CN113641222A

CN113641222A - Case and electronic equipment

Info

Publication number: CN113641222A
Application number: CN202010396476.7A
Authority: CN
Inventors: 陈建林; 池善久; 刘腾跃
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2020-05-11
Filing date: 2020-05-11
Publication date: 2021-11-12
Also published as: WO2021228089A1

Abstract

The application provides a quick-witted case and electronic equipment relates to electronic equipment technical field, can damage or pull out the fan relative with this part quick-witted case because of maintaining some part quick-witted case at some part fan of electronic equipment, cools off the quick-witted case that this part fan corresponds. The case comprises a shell and a circuit component; the shell is provided with a first opening and a second opening at two ends along a first direction respectively, the shell is surrounded to form a first cavity communicated with the first opening and the second opening, the shell comprises a first side wall and a second side wall which are parallel and oppositely arranged, the first side wall and the second side wall are both parallel to the first direction, a first through hole is formed in the first side wall, and a second through hole is formed in the second side wall; the circuit component is arranged in the first cavity. The chassis provided by the application is used for realizing partial functions or all functions of electronic equipment.

Description

Case and electronic equipment

Technical Field

The application relates to the technical field of electronic equipment, in particular to a case and electronic equipment.

Background

Within the data center, there are electronic devices such as storage, servers, network switches, and the like. These electronic devices include a subrack and multiple chassis mounted within the subrack in a stacked fashion to implement portions of the functions of storage, servers, and network switches. These enclosures generate a lot of heat during operation, and if the heat is not discharged in time, some of the enclosures, even the entire electronic device, will be over-heated and broken down.

In order to discharge heat generated by a plurality of chassis, a fan array is generally arranged on a shell of a machine frame, the fan array comprises a plurality of fans arranged in an array, and when the fan array works, the fan array can drive external air to enter the machine frame and discharge the air out of the machine frame after heat exchange with the plurality of chassis in the machine frame.

However, when one or more fans in the fan array are damaged or one or more fans in the fan array are unplugged to maintain one or more electronic devices (such as a hard disk) on one or more cases corresponding to the fans, the one or more cases are in a windless environment, and therefore, the one or more cases are easily burned out during operation.

Disclosure of Invention

The application provides a quick-witted case and electronic equipment can be when some part fan of electronic equipment damaged or pull out the fan relative with this part quick-witted case because of maintaining some part quick-witted case, cools off the quick-witted case that this part fan corresponds to avoid the quick-witted case that this part fan corresponds to be burnt out.

In order to achieve the above purpose, the embodiment of the present application adopts the following technical solutions:

in a first aspect, some embodiments of the present application provide a chassis including a housing and a circuit assembly; the shell is provided with a first opening and a second opening at two ends along a first direction respectively, the shell encloses a first cavity communicated with the first opening and the second opening, the shell comprises a first side wall and a second side wall, the first side wall and the second side wall are both parallel to the first direction, the first side wall is parallel to and opposite to the second side wall, the first side wall is provided with at least one first through hole, and the second side wall is provided with at least one second through hole; the circuit component is arranged in the first cavity, and the circuit component does not block communication paths between the first opening and the second opening, between the at least one first through hole and the first opening, between the at least one first through hole and the second opening, between the at least one second through hole and the first opening, and between the at least one second through hole and the second opening through the first cavity.

The number of at least part of first through holes in the at least one first through hole is equal to the number of at least part of second through holes in the at least one second through hole, the at least part of first through holes correspond to the at least part of second through holes in a one-to-one mode, and the projection area of each first through hole in the at least part of first through holes on the plane where the second side wall is located coincides with at least part of the occupied area of the second through hole corresponding to the first through hole on the plane where the second side wall is located.

In the chassis provided in the embodiment of the present application, the housings of the chassis enclose an independent air duct, and when a plurality of chassis are stacked and installed in the electronic device, and the stacking direction of the plurality of chassis is perpendicular to the first side wall of the housing of each chassis, and the outer surface of the first side wall of the plurality of chassis is oriented in the same direction, in two adjacent chassis, the first side wall of one chassis is attached to the second side wall of another chassis, and at least a part of at least one first through hole in the first side wall is aligned with at least a part of at least one second through hole in the second side wall. Therefore, when a part of fans in the fan array in the electronic device is damaged, or a part of fans are pulled out to maintain at least one case corresponding to the part of fans, air can be supplemented to the at least one case through at least part of the first through holes or at least part of the second through holes of the case adjacent to the at least one case, so that the at least one case can be cooled, and the at least one case is prevented from being burned out.

Optionally, the at least one first through hole is disposed on an end of the first sidewall close to the first opening, and the at least one second through hole is disposed on an end of the second sidewall close to the first opening. Therefore, when the case is applied to the electronic equipment, the first opening of the case can be made to face the air inlet of the machine frame, so that the temperature of the airflow entering or exiting from at least part of the first through hole or at least part of the second through hole in the lateral direction is lower, the pressure is higher, and the case can be cooled effectively.

Optionally, a first door body is arranged at the at least one first through hole, the first door body is used for opening or closing the at least one first through hole, and a door body is not arranged at the at least one second through hole; or the door body is not arranged at the at least one first through hole, the second door body is arranged at the at least one second through hole, and the second door body is used for opening or closing the at least one second through hole; or a first door body is arranged at least one first through hole and used for opening or closing the at least one first through hole, a second door body is arranged at least one second through hole and used for opening or closing the at least one second through hole. In this way, the first door body or the second door body can control the airflow to enter or exit from the lateral direction of the at least one first through hole or the at least one second through hole.

Optionally, the chassis further comprises a shielding structure; the shielding structure is arranged at the first opening and can move between a first position and a second position, when the shielding structure is located at the first position, the shielding structure does not shield the first opening, and when the shielding structure is located at the second position, the shielding structure partially shields the first opening. Therefore, when the case is applied to the electronic equipment, when the fan corresponding to the case normally operates, the shielding structure of the case can be driven to move to the first position, so that the shielding structure is prevented from shielding the airflow entering the first cavity from the first opening, and the cooling effectiveness is ensured. When the fan corresponding to the chassis is failed or is pulled out, the shielding structure of the chassis can be driven to move to the second position, so that the situation that airflow entering from at least part of the first through holes of the at least one first through hole or at least part of the second through holes of the at least one second through hole in the lateral direction is completely discharged from the first opening of the chassis is avoided, and therefore circuit components in a part of the shell between the at least one first through hole of the chassis and the second opening of the chassis cannot be effectively cooled.

Optionally, the shielding structure includes a plurality of blocking pieces, the blocking pieces are arranged at intervals along a direction perpendicular to the first direction and parallel to the first side wall, and the blocking pieces are all perpendicular to the first side wall, each blocking piece of the blocking pieces is rotatably connected to the housing or the circuit assembly, the rotation axis of each blocking piece is perpendicular to the first side wall, and each blocking piece can rotate around its rotation axis between a position parallel to the first direction and a position perpendicular to the first direction; when each baffle sheet in the plurality of baffle sheets is parallel to the first direction, the shielding structure is located at the first position; when each baffle sheet in the plurality of baffle sheets is perpendicular to the first direction, the shielding structure is located at the second position. The structure is simple, the realization is easy, and the occupied space is small.

Optionally, the circuit assembly comprises a hard disk unit and a central processing unit, the hard disk unit is electrically connected with the central processing unit; the hard disk unit is arranged in one end of the shell close to the first opening, and the central processing unit is arranged in one end of the shell close to the second opening.

Alternatively, the hard disk unit as a whole is slidably attached in the housing in a direction parallel to the first direction. In this way, when the hard disk in the hard disk unit needs to be maintained, the hard disk unit can be drawn out from the first opening, so that the hard disk in the hard disk unit can be maintained.

Optionally, the hard disk unit includes a plurality of hard disks stacked and spaced apart in a direction parallel to the first sidewall and perpendicular to the first direction; the at least one first through hole and the at least one second through hole are opposite to a gap between two adjacent hard disks. In this way, no interference is generated between the at least one first through hole and the plurality of hard disks and between the at least one second through hole and the plurality of hard disks, facilitating the lateral ingress or egress of air flow from the at least one first through hole or the at least one second through hole.

In a second aspect, some embodiments of the present application provide a chassis including a substrate and a circuit assembly; the edges of two ends of the substrate along the first direction are respectively a first edge and a second edge, and the substrate is provided with at least one through hole; the circuit component is arranged on the substrate and does not shield the at least one through hole.

