CN113814604A - Eutectic high-entropy alloy solder for brazing titanium, titanium alloy and stainless steel and preparation method thereof - Google Patents
Eutectic high-entropy alloy solder for brazing titanium, titanium alloy and stainless steel and preparation method thereof Download PDFInfo
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- CN113814604A CN113814604A CN202111188128.1A CN202111188128A CN113814604A CN 113814604 A CN113814604 A CN 113814604A CN 202111188128 A CN202111188128 A CN 202111188128A CN 113814604 A CN113814604 A CN 113814604A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
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Abstract
The invention provides an eutectic high-entropy alloy solder for brazing titanium, titanium alloy and stainless steel and a preparation method thereof. The eutectic high-entropy alloy solder is AlxCoCrCuNi1+xThe eutectic high-entropy alloy solder is composed of the following raw material components in atomic percentage: 10 to 20 percent of Al, 10 to 20 percent of Co, 10 to 20 percent of Cr, 10 to 20 percent of Cu and 25 to 35 percent of Ni, wherein the sum of the atomic percentages of the components is 100 percent. The invention also discloses a preparation method of the brazing filler metal. The eutectic high-entropy alloy solder provided by the invention has the advantages of good fluidity and wettability, stable structure components, less brittle intermetallic compounds of a welding joint and the like.
Description
Technical Field
The invention relates to the technical field of welding materials, in particular to an eutectic high-entropy alloy solder for brazing titanium, titanium alloy and stainless steel and a preparation method thereof.
Background
The titanium alloy has the excellent characteristics of high strength, high toughness, high corrosion resistance, low thermal conductivity, low density and the like, and is widely applied to the fields of aerospace, energy and chemical industry and the like. But the titanium alloy has higher smelting processing difficulty and higher price. Stainless steel has excellent corrosion resistance, good comprehensive mechanical property and low price, and is widely applied to industry. Therefore, the high-quality connector of titanium or titanium alloy and stainless steel has wide application prospect in the fields of nuclear industry, petrochemical industry and aerospace due to relatively low cost, high corrosion resistance and good mechanical property. However, the metallurgical compatibility between titanium alloy and stainless steel dissimilar metal is very poor, and brittle Ti-Fe intermetallic compounds are easily formed to seriously deteriorate the performance of the joint.
Vacuum brazing is a common dissimilar metal welding method, and can realize high-precision and small-deformation dissimilar material connection. In the vacuum brazing process, the type and shape of the brazing filler metal are important links for realizing high-quality joints. The alloy component with the highest component ratio in the brazing filler metal is called a basic component, one or two core elements are usually selected as the basic component of the brazing filler metal for titanium/steel vacuum brazing, and the performance of the brazing filler metal is regulated and controlled by adding a small amount of alloying elements.
At present, Ag or Ti with better metallurgical compatibility with a base metal is mainly used as a basic component in titanium/steel brazing vacuum welding, and other small amount of elements are added to prepare silver-based brazing filler metal and titanium-based brazing filler metal. However, the silver-based brazing filler metal has high cost and poor corrosion resistance of joints, and the titanium-based brazing filler metal is easy to generate Ti-Fe brittle intermetallic compounds to reduce brazing seam performance. Therefore, the brazing filler metal taking a single core element as a basic component has some defects in the development of realizing high-performance vacuum brazing joints of titanium/steel dissimilar metals.
The high-entropy alloy is an alloy with a simple solid solution structure prepared by utilizing the high mixed entropy of a multi-principal-element alloy system, and has the advantages of stable structure, good corrosion resistance and stable high-temperature mechanical property.
Therefore, there is a need to develop a solder prepared by utilizing the high entropy effect of high entropy alloy, so as to reduce the formation of intermetallic compounds and realize the high-efficiency connection of titanium and titanium alloy and stainless steel dissimilar metal joint through multi-component synergistic action.
Disclosure of Invention
According to the technical problems, the eutectic high-entropy alloy solder for brazing titanium and titanium alloy and stainless steel and the preparation method thereof are provided. Al of the inventionxCoCrCuNi1+xThe eutectic high-entropy alloy solder has the advantages of good fluidity and wettability, stable structure components, less brittle intermetallic compounds of a welding joint and the like, and is particularly suitable for vacuum brazing of titanium, titanium alloy and stainless steel.
