CN113556021B

CN113556021B - Power unit assembly

Info

Publication number: CN113556021B
Application number: CN202010252302.3A
Authority: CN
Inventors: 席文杰; 徐佳巍
Original assignee: Atlas Copco Wuxi Compressor Co Ltd
Current assignee: Atlas Copco Wuxi Compressor Co Ltd
Priority date: 2020-04-01
Filing date: 2020-04-01
Publication date: 2026-01-27
Anticipated expiration: 2040-04-01
Also published as: CN113556021A

Abstract

This invention discloses a power unit assembly. The power unit assembly includes: a power unit, the power unit comprising: a power structure having multiple pins; and multiple stacked busbars, wherein at least one pin is connected to the busbar through only one layer of the busbar, and the at least one pin is offset from and electrically insulated from the other busbars. According to the power unit assembly of this invention, by connecting the pin to the busbar through only one layer of the busbar, and by offsetting the pin from the other busbars, the number of holes drilled on other busbars can be reduced, simplifying the busbar manufacturing process, and improving the electrical insulation performance between the pin and other busbars.

Description

Power unit assembly

Technical Field

The invention relates to the technical field of frequency converters, in particular to a power unit assembly.

Background

In the existing frequency converter, a power structure is arranged on a substrate and is suitable for being connected with a driving circuit board and a multi-layer busbar, a plurality of layers of positive and negative busbars are simultaneously penetrated through pins of the power structure, the pins are connected with the multi-layer busbar simultaneously, and short circuits are easily generated between the adjacent busbars, so that the normal use of the frequency converter is affected. In addition, in the existing frequency converter power unit component, pins of a power structure pass through the multilayer bus bars through the via holes at the same time, and a traditional welding process (such as wave soldering and the like) cannot be used, because the via holes are arranged in the metal bus bars, the heat dissipation area is large, and when the traditional welding process is used, heat is rapidly lost at welding points because of large area of the bus bars, and the temperature required by welding is difficult to reach. Therefore, only spot welding techniques such as electron beam welding and laser welding can be used to concentrate welding energy in a small range, thereby achieving the purpose of welding.

Disclosure of Invention

The present invention aims to solve, at least to some extent, one of the above technical problems in the prior art. Therefore, the invention provides a power unit assembly which can prevent pins from being electrically connected with other busbar.

The power unit assembly comprises a power unit and a plurality of stacked busbar, wherein the power unit comprises a power structure and a plurality of busbars, at least one pin is connected with the worn busbar in a mode of only penetrating one layer of busbar, and the at least one pin is misplaced and electrically insulated from other busbars.

According to the power unit component provided by the embodiment of the invention, the pins are connected with the penetrated busbar in a way of penetrating only one layer of busbar, and the pins are staggered with other busbars, so that the number of holes in other busbars can be reduced, the production and manufacturing procedures of the busbars are simplified, and the electric insulation performance between the pins and other busbars is ensured to be good.

According to some embodiments of the invention, the busbar has busbar connection portions, at least one pin of the power unit is only provided with one layer of busbar connection portions in a penetrating manner and is connected with the busbar, and the busbar connection portions are configured in a sheet shape.

Optionally, the busbar and the corresponding busbar connection portion are in the same plane.

Optionally, the busbar and the corresponding busbar connection portion are formed by a blanking process.

According to some embodiments of the invention, the busbar connection portion protrudes corresponding to at least one side edge of the busbar and the busbar connection portion is directly connected to the corresponding busbar.

According to some embodiments of the invention, the busbar connection portion is provided with a busbar connection portion through hole allowing the pin to pass through.

According to some embodiments of the invention, in two busbar connection parts corresponding to two adjacent pins, a busbar connection part through hole on one busbar connection part is located outside the outline of the other busbar connection part.

According to some embodiments of the invention, two pins in the same power structure are respectively connected with the busbar connection parts of the corresponding two busbars, and each pin is only connected with the corresponding busbar connection part in a penetrating way.

Further, any one of the two pins is connected with the corresponding busbar connection portion and is adjacent to or spaced apart from the other busbar connection portion side by side.

According to some embodiments of the invention, any one of the two pins is connected to a corresponding busbar connection, and a busbar connection through hole on one busbar connection is located outside the outline of the other busbar connection.

According to some embodiments of the invention, the remaining one of the pins in the same power structure is adapted to be connected to a driving circuit board, and the remaining one of the pins is directly connected to the driving circuit board in a form of no shielding of the busbar connection portion.

According to some embodiments of the invention, the same power structure has a first pin, a second pin, and a third pin, the third pin is located between the first pin and the second pin, the third pin is located outside the first pin and the second pin relative to the power structure, and a gap between the first pin and the second pin allows one busbar connection portion to be inserted into and connected with the third pin in a penetrating manner.

Further, the busbar connection portion penetrating the first pin and the busbar connection portion penetrating the third pin are partially laminated or staggered in a lamination direction of a plurality of busbars, and the second pin is suitable for being directly connected with a driving circuit board.

According to some embodiments of the invention, the busbar comprises a first busbar, a second busbar and a third busbar, wherein the busbar connecting part comprises a first busbar connecting part connected with the first busbar, a second busbar connecting part connected with the second busbar and a third busbar connecting part connected with the third busbar, the first busbar connecting part is positioned on one side of the first busbar, the second busbar connecting part is positioned on the other side of the second busbar opposite to the first busbar connecting part, and the third busbar connecting parts are respectively positioned on two sides of the third busbar.

Specifically, one of the first busbar and the second busbar is a positive busbar and the other is a negative busbar.

Further, the power cell assembly also includes a busbar clamp for clamping the first busbar and the second busbar.

According to some embodiments of the invention, each of the first, second and third busbar is rectangular in shape and is arranged in a stacked manner in the thickness direction of the busbar, and the busbar connection portion is formed on a longitudinal long side corresponding to the busbar.

According to some embodiments of the invention, the power structure comprises a first power structure and a second power structure, the pins of the first power structure and the pins of the second power structure are respectively located on opposite outer sides of the first power structure and the second power structure, the pins of the first power structure are located on the same side as the first busbar connection and the third busbar connection on the third busbar on the first side of the busbar, and the pins of the second power structure are located on the same side as the second busbar connection and the third busbar connection on the second side of the busbar.

According to some embodiments of the invention, a first busbar transfer end plate is disposed at one end of the first busbar, a second busbar transfer end plate is disposed at one end of the second busbar, the first busbar transfer end plate and the second busbar transfer end plate are disposed at the same end and side by side, and a third busbar transfer end plate is disposed at the other end of the third busbar opposite to the first busbar transfer end plate.