When a plurality of cases are installed in the electronic equipment in a stacked mode, gaps are formed between the base plates of two adjacent cases and between the base plate of the case located on the uppermost layer and the top wall of the machine frame, independent air channels are formed by the gaps, the circuit assemblies are located in the air channels, and the air channels can laterally exhaust or enter air through at least one through hole. Therefore, when a part of fans in the fan array in the electronic device is damaged or a part of fans are pulled out to maintain at least one case corresponding to the part of fans, lateral air compensation can be performed on the at least one case through at least one through hole of the at least one case or at least one through hole of a case adjacent to the at least one case, so that the at least one case can be effectively cooled.

Optionally, at least one through hole is provided proximate the first edge. Therefore, when the case is applied to the electronic equipment, the first edge of the substrate of the case faces the air inlet of the machine frame, so that the temperature of the airflow entering or exiting from the side direction of the at least one through hole is lower, the pressure is higher, and the case can be effectively cooled.

Optionally, a damper is provided at the at least one through hole for opening or closing the at least one through hole. In this way, the lateral flow of the air flow can be controlled by the door body.

Optionally, the chassis further comprises a shielding structure; the shielding structure is arranged on the first edge of the substrate and can move between a first position and a second position, when the shielding structure is located at the first position, the shielding structure does not shield the circuit assembly from one side of the circuit assembly close to the first edge, and when the shielding structure is located at the second position, the shielding structure partially shields the circuit assembly from one side of the circuit assembly close to the first edge. Therefore, when the case is applied to the electronic equipment, when the fan corresponding to the case normally operates, the shielding structure can be driven to move to the first position, so that the shielding structure is prevented from shielding airflow entering an air duct between the substrates of two adjacent cases, and the cooling efficiency of the circuit assembly is ensured. When the fan corresponding to the case is failed or pulled out, the shielding structure can be driven to move to the second position, so that the situation that all airflow entering the adjacent air duct from the side direction of at least one through hole is discharged from one end, close to the first edge, of the adjacent air duct is avoided, and circuit components on a part of the substrate between the at least one through hole of the case and the second edge of the case cannot be effectively cooled is avoided.

Optionally, the shielding structure includes a plurality of blocking sheets, the blocking sheets are arranged at intervals along a direction perpendicular to the first direction and parallel to the substrate, and the blocking sheets are all perpendicular to the substrate, each blocking sheet of the blocking sheets is rotatably connected to the substrate or the circuit assembly, the rotation axis of each blocking sheet is perpendicular to the substrate, and each blocking sheet is capable of rotating around its rotation axis between a position parallel to the first direction and a position perpendicular to the first direction; when each baffle sheet in the plurality of baffle sheets is parallel to the first direction, the shielding structure is located at the first position; when each separation blade in the plurality of separation blades is perpendicular to the first direction, the shielding structure is located at the second position. The structure is simple, the realization is easy, and the occupied space is small.

Optionally, the circuit assembly comprises a hard disk unit and a central processing unit, the hard disk unit being electrically connected to the central processing unit; the hard disk unit is arranged on the part of the substrate close to the first edge, and the central processing unit is arranged on the part of the substrate close to the second edge.

Optionally, the hard disk unit includes a plurality of hard disks stacked and spaced apart in a direction perpendicular to the first direction and parallel to the substrate; at least one through hole is opposed to a gap between two adjacent hard disk units. In this way, no interference is generated between the at least one through hole and the plurality of hard disks, and the air flow is convenient to enter or exit from the at least one through hole in a side direction.

In a third aspect, some embodiments of the present application provide an electronic device that includes a subrack, a plurality of chassis, and a plurality of fans; a third opening and a fourth opening are respectively arranged at two ends of the machine frame along a second direction, the machine frame is enclosed into a second cavity, one end of the second cavity facing the third opening is communicated with the third opening, and one end of the second cavity facing the fourth opening is communicated with the fourth opening; each of the plurality of chassis is the chassis according to any one of the above-mentioned first aspect, the plurality of chassis are stacked and mounted in the second cavity, and the stacking direction of the plurality of chassis is perpendicular to the second direction, the stacking direction of the plurality of chassis is perpendicular to the first sidewall of each of the plurality of chassis, the outer surfaces of the first sidewalls of the plurality of chassis are oriented in the same direction, the first openings of the plurality of chassis are all oriented toward the third opening of the machine frame, and the second openings of the plurality of chassis are all oriented toward the fourth opening; the fan arrays are arranged in the third opening, the air outlet faces of the fans are opposite to the first openings of the cases, or the fan arrays are arranged in the fourth opening, and the air inlet faces of the fans are opposite to the second openings of the cases.

Since the chassis used in the electronic device according to the embodiment of the present application is the same as the chassis described in any of the above first aspect, the two chassis can solve the same technical problem and achieve the same expected effect.

Optionally, the second cavity is disposed near the third opening, and an end of the second cavity facing the third opening is directly communicated with the third opening. A back plate is arranged at one end of the second cavity, which is far away from the third opening, the back plate is a hollow circuit board, a plurality of first plug-in connectors and a plurality of second plug-in connectors are arranged on the back plate, and a third cavity is formed at one side of the back plate, which is far away from the second cavity; the plurality of cases are respectively plugged on the plurality of plug-in connectors; the electronic equipment further comprises a plurality of input/output cards which are respectively plugged into the second plug-in connectors. In this way, electrical connections between multiple chassis and multiple input/output cards are made through the backplane.

In a fourth aspect, some embodiments of the present application provide an electronic device that includes a subrack, a plurality of chassis, and a plurality of fans; a third opening and a fourth opening are respectively arranged at two ends of the machine frame along a second direction, the machine frame encloses a second cavity, one end of the second cavity facing the third opening is communicated with the third opening, and one end of the second cavity facing the fourth opening is communicated with the fourth opening; each of the multiple chassis is the chassis according to any one of the second aspect, the multiple chassis are stacked and mounted in the second cavity, the stacking direction of the multiple chassis is perpendicular to the second direction, the stacking direction of the multiple chassis is perpendicular to the substrate of each of the multiple chassis, the first edges of the substrates of the multiple chassis are disposed near the third opening of the machine frame, and the second edges of the substrates of the multiple chassis are disposed near the fourth opening; the fan arrays are arranged in the third opening, the air outlet surfaces of the fans face to the first edges of the substrates of the cases, or the fan arrays are arranged in the fourth opening, and the air inlet surfaces of the fans face to the second edges of the substrates of the cases.

Since the chassis used in the electronic device according to the embodiment of the present application is the same as the chassis described in any of the above second aspects, the two chassis can solve the same technical problem and achieve the same expected effect.

Drawings

Fig. 1 is a schematic structural diagram of an electronic device according to some embodiments of the present application;

FIG. 2 is a schematic structural diagram of the electronic device shown in FIG. 1 with the fan array removed;

fig. 3 is a schematic structural diagram of a first chassis according to some embodiments of the present application;

fig. 4 is a schematic structural diagram of a second chassis according to some embodiments of the present application;

FIG. 5 is a schematic view of another configuration of the electronic device shown in FIG. 1 with the fan array removed;

fig. 6 is a schematic structural diagram of an electronic device according to some embodiments of the present application;

FIG. 7 is a cross-sectional view of the electronic device shown in FIG. 6;

fig. 8 is a schematic structural diagram of a chassis provided in some embodiments of the present application;

fig. 9 is a schematic structural view of the enclosure shown in fig. 8 with the first side wall removed;

fig. 10 is a schematic structural diagram of a case of stacking a plurality of cases shown in fig. 8 and being installed in a second cavity of the electronic device shown in fig. 7;

FIG. 11 is a schematic structural diagram of the electronic device shown in FIG. 10 when a portion of the fan is unplugged;

FIG. 12 is a schematic structural view of a chassis according to still other embodiments of the present application after removing a first sidewall and with a shielding structure in a first position;

FIG. 13 is a schematic view of the enclosure of FIG. 12 in a second position of the shielding structure;

FIG. 14 is a schematic structural view of a chassis according to still other embodiments of the present application after removing a first sidewall and with a shielding structure in a first position;

FIG. 15 is a schematic view of the enclosure of FIG. 14 with the shelter structure in a second position;

FIG. 16 is a schematic structural view of a chassis according to still other embodiments of the present application after removing a first sidewall and with a shielding structure in a first position;

FIG. 17 is a schematic view of the enclosure of FIG. 16 in a second position of the shelter structure;

fig. 18 is a schematic structural diagram of a chassis according to still other embodiments of the present application;

FIG. 19 is a cross-sectional view of an electronic device provided in accordance with further embodiments of the present application;

FIG. 20 is a schematic structural diagram of the electronic device shown in FIG. 19 when a portion of the blower is unplugged;

FIG. 21 is a schematic structural view of a chassis according to still other embodiments of the present application, with a shelter structure in a first position;

FIG. 22 is a schematic view of the enclosure of FIG. 21 with the shelter structure in a second position;

FIG. 23 is a schematic structural view of a chassis according to still other embodiments of the present application, with a shelter structure in a first position;

FIG. 24 is a schematic view of the enclosure of FIG. 23 in a second position of the shelter structure;

FIG. 25 is a schematic structural view of a chassis according to still other embodiments of the present application, with a shelter structure in a first position;

fig. 26 is a schematic structural view of the enclosure shown in fig. 25 when the shielding structure is in the second position.

