CN113543613A - Noise suppression sheet - Google Patents
Noise suppression sheet Download PDFInfo
- Publication number
- CN113543613A CN113543613A CN202010310658.8A CN202010310658A CN113543613A CN 113543613 A CN113543613 A CN 113543613A CN 202010310658 A CN202010310658 A CN 202010310658A CN 113543613 A CN113543613 A CN 113543613A
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- China
- Prior art keywords
- noise
- layer
- adhesive material
- noise suppression
- sheet
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- 230000001629 suppression Effects 0.000 title abstract description 37
- 229910052751 metal Inorganic materials 0.000 claims abstract description 73
- 239000002184 metal Substances 0.000 claims abstract description 73
- 239000000853 adhesive Substances 0.000 claims abstract description 39
- 230000001070 adhesive effect Effects 0.000 claims abstract description 39
- 239000000463 material Substances 0.000 claims abstract description 39
- 229910045601 alloy Inorganic materials 0.000 claims description 9
- 239000000956 alloy Substances 0.000 claims description 9
- 229910002555 FeNi Inorganic materials 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000011888 foil Substances 0.000 abstract description 7
- 239000010410 layer Substances 0.000 description 82
- 230000000052 comparative effect Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 229910000976 Electrical steel Inorganic materials 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910000889 permalloy Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910000702 sendust Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- -1 vinylbenzyl Chemical group 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
In the noise suppression sheet, a metal magnetic layer and a nonmagnetic metal layer in the form of a foil are bonded via an adhesive material layer. By mounting such a noise suppression sheet on an electronic component or the like, noise generated from a circuit or the like in the electronic component can be absorbed and suppressed. In the noise suppressing sheet, noise is absorbed by the metal magnetic layer. Since the noise transmitted without being absorbed by the metal magnetic layer can be reflected by the nonmagnetic metal layer and absorbed again by the metal magnetic layer, the noise suppressing sheet can suppress the noise more effectively.
Description
Technical Field
The present disclosure relates to a noise suppression sheet (noise suppression sheet).
Background
In recent years, with an increase in the operating speed of digital circuits in electronic devices and the like, malfunctions of the electronic devices and influences on human bodies caused by noises such as electromagnetic waves generated from the circuits have become serious. Therefore, development of a noise suppression sheet for suppressing (blocking) noise is being performed.
For example, japanese patent application laid-open No. 2004-153213 discloses a noise suppressing sheet having a structure in which an insulating film is bonded to an FeNi alloy. This document discloses a technique of bonding a FeNi alloy foil and an insulating film via an adhesive layer.
Disclosure of Invention
As a result of repeated studies on the magnetic shielding properties of the noise suppression sheet, the inventors have newly found a technique that can realize high magnetic shielding properties even in a high frequency region.
According to the present disclosure, a noise suppression sheet is provided in which the magnetic shielding property is improved.
A noise suppression sheet according to an aspect of the present disclosure includes a metal magnetic layer in the form of a foil, a non-magnetic metal layer, and an adhesive material layer, and the metal magnetic layer and the non-magnetic metal layer are bonded to each other via the adhesive material layer.
In addition, according to the noise suppression sheet of another aspect, the adhesive material layer has a dielectric constant of 5.0 or less.
Further, according to the noise suppressing sheet of another aspect, the metal magnetic layer has a thickness of 20 μm or less.
In addition, according to another aspect of the noise suppression sheet, the thickness of the adhesive material layer is 5 to 100 μm.
Further, according to the noise suppressing sheet of another aspect, the metal magnetic layer is made of an FeNi alloy.
In addition, according to the noise suppressing sheet of another aspect, the nonmagnetic metal layer is made of at least one selected from Cu and Al.
Drawings
Fig. 1 is a schematic sectional view showing one embodiment of a noise suppressing sheet.
Fig. 2 is a table showing evaluation results of examples.
Detailed Description
Hereinafter, preferred embodiments of the present disclosure will be described in detail with reference to the accompanying drawings as appropriate. However, the present disclosure is not limited to the following embodiments.