According to some embodiments of the invention, the first busbar, the second busbar and the third busbar are all flat panel busbars.

According to some embodiments of the invention, the busbar connection portion is provided with a through groove allowing the pins to pass through, and the through groove extends in a direction away from the busbar and penetrates through an outer edge of the busbar connection portion away from the busbar.

According to some embodiments of the invention, the busbar surface is entirely covered with an insulating film.

Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

Drawings

FIG. 1 is a schematic perspective assembly view of a power unit when the retaining structure includes a second retaining structure;

FIG. 2 is an assembled side view of the power unit when the retention structure includes a second retention structure;

FIG. 3 is an exploded perspective view of the power unit when the retaining structure includes a second retaining structure;

FIG. 4 is an exploded side view of the power unit when the retention structure includes a second retention structure;

FIG. 5 is a schematic perspective view of a power unit assembled when the substrate is provided with a protruding strip and the holding structure includes a second holding structure;

FIG. 6 is an exploded perspective view of a power cell when a recess is provided in a substrate and a retaining structure includes a second retaining structure;

FIG. 7 is a schematic perspective assembly of a power unit with a recess provided in a substrate and a retaining structure including a second retaining structure;

FIG. 8 is an assembled side view of a power unit with a recess provided in a substrate and a retaining structure including a second retaining structure;

FIG. 9 is a schematic perspective view of a tabletting structure;

FIG. 10 is a schematic perspective assembly view of a power unit when the retention structure includes a third retention structure;

FIG. 11 is an assembled side view of the power unit when the retention structure includes a third retention structure;

FIG. 12 is a schematic perspective assembly view of a power unit with a spacer when the retention structure includes a fourth retention structure;

FIG. 13 is an assembled side view of a power unit with a spacer when the retention structure includes a fourth retention structure;

FIG. 14 is a schematic perspective assembly view of a power unit without a spacer when the retention structure includes a fourth retention structure;

FIG. 15 is an assembled side view of a power unit without a spacer when the retention structure includes a fourth retention structure;

FIG. 16 is an exploded isometric view of a power cell assembly;

FIG. 17 is a schematic perspective assembly view of a power cell assembly;

FIG. 18 is an assembled side view of the power cell assembly;

FIG. 19 is a schematic diagram of the connection of a power structure to a tri-layer busbar;

FIG. 20 is an exploded perspective view of a power cell and a second busbar, a third busbar;

FIG. 21 is a schematic perspective view of a power unit assembled with a second busbar and a third busbar;

FIG. 22 is an exploded perspective view of a power cell and a third busbar;

FIG. 23 is a schematic perspective assembly of a power cell with a third busbar;

FIG. 24 is an exploded perspective view of the power cell assembly and the drive circuit board;

FIG. 25 is a schematic perspective view of an assembled power unit assembly and a drive circuit board;

Fig. 26 is an assembled side view of the power unit assembly and the drive circuit board.

Reference numerals:

Power module 10000, power unit assembly 1000, power unit 100, substrate 10, protrusion 11, groove 12, pressing structure 20, pressing body 21, pressing body positioning hole 211, pressing arm 22, first pressing arm 221, second pressing arm 222, pressing connection portion 23, bent section 24, power structure 30, first power structure 31, first connection leg 311, second power structure 32, second connection leg 321, first pin 331, second pin 332, third pin 333, holding structure 45, first holding structure 40, second holding structure 50, positioning piece 60, positioning port 61, annular positioning rib 62, positioning piece through hole 63, heat insulating structure 60', third holding structure 70, small diameter end 71, large diameter end 72, fourth holding structure 80, fastener 81, first busbar 201, first busbar connection portion 2011, first busbar transfer end plate 2012, first busbar body 2013, first busbar connection portion through hole 2014, second busbar 202, second busbar connection portion 2021, second busbar end plate 2022, second busbar end plate 2023, third busbar connection portion 2032, third busbar end plate 2034, third busbar connection portion 2022, third busbar connection portion 2033, third busbar connection portion 2034, third busbar connection portion 2021 and third busbar connection portion 2032.

Detailed Description

Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present invention and should not be construed as limiting the invention.

In the description of the present invention, it should be understood that the terms "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.

In the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed, mechanically connected, electrically connected, or in communication with each other, directly connected, indirectly connected via an intervening medium, or in communication between two elements or in an interactive relationship between the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.

Referring to fig. 24-26, the power module 10000 may include a power cell assembly 1000 and a driving circuit board 2000, optionally, the driving circuit board 2000 is located above the power cell assembly 1000. A power cell assembly 1000 according to an embodiment of the present invention is described in detail below in conjunction with fig. 1-26.

Referring to fig. 16-26, a power cell assembly 1000 according to an embodiment of the present invention may include a power cell 100, a plurality of stacked bus bars.

The power unit 100 may include a substrate 10, a presser structure 20, and a power structure 30, where a first side of the substrate 10 (i.e., an upper side in fig. 2) has a first side, the presser structure 20 is located on the first side of the substrate 10, and the power structure 30 is pressed against the first side of the substrate 10 by the presser structure 20.

The use of the presser structure 20 to press the power structure 30 against the first side of the substrate 10 ensures a secure and reliable mounting of the power structure 30 on the substrate 10.

Referring to fig. 1-9, the power unit 100 further includes a holding structure 45, where the holding structure 45 includes a first holding structure 40, the first holding structure 40 extends from the substrate 10 toward a direction away from the first side, and the first holding structure 40 penetrates the pressing structure 20 to hold the pressing structure 20 on the first side of the substrate 10, and further presses the pressing structure 20 against the power structure 30 to hold the power structure 30 on the first side of the substrate 10. In other words, referring to fig. 2 and 8, the first holding structure 40 is threaded through the tablet structure 20 from bottom to top, and the tablet structure 20 is held on the first side of the substrate 10 by the first holding structure 40, that is, when the first holding structure 40 is threaded through the tablet structure 20, the relative position of the tablet structure 20 and the substrate 10 is determined, and the first holding structure 40 can play a role of positioning the tablet structure 20.

In some embodiments, not shown, the clip structure 20 may also be directly secured, such as welded, to the base plate 10, eliminating the retaining structure 45, thereby facilitating a reduction in the number of connected components and thus the weight of the power unit 100.