Detailed Description

In the embodiments of the present application, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

In the description of the embodiments of the present application, it should be noted that the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected unless explicitly stated or limited otherwise; may be directly connected or indirectly connected through an intermediate. Specific meanings of the above terms in the embodiments of the present application can be understood in specific cases by those of ordinary skill in the art.

In addition to the presence of electronic devices such as storage devices, servers, and network switches, a data center needs to be provided with a cool air duct and a warm air duct. Fig. 1 is a schematic structural diagram of an electronic device 01 according to some embodiments of the present disclosure, and fig. 2 is a schematic structural diagram of the electronic device 01 shown in fig. 1 after a fan array 013 is removed. As shown in fig. 1 and 2, the electronic device 01 includes a subrack 011, a chassis 012, and a blower array 013. The front end and the rear end of the machine frame 011 are both open, and when the electronic device 01 is installed in the data center, the front end of the machine frame 011 is open to the cold air channel (not shown in the figure), and the rear end of the machine frame 011 is open to the hot air channel (not shown in the figure). The cabinets 012 are mounted in a stacked manner in the machine frame 011, and as shown in fig. 1, the fan array 013 is provided at an opening at the front end of the machine frame, and an air outlet surface of the fan array 013 faces the plurality of cabinets 012. When the fan array 013 works, cold air flow in the cold air channel can be driven to enter the machine frame 011 from the front end opening of the machine frame 011, and is discharged to the hot air channel from the rear end opening of the machine frame 011 after being subjected to heat exchange with the plurality of chassis 012 in the machine frame 011.

Wherein, the machine case mainly has following two kinds of structures:

fig. 3 is a schematic structural diagram of a first chassis provided in some embodiments of the present application, where the chassis is a structural diagram of the chassis in the electronic device 01 shown in fig. 2. As shown in fig. 3, the case 012 includes a case 0121 and a circuit assembly 0122 mounted in the case 0121, opposite ends of the case 0121 being open. When a plurality of chassis 012 shown in fig. 3 are stacked and mounted in machine frame 011, as shown in fig. 2, one end of casing 0121 is opened toward the front end of machine frame 011, and the other end of casing 0121 is opened toward the rear end of machine frame 011. In this way, the shells 0121 of each chassis 012 enclose an independent air duct, and when the fan array 013 (as shown in fig. 1) operates, the cold air flow in the cold air duct enters the multiple independent air ducts from the front end opening of the machine frame 011, exchanges heat with the circuit components 0122 in the multiple independent air ducts, and is discharged to the hot air duct from the rear end opening of the machine frame 011. When a certain one or more fans in the fan array 013 are damaged or a certain one or more fans in the fan array are pulled out to maintain a certain electronic device (such as a hard disk) in one or more cases 012 corresponding to the fan, no wind exists in the independent air duct of the case 012 corresponding to the one or more fans, and the circuit assemblies 0122 in the independent air duct are easily burnt out due to the fact that heat cannot be quickly dissipated in the independent air duct in the operation process of the circuit assemblies 0122 in the independent air duct.

Fig. 4 is a schematic structural diagram of a second chassis according to some embodiments of the present application. As shown in fig. 4, the case 012 includes a support plate 0123 and a circuit assembly 0122 mounted on the support plate 0123. When a plurality of chassis 012 shown in fig. 4 are stacked and mounted in the machine frame 011, as shown in fig. 5, one end edge of the support plate 0123 is close to the front end opening of the machine frame 011, the other end edge of the support plate 0123 is close to the rear end opening of the machine frame 011, and a gap is provided between two adjacent chassis 012. In this way, each two adjacent chassis 012 and the side wall of the machine frame 011 form an independent air duct, when the fan array 013 (as shown in fig. 1) operates, the cold air flow in the cold air duct enters the multiple independent air ducts from the front end opening of the machine frame 011, exchanges heat with the circuit assemblies 0122 in the multiple independent air ducts, and is discharged to the hot air duct from the rear end opening of the machine frame 011. When a certain one or more fans in the fan array 013 are damaged, or when a certain one or more fans in the fan array 013 are pulled out to maintain a certain electronic device (such as a hard disk) in one or more cases 012 that is blocked by the fan, no wind is present in the independent air duct of the case 012 corresponding to the one or more fans, and the circuit components 0122 in the independent air duct are not rapidly cooled in the independent air duct during the operation process, so that the circuit components 0122 in the independent air duct are easily burned out.

In order to avoid the above problems, the present application provides an electronic device that is applied to a data center and includes, but is not limited to, a server, a storage, and a switch.

Fig. 6 is a schematic structural diagram of an electronic device according to some embodiments of the present application. As shown in fig. 6, the electronic device includes a subrack 1. The machine frame 1 includes, but is not limited to, a metal machine frame and a plastic machine frame, and both ends of the machine frame 1 in the second direction (Y direction as shown in fig. 6 and 7) are respectively provided with a third opening 11 and a fourth opening 12. In the electronic apparatus according to the embodiment of the present application, the third opening 11 faces the cold air duct, and the fourth opening 12 faces the hot air duct.

Fig. 7 is a cross-sectional view of the electronic device shown in fig. 6. As shown in fig. 7, the machine frame 1 encloses a second cavity 13, one end of the second cavity 13 facing the third opening 11 is communicated with the third opening 11, and one end of the second cavity 13 facing the fourth opening 12 is communicated with the fourth opening 12.

The end of the second cavity 13 facing the third opening 11 may be directly communicated with the third opening 11, or may be indirectly communicated with the third opening 11 through another cavity or a hollow structure, which is not limited herein.

One end of the second cavity 13 facing the fourth opening 12 may be directly communicated with the fourth opening 12, or indirectly communicated with the fourth opening 12 through other cavities or hollow structures, which is not specifically limited herein.

The second cavity 13 may be disposed near the third opening 11, may also be disposed near the fourth opening 12, and may also be disposed in the middle of the frame 1 in the second direction, which is not specifically limited herein, as long as one end of the second cavity 13 facing the third opening 11 communicates with the third opening 11, and one end of the second cavity 13 facing the fourth opening 12 communicates with the fourth opening 12.

In some embodiments, as shown in fig. 7, the second cavity 13 is disposed near the third opening 11, and an end of the second cavity 13 facing the third opening 11 is directly communicated with the third opening 11. A back plate 14 is arranged at one end of the second cavity 13 away from the third opening 11, and the back plate 14 is a hollow plate. The side of the back plate 14 facing away from the second cavity 13 forms a third cavity 15. In this way, the end of the second cavity 13 close to the fourth opening 12 is indirectly communicated with the fourth opening 12 through the hollow area on the back plate 14 and the third cavity 15.

As shown in fig. 7, the electronic device further includes a plurality of housings 2, the housings 2 are stacked and mounted in the second cavity 13, and the stacking direction of the housings 2 is perpendicular to the second direction. The plurality of cabinets 2 may be inserted into or pulled out of the second cavity 13 through the third opening 11, or may be mounted in the second cavity 13 in other manners, which is not limited herein.

The electronic device may include two, three, four, five, etc. cases 2, which are not limited in particular. Fig. 7 merely shows an example in which the electronic device includes two housings 2, and does not limit the present application.