The technical means adopted by the invention are as follows:
eutectic high-entropy alloy brazing filler metal for brazing titanium, titanium alloy and stainless steel, wherein the brazing filler metal is AlxCoCrCuNi1+xThe eutectic high-entropy alloy solder is composed of the following raw material components in atomic percentage:
10 to 20 percent of Al, 10 to 20 percent of Co, 10 to 20 percent of Cr, 10 to 20 percent of Cu and 25 to 35 percent of Ni, wherein the sum of the atomic percentages of the components is 100 percent. Wherein x represents the molar ratio of Al to Co, Cr and Cu elements, namely the molar ratio of Al to Co to Cr to Cu to Ni is x:1:1:1 (1+ x), and x is between 0.5 and 1.5.
Further, the Al, Co, Cr, Cu, and Ni are pure metal particles having a purity of 99.99%.
The invention also discloses a preparation method of the eutectic high-entropy alloy solder for brazing titanium, titanium alloy and stainless steel, which comprises the following steps,
step 1: putting a high-purity metal raw material into a 99.5% absolute ethyl alcohol solution, performing ultrasonic cleaning by using an ultrasonic cleaning machine, and drying for later use;
step 2: using an electronic balance with the precision of 0.001g, and respectively weighing the following raw materials in atomic percentage: 10 to 20 percent of Al, 10 to 20 percent of Co, 10 to 20 percent of Cr, 10 to 20 percent of Cu and 25 to 35 percent of Ni, wherein the sum of the atomic percentages of the components is 100 percent;
and step 3: sequentially putting Al, Cu, Ni, Co and Cr raw materials into a crucible A of a vacuum arc melting furnace according to the sequence of melting points from low to high in the raw materials in the step 2, and putting a pure titanium block into a crucible B of the vacuum arc melting furnace;
and 4, step 4: vacuumizing the vacuum arc melting furnace, filling high-purity argon into the furnace chamber, melting the pure titanium block placed in the step 3 in a crucible B by using electric arc to remove residual oxygen in the furnace, and then melting the sample in the crucible A to obtain an eutectic high-entropy alloy button ingot;
and 5: and (4) preparing the eutectic high-entropy alloy button ingot obtained in the step (4) into an alloy solder foil strip by using a single-roller rapid solidification device.
Furthermore, the purity of the high-purity metal raw material is more than 99.99 wt%.
Further, in step 4, the vacuum environment is 5 × 10-3Pa or less.
Further, in step 4, the pure titanium block placed in the crucible B is melted by using an electric arc, and the electric arc current is 100-120A and the duration is 15-30 s.
Further, in step 4, the current for melting the samples in the crucible A ranges from 150A to 200A, and the melting is repeated at least 5 times for each sample.
Further, in the step 5, the roller rotating speed of the single-roller rapid solidification device is 10-30m/s, and the thickness of the prepared foil tape is about 30-100 mu m.
Compared with the prior art, the invention has the following advantages:
1. aiming at the defects of poor fluidity, poor casting performance, serious segregation and the like of the existing single-phase solid solution alloy, Al is designed and preparedxCoCrCuNi1+xEutectic high-entropy alloy solder. The eutectic high-entropy alloy has the advantages of good fluidity and excellent casting performance of the eutectic alloy, and is convenient for preparing the brazing filler metal foil strip;
2. the eutectic high-entropy alloy solder belongs to multi-principal-element alloy, in order to enable the structure of the high-entropy alloy to be an eutectic structure, pseudo-binary combination of AlNi and CoCrNi is adopted, Cu is added to improve the performance of the alloy, the designed solder structure is a two-phase solid solution structure, and the structure components are uniform. The high mixing entropy of the multi-principal-element alloy can effectively improve the metallurgical reaction of the joint interface and inhibit the generation of brittle intermetallic compounds in the welding seam;
3. al of the inventionxCoCrCuNi1+xThe addition of Cu element in the brazing filler metal can slowly release the stress between two components of AlNi-CoCrNi in the preparation process of the high-entropy alloy, effectively improve the plasticity of the alloy and enhance the forming capability of the brazing filler metal;
4. the melting point of the eutectic high-entropy alloy solder is obviously higher than that of the common Ag-based, Al-based and Ti-Cu-based solders, and the high-temperature service performance of the titanium/steel vacuum soldered joint can be effectively improved.