Further, referring to FIGS. 1-8, the retaining structure 45 further includes a second retaining structure 50, the second retaining structure 50 being adapted to be coupled to the first retaining structure 40 such that the tabletting structure 20 is retained on the first side of the base plate 10. The second retaining structure 50 is connected to the first retaining structure 40 on the side of the tabletting structure 20 facing away from the base plate 10. As shown in fig. 2, the second holding structure 50 is connected to the first holding structure 40 at the upper side of the tabletting structure 20, and the upper side space of the tabletting structure 20 is wide, thus providing an operation space for mounting and dismounting the second holding structure 50. The wafer structure 20 is clamped between the second holding structure 50 and the substrate 10, while the power structure 30 is clamped between the wafer structure 20 and the substrate 10.

In the description of the present invention, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. Furthermore, the meaning of "a plurality of" means at least two, such as two, three, etc., unless specifically defined otherwise.

In the embodiment shown in fig. 1 to 8, the first holding structure 40 is configured as a columnar structure, the second holding structure 50 is configured as an annular structure that is sleeved with the columnar structure, and the tabletting structure 20 is clamped between the second holding structure 50 and the substrate 10 to prevent the tabletting structure 20 from being separated from the substrate 10.

Specifically, the first retaining structure 40 is perpendicular to the first side of the substrate 10, and the first retaining structure 40 has a free end far away from the substrate 10, and the second retaining structure 50 is screwed on the first retaining structure 40 from the side of the tabletting structure 20 far away from the substrate 10, so as to facilitate quick connection or disconnection between the second retaining structure 50 and the first retaining structure 40.

In some alternative embodiments, the first retaining structure 40 is configured as an externally threaded screw and the second retaining structure 50 is configured as an internally threaded nut that threadably engages the screw to facilitate installation and removal of the wafer structure 20.

Referring to fig. 1-8, the second retaining structure 50 presses against the side of the tabletting structure 20 facing away from the substrate 10, and the second retaining structure 50 can apply a pressing force to the tabletting structure 20 toward the substrate 10 to prevent the tabletting structure 20 from shaking, so that the connection between the tabletting structure 20 and the substrate 10 is more reliable.

Referring to fig. 1-9, the tabletting structure 20 comprises a tabletting body 21, the tabletting body 21 being formed as a concave channel structure concave towards the first side, the opening of the tabletting body 21 facing away from the first side. Referring to fig. 2 and 4, the tablet body 21 is formed in a concave groove structure recessed downward, and the opening of the tablet body 21 is directed upward.

Further, at least a portion of the second holding structure 50 is located in the concave groove of the tablet body 21, and the end face of the first holding structure 40 away from the free end of the substrate 10 (i.e., the upper end face of the first holding structure 40) is also located in the concave groove, whereby the distance between the end face of the first holding structure 40 away from the free end of the substrate 10 and the substrate 10 can be shortened, while the distance between the second holding structure 50 and the substrate 10 is shortened, so that the holding structure 45 is located in the concave groove of the tablet body 21 as much as possible, the size of the power unit 100 in the height direction can be reduced, and a larger usable space can be formed above the tablet structure 20, so that an installation space is left for other parts, preventing mutual interference from occurring at the time of installation.

In the embodiment shown in fig. 2, the second holding structure 50 is entirely located in the recessed groove, and the upper end surface of the first holding structure 40 is also located in the recessed groove, whereby the size of the power unit 100 in the height direction can be further reduced.

Referring to fig. 2, the overlapping dimension of the second holding structure 50 and the power structure 30 in the thickness direction of the power structure 30 exceeds half the thickness of the second holding structure 50, thereby ensuring that the second holding structure 50 is located as much as possible in the concave groove of the tablet body 21, and further the distance between the second holding structure 50 and the substrate 10 can be further reduced.

Referring to fig. 1-3, 5 and 7-9, the second holding structure 50 is pressed against the bottom wall of the tablet body 21, the first holding structure 40 penetrates through the bottom wall of the tablet body, and a tablet body positioning hole 211 adapted to the first holding structure 40 is formed in the bottom wall of the tablet body, and after the first holding structure 40 penetrates through the tablet body positioning hole 211 in the bottom wall of the tablet body, the tablet structure 20 can be initially positioned, so that the tablet structure 20 can be fixed by using the second holding structure 50 later.

Referring to fig. 9, the pressing structure 20 includes a pressing body 21 and a pressing arm 22, the pressing arm 22 is connected to the pressing body 21, and referring to fig. 1-2 and 5, the pressing arm 22 is used to press against the power structure 30, and the power structure 30 is clamped between the pressing structure 20 and the substrate 10.

Referring to fig. 1-8, the power structure 30 may include a first power structure 31 and a second power structure 32, the first power structure 31 and the second power structure 32 being spaced apart. The presser arm 22 comprises a first presser arm 221 and a second presser arm 222, the first presser arm 221 being adapted to press against the first power structure 31, the second presser arm 222 being adapted to press against the second power structure 32, the presser body 21 being located between the first power structure 31 and the second power structure 32, the retention structure 45 also being located between the first power structure 31 and the second power structure 32.

Further, the first power structure 31 has a first connection leg 311, the second power structure 32 has a second connection leg 321, the first connection leg 311 and the second connection leg 321 are located on opposite outer sides of the first power structure 31 and the second power structure 32, respectively, and the tablet body 21 is located between opposite inner sides of the first power structure 31 and the second power structure 32.

Optionally, an angle between the extending direction of the first connection leg 311 from the first power structure 31 and the extending direction of the second connection leg 321 from the second power structure 32 is 180 degrees. That is, the pins of the first connection leg 311 and the second connection leg 321 are disposed outwards, leaving a central space between the first power structure 31 and the second power structure 32, from which the holding structure 45 is convenient to fix the tabletting structure 20 on the substrate 10.

The pins of the first connection leg 311 and the second connection leg 321 each include a first pin 331, a second pin 332, and a third pin 333, each of which is adapted to be electrically connected to the driving circuit board 2000 or a corresponding busbar.

Referring to fig. 2 and 4, the extending direction of the first connection leg 311 from the first power structure 31 is leftward, the extending direction of the second connection leg 321 from the second power structure 32 is rightward, and the included angle between the two is 180 degrees, so that the first connection leg 311 and the second connection leg 321 can be prevented from interfering with the first power structure 31 and the second power structure 32 due to the closer distance between the first connection leg 311 and the second connection leg 321 when facing each other. Meanwhile, when the first power structure 31 and the second power structure 32 are connected with the corresponding busbar or the driving circuit board 2000, the first connection leg 311 and the second connection leg 321 face outward, which is convenient for corresponding operation.