In some embodiments, as shown in fig. 7, the back plate 14 is a hollow circuit board, and a plurality of first plug connectors 141 are disposed on the back plate 14. When the multiple chassis 2 are inserted into the second cavity 13 through the third opening 11, the multiple chassis 2 may be respectively plugged onto the multiple first plug-in connectors 141 to achieve interconnection between the multiple chassis 2 and the backplane 14.

As shown in fig. 7, the electronic apparatus further includes a plurality of input/output cards 3, the plurality of input/output cards 3 are stacked and mounted in the third cavity 15, and the stacking direction of the plurality of input/output cards 3 is perpendicular to the second direction. The plurality of input/output cards 3 may be inserted into or pulled out of the third cavity 15 through the fourth opening 12, or may be mounted in the third cavity 15 in other manners, which is not limited herein.

In some embodiments, as shown in fig. 7, a plurality of second plug connectors 142 are provided on the backplane. When the plurality of input/output cards 3 are plugged into the third cavity 15 through the fourth opening 12, the plurality of input/output cards 3 may be plugged into the plurality of second plug connectors 142, respectively, to achieve interconnection between the plurality of input/output cards 3 and the backplane 14, and interconnection between the backplane 14 and the plurality of chassis 2.

The terminals of the plurality of input/output cards 3 face the fourth opening 12. In this way, the connection lines of the plurality of input/output cards 3 can be led out from the fourth opening 12, facilitating the lead management.

As shown in fig. 6 and 7, the electronic device further includes a plurality of fans 4, the plurality of fans 4 are arranged in the third opening 11 of the machine frame 1 in an array, and an air outlet surface of each of the plurality of fans 4 is opposite to the plurality of cases 2.

Therefore, when the fans 4 operate, the external cold airflow can be driven to flow into the second cavity 13 through the third opening 11 to exchange heat with the plurality of cases 2 in the second cavity 13, and the airflow after heat exchange passes through the hollow area on the back plate 14 and the third cavity 15 and is discharged from the fourth opening 12.

It should be noted that the plurality of fans 4 may also be disposed in the fourth opening 12 of the machine frame 1 in an array form, and at this time, the air inlet surfaces of the plurality of fans 4 are opposite to the plurality of chassis 2. Fig. 6 and 7 show only one example of the arrangement positions of the plurality of fans 4, and do not limit the present application.

The present application further provides a chassis for implementing some or all of the functions in an electronic device.

Fig. 8 is a schematic structural diagram of a chassis provided in some embodiments of the present application, where the chassis is an example of a chassis in the electronic device shown in fig. 7. As shown in fig. 8, the chassis 2 includes a housing 21. The housing 21 includes, but is not limited to, a metal housing and a plastic housing, and both ends of the housing 21 in a first direction (i.e., the X direction shown in fig. 8) are respectively provided with a first opening 211 and a second opening 212. The housing 21 encloses a first cavity 213 communicating the first opening 211 and the second opening 212. The case 21 includes a first sidewall 214 and a second sidewall 215, the first sidewall 214 and the second sidewall 215 are both parallel to the first direction, and the first sidewall 214 is parallel to and opposite to the second sidewall 215. The first sidewall 214 is provided with at least one first through hole 22. Fig. 9 is a schematic structural diagram of the chassis shown in fig. 8 after the first sidewall is removed. As shown in fig. 9, the second sidewall 215 is provided with at least one second through hole 23.

Wherein, the number of at least some first through holes 22 in the at least one first through hole 22 is equal to the number of at least some second through holes 23 in the at least one second through hole 23, the at least some first through holes 22 are in one-to-one correspondence with the at least some second through holes 23, and a projection area of each first through hole 22 in the at least some first through holes 22 on a plane where the second sidewall 215 is located coincides with at least some area of an occupied area of the second through hole 23 corresponding to the first through hole 22 on the plane where the second sidewall 215 is located. Specifically, this embodiment includes the following four implementations:

in a first implementation manner, the number of all the first through holes 22 in the at least one first through hole 22 is equal to the number of all the second through holes 23 in the at least one second through hole 23, all the first through holes 22 in the at least one first through hole 22 correspond to all the second through holes 23 in the at least one second through hole 23 in a one-to-one manner, and a projection area of each first through hole 22 in the at least one first through hole 22 on a plane where the second side wall 215 is located coincides with all or part of an occupied area of the second through hole 23 corresponding to the first through hole 22 on the plane where the second side wall 215 is located.

In a second implementation manner, the number of all the first through holes 22 in the at least one first through hole 22 is equal to the number of some second through holes 23 in the at least one second through hole 23, all the first through holes 22 in the at least one first through hole 22 correspond to some second through holes 23 in the at least one second through hole 23 in a one-to-one manner, and a projection area of each first through hole 22 in the at least one first through hole 22 on a plane where the second sidewall 215 is located coincides with all or some of an occupied area of the second through hole 23 corresponding to the first through hole 22 on the plane where the second sidewall 215 is located.

In a third implementation manner, the number of some first through holes 22 in the at least one first through hole 22 is equal to the number of all second through holes 23 in the at least one second through hole 23, the some first through holes 22 correspond to all second through holes 23 in the at least one second through hole 23 one to one, and a projection area of each first through hole 22 in the some first through holes 22 on a plane where the second side wall 215 is located coincides with all or part of an occupied area of the second through hole 23 corresponding to the first through hole 22 on the plane where the second side wall 215 is located.

In a fourth implementation manner, the number of some first through holes 22 in the at least one first through hole 22 is equal to the number of some second through holes 23 in the at least one second through hole 23, the some first through holes 22 correspond to the some second through holes 23 one to one, and a projection area of each first through hole 22 in the some first through holes 22 on a plane where the second sidewall 215 is located coincides with all or part of an occupied area of the second through hole 23 corresponding to the first through hole 22 on the plane where the second sidewall 215 is located.

In this way, when the plurality of housings 2 shown in fig. 8 are stacked and mounted in the second cavity 13 of the electronic device shown in fig. 7, as shown in fig. 10, the stacking direction of the plurality of housings 2 may be perpendicular to the first side wall 214 of each housing 2, the outer surfaces of the first side walls 214 of the plurality of housings 2 may be aligned, the first openings 211 of the plurality of housings 2 may be all facing the third opening 11 of the machine frame 1, and the second openings 212 of the plurality of housings 2 may be all facing the fourth opening 12 of the machine frame 1. The outer surface of the first sidewall 214 refers to a surface of the first sidewall 214 facing away from the first cavity 213.

In this way, the housing 21 of each chassis 2 encloses an independent air duct, and in two adjacent chassis 2, the first side wall 214 of one chassis 2 is attached to the second side wall 215 of the other chassis 2, and at least a part of the first through holes 22 of the at least one first through hole 22 on the first side wall 214 is aligned with at least a part of the second through holes 23 of the at least one second through hole 23 on the second side wall 215, so that when the plurality of fans 4 operate simultaneously, the external cold air flow can be driven to flow into the second cavity 13 from the third opening 11, and pass through the plurality of air ducts enclosed by the housings 21 of the plurality of chassis 2, and be discharged to the external environment from the fourth opening 12, in this process, as shown in fig. 10, the air volumes in the plurality of air ducts are approximately equal in speed, and the air flows in the two adjacent air ducts do not mutually move. When a part of the plurality of fans 4 is damaged or a part of the fans 4 is unplugged to maintain the at least one enclosure 2 shielded by the part of the fans 4, as shown in fig. 11, air can be supplemented to the at least one enclosure 2 through at least a part of the first through holes 22 or at least a part of the second through holes 23 of the enclosures 2 adjacent to the at least one enclosure 2, so that the at least one enclosure 2 can be cooled.

The number of the at least one first through hole 22 may be one or more, and is not particularly limited herein. In some embodiments, as shown in fig. 8, the number of the at least one first through hole 22 is plural, specifically 6.

Similarly, the number of the at least one second through hole 23 may be one, or may be multiple, and is not limited specifically herein. In some embodiments, as shown in fig. 9, the number of the at least one second through hole 23 is plural, and the number of the plurality of second through holes 23 is equal to the number of the plurality of first through holes 22 in fig. 8.