Fig. 1 is a schematic sectional view showing one embodiment of a noise suppressing sheet. The noise suppression sheet 1 shown in fig. 1 has a laminated structure, and is laminated in the order of a metal magnetic layer 10, an adhesive material layer 30, and a non-magnetic metal layer 20. More specifically, in the noise suppressing sheet 1, the metal magnetic layer 10 and the nonmagnetic metal layer 20 are bonded (i.e., laminated) via the adhesive material layer 30. From the viewpoint of thinning, the thickness of the noise suppressing sheet 1 is designed to be 100 μm or less.
The metal magnetic layer 10 is formed in a foil shape and is made of a metal magnetic body. The metal magnetic layer 10 can be obtained by, for example, rolling or sheet manufacturing. The metal magnetic layer 10 is made of, for example, FeNi alloy (permalloy), silicon steel plate, FeSiAl alloy (Sendust), or the like. In the present embodiment, the metal magnetic layer 10 is made of an FeNi alloy containing 70 to 84 wt% of Ni and 16 to 30 wt% of Fe. Si may be added to the metal magnetic layer 10 in an amount of 2 to 8 wt%. The metal magnetic layer 10 has a high magnetic permeability and functions as a magnetic shield layer that absorbs noise.
The thickness of the metal magnetic layer 10 is designed to be 20 μm or less (10 μm, for example) in the present embodiment. From the viewpoint of thinning of the noise suppressing sheet 1, the thickness of the metal magnetic layer 10 may be 10 μm or less, 7 μm or less, or 5 μm or less. From the viewpoint of more effectively absorbing noise, the thickness of the metal magnetic layer 10 may be 0.5 μm or more, 1 μm or more, or 3 μm or more.
The metal magnetic layer 10 is designed to have a high resistivity, and the resistivity of the metal magnetic layer 10 according to the present embodiment is 70 to 115 μ Ω · cm (95 μ Ω · cm, for example).
The nonmagnetic metal layer 20 is a foil or a thin film, and is composed of a nonmagnetic metal. Examples of the nonmagnetic metal constituting the nonmagnetic metal layer 20 include Cu, Al, Sn, and Bi. The nonmagnetic metal layer 20 may be composed of a single nonmagnetic metal or may be composed of a plurality of nonmagnetic metals of different metal types. The nonmagnetic metal layer 20 according to the present embodiment is composed of at least one selected from Cu and Al. The nonmagnetic metal layer 20 functions as an electromagnetic wave shield that reflects electromagnetic wave noise.
The thickness of the nonmagnetic metal layer 20 is designed to be 20 μm or less (12 μm as an example) in the present embodiment. The thickness of the nonmagnetic metal layer 20 may be 1 μm or more, or 2 μm or more from the viewpoint of more efficiently reflecting electromagnetic wave noise, and may be 4 μm or less, 3 μm or less, or 2 μm or less from the viewpoint of thinning of the noise suppression sheet 1.
In the case where the nonmagnetic metal layer 20 is a foil (or sheet), the nonmagnetic metal layer 20 may be obtained by, for example, rolling or sheet-making. When the nonmagnetic metal layer 20 is a thin film, the nonmagnetic metal layer 20 may be obtained by electrolytic processing, vapor deposition, or the like.
The adhesive material layer 30 is made of an adhesive material and is interposed between the metal magnetic layer 10 and the nonmagnetic metal layer 20. The adhesive material layer 30 is made of an adhesive material, and is made of vinylbenzyl, for example. The adhesive material layer 30 is made of an adhesive material having a dielectric constant of 5.0 or less. The thickness of the adhesive material layer 30 is 5 to 100 μm, for example, 50 μm.
The method of obtaining the noise suppression sheet 1 by bonding the metal magnetic layer 10 and the nonmagnetic metal layer 20 is not particularly limited, and various methods can be employed.
