CN113523593A - Laser processing method and device for case of instrument - Google Patents
Laser processing method and device for case of instrument Download PDFInfo
- Publication number
- CN113523593A CN113523593A CN202110755762.2A CN202110755762A CN113523593A CN 113523593 A CN113523593 A CN 113523593A CN 202110755762 A CN202110755762 A CN 202110755762A CN 113523593 A CN113523593 A CN 113523593A
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- laser processing
- processing device
- screw rod
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- sliding block
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
- B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least in three axial directions, e.g. manipulators, robots
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Engineering & Computer Science (AREA)
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- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention relates to the technical field of case laser processing equipment, in particular to a case laser processing method and device for instruments and meters; support through the workstation, the top at the workstation is installed to the slip subassembly, it removes to drive lifting unit, install horizontal adjustment subassembly on the lifting unit, and can drive horizontal adjustment subassembly and reciprocate, the mount table is installed on horizontal adjustment subassembly, can realize the removal of XY axle direction, and inside drive arrangement such as motor that sets up, the drive swivel stand is rotatory, set up drive arrangement such as motor in the swivel stand, the rotation of drive swivel tray longitudinal direction, the laser cutting head is fixed on the swivel tray, and then can make it realize altitude mixture control through the computer end, position shift and angle modulation, it is more convenient to process, be favorable to improving work efficiency.
Description
Technical Field
The invention relates to the technical field of case laser processing equipment, in particular to a case laser processing method and device for instruments and meters.
Background
The instrument case refers to a shell or a packing case used by various instruments and meters, and can be divided into a plastic case, an alloy case, a composite material case and the like according to materials. In the case machining process, a laser cutting machine is widely used for cutting the plate.
Current laser cutting machine for machine case processing includes the frame, and the top of frame is provided with the longitudinal movement crossbeam that can move back and forth, is provided with the mount table that can move about on the longitudinal movement crossbeam to be provided with the laser cutting head in the bottom of mount table, however, processing angle is limited, when needing special processing angle, still needs the artifical supplementary angle of placing that changes panel to realize, increases the amount of manual labor, and machining efficiency is not high.
Disclosure of Invention
The invention aims to provide a laser processing method and a laser processing device for a case for instruments and meters, and aims to solve the technical problems that a laser cutting machine in the prior art is limited in processing angle, needs to change the placing angle of a plate in a manual-assisted manner when special processing angle is needed, increases the manual labor amount, and is low in processing efficiency.
In order to achieve the purpose, the invention adopts a case laser processing device for instruments and meters, which comprises a workbench, a sliding assembly, a lifting assembly, a horizontal adjusting assembly, an installation table, a rotating disc and a laser cutting head;
the utility model discloses a laser cutting machine, including workstation, slip subassembly, elevating system, horizontal adjustment subassembly, mount table, laser cutting head, and the laser cutting head is connected, and is located the carousel is kept away from one side of workstation, slip subassembly with slip subassembly rotates to be connected, horizontal adjustment subassembly with elevating system fixed connection, the mount table with horizontal adjustment subassembly fixed connection, the swivel table with the mount table rotates to be connected, and is located the mount table is close to one side of workstation, the carousel with the swivel table rotates to be connected, and is located the swivel table is kept away from one side of swivel table.
The workbench supports the sliding assembly, the sliding assembly drives the lifting assembly to move back and forth, the lifting assembly drives the horizontal adjusting assembly to move up and down, the horizontal adjusting assembly drives the mounting table to move in the XY-axis direction, driving devices such as a motor are arranged in the mounting table to drive the rotating table to rotate horizontally, driving devices such as a motor are arranged in the rotating table to drive the rotating disc to rotate in the longitudinal direction, the laser cutting head is mounted on the rotating disc, and then the computer end controls the operation of each electronic device, so that the laser cutting head can cut in multiple angles and multiple directions.
The lifting assembly comprises a base and a lifting component, wherein the base is fixedly connected with the power part and is positioned above the guide rail; the lifting member is fixedly connected with the base.
The base support is used for supporting the lifting component, and the lifting component drives the horizontal adjusting component to move up and down.
The lifting component comprises a telescopic cylinder and a telescopic rod, and the telescopic cylinder is fixedly connected with the base and is positioned on one side of the base, which is far away from the guide rail; the telescopic rod is fixedly connected with the output end of the telescopic cylinder and is positioned on one side, far away from the base, of the telescopic cylinder.
The telescopic cylinder drives the telescopic rod to move up and down, and the telescopic rod supports the horizontal adjusting assembly.