Referring to fig. 1, 3, and 5 to 7, the first power structures 31 and the second power structures 32 are oppositely arranged in a first direction of the substrate 10, the first power structures 31 are plural, the plurality of first power structures 31 are arranged on the substrate 10 in a second direction of the substrate 10, the second power structures 32 are plural, the plurality of second power structures 32 are arranged on the substrate 10 in the second direction, the tabletting structures 20 are plural, and the plurality of tabletting structures 20 are arranged in the second direction, wherein the first direction and the second direction are perpendicular to each other. When the substrate 10 is rectangular, the first direction may be a width direction of the substrate 10, and the second direction may be a length direction of the substrate 10.

Further, the plurality of first power structures 31, the plurality of tabletting structures 20 and the plurality of second power structures 32 are in one-to-one correspondence in the first direction. A pair of first and second power structures 31, 32 disposed opposite each other may be pressed against the substrate 10 by the same press structure 20.

In some embodiments, not shown, the plurality of tabletting structures 20 may be separate individuals.

In the embodiment shown in fig. 1, 3 and 9, the plurality of tabletting structures 20 are integrally connected through the tabletting connection part 23, so that the assembling process of the plurality of tabletting structures 20 is saved, and the assembling efficiency of the power unit 100 is improved. Meanwhile, the integrated tabletting structure 20 can simultaneously press a plurality of power structures 30, and the crimping efficiency is high. The integrated tabletting structure 20 is pressed against the base plate 10 by two or more holding structures 45.

Further, the pad connecting portion 23 is connected between the pad bodies 21 of the adjacent two pad structures 20, and the width of the pad connecting portion 23 may be equal to the width of the pad bodies 21.

In the embodiment shown in fig. 1, 3 and 9, the pressing structure 20 includes a pressing body 21 and a pressing arm 22, the pressing body 21 is penetrated by the first holding structure 40, the pressing arm 22 is connected with the pressing body 21 side by side in a first direction of the substrate 10, and the pressing arm 22 is used for pressing against the power structure 30, the pressing structure 20 is a plurality of pressing structures 20, the plurality of pressing structures 20 are connected with each other in a second direction of the substrate 10, and the first direction and the second direction are perpendicular to each other.

Further, the presser arm 22 may include a first presser arm 221 and a second presser arm 222, the first and second presser arms 221 and 222 being symmetrically connected to both sides of the presser body 21, and the presser bodies 21 of the adjacent two presser structures 20 being connected to each other by a presser connection portion 23.

Referring to fig. 2, 4 and 9, the tablet body 21 is formed in a concave groove structure recessed toward the first side, the opening of the tablet body 21 faces away from the first side, the first tablet arm 221 and the second tablet arm 222 are connected to both ends of the opening of the tablet body 21, respectively, and the first tablet arm 221 and the second tablet arm 222 extend in a direction away from each other. Referring to fig. 2 and 4, the tablet body 21 is formed in a concave groove structure recessed downward, the opening of the tablet body 21 is directed upward, the first tablet arm 221 extends leftward, and the second tablet arm 222 extends rightward.

In some alternative embodiments, the power unit 100 may further include a positioning portion for positioning the power structure 30 on the substrate 10, thereby ensuring that the power structure 30 is accurately positioned on the substrate 10 and preventing the power structure 30 from arbitrarily shaking on the substrate 10.

In the embodiment shown in fig. 1-4, the positioning portion includes a positioning plate 60, and a positioning opening 61 is provided on the positioning plate 60, where the positioning opening 61 matches the power structure 30. For example, the outer peripheral surface of the power structure 30 and the positioning opening 61 are both rectangular, the power structure 30 is positioned in the positioning opening 61, the bottom of the power structure 30 is directly attached to the substrate 10, the substrate 10 may be a metal substrate 10, the heat of the power structure 30 may be transferred to the substrate 10, and a cooling device or a heating device may be disposed below the substrate 10 to cool or heat the power structure 30.

Optionally, as shown in fig. 3-4, the positioning plate 60 is further provided with an annular positioning rib 62 surrounding the positioning opening 61, and the annular positioning rib 62 is matched with the outer peripheral surface of the power structure 30. The annular positioning ribs 62 protrude from the surface of the positioning sheet 60, so that the positioning firmness of the power structure 30 can be increased, and the positioning effect is good.

In the embodiment shown in fig. 1-4, the spacer 60 is an insulating spacer, and the spacer 60 is adhesively fixed to the first side of the substrate 10.

Referring to fig. 1 and 3, the positioning sheet 60 is provided with a positioning sheet through hole 63 for matching with the first holding structure 40 and allowing the first holding structure 40 to pass through the positioning sheet through hole 63, and the positioning sheet 60 can be initially positioned after the first holding structure 40 passes through the positioning sheet through hole 63. The first holding structure 40 is connected to the second holding structure 50 after passing through the spacer through hole 63 on the spacer 60 and the spacer body positioning hole 211 on the spacer body 21, so as to fix the spacer 60 and the spacer structure 20 between the second holding structure 50 and the substrate 10.

In the embodiment shown in fig. 5, the positioning portion includes the convex strip 11 provided on the first side of the base plate 10, thereby saving the positioning piece 60, contributing to a reduction in the number of parts, and contributing to a saving in assembly man-hours.

Alternatively, the ribs 11 are continuous annular ribs 11, the annular ribs 11 matching the outer circumferential surface of the power structure 30.

Optionally, the protruding strips 11 corresponding to each power structure 30 are divided into four sections, and the four sections are respectively located on four sides of the rectangular power structure 30, so that the power structures 30 are limited in all directions, and the power structures 30 are better positioned on the substrate 10.

In the embodiment shown in fig. 6-8, the positioning portion comprises a groove 12 formed on the first side of the substrate 10, the peripheral wall of the groove 12 is adapted to mate with the peripheral surface of the power structure 30, preferably the groove 12 is a blind groove, and as shown in fig. 8, the bottom wall of the groove 12 is adapted to fit against the bottom surface of the power structure 30 to support the power structure 30. This embodiment also saves the spacer 60, which is advantageous in reducing the number of parts and assembly man-hours. Meanwhile, the recess 12 is directly formed on the first side of the substrate 10, the process is simple, the operability is strong, and referring to fig. 8, the bottom surface of the power structure 30 is lower than the first side of the substrate 10, thereby shortening the total height of the power structure 30 and the substrate 10 after assembly and reducing the volume of the power unit 100.