For example, when the nonmagnetic metal layer 20 is a foil, the noise suppression sheet 1 can be formed by bonding the metal magnetic layer 10 and the nonmagnetic metal layer 20 via the adhesive material layer 30. That is, the noise suppression sheet 1 may be formed only in the bonding step. Therefore, the noise suppression sheet 1 can be formed relatively easily without requiring a film deposition apparatus.
When the nonmagnetic metal layer 20 is a thin film formed on a substrate or the like, the noise suppression sheet 1 can be formed by attaching the metal magnetic layer 10 to the nonmagnetic metal layer 20 via the adhesive material layer 30. In this case, the noise suppression sheet 1 may be formed only in the bonding step, and the noise suppression sheet 1 may be formed relatively easily.
By mounting the above-described noise suppression sheet 1 on an electronic component or the like, noise (magnetism, electromagnetic waves, or the like) generated from a circuit or the like in the electronic component can be absorbed and suppressed. In the noise suppressing sheet 1, noise is absorbed by the metal magnetic layer 10. As for the noise that is transmitted without being absorbed by the metal magnetic layer 10, it can be reflected by the nonmagnetic metal layer 20 and absorbed again by the metal magnetic layer 10, and therefore the noise suppression sheet 1 can suppress the noise more effectively.
Further, according to the noise suppression sheet 1, high magnetic shielding characteristics can be realized. In the noise suppression sheet 1, particularly, a high resistivity of 70 to 115 μ Ω · cm can be realized in the metal magnetic layer 10, and since a high magnetic permeability is maintained even in a high frequency region of about 1MHz to 10MHz, the frequency dependence of the dielectric constant becomes low.
Further, since the noise suppression sheet 1 has high magnetic shielding characteristics, it can be thinned while maintaining practically sufficient magnetic shielding characteristics as a noise suppression sheet.
In addition, in the noise suppressing sheet 1, since the dielectric constant of the adhesive material layer is 5.0 or less, as shown in the example described later, a high noise attenuation amount is realized.
Further, in the noise reduction sheet 1, the thickness of the metal magnetic layer is 20 μm or less, and thinning and improvement of flexibility are sought.
In addition, in the noise suppression sheet 1, the thickness of the adhesive material layer is 5 to 100 μm, and thinning and improvement of flexibility are sought.
Examples
Hereinafter, the present disclosure is specifically explained according to embodiments. However, the present disclosure is not limited to these embodiments.
[ preparation of noise suppression sheet ]
(example 1)
As example 1, a noise suppression sheet having a laminated structure (three-layer structure) in which a foil-shaped metal magnetic layer made of a FeNi alloy and a foil-shaped nonmagnetic metal layer made of Cu were laminated via an adhesive material layer was prepared. The thickness of the metal magnetic layer was 10 μm, the thickness of the nonmagnetic metal layer was 12 μm, and the thickness of the adhesive material layer was 50 μm. The adhesive material layer is formed using an adhesive material having a dielectric constant of 4.95.
(examples 2 and 3)
As examples 2 and 3, the same noise suppression sheets as in example 1 were prepared except for the dielectric constant of the adhesive material layer. In example 2, an adhesive material having a dielectric constant of 3.45 was used to constitute the adhesive material layer. In example 3, an adhesive material having a dielectric constant of 2.25 was used to constitute the adhesive material layer.
Comparative example 1
As comparative example 1, a noise suppression sheet was prepared which was composed of only a foil-like metal magnetic layer composed of a FeNi alloy.
Comparative examples 2 and 3
As comparative examples 2 and 3, the same noise suppression sheets as in example 1 were prepared except for the dielectric constant of the adhesive material layer. In comparative example 2, the adhesive material layer was constituted using an adhesive material having a dielectric constant of 6.22. In comparative example 3, the adhesive material layer was constituted using an adhesive material having a dielectric constant of 5.38.
