 2012-04-19 | 2012-12-26 | 京信通信系统（中国）有限公司 | Heat dissipation device |
| CN103107276A (en) * | 2012-12-07 | 2013-05-15 | 孙雪刚 | Light-emitting diode (LED) packaging structure |
| CN203120368U (en) * | 2013-03-11 | 2013-08-07 | 广东欧珀移动通信有限公司 | A cooling device for electronic equipment |
| CN203607389U (en) * | 2013-12-04 | 2014-05-21 | 中国航天科技集团公司第九研究院第七七一研究所 | Reinforced chip conduction radiator |
| CN107254297A (en) * | 2017-06-13 | 2017-10-17 | 中国科学技术大学 | A kind of flexible phase-change material for electronic equipment thermal control |
| CN107771011A (en) * | 2017-09-28 | 2018-03-06 | 深圳市英威腾电气股份有限公司 | A kind of flexible phase-change heat radiating device |
| CN108329893A (en) * | 2018-03-11 | 2018-07-27 | 深圳市驭晟新能源科技有限公司 | A kind of compliant thermal interface phase transformation compound foil material and preparation method thereof |
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