In some alternative embodiments, the power unit 100 may further include an insulating structure 60', the insulating structure 60' being disposed on the first side of the substrate 10 in a manner to surround the power structure 30. The heat insulation structure 60 'is located between the power structure 30 and the substrate 10, and the heat insulation structure 60' can separate the power structure 30 from the substrate 10, so as to prevent heat of the power structure 30 from affecting components below the substrate 10, and prevent heat below the substrate 10 from being transferred upwards to the power structure 30.

In some alternative embodiments, the first side of the substrate 10 is the side facing the busbar.

Referring to fig. 2, 4 and 9, the tabletting structure 20 is configured as a gull wing shape, and the tabletting structure 20 may include a tabletting body 21 and first and second tabletting arms 221 and 222, the first and second tabletting arms 221 and 222 are symmetrically connected at both sides of the tabletting body 21, and free ends of the first and second tabletting arms 221 and 222 each have a bending section 24 bent toward the substrate 10. The bending section 24 is adapted to press against the power structure 30 such that the power structure 30 presses against the substrate 10.

The upper side of the tabletting structure 20 forms a larger planar space, which provides a mounting space for other components (for example, a busbar), and the dimension of the power unit 100 and the busbar assembly in the height direction can be significantly shortened.

In some embodiments, referring to fig. 10-11, the retaining structure 45 may include a first retaining structure 40 and a third retaining structure 70, the third retaining structure 70 being disposed at a free end of the first retaining structure 40 remote from the substrate 10, the first retaining structure 40 being disposed on the substrate 10, and the third retaining structure 70 being disposed at an upper end of the first retaining structure 40, as shown in fig. 11. The third holding structure 70 may be configured as a buckle suitable for clamping the pressing structure 20, where the pressing structure 20 is fixed on the substrate 10 by the clamping manner, so that the installation and the disassembly of the pressing structure 20 are faster and more convenient, which is beneficial to saving operation time.

Specifically, the cross section of the buckle is gradually changed and has a small diameter end 71 and a large diameter end 72, referring to fig. 11, the upper end of the buckle is the small diameter end 71, the lower end is the large diameter end 72, the buckle forms a guiding conical surface suitable for guiding the penetrating tablet structure 20 from the small diameter end 71 to the large diameter end 72, the tablet structure 20 is provided with a buckle hole suitable for the penetrating of the buckle, the outer diameter of the small diameter end 71 is smaller than the diameter of the buckle hole, in a free state, the outer diameter of the large diameter end 72 is larger than the diameter of the buckle hole, and the large diameter end 72 forms a clamping surface suitable for clamping the tablet structure 20.

Further, the large diameter end 72 is located at one side of the small diameter end 71 near the substrate 10, and the small diameter end 71 is adapted to be fixed to the first holding structure 40, and the large diameter end 72 is adapted to be separated from the first holding structure 40, so that the large diameter end 72 can be elastically deformed to approach or separate from the first holding structure 40 in the circumferential direction, when the tabletting structure 20 passes over the buckle from top to bottom, the small diameter end 71 extends out of the buckle hole first, and the large diameter end 72 gathers towards the first holding structure 40 under the limit action of the wall of the buckle hole, so that the large diameter end 72 can smoothly pass over the buckle hole and reach above the tabletting structure 20, and the clamping surface of the large diameter end 72 is pressed against the upper surface of the tabletting structure 20, that is, the tabletting structure 20 is clamped between the third holding structure 70 and the substrate 10.

The presser body 21 is formed as a concave groove structure concave toward the substrate 10, and an opening of the presser body 21 faces away from the substrate 10. Referring to fig. 11, the tablet body 21 is formed in a concave groove structure recessed downward, and an opening of the tablet body 21 is directed upward.

At least a portion of the third holding structure 70 is located in the concave groove of the tablet body 21, and the end face of the first holding structure 40 away from the free end of the substrate 10 (i.e., the upper end face of the first holding structure 40) is also located in the concave groove, whereby the distance between the end face of the first holding structure 40 away from the free end of the substrate 10 and the substrate 10 can be shortened, while the distance between the third holding structure 70 and the substrate 10 is shortened, so that the holding structure 45 is located as much as possible in the concave groove of the tablet body 21, the size of the power unit 100 in the height direction can be reduced, and a larger available space can be formed above the tablet structure 20, which is convenient for leaving an installation space for other parts, preventing mutual interference from occurring at the time of installation.

In the embodiment shown in fig. 11, the third holding structure 70 is entirely located in the recessed groove, and the upper end surface of the first holding structure 40 is also located in the recessed groove, whereby the size of the power unit 100 in the height direction can be further reduced.

Referring to fig. 11, the overlapping dimension of the third holding structure 70 and the power structure 30 in the thickness direction of the power structure 30 exceeds half the thickness of the third holding structure 70, thereby ensuring that the second holding structure 50 is located as much as possible in the concave groove of the tablet body 21, and further the distance between the third holding structure 70 and the substrate 10 can be further reduced.

After the third holding structure 70 and the first holding structure 40 penetrate through the bottom wall of the tablet body, the third holding structure 70 presses against the bottom wall of the tablet body 21, so that the positioning and fixing of the tablet structure 20 can be realized.

In some embodiments, referring to fig. 12-15, the retaining structure 45 may include a fourth retaining structure 80, the fourth retaining structure 80 pressing against the plurality of compression bodies 21, and the fourth retaining structure 80 being secured to the base plate 10.

Specifically, referring to fig. 12 and 14, the fourth holding structure 80 spans the plurality of pressing bodies 21, and the longitudinal ends of the fourth holding structure 80 respectively extend beyond the outermost two of the plurality of pressing structures 20 and the extending portions are fixed to the base plate 10, so that the fourth holding structure 80 can firmly hold the plurality of pressing bodies 21 on the first side of the base plate 10, and when the power structure 30 is mounted in the power structure mounting space, the pressing structure 20 applies a pressing force toward the base plate 10 to the power structure 30, thereby effectively preventing the power structure 30 from falling.

Further, the above-mentioned excess portion and the substrate 10 are fixed by screw or clip. Referring to fig. 11 to 15, the fastener 81 is fixed to the base plate 10 after penetrating the excess portion, thereby achieving fixation of the fourth holding structure 80. The fastener 81 may be a bolt. The fourth holding structure 80 can be installed and removed by installing or removing the fasteners 81 at both ends, and the operation is fast and convenient.

