CN113573495A - Automatic chip mounter - Google Patents
Automatic chip mounter Download PDFInfo
- Publication number
- CN113573495A CN113573495A CN202110820619.7A CN202110820619A CN113573495A CN 113573495 A CN113573495 A CN 113573495A CN 202110820619 A CN202110820619 A CN 202110820619A CN 113573495 A CN113573495 A CN 113573495A
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- CN
- China
- Prior art keywords
- axis
- spline shaft
- chip mounter
- axis motor
- motor
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention discloses an automatic chip mounter which comprises a machine table, wherein a display and a safety door capable of axially rotating are respectively arranged at the front end and the rear end of the machine table, a feeding mechanism, an X-axis track, a Y-axis track, station bases, an industrial camera and a chip mounting head are arranged in the machine table, the chip mounting head is arranged on the side surface of the Y-axis track, the Y-axis track is arranged on the X-axis track, a plurality of elements are placed on each station base and are absorbed by the chip mounting head, the chip mounting head absorbs the elements to carry out surface mounting operation on a PCB (printed circuit board) conveyed by the feeding mechanism, the industrial camera is arranged on the side surface of the station base, the chip mounting head comprises a spline shaft, a suction nozzle arranged at the tail end of the spline shaft, a Z-axis motor and an R-axis motor, the spline shaft is driven by the Z-axis motor to move up and down, and the spline shaft is driven by the R-axis motor to horizontally rotate. The chip mounter can realize the automation of feeding and mounting and can mount the PCBs with different sizes, so that the production efficiency is high.
Description
Technical Field
The invention relates to the technical field of PCB (printed circuit board) surface mounting processing, in particular to an automatic surface mounting machine.
Background
The chip mounter is also called a mounter or a surface mounting system (surface mounting system), and is configured behind a dispensing machine or a screen printer in a production line, and is a device for accurately placing surface mounted components on a PCB pad by moving a mounting head, and the device is divided into a manual device and a full-automatic device. The full-automatic chip mounter is a device for realizing full-automatic component mounting at high speed and high precision, and is the most critical and complex device in the whole SMT (surface mount technology — abbreviation) production. Chip mounters are main devices in SMT production lines, have been developed from early low-speed mechanical chip mounters to high-speed optical centering chip mounters, and have been developed towards multifunctional and flexible connection modularization.
However, the existing chip mounter has low automation degree, can only realize the automation of mounting, cannot realize the automation of feeding raw materials and a PCB, and is low in production efficiency, and cannot adapt to PCBs of different sizes for chip mounting, so that the technical scheme of the application is urgently needed to solve the problems.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides an automatic chip mounter which can realize the automation of feeding and mounting and can mount PCBs (printed circuit boards) with different sizes, so that the production efficiency is high.
The invention is realized in such a way that an automatic chip mounter is provided, which comprises a machine table, wherein the front end and the rear end of the machine table are respectively provided with a display and a safety door capable of axially rotating, the machine table is internally provided with a feeding mechanism, an X-axis track, a Y-axis track, a station base, an industrial camera and a chip mounting head, the chip mounting head is arranged on the side surface of the Y-axis track, the Y-axis track is arranged on the X-axis track, a plurality of elements are placed on each station base and are absorbed by the chip mounting head, the chip mounting head sucks a component to carry out mounting operation on the PCB conveyed by the feeding mechanism, the industrial camera is arranged on the side surface of the station base and records the position of the component on the station base, the patch head comprises a spline shaft, a suction nozzle arranged at the tail end of the spline shaft, a Z-axis motor and an R-axis motor, the Z-axis motor enables the spline shaft to move up and down, and the R-axis motor enables the spline shaft to horizontally rotate.
Furthermore, the station bases are provided with two groups, and each group of station bases is correspondingly arranged below the safety door.