In conclusion, the solder alloy design concept provided by the invention can be widely applied to preparation of dissimilar metal welding solders.
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In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 shows Al1.0CoCrCuNi2.0XRD pattern of high entropy alloy.
FIG. 2 is Al1.0CoCrCuNi2.0DSC curve of high entropy alloy.
FIG. 3 shows the metallographic structure of the high-entropy alloy solder obtained in example 3 of the invention.
Detailed Description
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
The invention provides Al for brazing titanium, titanium alloy and stainless steelxCoCrCuNi1+xThe eutectic high-entropy alloy solder is particularly suitable for vacuum brazing and comprises the following components in atomic percentage: 10 to 20 percent of Al, 10 to 20 percent of Co, 10 to 20 percent of Cr, 10 to 20 percent of Cu and 25 to 35 percent of Ni, wherein the sum of the atomic percentages of the components is 100 percent.
The reasons for limiting the components and the contents of the eutectic high-entropy alloy solder are as follows:
the invention adopts a pseudo-binary eutectic design concept, fully considers the element metallurgical reaction and chemical compatibility of each component of the brazing filler metal and parent metals on two sides, and utilizes the high mixed entropy of a multi-principal-element system to inhibit the formation of intermetallic compounds in the welding seam. In the multi-element alloy system, when the components are mixed in equal atomic ratio, the maximum configuration entropy is obtained, so that the components are in equal atomic ratio in the design. Al and Ni elements have strong affinity with Ti elements, and the Al and Ni elements have large negative mixed enthalpy and are easy to form a stable phase, so that AlNi with equal atomic ratio is taken as a component during component design; co, Cr and Ni elements are completely dissolved in solid solution with Fe elements, the Co, Cr and Ni elements have approximate atomic radii and small enthalpy of mixing between atom pairs, so CoCrNi with equal atomic ratio is used as a second component; the Cu element is segregated among the crystals, so that the internal stress in the alloy can be weakened, and the plasticity of the alloy is effectively improved. The optimal solder proportioning is realized by regulating and controlling the AlNi-CoCrNiCu two-component proportion, namely the atomic ratio of the components of the solder is Al to Co to Cr to Cu to Ni is x to 1+ x, and x is 0.5-1.5.
Al provided by the inventionxCoCrCuNi1+xThe preparation method of the eutectic high-entropy alloy solder is implemented according to the following steps:
step 1: the high-purity metal raw material is placed in a 99.5% absolute ethyl alcohol solution to be subjected to ultrasonic cleaning by using an ultrasonic cleaning machine and is dried by using a vacuum drying oven. The method is mainly used for removing the possible pollution on the surface of the high-purity raw material in the storage process, such as oil stain, dust and the like.
Step 2: using an electronic balance with the precision of 0.001g, weighing the following raw materials (with the purity of more than 99.99%) according to atomic percentage:
10 to 20 percent of Al, 10 to 20 percent of Co, 10 to 20 percent of Cr, 10 to 20 percent of Cu and 25 to 35 percent of Ni, wherein the sum of the atomic percentages of the components is 100 percent. The accuracy of the alloy composition is ensured to the maximum extent.
And step 3: and (3) sequentially putting the raw materials of Al, Cu, Ni, Co and Cr into a crucible A of a vacuum arc melting furnace according to the sequence of melting points from low to high in the step 2. And a pure titanium block is placed in a crucible B of the vacuum smelting furnace. The metal with low melting point is arranged at the bottom of the crucible, so that the burning loss of the low melting point element caused by overhigh arc temperature in the smelting process is reduced, and the stability of the alloy components is further ensured.