[ evaluation of noise suppression sheet ]
(measurement of noise attenuation amount)
The noise attenuation amounts (dB μ V) of the noise suppression sheets obtained in examples 1 to 3 and the noise suppression sheets obtained in comparative examples 1 to 3 were measured, respectively. More specifically, the amount of noise attenuation (dB μ V) in noise at each frequency of 20MHz, 100MHz, 500MHz and 1200MHz was measured using an EMI tester (EMV-200 manufactured by Peritec Corporation). The results are shown in the table of fig. 2.
As shown in the table of FIG. 2, in any of examples 1 to 3 in which the dielectric constant of the adhesive material layer was 5.0 or less, a high noise attenuation of 25dB μ V or more was obtained at all frequencies. In comparative example 1, a sufficient noise attenuation amount was not obtained at a low frequency. In comparative examples 2 and 3 in which the dielectric constant of the adhesive material layer exceeded 5.0, the noise attenuation amount was less than 25dB μ V at low frequencies, and a sufficient noise attenuation amount was not obtained.
From the above results, it was confirmed that the noise suppression sheet having the adhesive material layer with a dielectric constant of 5.0 or less provides a high noise attenuation amount and can improve the magnetic shielding property.
Claims (6)
1. A noise-suppressing sheet, wherein,
comprises a foil-shaped metal magnetic layer, a non-magnetic metal layer and an adhesive material layer,
the metal magnetic layer and the nonmagnetic metal layer are bonded via the adhesive material layer.
2. The noise-suppressing sheet according to claim 1,
the adhesive material layer has a dielectric constant of 5.0 or less.
3. The noise-suppressing sheet according to claim 1 or 2,
the thickness of the metal magnetic layer is 20 [ mu ] m or less.
4. The noise-suppressing sheet according to any one of claims 1 to 3,
the thickness of the adhesive material layer is 5-100 μm.
5. The noise-suppressing sheet according to any one of claims 1 to 4,
the metal magnetic layer is made of an FeNi alloy.
6. The noise-suppressing sheet according to any one of claims 1 to 5,
the nonmagnetic metal layer is composed of at least one selected from Cu and Al.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010310658.8A CN113543613A (en) | 2020-04-20 | 2020-04-20 | Noise suppression sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010310658.8A CN113543613A (en) | 2020-04-20 | 2020-04-20 | Noise suppression sheet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113543613A true CN113543613A (en) | 2021-10-22 |
Family
ID=78123547
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010310658.8A Pending CN113543613A (en) | 2020-04-20 | 2020-04-20 | Noise suppression sheet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113543613A (en) |
Citations (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03120613A (en) * | 1989-10-04 | 1991-05-22 | Konica Corp | Magnetic disk and its production |
| US5990417A (en) * | 1993-06-07 | 1999-11-23 | Nippon Telegraph And Telephone Corporation | Electromagnetic noise absorbing material and electromagnetic noise filter |
| JP2003337539A (en) * | 2002-05-21 | 2003-11-28 | Dainippon Ink & Chem Inc | Pasting sheet for display of attraction type which does not use tacky adhesive |
| JP2004153213A (en) * | 2002-11-01 | 2004-05-27 | Daido Steel Co Ltd | Electromagnetic wave absorbing sheet |
| JP2005142551A (en) * | 2003-10-17 | 2005-06-02 | Nitta Ind Corp | Magnetic shielding sheet and input corresponding display |
| JP2005228939A (en) * | 2004-02-13 | 2005-08-25 | Denki Kagaku Kogyo Kk | Electromagnetic wave absorber and its production process |