Further, feed mechanism includes the bottom plate, install two sets of splint mechanisms on the bottom plate, it is a set of suction nozzle box and throw the material box are installed in the outside of splint mechanism, and is a set of backstop mechanism, roof mechanism and inductor, another group are installed to splint mechanism's inboard be fixed with the IC tray on splint mechanism's the outside bottom plate, be equipped with in the splint mechanism through conveying motor driven flat belt, it is two sets of linear guide rail and ball screw are all violently passed to the both ends inside of splint mechanism, the synchronizing wheel is installed to ball screw's one end.
Further, one group of the clamping plate mechanisms is fixed on the bottom plate, and the other group of the clamping plate mechanisms moves along with the rotation of the ball screw.
Furthermore, the synchronizing wheel is driven by the width adjusting motor through the synchronous belt, and when the width adjusting motor is driven, the ball screw is driven to rotate so that the other clamping plate mechanism can move, so that the distance between the two clamping plate mechanisms can be adjusted, and the air cylinder is used for clamping the PCB plates with different sizes.
Furthermore, two ends of the bottom of the Y-axis track are respectively fixed with a track base, the track bases slide on the X-axis track, and the industrial camera is fixed on the outer side of the track bases.
Further, the paster head is installed in Y axle track side through the bracket, the mark camera is still installed to R axle motor one side, R axle motor is equipped with two, every R axle motor passes through the belt and drives three integral key shaft level rotations.
Furthermore, the chip mounting head moves on the X-axis track and the Y-axis track, reaches the position above the base of the station and absorbs elements through the suction nozzle, the marking camera continuously shoots and records the marking point information of the PCB in the moving process, after the marking point information is processed by the control module in the machine table, the R-axis motor drives the spline shaft to rotate, the Z-axis motor drives the spline shaft to mount downwards through the belt, and the mounting action is completed.
Furthermore, the control module comprises a power supply, an industrial personal computer and a control card which are connected with each other.
In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that: the X-axis track and the Y-axis track enable the chip mounting head to move flexibly, workpieces on the station base are extracted onto a PCB for chip mounting, the chip mounting head comprises a spline shaft, a suction nozzle installed at the tail end of the spline shaft, a Z-axis motor and an R-axis motor, the spline shaft is enabled to move up and down by the Z-axis motor, the spline shaft is enabled to rotate horizontally by the R-axis motor, and accuracy and efficiency of component installation can be improved; the feeding mechanism who sets up can realize the autoloading of PCB board to satisfy the clamp dress of not unidimensional PCB board, thereby guarantee that production efficiency is high.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention without limiting the invention. In the drawings:
fig. 1 is a schematic perspective view of an automatic placement machine according to an embodiment of the present invention.
Fig. 2 is a schematic internal perspective view of the automatic placement machine according to the embodiment shown in fig. 1.
Fig. 3 is a schematic top view of the automatic placement machine according to the embodiment shown in fig. 2.
Fig. 4 is an exploded view of a feeding mechanism in the automatic placement machine according to the embodiment shown in fig. 2.
Fig. 5 is a schematic perspective view of a pick-and-place head in the automatic pick-and-place machine according to the embodiment shown in fig. 2.
Fig. 6 is a schematic perspective view of a connection relationship between a spline shaft and an R-axis motor in the patch head according to the embodiment shown in fig. 5.