The at least one first through hole 22 may be disposed on an end of the first sidewall 214 close to the first opening 211, an end of the first sidewall 214 close to the second opening 212, or a middle position of the first sidewall 214 along the first direction, which is not limited in detail herein. In some embodiments, as shown in fig. 8, at least one first through hole 22 is disposed on an end of the first sidewall 214 near the first opening 211. When a plurality of housings 2 are stacked and mounted in an electronic apparatus, as shown in fig. 10, the first opening of the housing 2 faces the third opening 11 of the machine frame, and the third opening 11 is an inlet into which outside cool air flows, so that the temperature of the airflow entering or exiting from at least part of the first through holes 22 in the lateral direction is low, the pressure is high, and the adjacent housings 2 can be cooled efficiently.

Accordingly, the at least one second through hole 23 may be disposed on an end of the second sidewall 215 near the first opening 211, on an end of the second sidewall 215 near the second opening 212, or in a middle position of the second sidewall 215 along the first direction, which is not particularly limited herein. In some embodiments, as shown in fig. 8, at least one second through hole 23 is disposed on an end of the second sidewall 215 near the first opening 211. When a plurality of housings 2 are stacked and mounted in an electronic apparatus, as shown in fig. 10, the first opening 211 of the housing 2 faces the third opening 11 of the machine frame, and the third opening 11 is an inlet into which outside cool air flows, so that the temperature of the air flow entering or exiting from at least part of the second through holes 23 in the lateral direction is low, the pressure is high, and the adjacent housings 2 can be cooled efficiently.

In some embodiments, a first door (not shown) is disposed at the at least one first through hole 22, and is used for opening or closing the at least one first through hole 22, and a door is not disposed at the at least one second through hole 23. In this way, the lateral flow of the air flow in the first cavity 213 can be controlled by the first door body.

The first door body may be driven to open or close manually, or may be driven automatically by a driving device (e.g., a motor), and is not limited in this respect. The number of the first door bodies may also be the same as that of the at least one first through hole 22, and the at least one first door body opens or closes the at least one first through hole 22 respectively.

In still other embodiments, at least one first through hole 22 is not provided with a door body, and at least one second through hole 23 is provided with a second door body (not shown), and the second door body is used for opening or closing the at least one second through hole 23. In this way, the lateral flow of the air flow in the first cavity 213 can be controlled by the second door body.

The opening or closing of the second door body may be driven manually, or may be driven automatically by a driving device (e.g., a motor), which is not limited in this respect. The number of the second door bodies may also be the same as the number of the at least one second through hole 23, and the at least one second door body opens or closes the at least one second through hole 23 respectively.

In still other embodiments, a first door body is disposed at the at least one first through hole 22, and the first door body is configured to open or close the at least one first through hole 22, and a second door body is disposed at the at least one second through hole 23, and the second door body is configured to open or close the at least one second through hole 23. In this way, the second door and the second door can be combined to control the lateral flow of the air flow in the first cavity 213.

As shown in fig. 9, the chassis 2 also includes a circuit assembly 24. The circuit assembly 24 is disposed in the first cavity 213. The circuit assembly 24 is a circuit assembly for realizing the function of the chassis, and is a structure for generating heat loss in the chassis 2, and the cold airflow entering the first cavity 213 from the first opening 211 mainly exchanges heat with the circuit assembly 24 to cool the circuit assembly 24.

In order to enable the cold airflow to be discharged from the second opening 212 after the cold airflow is heat exchanged with the circuit assembly 24, the circuit assembly 24 does not block the communication path between the first opening 211 and the second opening 212 through the first cavity 213. Meanwhile, in order to enable the chassis 2 to perform lateral air supply through at least a portion of the first through holes 22 of the at least one first through hole 22 or at least a portion of the second through holes 23 of the at least one second through hole 23 to cool the entire circuit assembly 24, the circuit assembly 24 does not block a communication path between the at least one first through hole 22 and the first opening 211 through the first cavity 213, the circuit assembly 24 also does not block a communication path between the at least one first through hole 22 and the second opening 212 through the first cavity 213, the circuit assembly 24 also does not block a communication path between the at least one second through hole 23 and the first opening 211 through the first cavity 213, and the circuit assembly 24 also does not block a communication path between the at least one second through hole 23 and the second opening 212 through the first cavity 213. In this way, lateral wind compensation can be performed through at least part of the first through hole 22 or at least part of the second through hole 23, and the compensated wind can flow in the direction of the first opening 211 and the second opening 212 to cool the entire circuit assembly.

The circuit assembly 24 may take a variety of structural forms depending on the function it performs and its performance. In some embodiments, as shown in fig. 9, the circuit component 24 includes a hard disk unit 241 and a Central Processing Unit (CPU) 242. The hard disk unit 241 is used for storing data and information, the hard disk unit 241 is electrically connected to the central processing unit 242, and the central processing unit 242 is used for processing the data and information stored in or read out from the hard disk unit 241. The hard disk unit 241 is disposed in an end of the housing 21 close to the first opening 211, and the central processing unit 242 is disposed in an end of the housing 21 close to the second opening 212. The hard disk unit 241 includes a plurality of hard disks 241a, which are stacked and spaced apart in a direction perpendicular to the first direction.

The hard disk 241a in the hard disk unit 241 has a much higher probability of being damaged than the central processing unit 242, and therefore the cabinet 2 is maintained, and usually the hard disk 241a in the cabinet 2 is maintained, that is, the damaged hard disk 241a in the cabinet 2 is pulled out. Since the hard disk unit 241 is disposed at one end of the housing 21 close to the first opening 211, when the enclosure 2 provided in this embodiment is applied to the electronic device shown in fig. 7 and installed in a data center, the first opening 211 faces a cold air channel of the data center, and the cold air channel is a maintenance channel for an operator, so that the operator can maintain the hard disk 241a in the enclosure 2 through the first opening 211.

In order to further reduce the difficulty of the maintenance operation of the hard disk 241a in the hard disk unit 241, the hard disk unit 241 may be slidably coupled to the housing 21 as a whole in a direction parallel to the first direction, and when the hard disk 241a in the hard disk unit 241 needs to be maintained, the hard disk unit 241 may be drawn out through the first opening 211 so as to facilitate the maintenance of the hard disk 241a in the hard disk unit 241.

Since the central processing unit 242 is disposed in one end of the housing 21 close to the second opening 212, when a plurality of chassis 2 provided in this embodiment are stacked and installed in the second cavity 13 of the electronic device shown in fig. 7, as shown in fig. 10, the central processing unit 242 is disposed close to the backplane 14, so that the central processing unit 242 is electrically connected to the input/output card 3 in the third cavity 15 through the backplane 14.

In some embodiments, as shown in fig. 8 and 9, the stacking direction of the plurality of hard disks 241a in the hard disk unit 241 is parallel to the first sidewall 214, and the at least one first through hole 22 and the at least one second through hole 23 are opposite to the gap between the adjacent two hard disks 241 a.

Thus, on the one hand, since the hard disk unit 241 is disposed in the end of the housing 21 close to the first opening 211, the at least one first through hole 22 and the at least one second through hole 23 are disposed opposite to the gap between the adjacent two hard disks 241a, that is, the at least one first through hole 22 and the at least one second through hole 23 are disposed on the end of the housing 21 close to the first opening 211. When the plurality of housings 2 are stacked and mounted in the electronic apparatus shown in fig. 7, as shown in fig. 10, the first opening 211 of the housing 2 faces the third opening 11 of the machine frame, and the third opening 11 is an inlet into which outside cool air flows, so that the temperature of the airflow entering or exiting from the side direction through the at least one first through hole 22 and the at least one second through hole 23 is low, the pressure is high, and the circuit module 24 of the housing 2 or the circuit module 24 of the adjacent housing 2 can be cooled effectively.

On the other hand, since the stacking direction of the plurality of hard disks 241a in the hard disk unit 241 is parallel to the first side wall 214, and the at least one first through hole 22 and the at least one second through hole 23 are opposite to the gap between the adjacent two hard disks 241a, no interference is generated between the at least one first through hole 22 and the plurality of hard disks 241a, and between the at least one second through hole 23 and the plurality of hard disks 241a, facilitating the lateral ingress or egress of the air flow from the at least one first through hole 22 or the at least one second through hole 23.

After the airflow enters the adjacent chassis 2 laterally from at least a part of the first through holes 22 of the at least one first through hole 22 or at least a part of the second through holes 23 of the at least one second through hole 23, as shown in fig. 11, a part of the airflow flows along the first cavity 213 of the adjacent chassis 2 to the first opening 211 of the adjacent chassis 2, and another part of the airflow flows along the first cavity 213 of the adjacent chassis 2 to the second opening 212 of the adjacent chassis 2.