And 4, step 4: vacuum pumping the vacuum arc melting furnace to 5 x 10-3And (5) filling high-purity argon into the furnace chamber below Pa. The pure titanium block placed in step 3 was melted in crucible B using an arc with an arc current of 100A for a duration of 20 s. Then, the samples in the crucible A are smelted, the current ranges from 150A to 200A, and smelting is repeated for at least 5 times for each sample. The pure titanium block is used for consuming the oxygen remained in the furnace chamber of the vacuum melting furnace. The purpose of repeated melting of the sample is to make the alloy ingot uniform in composition and stable in structure.
And 5: and (4) preparing the eutectic high-entropy alloy button ingot obtained in the step (4) into an alloy solder foil strip with the thickness of about 30-100 microns by using a single-roller rapid solidification device and the linear speed of a roller of 10-30 m/s. The brazing filler metal foil belt with good forming and smooth surface is obtained by reasonably adjusting the rotating speed of the roller in the single-roller rapid solidification device, and the poor forming quality of the foil belt can be caused by too high or too low rotating speed.
Table 1 below lists the contents of the various components in examples 1-4:
TABLE 1 brazing filler metals in examples 1-4 contain the respective component contents
Content of Components (at%) | Al | Co | Cr | Cu | Ni |
Example 1(x ═ 0.6) | 11.5 | 19.2 | 19.2 | 19.2 | 30.9 |
Example 2(x ═ 0.8) | 14.3 | 17.9 | 17.9 | 17.9 | 32 |
Example 3(x ═ 1.0) | 16.7 | 16.7 | 16.7 | 16.7 | 33.2 |
Example 4(x ═ 1.2) | 18.7 | 15.6 | 15.6 | 15.6 | 34.5 |
Example 1
Step 1: the high-purity metal raw material is placed in a 99.5% absolute ethyl alcohol solution to be subjected to ultrasonic cleaning by using an ultrasonic cleaning machine and is dried by using a vacuum drying oven.
Step 2: the respective raw materials were weighed out in accordance with the elemental component contents of example 1 listed in table 1 using an electronic balance with an accuracy of 0.001 g.
And step 3: and (3) sequentially putting the raw materials of Al, Cu, Ni, Co and Cr into a crucible A of a vacuum arc melting furnace according to the sequence of melting points from low to high in the step 2. And a pure titanium block is placed in a crucible B of the vacuum smelting furnace.
And 4, step 4: vacuum pumping the vacuum arc melting furnace to 5 x 10-3And (5) filling high-purity argon into the furnace chamber below Pa. The pure titanium block placed in step 3 was melted in crucible B using an arc with an arc current of 100A for a duration of 20 s. Then, the samples in the crucible A are smelted, the current ranges from 150A to 200A, and smelting is repeated for at least 5 times for each sample.
And 5: applying a single-roller rapid solidification device, wherein the roller rotating speed is 18m/s, and the steps4 Al obtained0.6CoCrCuNi1.6The eutectic high-entropy alloy button ingot is prepared into an alloy solder foil strip with the thickness of about 60 mu m.
Example 2
Step 1: the high-purity metal raw material is placed in a 99.5% absolute ethyl alcohol solution to be subjected to ultrasonic cleaning by using an ultrasonic cleaning machine and is dried by using a vacuum drying oven.
Step 2: the respective raw materials were weighed out in accordance with the elemental composition contents of example 2 listed in table 1 using an electronic balance with an accuracy of 0.001 g.
And step 3: and (3) sequentially putting the raw materials of Al, Cu, Ni, Co and Cr into a crucible A of a vacuum arc melting furnace according to the sequence of melting points from low to high in the step 2. And a pure titanium block is placed in a crucible B of the vacuum smelting furnace.
And 4, step 4: vacuum pumping the vacuum arc melting furnace to 5 x 10-3And (5) filling high-purity argon into the furnace chamber below Pa. The pure titanium block placed in step 3 was melted in crucible B using an arc with an arc current of 100A for a duration of 20 s. Then, the samples in the crucible A are smelted, the current ranges from 150A to 200A, and smelting is repeated for at least 5 times for each sample.
And 5: applying a single-roller rapid solidification device, wherein the roller rotating speed is 20m/s, and carrying out the step 4 to obtain Al0.8CoCrCuNi1.8The eutectic high-entropy alloy button ingot is prepared into an alloy solder foil strip, and the thickness of the alloy solder foil strip is about 80 mu m.