Alternatively, the fourth holding structure 80 is configured as a pressing lever, the face of which facing the tablet body 21 is a pressing plane. By varying the length of the fourth holding structure 80, compaction of a different number of power structures 30 may be achieved.

The presser body 21 is formed as a concave groove structure concave toward the substrate 10, and an opening of the presser body 21 faces away from the substrate 10. Referring to fig. 13 and 15, the tablet body 21 is formed in a concave groove structure recessed downward, and the opening of the tablet body 21 is directed upward.

Further, at least a portion of the fourth holding structure 80 is located in the concave groove of the tablet body 21, whereby the distance between the fourth holding structure 80 and the substrate 10 can be shortened, so that the holding structure 45 is located as much as possible in the concave groove of the tablet body 21, the size of the power unit 100 in the height direction can be reduced, and a large usable space can be formed above the tablet structure 20, which is convenient for leaving an installation space for other parts, preventing mutual interference from occurring at the time of installation.

In the embodiment shown in fig. 13, the fourth retaining structure 80 is located entirely within the recessed channel.

Referring to fig. 16-26, the power structure 30 has a plurality of pins, such as a first pin 331, a second pin 332, and a third pin 333 of the first connection leg 311 and the second connection leg 321, at least one pin is connected with a mother board that is penetrated in a manner of penetrating only one layer of mother board, and the at least one pin is misplaced and electrically insulated from other mother boards. That is, the at least one pin does not need to pass through other busbar, and only needs to be perforated on the perforated busbar, so that the at least one pin passes through the hole, thereby reducing the number of perforation on other busbar and simplifying the production process of the power unit assembly 1000. Meanwhile, the at least one pin is staggered with other busbar, so that good insulation performance between the at least one pin and other busbar can be ensured.

According to the power unit assembly 1000 of the embodiment of the invention, the pins are connected with the penetrated busbar in a manner of penetrating only one layer of busbar, and the pins are staggered with other busbars, so that the number of holes in other busbars can be reduced, the production and manufacturing procedures of the busbars are simplified, and the electrical insulation performance between the pins and other busbars is ensured to be good.

In some alternative embodiments, the busbar has busbar connection portions, at least one pin of the power unit 100 is connected to the busbar in a form of penetrating only one layer of busbar connection portions, and the busbar connection portions are configured in a sheet shape. That is, for the busbar, the busbar connection part is only arranged at the position where the busbar is required to be connected with the pins, and the physical structure is not arranged at the position which is staggered with the pins, so that the material of the busbar is saved, and the cost is saved.

Optionally, the busbar and the corresponding busbar connecting part are positioned on the same plane, so that the busbar structure is simplified, and the busbar is convenient to process and manufacture.

Optionally, the busbar and the corresponding busbar connecting part are formed through a blanking process, the blanking process is simple and high in efficiency, the processing time of the busbar is shortened, and stray inductance is reduced.

In some alternative embodiments, the busbar connection portion protrudes from at least one side edge of the corresponding busbar, and the busbar connection portion is directly connected with the corresponding busbar, in other words, the busbar connection portion is connected with the corresponding busbar in a form of not passing through other connection pieces, so that the busbar structure can be ensured to be simple, the processing procedure of the busbar can be simplified, and stray inductance can be reduced.

In some alternative embodiments, the busbar connection portion is provided with a busbar connection portion through hole for allowing the pin to pass through. Pins of the power structure 30 extend into corresponding busbar connecting portion through holes and are electrically connected with the busbar where the busbar connecting portion is located.

In some alternative embodiments, in two busbar connection portions corresponding to two adjacent pins, the busbar connection portion through hole on one busbar connection portion is located outside the outline of the other busbar connection portion, thereby ensuring that each pin is connected only with the busbar connection portion through hole on the corresponding busbar connection portion, and not with the busbar connection portion through hole on the other busbar connection portion. It should be noted that, as used herein, two adjacent pins may be two adjacent pins of the same power structure 30, or two adjacent pins of different power structures 30.

In some alternative embodiments, referring to fig. 16-23, two pins in the same power structure 30 are respectively connected to the busbar connection portions of the corresponding two busbars, and each pin is only connected through the corresponding busbar connection portion. Referring to fig. 24-26, the remaining one pin in the same power structure 30 is adapted to be connected to a driver circuit board 2000.

Referring to fig. 16-19, the busbar includes a first busbar 201, a second busbar 202, and a third busbar 203, wherein the first busbar 201 includes a first busbar body 2013, the second busbar 202 includes a second busbar body 2023, the third busbar 203 includes a third busbar body 2033, and the busbar connection portion includes a first busbar connection 2011, a second busbar connection 2021, and a third busbar connection 2031, the first busbar connection 2011 is connected with the first busbar body 2013 of the first busbar 201, the second busbar connection 2021 is connected with the second busbar body 2023 of the second busbar 202, and the third busbar connection 2031 is connected with the third busbar body 2033 of the third busbar 203.

The first busbar connection 2011 is located on one side of the first busbar 201, the second busbar connection 2021 is located on the other side of the second busbar 202 opposite to the first busbar connection 2011, and the third busbar connection 2031 is located on both sides of the third busbar 203.

In some alternative embodiments, referring to fig. 16, the power structure 30 includes a first power structure 31 and a second power structure 32, where the pins of the first power structure 31 and the pins of the second power structure 32 are located on opposite outer sides of the first power structure 31 and the second power structure 32, respectively, the pins of the first power structure 31 are a first connection leg 311, the pins of the second power structure 32 are a second connection leg 321, and the first connection leg 311 and the second connection leg 321 each include a first pin 331, a second pin 332, and a third pin 333.

The pins 311 of the first power structure 31 are on the same side as the first busbar connection 2011 and the third busbar connection 2031 on the third busbar 203 on the first side of the busbar (e.g., the left side in fig. 16), and the pins 321 of the second power structure 32 are on the same side as the second busbar connection 2021 and the third busbar connection 2031 on the third busbar 203 on the second side of the busbar (e.g., the right side in fig. 16).

The first busbar connection 2011 has a first busbar connection through hole 2014, the second busbar connection 2021 has a second busbar connection through hole 2024, and the third busbar connection 2031 has a third busbar connection through hole 2034.

Specifically, referring to fig. 16-19 and 23-26, the first pin 331 of the first connection leg 311 is adapted to be inserted through the third busbar connection portion through hole 2034 on the third busbar connection portion 2031 to connect with the third busbar 203, the second pin 332 of the first connection leg 311 is adapted to be inserted through the driving circuit board 2000 to connect with the driving circuit board 2000, and the third pin 333 of the first connection leg 311 is adapted to be inserted through the first busbar connection portion through hole 2014 on the first busbar connection portion 2011 to connect with the first busbar 201.