In order to avoid that the airflow entering the chassis 2 laterally from at least part of the at least one first through hole 22 or at least part of the at least one second through hole 23 of the at least one first through hole 22 or the at least one second through hole 23 of the chassis 2 is discharged entirely from the first opening 211 of the chassis 2, in some embodiments, as shown in fig. 12, 14 or 16, the chassis 2 further comprises a shielding structure 25. The shielding structure 25 is disposed at the first opening 211. The shielding structure 25 is movable between a first position a and a second position B, when the shielding structure 25 is located at the first position a, the shielding structure 25 does not shield the first opening 211; when the shielding structure 25 is located at the second position B, the shielding structure 25 partially shields the first opening 211.

In this way, when the fan 4 (shown in fig. 10) corresponding to the housing 2 operates normally, the shielding structure 25 may be driven to move to the first position a, so as to prevent the shielding structure 25 from shielding the airflow entering the first cavity 213 from the first opening 211, thereby ensuring the cooling effectiveness. When the fan 4 corresponding to the chassis 2 fails or is unplugged, the shielding structure 25 may be driven to move to the second position B, so as to prevent the airflow entering laterally from at least a part of the first through holes 22 of the at least one first through hole 22 or at least a part of the second through holes 23 of the at least one second through hole 23 of the chassis 2 from being discharged completely from the first opening 211 of the chassis 2, thereby resulting in failure to effectively cool the circuit components located in the portion of the housing 21 between the at least one first through hole 23 of the chassis 2 and the second opening 212 of the chassis 2.

The shielding structure 25 may have various structural forms and moving manners.

For example, fig. 12 is a schematic structural diagram of a chassis according to still other embodiments of the present application after removing a first sidewall. As shown in fig. 12, the shielding structure 25 includes a baffle plate, the baffle plate is parallel to the plane of the first opening 211, the baffle plate is translated between the first position a and the second position B along a direction parallel to the plane of the first opening 211, and when the shielding structure 25 is in the first position a, as shown in fig. 12, the baffle plate is located outside the first opening 211, and at this time, the baffle plate does not shield the first opening 211. When the shielding structure 25 is in the second position B, as shown in fig. 13, the baffle is located in the first opening 211, and the area of the baffle is smaller than that of the first opening 211, and the baffle partially shields the first opening 211. The structure is simple and easy to realize.

For another example, fig. 14 is a schematic structural diagram of a chassis provided in further embodiments of the present application after removing a first sidewall. As shown in fig. 14, the shielding structure 25 comprises a foldable telescopic structure, and when the shielding structure 25 is in the first position a, as shown in fig. 14, the foldable telescopic structure is in a folded state, and the thickness of the foldable telescopic structure is very small, it can be considered as not shielding the first opening 211. When the shielding structure 25 is in the second position B, as shown in fig. 15, the foldable telescopic structure is in an extended state, and there is a gap between the foldable telescopic structure and the first sidewall 214, and the foldable telescopic structure partially shields the first opening 211. The structure is simple, the realization is easy, and the occupied space is small.

For another example, fig. 16 is a schematic structural diagram of a chassis according to still other embodiments of the present application after removing a first sidewall. As shown in fig. 16, the shielding structure 25 includes a plurality of blocking pieces 251, the plurality of blocking pieces 251 are arranged at intervals along a direction perpendicular to the first direction (X direction shown in fig. 16) and parallel to the first side wall 214 (shown in fig. 8), the plurality of blocking pieces 251 are all perpendicular to the first side wall 214, each of the plurality of blocking pieces 251 can be rotatably connected to the housing 21 or the circuit assembly, the rotation axis of each blocking piece 251 is perpendicular to the first side wall 214, and each blocking piece 251 can rotate around the rotation axis thereof between a position parallel to the first direction and a position perpendicular to the first direction. When the shielding structure 25 is located at the first position a, as shown in fig. 16, each of the plurality of baffles 251 is parallel to the first direction, and the thickness of the plurality of baffles 251 is very small, which can be considered as not shielding the first opening 211. When the shielding structure 25 is located at the second position B, as shown in fig. 17, each of the plurality of blocking pieces 251 is perpendicular to the first direction, two sides of each of the blocking pieces 251 have a gap, and the plurality of blocking pieces 251 partially shield the first opening 211. The structure is simple, the realization is easy, and the occupied space is small.

Specifically, as shown in fig. 16, a plurality of baffles 251 may be respectively disposed in one end of a plurality of gaps formed between a plurality of hard disks 241a in the hard disk unit near the first opening 211.

When the plurality of fans 4 are arranged in the third opening 11 of the machine frame 1 in an array, as shown in fig. 10, the plurality of chassis 2 may be stacked and installed in the second cavity 13 of the electronic device, and then the plurality of fans 4 are installed, or at least one chassis 2 and fan 4 may be assembled together and then installed in the machine frame 1, which is not limited herein.

Fig. 18 is a schematic structural diagram of a chassis according to still other embodiments of the present application. As shown in fig. 18, the chassis 2 includes a base plate 26. The substrate 26 includes, but is not limited to, a metal substrate and a plastic substrate, and two end edges of the substrate 26 along a first direction (i.e., the X direction shown in fig. 18) are a first edge 261 and a second edge 262, respectively. The substrate 26 is provided with at least one through hole 263.

As shown in fig. 18, the chassis 2 also includes a circuit assembly 24. The circuit assembly 24 is disposed on a substrate 26. The circuit component 24 is a circuit component that performs the function of the enclosure, and is a structure that generates heat loss in the enclosure 2, and cooling of the enclosure 2 is mainly cooling of the circuit component 24.

When the plurality of housings 2 shown in fig. 18 are stacked and mounted in the second cavity 13 of the electronic device shown in fig. 7, as shown in fig. 19, the stacking direction of the plurality of housings 2 is perpendicular to the second direction (i.e., the Y direction shown in fig. 19), the stacking direction of the plurality of housings 2 is perpendicular to the substrate 26 of each of the plurality of housings 2, the first edge 261 of the substrate 26 of the plurality of housings 2 is disposed near the third opening 11 of the machine frame 1, and the second edge 262 of the plurality of housings 2 is disposed near the fourth opening 12 of the machine frame 1.

In this way, gaps are formed between the substrates 26 of two adjacent cases 2 and between the substrate 26 of the uppermost case 2 and the top wall of the machine frame 1, and these gaps form independent air ducts, and the circuit components 24 are located in these air ducts, and these air ducts can laterally discharge or intake air through the at least one through hole 263.

Therefore, when the fans 4 operate simultaneously, the external cold air flow can be driven to flow into the second cavity 13 from the third opening 11, and pass through the air duct between every two adjacent cases 2 and the air duct between the uppermost case 1 and the top wall of the machine frame 1 to exchange heat with the circuit assembly 24 in the air duct. The heat-exchanged air flow is discharged to the external environment through the fourth opening 12. In this process, as shown in fig. 19, the air volume in the plurality of air ducts is approximately equal in speed, and the air flows in the two adjacent air ducts do not move with each other. When a part of the fans 4 in the plurality of fans 4 is damaged or a part of the fans 4 is unplugged to maintain the at least one enclosure 2 shielded by the part of the fans 4, as shown in fig. 20, a lateral air supplement may be performed to the at least one enclosure 2 through the at least one through hole 263 of the at least one enclosure 2 or the at least one through hole 263 of the enclosure 2 adjacent to the at least one enclosure 2, so as to effectively cool the at least one enclosure 2.

It should be noted that, in order to enable the chassis 2 to perform lateral air compensation through the at least one through hole 263, the at least one through hole 263 is not shielded by the circuit component 24, that is, a projection area of the circuit component 24 on the plane where the substrate 26 is located does not cover an occupied area of the at least one through hole 263 on the plane where the substrate 26 is located. In this way, when a plurality of the housings 2 are stacked and mounted in the electronic apparatus shown in fig. 7, at least one of the through holes 263 communicates with the air ducts on both sides of the substrate 26, and thus lateral air supply can be performed through the at least one through hole 263.

The number of the at least one through hole 263 is not particularly limited, and may be one or more. In some embodiments, as shown in fig. 18, the number of the at least one through hole 263 is plural, specifically 6.