Example 3
Step 1: the high-purity metal raw material is placed in a 99.5% absolute ethyl alcohol solution to be subjected to ultrasonic cleaning by using an ultrasonic cleaning machine and is dried by using a vacuum drying oven.
Step 2: the respective raw materials were weighed out in accordance with the elemental composition contents of example 3 listed in table 1 using an electronic balance with an accuracy of 0.001 g.
And step 3: and (3) sequentially putting the raw materials of Al, Cu, Ni, Co and Cr into a crucible A of a vacuum arc melting furnace according to the sequence of melting points from low to high in the step 2. And a pure titanium block is placed in a crucible B of the vacuum smelting furnace.
And 4, step 4: vacuum pumping the vacuum arc melting furnace to 5 x 10-3Below Pa, toward the furnace chamberHigh-purity argon is filled in the reactor. The pure titanium block placed in step 3 was melted in crucible B using an arc with an arc current of 100A for a duration of 20 s. Then, the samples in the crucible A are smelted, the current ranges from 150A to 200A, and smelting is repeated for at least 5 times for each sample.
And 5: applying a single-roller rapid solidification device, wherein the roller rotating speed is 20m/s, and carrying out the step 4 to obtain Al1.0CoCrCuNi2.0The eutectic high-entropy alloy button ingot is prepared into an alloy solder foil strip, and the thickness of the alloy solder foil strip is about 80 mu m.
As shown in fig. 1, 2 and 3. An XRD diffraction pattern shows that the prepared high-entropy alloy is of an FCC + BCC two-phase solid solution structure, and the Cu-rich phase can improve the plasticity of the high-entropy alloy; the melting point of the obtained brazing filler metal is about 1030 ℃; the high-entropy alloy solder is good in forming and free of obvious casting defects in the structure.
Example 4
Step 1: the high-purity metal raw material is placed in a 99.5% absolute ethyl alcohol solution to be subjected to ultrasonic cleaning by using an ultrasonic cleaning machine and is dried by using a vacuum drying oven.
Step 2: the respective raw materials were weighed out in accordance with the elemental composition contents of example 4 listed in table 1 using an electronic balance with an accuracy of 0.001 g.
And step 3: and (3) sequentially putting the raw materials of Al, Cu, Ni, Co and Cr into a crucible A of a vacuum arc melting furnace according to the sequence of melting points from low to high in the step 2. And a pure titanium block is placed in a crucible B of the vacuum smelting furnace.
And 4, step 4: vacuum pumping the vacuum arc melting furnace to 5 x 10-3And (5) filling high-purity argon into the furnace chamber below Pa. The pure titanium block placed in step 3 was melted in crucible B using an arc with an arc current of 100A for a duration of 20 s. Then, the samples in the crucible A are smelted, the current ranges from 150A to 200A, and smelting is repeated for at least 5 times for each sample.
And 5: using a single-roller rapid solidification device, wherein the roller rotating speed is 24m/s, and carrying out the step 4 to obtain Al1.2CoCrCuNi2.2The eutectic high-entropy alloy button ingot is prepared into an alloy solder foil strip, and the thickness of the alloy solder foil strip is about 70 mu m.
The high-entropy brazing filler metal prepared by the method is subjected to vacuum brazing of TC4 titanium alloy and 316L stainless steel, and the shear strength of the joint is tested according to a strength test method of a brazed joint GB/T11363-2008. As can be seen from Table 2, the eutectic high-entropy alloy solder provided by the invention can realize reliable connection of TC4 titanium alloy and 316L stainless steel, the welding effect is stable, and the average maximum shear strength of a welded joint can reach more than 200 MPa.
TABLE 2 average shear strength after vacuum brazing of different high-entropy alloy solders
Numbering | Average shear strength |
Example 1 | ≥215MPa |
Example 2 | ≥238MPa |
Example 3 | ≥260MPa |
Example 4 | ≥220MPa |
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (8)
1. An eutectic high-entropy alloy solder for brazing titanium, titanium alloy and stainless steel is characterized in that the solder is AlxCoCrCuNi1+xThe eutectic high-entropy alloy solder is composed of the following raw material components in atomic percentage:
10 to 20 percent of Al, 10 to 20 percent of Co, 10 to 20 percent of Cr, 10 to 20 percent of Cu and 25 to 35 percent of Ni, wherein the sum of the atomic percentages of the components is 100 percent.