Similarly, referring to fig. 20-26, the first pin 331 of the second connection leg 321 is adapted to be inserted through the second busbar connection portion through hole 2024 on the second busbar connection portion 2021 to connect with the second busbar 202, the second pin 332 of the second connection leg 321 is adapted to be inserted through the driving circuit board 2000 to connect with the driving circuit board 2000, and the third pin 333 of the second connection leg 321 is adapted to be inserted through the third busbar connection portion through hole 2034 on the third busbar connection portion 2031 to connect with the third busbar 203. The third busbar connection through holes 2034 on the third busbar connection 2031 on the first side of the busbar on the third busbar 203 are offset from the third busbar connection through holes 2034 on the third busbar connection 2031 on the second side of the busbar on the third busbar 203. As shown in fig. 20, the third busbar connection portion through holes 2034 on both sides of the third busbar 203 are not parallel to the short sides of the third busbar 203.

The stacking positions of the first busbar 201, the second busbar 202 and the third busbar 203 may be changed according to actual requirements. For example, the third busbar 203 may be located above the first busbar 201 and the second busbar 202, or may be located between the first busbar 201 and the second busbar 202.

Further, any one of the two pins in the same power structure 30 is connected to the corresponding busbar connection portion and is adjacent to or spaced apart from the other busbar connection portion side by side.

As shown in fig. 16 to 17, the first pin 331 of the first connection foot 311 is connected to the third busbar connection portion 2031 and spaced apart from the first busbar connection portion 2011, the third pin 333 of the first connection foot 311 is connected to the first busbar connection portion 2011 and spaced apart from the third busbar connection portion 2031, the first pin 331 of the second connection foot 321 is connected to the second busbar connection portion 2021 and spaced apart from the third busbar connection portion 2031, and the third pin 333 of the second connection foot 321 is connected to the third busbar connection portion 2031 and spaced apart from the second busbar connection portion 2021.

In some alternative embodiments, any one of the two pins in the same power structure 30 is connected to a corresponding busbar connection, and the busbar connection through hole on one busbar connection is located outside the outline of the other busbar connection. As shown in fig. 16 to 17, the first pin 331 of the first connection leg 311 is connected to the third busbar connection portion 2031 with the third busbar connection portion through hole 2034 on the third busbar connection portion 2031 being located outside the outline of the first busbar connection portion 2011, the third pin 333 of the first connection leg 311 is connected to the first busbar connection portion 2011 with the first busbar connection portion through hole 2014 on the first busbar connection portion 2011 being located outside the outline of the third busbar connection portion 2031, the first pin 331 of the second connection leg 321 is connected to the second busbar connection portion 2021 with the second busbar connection portion through hole 2024 on the second busbar connection portion 2021 being located outside the outline of the third busbar connection portion 2031, and the third pin 333 of the second connection leg 321 is connected to the third busbar connection portion 2031 with the third busbar connection portion 2034 on the third busbar connection portion 2031 being located outside the outline of the second busbar connection portion 2021.

Referring to fig. 24-26, the remaining one pin of the same power structure 30 is adapted to be connected to the driving circuit board 2000, and the remaining one pin is directly connected to the driving circuit board 2000 in a form without shielding of a busbar connection portion. For example, the second pin 332 of the first power structure 31 is connected to the driving circuit board 2000 without shielding a busbar connection between the second pin 332 of the first power structure 31 and the driving circuit board 2000, and the second pin 332 of the second power structure 32 is connected to the driving circuit board 2000 without shielding a busbar connection between the second pin 332 of the second power structure 32 and the driving circuit board 2000.

In some alternative embodiments, referring to fig. 1,3, 16-17, 19-21, and 25, the same power structure 30 has a first pin 331, a second pin 332, and a third pin 333, where the third pin 333 is located between the first pin 331 and the second pin 332, and referring to fig. 2,4, 8, 18, and 26, the third pin 333 is located outside the first pin 331 and the second pin 332 with respect to the power structure 30, and the pins are staggered, so as to facilitate reasonably arranging connection points of the power structure 30 corresponding to the busbar. The gap between the first pin 331 and the second pin 332 allows one busbar connection to be inserted, and the busbar connection is penetratingly connected with the third pin 333.

For example, the gap between the first pin 331 and the second pin 332 of the first power structure 31 allows the first busbar connection 2011 to be inserted, and the first busbar connection 2011 is penetratingly connected with the third pin 333 of the first power structure 31. The gap between the first pin 331 and the second pin 332 of the second power structure 32 allows the third busbar connection 2031 to be inserted, and the third busbar connection 2031 is penetratingly connected with the third pin 333 of the second power structure 32.

Further, the busbar connection portion penetrating the first pin 331 and the busbar connection portion penetrating the third pin 333 are partially stacked or staggered in the stacking direction of the plurality of busbars, for example, as shown in fig. 16 to 17, the third busbar connection portion 2031 penetrating the first pin 331 of the first power structure 31 and the first busbar connection portion 2011 penetrating the third pin 333 are partially stacked or staggered in the stacking direction of the plurality of busbars, and the second busbar connection portion 2021 penetrating the first pin 331 of the second power structure 32 and the third busbar connection portion 2031 penetrating the third pin 333 are partially stacked or staggered in the stacking direction of the plurality of busbars. The design ensures that the welding spots of the power structure and the metal busbar are positioned at the convex positions of the edges of the busbar, and when the traditional welding process is used, the welding heat can be well kept at the welding spots, and the threshold of the production process is lower, so that the traditional process can be used for mass production.

Referring to fig. 24-26, the second pins 332 of the first power structure 31 and the second pins 332 of the second power structure 32 are adapted to be directly connected to the driving circuit board 2000.

Specifically, one of the first busbar 201 and the second busbar 202 is a positive busbar and the other is a negative busbar. The third busbar 203 is a phase row. For example, the first busbar 201 is a positive busbar, the second busbar 202 is a negative busbar, or the first busbar 201 is a negative busbar and the second busbar 202 is a positive busbar.

Further, the power cell assembly 1000 may further include a busbar clamp (not shown) for clamping the first busbar 201 and the second busbar 202, thereby facilitating the fitting of the first busbar 201 and the second busbar 202, and shortening the distance between the first busbar 201 and the second busbar 202, thereby further shortening the height dimension of the power cell assembly 1000.