The at least one through hole 263 may be disposed near the first edge 261, the second edge 262, and a middle portion of the substrate 26 along the first direction, which is not particularly limited herein. In some embodiments, as shown in fig. 18, at least one through hole 263 is disposed proximate to first edge 261. When a plurality of housings 2 are stacked and mounted in the electronic apparatus shown in fig. 7, as shown in fig. 19, the first edge 261 of the housing 2 is disposed close to the third opening 11 of the machine frame, and the third opening 11 is an inlet into which outside cool air flows, so that the temperature of the air flow entering or exiting from the side direction through the at least one through hole 263 is low, the pressure is high, and the housing 2 or the housing adjacent to the housing 2 can be cooled effectively.

In some embodiments, a door (not shown) is disposed at the at least one through hole 263, and the door is used for opening or closing the at least one through hole 263. In this way, the lateral flow of the air flow can be controlled by the door body.

The opening or closing of the door body may be driven manually, or may be driven automatically by a driving device (e.g., a motor), which is not limited specifically herein. The number of the door bodies may be one, and the door bodies open or close the at least one through hole 263 at the same time, and the number of the door bodies may also be the same as the number of the at least one through hole 263, and the at least one door body opens or closes the at least one through hole 263 respectively.

The circuit assembly 24 may take a variety of structural forms depending on the function it performs and its performance. In some embodiments, as shown in fig. 18, the circuit component 24 includes a hard disk unit 241 and a Central Processing Unit (CPU) 242. The hard disk unit 241 is used for storing data and information, the hard disk unit 241 is electrically connected to the central processing unit 242, and the central processing unit 242 is used for processing the data and information stored in or read out from the hard disk unit 241. The hard disk unit 241 is disposed on a portion of the substrate 26 near the first edge 261, and the central processing unit 242 is disposed on a portion of the substrate 26 near the second edge 262. The hard disk unit 241 includes a plurality of hard disks 241a, and the plurality of hard disks 241a are stacked and spaced apart in a direction perpendicular to the first direction and parallel to the substrate 26.

The hard disk 241a in the hard disk unit 241 has a much higher probability of being damaged than the central processing unit 242, and therefore the cabinet 2 is maintained, and usually the hard disk 241a in the cabinet 2 is maintained, that is, the damaged hard disk 241a in the cabinet 2 is pulled out. Since the hard disk unit 241 is disposed on the portion of the substrate 26 near the first edge 261, when the enclosure 2 provided in this embodiment is applied to an electronic device and installed in a data center, the first edge 261 is close to the cool air channel, which is a maintenance channel for an operator, so that the operator can maintain the hard disk 241a in the enclosure 2 from the side close to the first edge 261.

In order to further reduce the difficulty of the maintenance operation of the hard disk 241a in the hard disk unit 241, the hard disk unit 241 may be slidably connected to the base plate 26 as a whole in a direction parallel to the first direction, and when the hard disk 241a in the hard disk unit 241 needs to be maintained, the hard disk unit 241 may be drawn out from a side close to the first edge 261 so as to facilitate the maintenance of the hard disk 241a in the hard disk unit 241.

Since the cpu 242 is disposed on the portion of the substrate 26 near the second edge 262, when a plurality of chassis 2 provided in this embodiment are stacked and installed in the second cavity 13 of the frame 1 of the electronic device shown in fig. 7, as shown in fig. 19, the cpu 242 is disposed near the backplane 14, so that the cpu 242 can be electrically connected to the i/o card 3 in the third cavity 15 through the backplane 14.

In some embodiments, as shown in fig. 18, at least one through hole 263 is opposite to a gap between two adjacent hard disks 241 a.

Thus, on the one hand, since the hard disk units 241 are disposed on the portion of the substrate 26 near the first edge 261, the at least one through hole 263 is disposed opposite to the gap between the adjacent two hard disks 241a, that is, the at least one through hole 263 is disposed on the portion of the substrate 26 near the first edge 261. When a plurality of housings 2 are stacked and mounted in an electronic apparatus, as shown in fig. 19, the first edge 261 of the housing 2 is close to the third opening 11 of the machine frame 1, and the third opening 11 is an inlet into which outside cool air flows, so that the temperature of the air flow entering or exiting from the side direction through the at least one through hole 263 is low, the pressure is high, and the circuit module 24 of the housing 2 or the circuit module 24 of the adjacent housing 2 can be cooled effectively.

On the other hand, since the at least one through hole 263 is opposite to the gap between the adjacent two hard disks 241a, interference is not generated between the at least one through hole 263 and the plurality of hard disks 241a, facilitating the lateral ingress or egress of the air flow from the at least one through hole 263.

After the airflow enters the adjacent air channel from the side direction of the at least one through hole 263, as shown in fig. 20, a part of the airflow flows along the adjacent air channel in a direction close to the first edge 261, and another part of the airflow flows along the adjacent air channel in a direction close to the second edge 262.

In order to avoid that the airflow entering the adjacent air duct from the at least one through hole 263 is discharged from the end of the adjacent air duct close to the first edge 261, in some embodiments, as shown in fig. 21, the housing 2 further includes a shielding structure 25. The shielding structure 25 is disposed on the first edge 261. The shielding structure 25 is movable between a first position a and a second position B, and when the shielding structure 25 is located at the first position a, the shielding structure does not shield the circuit component 24 from a side of the circuit component 24 close to the first edge 261; when the shielding structure is located at the second position B, the shielding structure 25 partially shields the circuit component 24 from a side of the circuit component 24 close to the first edge 261.

In this way, when the fan 4 (as shown in fig. 19) corresponding to the chassis 2 operates normally, the shielding structure 25 may be driven to move to the first position a, so as to prevent the shielding structure 25 from shielding the airflow entering the air duct between the substrates 26 of two adjacent chassis 2, thereby ensuring the cooling efficiency of the circuit assembly 24. When the fan 4 corresponding to the chassis 2 fails or is unplugged, the shielding structure 25 may be driven to move to the second position B, so as to prevent the airflow entering the adjacent air duct from the at least one through hole 263, from being exhausted from the end of the adjacent air duct close to the first edge 261, and thus the circuit components on the portion of the substrate 26 between the at least one through hole 263 of the chassis 2 and the second edge 262 of the chassis 2 cannot be effectively cooled.

For example, fig. 21 is a schematic structural diagram of a chassis according to still other embodiments of the present application. As shown in fig. 21, the shielding structure 25 includes a baffle plate perpendicular to the first direction (i.e., the X direction in fig. 21), the baffle plate is translated between a first position a and a second position B along the direction perpendicular to the first direction, and when the shielding structure 25 is in the first position a, as shown in fig. 12, the baffle plate is not located on a side of the circuit component 24 close to the first edge 261, and the baffle plate does not shield the circuit component 24 from the side of the circuit component 24 close to the first edge 261. When the shielding structure 25 is in the second position B, as shown in fig. 22, the baffle is located on a side of the circuit component 24 close to the first edge 261, and the height of the baffle is smaller than the maximum height of the circuit component protruding from the surface of the substrate 26, and the baffle partially shields the circuit component 24 from the side of the circuit component 24 close to the first edge 261. The structure is simple and easy to realize.

For another example, fig. 23 is a schematic structural diagram of a chassis according to still other embodiments of the present application. As shown in fig. 23, the shielding structure 25 includes a foldable telescopic structure, and when the shielding structure 25 is in the first position a, as shown in fig. 23, the foldable telescopic structure is in a folded state, and the thickness of the foldable telescopic structure is very small, it can be considered that the foldable telescopic structure does not shield the circuit component 24 from a side of the circuit component 24 near the first edge 261. When the shielding structure 25 is in the second position B, as shown in fig. 24, the foldable retractable structure is in an extended state, and the height of the protruding substrate 26 of the foldable retractable structure is less than the maximum height of the surface of the protruding substrate 26 of the circuit component, and the foldable retractable structure partially shields the circuit component 24 from a side of the circuit component 24 near the first edge 261. The structure is simple, the realization is easy, and the occupied space is small.