2. An eutectic high entropy alloy solder for brazing titanium and titanium alloys with stainless steel according to claim 1, characterized in that the Al, Co, Cr, Cu and Ni are pure metal particles with a purity of 99.99%.
3. A method for preparing eutectic high-entropy alloy solder for brazing titanium and titanium alloy with stainless steel according to claim 1 or 2, characterized by comprising the steps of,
step 1: putting a high-purity metal raw material into a 99.5% absolute ethyl alcohol solution, performing ultrasonic cleaning by using an ultrasonic cleaning machine, and drying for later use;
step 2: using an electronic balance with the precision of 0.001g, and respectively weighing the following raw materials in atomic percentage: 10 to 20 percent of Al, 10 to 20 percent of Co, 10 to 20 percent of Cr, 10 to 20 percent of Cu and 25 to 35 percent of Ni, wherein the sum of the atomic percentages of the components is 100 percent;
and step 3: sequentially putting Al, Cu, Ni, Co and Cr raw materials into a crucible A of a vacuum arc melting furnace according to the sequence of melting points from low to high in the raw materials in the step 2, and putting a pure titanium block into a crucible B of the vacuum arc melting furnace;
and 4, step 4: vacuumizing the vacuum arc melting furnace, filling high-purity argon into the furnace chamber, melting the pure titanium block placed in the step 3 in a crucible B by using electric arc, and then melting the sample in the crucible A to obtain an eutectic high-entropy alloy button ingot;
and 5: and (4) preparing the eutectic high-entropy alloy button ingot obtained in the step (4) into an alloy solder foil strip by using a single-roller rapid solidification device.
4. The preparation method of the eutectic high-entropy alloy solder for brazing titanium and titanium alloy and stainless steel according to claim 3, wherein the purity of the high-purity metal raw material is more than 99.99 wt%.
5. The method for preparing the eutectic high-entropy alloy solder for brazing titanium and titanium alloy and stainless steel according to claim 3, wherein in the step 4, the vacuumizing environment is 5 x 10-3Pa or less.
6. The preparation method of the eutectic high-entropy alloy solder for brazing titanium and titanium alloy and stainless steel as claimed in claim 3, wherein in the step 4, the pure titanium block placed in the crucible B is melted by electric arc, and the electric arc current is 100-120A for 15-30 s.
7. The method for preparing the eutectic high-entropy alloy solder for brazing titanium and titanium alloys and stainless steel according to claim 3, wherein in the step 4, the samples in the crucible A are melted in a current range of 150A-200A, and the melting is repeated at least 5 times for each sample.
8. The preparation method of the eutectic high-entropy alloy solder for brazing titanium and titanium alloy and stainless steel according to claim 3, wherein the roller rotating speed of the single-roller rapid solidification device in the step 5 is 10-30m/s, and the thickness of the prepared foil tape is about 30-100 μm.
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Cited By (3)
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CN114939753A (en) * | 2022-05-18 | 2022-08-26 | 上海工程技术大学 | Composite brazing filler metal for brazing sapphire and kovar alloy and brazing process thereof |
CN115106675A (en) * | 2022-08-09 | 2022-09-27 | 哈尔滨工业大学(威海) | High-entropy brazing filler metal, preparation method thereof and application thereof in brazing |
CN116117379A (en) * | 2022-12-30 | 2023-05-16 | 大连理工大学 | Particle self-reinforced high-entropy amorphous alloy solder for soldering titanium, titanium alloy and stainless steel and preparation method thereof |
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CN115106675B (en) * | 2022-08-09 | 2024-02-27 | 哈尔滨工业大学(威海) | High-entropy brazing filler metal, preparation method thereof and application thereof in brazing |
CN116117379A (en) * | 2022-12-30 | 2023-05-16 | 大连理工大学 | Particle self-reinforced high-entropy amorphous alloy solder for soldering titanium, titanium alloy and stainless steel and preparation method thereof |
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