In the embodiment shown in fig. 16 to 26, each of the first, second, and third bus bars 201, 202, and 203 is rectangular in shape, and the first, second, and third bus bars 201, 202, and 203 are arranged in a stack in the thickness direction of the bus bars, with bus bar connecting portions formed on the longitudinal long sides of the corresponding bus bars. Specifically, the first busbar connection 2011 is formed on a first side longitudinal long edge of the first busbar 201, the second busbar connection 2021 is formed on a second side longitudinal long edge of the second busbar 202, and the third busbar connection 2031 is formed on both side longitudinal long edges of the third busbar 203.

Referring to fig. 16-17 and 19-23, a first busbar transfer end plate 2012 is disposed at one end of the first busbar 201, a second busbar transfer end plate 2022 is disposed at one end of the second busbar 202, the first busbar transfer end plate 2012 and the second busbar transfer end plate 2022 are disposed at the same end and side by side, and a third busbar transfer end plate 2032 is disposed at the other end of the third busbar 203 opposite to the first busbar transfer end plate 2012, thereby facilitating a rational arrangement of the transfer end plates of the respective busbars.

In some alternative embodiments, the first busbar 201, the second busbar 202, and the third busbar 203 are each flat-plate busbars, thereby facilitating further reduction in the dimensions of the power cell assembly 1000 in the height direction.

In some embodiments, which may not be shown, the busbar connection portion is provided with a through slot allowing the pins to pass through, and the through slot extends in a direction away from the busbar and penetrates an outer edge of the busbar connection portion away from the busbar. For example, the through slot may be a "U" shaped slot with an opening facing outward, thereby facilitating threading or removal of the pins from the through slot.

In some alternative embodiments, the surface of the busbar is entirely covered with an insulating film, which can prevent the busbar from being electrically connected with other pins, and the insulating performance between two adjacent busbars is better.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Further, one skilled in the art can engage and combine the different embodiments or examples described in this specification.

While embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the invention, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the invention.

Claims

1. A power cell assembly, comprising:

The power unit comprises a power structure, a power supply and a power supply, wherein the power structure is provided with a plurality of pins;

a plurality of stacked busbar, at least one of the pins is connected with the arranged busbar in a penetrating way, and is misplaced and electrically insulated from other busbar;

The busbar is provided with a busbar connecting part, at least one pin of the power unit only penetrates through one layer of busbar connecting part to be connected with the busbar, and the busbar connecting part is in a sheet shape;

The same power structure is provided with a first pin, a second pin and a third pin, wherein the third pin is positioned between the first pin and the second pin, the third pin is positioned outside the first pin and the second pin relative to the power structure, and a gap between the first pin and the second pin allows one busbar connecting part to be inserted into and connected with the third pin in a penetrating way;

The power unit further comprises a substrate and a tabletting structure, the power structure is pressed against the first side surface of the substrate by the tabletting structure, the power structure comprises a first power structure and a second power structure, the first power structure and the second power structure are oppositely arranged in the first direction of the substrate, a plurality of the first power structures are arranged in the second direction, a plurality of the second power structures are arranged in the second direction, and a plurality of the tabletting structures are arranged in the second direction, wherein the first direction and the second direction are perpendicular to each other;

The pressing structure comprises a pressing body and a pressing arm, wherein the pressing arm is connected to the pressing body, the pressing body is formed into a concave groove body structure which is concave towards the first side face, an opening of the pressing body is away from the first side face, the pressing arm comprises a first pressing arm and a second pressing arm, the first pressing arm is used for pressing against the first power structure, the second pressing arm is used for pressing against the second power structure, the first power structure is provided with a first connecting foot part, the second power structure is provided with a second connecting foot part, the first connecting foot part and the second connecting foot part are respectively located on the opposite outer sides of the first power structure and the second power structure, the pressing body is located between the opposite inner sides of the first power structure and the second power structure, and the first side face of the substrate is a side face towards a busbar.

2. The power cell assembly of claim 1, wherein the busbar and corresponding busbar connection are formed by a blanking process.

3. The power cell assembly of claim 1 wherein the busbar connection portion projects corresponding to at least one side edge of the busbar and the busbar connection portion is directly connected to the corresponding busbar.

4. The power unit assembly of claim 1, wherein the busbar connection is provided with busbar connection through holes allowing the pins to pass through.

5. The power cell assembly of claim 1 wherein the power cell assembly comprises,

The busbar comprises a first busbar, a second busbar and a third busbar;

The busbar connecting part comprises a first busbar connecting part connected with the first busbar, a second busbar connecting part connected with the second busbar and a third busbar connecting part connected with the third busbar, wherein the first busbar connecting part is positioned on one side of the first busbar, the second busbar connecting part is positioned on the other side of the second busbar opposite to the first busbar connecting part, and the third busbar connecting parts are respectively positioned on two sides of the third busbar.

6. The power cell assembly of claim 5, wherein one of the first busbar and the second busbar is a positive busbar and the other is a negative busbar.

7. The power cell assembly of claim 6 further comprising a busbar clamp for clamping the first busbar and the second busbar.

8. The power cell assembly of claim 5, wherein each of the first busbar, the second busbar, and the third busbar is rectangular in shape and is arranged in a stack in a thickness direction of the busbar, and the busbar connection portion is formed on a longitudinal long side of the corresponding busbar.

9. The power cell assembly of claim 5 wherein the pins of the first power structure are on the first side with the first busbar connection and the third busbar connection on the third busbar on the first side of the busbar, and the pins of the second power structure are on the second side with the second busbar connection and the third busbar connection on the third busbar on the second side of the busbar.

10. The power cell assembly of claim 5, wherein one end of the first busbar is provided with a first busbar transfer end plate, one end of the second busbar is provided with a second busbar transfer end plate, the first busbar transfer end plate and the second busbar transfer end plate are located at the same end and are arranged side by side, and the other end of the third busbar opposite the first busbar transfer end plate is provided with a third busbar transfer end plate.

11. The power cell assembly of claim 5, wherein the first busbar, the second busbar, and the third busbar are all flat panel busbars.

12. The power unit assembly of claim 1, wherein the busbar connection portion is provided with a through slot allowing the pin to pass therethrough, and the through slot extends in a direction away from the busbar and penetrates an outer edge of the busbar connection portion away from the busbar.

13. The power cell assembly of claim 1, wherein the busbar surface is entirely covered with an insulating film.