For another example, fig. 25 is a schematic structural diagram of a chassis according to still other embodiments of the present application. As shown in fig. 25, the shielding structure 25 includes a plurality of blocking pieces 251, the plurality of blocking pieces 251 are arranged at intervals along a direction perpendicular to the first direction (X direction shown in fig. 25) and parallel to the substrate 26, and the plurality of blocking pieces 251 are all perpendicular to the substrate 26, each of the plurality of blocking pieces 251 is rotatably connected to the substrate 26 or the circuit assembly, the rotation axis of each of the plurality of blocking pieces 251 is perpendicular to the substrate 26, and each of the plurality of blocking pieces 251 is capable of rotating around its rotation axis between a position parallel to the first direction and a position perpendicular to the first direction. When the shielding structure 25 is located at the first position a, as shown in fig. 25, each of the plurality of blocking pieces 251 is parallel to the first direction, the thickness of the plurality of blocking pieces 251 is very small, and it can be considered that the plurality of blocking pieces 251 do not shield the circuit assembly 24 from the side of the circuit assembly 24 close to the first edge 261. When the shielding structure 25 is located at the second position B, as shown in fig. 26, each of the plurality of blocking pieces 251 is perpendicular to the first direction, two sides of each of the plurality of blocking pieces 251 have a gap, and the plurality of blocking pieces 251 partially shield the circuit assembly 24 from a side of the circuit assembly 24 close to the first edge 261. The structure is simple, the realization is easy, and the occupied space is small.

Specifically, as shown in fig. 25, a plurality of blocking pieces 251 may be respectively disposed in one end of a plurality of gaps formed between a plurality of hard disks 241a in the hard disk unit near the first edge 261.

When the plurality of fans 4 are arranged in the third opening 11 of the machine frame 1 in an array, as shown in fig. 19, the plurality of chassis 2 may be stacked and installed in the second cavity 13 of the electronic device, and then the plurality of fans 4 are installed, or at least one chassis 2 and fan 4 may be assembled together and then installed in the machine frame 1, which is not limited herein.

In the description herein, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

Claims

1. A chassis, comprising:

the shell is provided with a first opening and a second opening at two ends along a first direction respectively, the shell is surrounded to form a first cavity communicated with the first opening and the second opening, the shell comprises a first side wall and a second side wall, the first side wall and the second side wall are both parallel to the first direction, the first side wall and the second side wall are parallel and opposite, the first side wall is provided with at least one first through hole, and the second side wall is provided with at least one second through hole;

a circuit component disposed within the first cavity and not blocking communication paths between the first opening and the second opening, between the at least one first through hole and the first opening, between the at least one first through hole and the second opening, between the at least one second through hole and the first opening, and between the at least one second through hole and the second opening through the first cavity.

2. The chassis according to claim 1, wherein a number of at least some of the at least one first through holes is equal to a number of at least some of the at least one second through holes, the at least some first through holes are in one-to-one correspondence with the at least some second through holes, and a projection area of each of the at least some first through holes on a plane where the second side wall is located is at least partially overlapped with an occupation area of a corresponding second through hole of the at least some first through holes on a plane where the second side wall is located.

3. A cabinet according to claim 1 or 2, wherein the at least one first through hole is disposed on an end of the first side wall near the first opening, and the at least one second through hole is disposed on an end of the second side wall near the first opening.

4. The chassis according to any one of claims 1 to 3, wherein a first door body is arranged at the at least one first through hole, the first door body is used for opening or closing the at least one first through hole, and a door body is not arranged at the at least one second through hole;

or a door body is not arranged at the at least one first through hole, a second door body is arranged at the at least one second through hole, and the second door body is used for opening or closing the at least one second through hole;

or a first door body is arranged at the at least one first through hole and used for opening or closing the at least one first through hole, a second door body is arranged at the at least one second through hole and used for opening or closing the at least one second through hole.

5. The chassis of any of claims 1-4, further comprising:

the shielding structure is arranged at the first opening and can move between a first position and a second position, when the shielding structure is positioned at the first position, the shielding structure does not shield the first opening, and when the shielding structure is positioned at the second position, the shielding structure partially shields the first opening.

6. A cabinet according to claim 5, wherein the shielding structure includes a plurality of blocking pieces, the blocking pieces are arranged at intervals along a direction perpendicular to the first direction and parallel to the first side wall, and are all perpendicular to the first side wall, each blocking piece of the blocking pieces can be rotatably connected to the housing or the circuit assembly, the rotation axis of each blocking piece is perpendicular to the first side wall, and each blocking piece can rotate around the rotation axis thereof between a position parallel to the first direction and a position perpendicular to the first direction;

when each baffle plate in the plurality of baffle plates is parallel to the first direction, the shielding structure is located at the first position;

when each baffle plate in the plurality of baffle plates is perpendicular to the first direction, the shielding structure is located at the second position.

7. The chassis according to any one of claims 1 to 6, wherein the circuit assembly includes a hard disk unit and a central processing unit, the hard disk unit being electrically connected to the central processing unit;

the hard disk unit is arranged in one end, close to the first opening, of the shell, and the central processing unit is arranged in one end, close to the second opening, of the shell.

8. The chassis of claim 7, wherein the hard disk unit includes a plurality of hard disks stacked and spaced apart in a direction parallel to the first sidewall and perpendicular to the first direction;

the at least one first through hole and the at least one second through hole are opposite to a gap between two adjacent hard disks.

9. A chassis, comprising:

the substrate is provided with at least one through hole, and the edges of two ends in the first direction are respectively a first edge and a second edge;

the circuit component is arranged on the substrate and does not shield the at least one through hole.

10. A cabinet according to claim 9, wherein the at least one through hole is disposed adjacent to the first edge.

11. A cabinet according to claim 9 or 10, wherein a damper is provided at the at least one through hole, the damper being adapted to open or close the at least one through hole.

12. The chassis of any of claims 9-11, further comprising:

the shielding structure is arranged on the first edge of the substrate and can move between a first position and a second position, when the shielding structure is located at the first position, the shielding structure does not shield the circuit assembly from one side of the circuit assembly close to the first edge, and when the shielding structure is located at the second position, the shielding structure partially shields the circuit assembly from one side of the circuit assembly close to the first edge.

13. The chassis of claim 12, wherein the shielding structure includes a plurality of baffles spaced apart in a direction perpendicular to the first direction and parallel to the substrate, and each of the plurality of baffles is perpendicular to the substrate, each of the plurality of baffles being rotatably connected to the substrate or the circuit assembly, the axis of rotation of each of the plurality of baffles being perpendicular to the substrate, each of the plurality of baffles being rotatable about its axis of rotation between a position parallel to the first direction and a position perpendicular to the first direction;

14. The chassis according to any one of claims 9 to 13, wherein the circuit assembly includes a hard disk unit and a central processing unit, the hard disk unit being electrically connected to the central processing unit;

the hard disk unit is arranged on a part of the substrate close to the first edge, and the central processing unit is arranged on a part of the substrate close to the second edge.

15. The chassis of claim 14, wherein the hard disk unit includes a plurality of hard disks stacked and spaced apart in a direction perpendicular to the first direction and parallel to the substrate;

the at least one through hole is opposite to a gap between two adjacent hard disk units.

16. An electronic device, comprising:

the machine frame is provided with a third opening and a fourth opening at two ends in a second direction respectively, a second cavity is enclosed by the machine frame, one end, facing the third opening, of the second cavity is communicated with the third opening, and one end, facing the fourth opening, of the second cavity is communicated with the fourth opening;

a plurality of chassis, each of the chassis being as claimed in any one of claims 1 to 8, the plurality of chassis being stacked and installed in the second cavity, and the stacking direction of the plurality of chassis being perpendicular to the second direction, the stacking direction of the plurality of chassis being perpendicular to the first sidewall of each of the plurality of chassis, the outer surfaces of the first sidewalls of the plurality of chassis facing in the same direction, the first openings of the plurality of chassis facing in the third opening of the machine frame, the second openings of the plurality of chassis facing in the fourth opening;

and the fan arrays are arranged in the third opening, the air outlet surfaces of the fans are opposite to the first openings of the cases, or the fan arrays are arranged in the fourth opening, and the air inlet surfaces of the fans are opposite to the second openings of the cases.

17. An electronic device, comprising:

a plurality of chassis, each of the chassis being as claimed in any one of claims 9 to 15, the plurality of chassis being stacked and mounted in the second cavity, and a stacking direction of the plurality of chassis being perpendicular to the second direction, the stacking direction of the plurality of chassis being perpendicular to the substrate of each of the plurality of chassis, a first edge of the substrate of the plurality of chassis being disposed near the third opening of the machine frame, and a second edge of the substrate of the plurality of chassis being disposed near the fourth opening;

and the fan arrays are arranged in the third opening, the air outlet surfaces of the fans face the first edges of the substrates of the cases, or the fan arrays are arranged in the fourth opening, and the air inlet surfaces of the fans face the second edges of the substrates of the cases.