Fig. 7 is a schematic structural diagram of a principle of a control module in the automatic chip mounter according to the embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
As shown in fig. 1 to 6, the automatic chip mounter according to this embodiment includes a machine table 1, a display 2 and an axially rotatable safety door 3 are respectively disposed at front and rear ends of the machine table 1, wherein the safety door 3 is connected to a housing of the machine table 1 through a hinge, so that the safety door 3 can be opened and closed, and safety of the chip mounter in an operation process is ensured, and preferably, explosion-proof glass is embedded in the safety door 3, so that an internal state of the machine table 1 can be observed. A feeding mechanism 4, an X-axis track 5, a Y-axis track 6, a station base 7, an industrial camera 8 and a chip mounting head 9 are arranged in the machine table 1, and specifically, the X-axis track 5 adopts a ball screw transmission mode and is responsible for motion adjustment in the X-axis direction; the Y-axis track 6 adopts a linear motor transmission mode and is responsible for motion adjustment in the Y-axis direction; the paster head 9 is installed in Y axle track 6 side, Y axle track 6 is installed on X axle track 5, it is absorbed by paster head 9 to have placed a plurality of components on every station base 7, paster head 9 absorbs the PCB board that the component carried feeding mechanism 4 and carries out the dress operation, industry camera 8 is established in station base 7 side, industry camera 7 carries out the record to the position of component on station base 7, and is concrete, industry camera adopts six mesh cameras, promote the efficiency of record. The chip mounter head 9 includes a spline shaft 91, a suction nozzle 92 installed at the end of the spline shaft 91, a Z-axis motor 93 and an R-axis motor 94, the Z-axis motor 93 enables the spline shaft 91 to move up and down, the R-axis motor 94 enables the spline shaft 91 to horizontally rotate, the suction nozzle 92 can be guaranteed to move on the X, Y, Z shaft and horizontally rotate as a whole, the structure flexibility is high, and an external air source of the suction nozzle 92 has vacuum degree to suck components.
In this embodiment, there are two sets of the stand bases 7, each set of the stand base 7 is correspondingly disposed below the safety door 3, and there are 48 stands for the two sets of the stand bases 7 to place the components, specifically, the components are neatly placed on the stand bases 7 by the robot arm.
As shown in fig. 3-4, the feeding mechanism 4 includes a bottom plate 41, two sets of clamping mechanisms 42 are mounted on the bottom plate 41, a nozzle box 43 and a material throwing box 44 are mounted on the outer side of one set of clamping mechanisms 42, a stop mechanism 45, a top plate mechanism 46 and a sensor 47 are mounted on the inner side of one set of clamping mechanisms 42, an IC tray 48 is fixed on the outer bottom plate of the other set of clamping mechanisms 42, and the IC tray 48 is used for placing an IC chip. A flat belt driven by a transmission motor 49 is arranged in the clamping plate mechanisms 42, the interiors of two ends of the two groups of clamping plate mechanisms 42 transversely penetrate through the linear guide rail 50 and the ball screw 51, one end of the ball screw 51 is provided with a synchronizing wheel 52, and when the PCB conveying width (+0.5mm) is properly adjusted after the chip mounting is started; after the sensor 47 senses the PCB, the PCB starts to be transmitted to the stopping mechanism 45, and the air cylinder of the clamping plate mechanism 42 works to clamp the PCB; the PCB board, if large, may be attached using a top plate mechanism 46.
In this embodiment, one set of clamping mechanism 42 is fixed on the bottom plate 41, the other set of clamping mechanism 42 moves along with the rotation of the ball screw 51, the synchronizing wheel 52 is driven by the width adjusting motor 54 through the synchronizing belt 53, when the width adjusting motor 54 is driven, the ball screw 51 is driven to rotate so as to move the other set of clamping mechanism 42, thereby adjusting the distance between the two sets of clamping mechanisms 42, and the air cylinder 55 is used for clamping PCBs with different sizes.
In this embodiment, rail bases 61 are fixed to both ends of the bottom of the Y-axis rail 6, the rail bases 61 slide on the X-axis rail 5, and the industrial camera 8 is fixed to the outside of the rail bases 61, and can record the number of components and states on the rail bases 61.
In this embodiment, the placement head 9 is installed on the side of the Y-axis rail 6 through the bracket 97, the marking cameras 95 are further installed on one side of the R-axis motor 94, two R-axis motors 94 are provided, each R-axis motor 94 drives three spline shafts 91 to horizontally rotate through the belt 96, the placement head 9 moves on the X-axis rail 5 and the Y-axis rail 6, reaches the upper side of the station base 7 and sucks components through the suction nozzles 92, the marking cameras 95 continuously take pictures and record mark point information of the PCB during the moving process, after being processed by the control module in the machine 1, the R-axis motor 94 drives the spline shafts 91 to rotate, the Z-axis motor 93 drives the spline shafts 91 to be attached downwards through the belt, and the attaching action is completed.