| JP2005327930A (en) * | 2004-05-14 | 2005-11-24 | Shin Etsu Polymer Co Ltd | Electromagnetic wave noise suppressor and its manufacturing method |
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| CN103392389A (en) * | 2011-02-25 | 2013-11-13 | 加川清二 | Near-field-noise-suppressing sheet |
| CN103959927A (en) * | 2011-11-30 | 2014-07-30 | 加川清二 | Electromagnetic wave absorbing composite sheet |
| CN105074838A (en) * | 2013-03-28 | 2015-11-18 | 日立金属株式会社 | Magnetic sheet, electronic device using same, and method for manufacturing magnetic sheet |
| US20150342099A1 (en) * | 2012-12-27 | 2015-11-26 | Amosense Co., Ltd. | Electromagnetic wave absorbing sheet and method of manufacturing the same and electronic device using the same |
| CN107135637A (en) * | 2017-05-27 | 2017-09-05 | 东北大学 | A kind of wave absorbing patch based on cladded type composite and preparation method thereof |
| CN208257076U (en) * | 2018-06-13 | 2018-12-18 | 贝尔威勒电子（昆山）有限公司 | High-frequency signal transmission apparatus |
| CN110235537A (en) * | 2017-03-13 | 2019-09-13 | 麦克赛尔控股株式会社 | Electro-magnetic wave absorption piece |
| CN110958827A (en) * | 2018-09-27 | 2020-04-03 | Tdk株式会社 | Noise suppression sheet |
-
2020
- 2020-04-20 CN CN202010310658.8A patent/CN113543613A/en active Pending
Patent Citations (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03120613A (en) * | 1989-10-04 | 1991-05-22 | Konica Corp | Magnetic disk and its production |
| US5990417A (en) * | 1993-06-07 | 1999-11-23 | Nippon Telegraph And Telephone Corporation | Electromagnetic noise absorbing material and electromagnetic noise filter |
| JP2003337539A (en) * | 2002-05-21 | 2003-11-28 | Dainippon Ink & Chem Inc | Pasting sheet for display of attraction type which does not use tacky adhesive |
| JP2004153213A (en) * | 2002-11-01 | 2004-05-27 | Daido Steel Co Ltd | Electromagnetic wave absorbing sheet |
| JP2005142551A (en) * | 2003-10-17 | 2005-06-02 | Nitta Ind Corp | Magnetic shielding sheet and input corresponding display |
| JP2005228939A (en) * | 2004-02-13 | 2005-08-25 | Denki Kagaku Kogyo Kk | Electromagnetic wave absorber and its production process |
| JP2005327930A (en) * | 2004-05-14 | 2005-11-24 | Shin Etsu Polymer Co Ltd | Electromagnetic wave noise suppressor and its manufacturing method |
| US20080220231A1 (en) * | 2007-03-09 | 2008-09-11 | Kabushiki Kaisha Toshiba | Core-shell type magnetic particle and high-frequency magnetic material |
| JP2010278090A (en) * | 2009-05-26 | 2010-12-09 | Seiji Kagawa | Electromagnetic wave-absorbing film |
| CN201709080U (en) * | 2010-06-03 | 2011-01-12 | 康家祯 | Anti-electromagnetic interference sheet |
| CN103155737A (en) * | 2010-09-30 | 2013-06-12 | 日东电工株式会社 | Electromagnetic wave shielding sheet for use in wireless power transmission |
| CN103392389A (en) * | 2011-02-25 | 2013-11-13 | 加川清二 | Near-field-noise-suppressing sheet |
| CN103959927A (en) * | 2011-11-30 | 2014-07-30 | 加川清二 | Electromagnetic wave absorbing composite sheet |
| US20150342099A1 (en) * | 2012-12-27 | 2015-11-26 | Amosense Co., Ltd. | Electromagnetic wave absorbing sheet and method of manufacturing the same and electronic device using the same |
| CN105074838A (en) * | 2013-03-28 | 2015-11-18 | 日立金属株式会社 | Magnetic sheet, electronic device using same, and method for manufacturing magnetic sheet |
| CN110235537A (en) * | 2017-03-13 | 2019-09-13 | 麦克赛尔控股株式会社 | Electro-magnetic wave absorption piece |
| CN107135637A (en) * | 2017-05-27 | 2017-09-05 | 东北大学 | A kind of wave absorbing patch based on cladded type composite and preparation method thereof |
| CN208257076U (en) * | 2018-06-13 | 2018-12-18 | 贝尔威勒电子（昆山）有限公司 | High-frequency signal transmission apparatus |
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