As shown in fig. 7, the control module includes a power supply, an industrial personal computer, and a control card connected to each other, wherein the control card can control the feeding mechanism 4, the X-axis track 5, the Y-axis track 6, the industrial camera 8, and the placement head 9, so that the automated placement is performed.
The foregoing is a preferred embodiment of the present invention, and it should be noted that it would be apparent to those skilled in the art that various modifications and enhancements can be made without departing from the principles of the invention, and such modifications and enhancements are also considered to be within the scope of the invention.
Claims (9)
1. An automatic chip mounter comprises a machine table (1), wherein a display (2) and an axially-rotatable safety door (3) are arranged at the front end and the rear end of the machine table (1) respectively, the automatic chip mounter is characterized in that a feeding mechanism (4), an X-axis track (5), a Y-axis track (6), a station base (7), an industrial camera (8) and a chip mounting head (9) are arranged in the machine table (1), the chip mounting head (9) is installed on the side surface of the Y-axis track (6), the Y-axis track (6) is installed on the X-axis track (5), a plurality of elements are placed on each station base (7) and are sucked by the chip mounting head (9), the chip mounting heads (9) suck the elements to carry out mounting operation on a PCB (printed circuit board) conveyed by the feeding mechanism (4), the industrial camera (8) is arranged on the side surface of the station base (7), and the industrial camera (7) records the positions of the elements on the station base (7), the patch head (9) comprises a spline shaft (91), a suction nozzle (92) arranged at the tail end of the spline shaft (91), a Z-axis motor (93) and an R-axis motor (94), wherein the spline shaft (91) is made to move up and down by the Z-axis motor (93), and the spline shaft (91) is made to horizontally rotate by the R-axis motor (94).
2. The automatic chip mounter according to claim 1, wherein said station bases (7) are provided in two sets, and each set of said station bases (7) is correspondingly provided below the safety door (3).
3. The automatic chip mounter according to claim 1, wherein the feeding mechanism (4) comprises a bottom plate (41), two sets of clamping plate mechanisms (42) are mounted on the bottom plate (41), a suction nozzle box (43) and a material throwing box (44) are mounted on the outer side of one set of clamping plate mechanisms (42), a stop mechanism (45), a top plate mechanism (46) and a sensor (47) are mounted on the inner side of one set of clamping plate mechanisms (42), an IC tray (48) is fixed on the outer side bottom plate of the other set of clamping plate mechanisms (42), a flat belt driven by a conveying motor (49) is arranged in each clamping plate mechanism (42), a linear guide rail (50) and a ball screw (51) are transversely penetrated inside two ends of the two sets of clamping plate mechanisms (42), and a synchronizing wheel (52) is mounted at one end of the ball screw (51).
4. The automatic placement machine according to claim 3, wherein one of said clamping mechanisms (42) is fixed to the base plate (41), and the other of said clamping mechanisms (42) is moved in response to rotation of the ball screw (51).
5. The automatic chip mounter according to claim 3, wherein the synchronizing wheel (52) is driven by the width adjusting motor (54) through a synchronizing belt (53), when the width adjusting motor (54) is driven, the ball screw (51) is driven to rotate so that the other group of clamping plate mechanisms (42) can move, and therefore the distance between the two groups of clamping plate mechanisms (42) is adjusted, and an air cylinder (55) is used for clamping PCB plates with different sizes.
6. The automatic placement machine according to claim 1, wherein rail bases (61) are respectively fixed to two ends of the bottom of the Y-axis rail (6), the rail bases (61) slide on the X-axis rail (5), and the industrial camera (8) is fixed to the outer side of the rail bases (61).
7. The automatic chip mounter according to claim 1, wherein the chip mounter head (9) is mounted on the side of the Y-axis rail (6) through a bracket (97), the marking camera (95) is further mounted on one side of the R-axis motor (94), two R-axis motors (94) are provided, and each R-axis motor (94) drives three spline shaft (91) rods to horizontally rotate through a belt (96).
8. The automatic chip mounter according to any one of claims 1-7, wherein the chip mounter head (9) moves on the X-axis track (5) and the Y-axis track (6), reaches the position above the station base (7), sucks components through the suction nozzle (92), continuously photographs and records marking point information of the PCB during movement through the marking camera (95), after the marking point information is processed through the control module in the machine table (1), the R-axis motor (94) drives the rotation angle of the spline shaft (91), and the Z-axis motor (93) drives the spline shaft (91) to be mounted downwards through the belt, so that mounting operation is completed.
9. The automatic placement machine according to claim 8, wherein the control module comprises a power supply, an industrial personal computer and a control card connected to each other.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202110820619.7A CN113573495A (en) | 2021-07-20 | 2021-07-20 | Automatic chip mounter |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110820619.7A CN113573495A (en) | 2021-07-20 | 2021-07-20 | Automatic chip mounter |
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CN113573495A true CN113573495A (en) | 2021-10-29 |
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CN202110820619.7A Pending CN113573495A (en) | 2021-07-20 | 2021-07-20 | Automatic chip mounter |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116322014A (en) * | 2023-03-02 | 2023-06-23 | 惠州市天睿电子有限公司 | Automatic paster device of circuit board |
CN116528501A (en) * | 2023-06-28 | 2023-08-01 | 东莞市威新电子科技有限公司 | Precise component chip mounter |
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JP2000117592A (en) * | 1998-10-12 | 2000-04-25 | Yamagata Casio Co Ltd | Part mounting device and part feeding device |
KR101050840B1 (en) * | 2004-05-29 | 2011-07-21 | 삼성테크윈 주식회사 | Component mounting machine and its electronic component pickup mounting method |
CN102625593A (en) * | 2012-03-21 | 2012-08-01 | 广州市攀森机械设备制造有限公司 | LED (light emitting diode) chip mounter |
CN102905477A (en) * | 2012-08-24 | 2013-01-30 | 广东工业大学 | Cantilever type efficient chip mounter |
CN109462976A (en) * | 2018-12-25 | 2019-03-12 | 东莞市和达电子设备有限公司 | A kind of efficient accurately automatism card machine |
CN110352000A (en) * | 2019-06-17 | 2019-10-18 | 江苏华志珹智能科技有限公司 | A kind of high stability can bilateral feeding arch (bridge) type SMT chip mounter |
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2021
- 2021-07-20 CN CN202110820619.7A patent/CN113573495A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2000117592A (en) * | 1998-10-12 | 2000-04-25 | Yamagata Casio Co Ltd | Part mounting device and part feeding device |
KR101050840B1 (en) * | 2004-05-29 | 2011-07-21 | 삼성테크윈 주식회사 | Component mounting machine and its electronic component pickup mounting method |
CN102625593A (en) * | 2012-03-21 | 2012-08-01 | 广州市攀森机械设备制造有限公司 | LED (light emitting diode) chip mounter |
CN102905477A (en) * | 2012-08-24 | 2013-01-30 | 广东工业大学 | Cantilever type efficient chip mounter |
CN109462976A (en) * | 2018-12-25 | 2019-03-12 | 东莞市和达电子设备有限公司 | A kind of efficient accurately automatism card machine |
CN110352000A (en) * | 2019-06-17 | 2019-10-18 | 江苏华志珹智能科技有限公司 | A kind of high stability can bilateral feeding arch (bridge) type SMT chip mounter |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116322014A (en) * | 2023-03-02 | 2023-06-23 | 惠州市天睿电子有限公司 | Automatic paster device of circuit board |
CN116322014B (en) * | 2023-03-02 | 2024-07-16 | 惠州市天睿电子有限公司 | Automatic paster device of circuit board |
CN116528501A (en) * | 2023-06-28 | 2023-08-01 | 东莞市威新电子科技有限公司 | Precise component chip mounter |
CN116528501B (en) * | 2023-06-28 | 2023-12-08 | 东莞市威新电子科技有限公司 | Precise component chip mounter |
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