The horizontal adjusting assembly comprises a supporting plate, a first screw rod and a first sliding block, wherein the supporting plate is fixedly connected with the telescopic rod and is positioned on one side of the telescopic rod, which is far away from the telescopic cylinder; the first screw rod is rotatably connected with the supporting plate and is positioned on one side of the supporting plate, which is far away from the telescopic rod; the first sliding block is rotatably connected with the first screw rod and is positioned on one side of the first screw rod, which is close to the supporting plate.
The supporting plate is fixed on the telescopic rod, the first screw rod is driven to rotate by a driving device such as a motor, and the first sliding block moves left and right according to the positive rotation and the reverse rotation of the first screw rod.
The horizontal adjusting assembly further comprises a moving plate, a second screw rod and a second sliding block, wherein the moving plate is fixedly connected with the first sliding block and is positioned on one side, far away from the first screw rod, of the first sliding block; the second screw rod is rotatably connected with the moving plate and is positioned on one side of the moving plate, which is far away from the first sliding block; the second sliding block is rotatably connected with the second screw rod and is positioned on one side, close to the moving plate, of the second screw rod, and the second sliding block is fixedly connected with the mounting table.
The movable plate moves left and right along with the first sliding block, the second screw rod is driven by a driving device such as a motor to rotate, and the second sliding block moves back and forth on the movable plate according to the positive rotation and the reverse rotation of the second screw rod to drive the mounting table to move in the XY axis direction.
The laser processing device for the case for the instrument and meter further comprises a clamping assembly, wherein the clamping assembly comprises an electric push rod and a stabilizing member, and the electric push rod is fixedly connected with the workbench and is positioned on one side, close to the guide rail, of the workbench; the stabilizing member is detachably connected with the output end of the electric push rod.
The quantity of centre gripping subassembly is a plurality of, respectively relative distribution be in around the workstation, electric putter promotes firm component will wait to cut the panel centre gripping fixed, is favorable to the accuracy nature of cutting.
A laser processing method for a case for instruments and meters comprises the following steps:
drawing a structure diagram of a case to be processed, and transmitting the structure diagram to laser cutting equipment;
placing a plate to be processed on the workbench, and fixing the plate by using a clamping assembly;
and the laser cutting equipment adjusts the cutting angle of the laser cutting head according to the structure diagram, and cuts the plate into a designed size.
And guiding the drawn structure diagram of the processing case into laser cutting equipment, automatically calculating the cutting step by a computer, manually putting the plate on the workbench, driving the clamping component to fix the plate, and regulating and controlling the angle of the laser cutting head by the laser cutting equipment to cut the plate.
According to the laser processing method and device for the case for the instrument and meter, the case is supported by the workbench, the sliding assembly is mounted above the workbench and drives the lifting assembly to move, the horizontal adjusting assembly is mounted on the lifting assembly and can drive the horizontal adjusting assembly to move up and down, the mounting table is mounted on the horizontal adjusting assembly and can move in the XY axis direction, the motor and other driving devices are arranged in the mounting table and drive the rotating table to rotate, the motor and other driving devices are arranged in the rotating table and drive the rotating disc to rotate in the longitudinal direction, the laser cutting head is fixed on the rotating disc, and therefore the laser processing method and device can achieve height adjustment, position movement and angle adjustment through a computer end, processing is more convenient, and work efficiency is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural view of a laser processing apparatus for instrument cabinet according to the present invention.
Fig. 2 is a schematic structural view of the electric putter of the present invention.
Fig. 3 is a sectional view of the laser processing apparatus for instrument cabinet of the present invention.
Fig. 4 is an enlarged view of fig. 3 a of the present invention.
Fig. 5 is an enlarged view of the invention at B of fig. 3.
Fig. 6 is a step diagram of a laser processing method of the instrument housing according to the present invention.
1-workbench, 10-sliding component, 11-guide rail, 12-pulley, 13-power component, 20-lifting component, 21-base, 22-lifting component, 221-telescopic cylinder, 222-telescopic rod, 30-horizontal adjusting component, 31-supporting plate, 32-first screw rod, 33-first sliding block, 34-moving plate, 35-second screw rod, 36-second sliding block, 2-mounting table, 3-rotating table, 4-rotating disc, 5-laser cutting head, 40-clamping component, 41-electric push rod, 42-stabilizing component, 421-hard plate, 422-soft plate, 100-case laser processing device for instrument and meter.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention. Further, in the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
Referring to fig. 1 to 5, the present invention provides a laser processing device 100 for a case of an instrument, which includes a worktable 1, a sliding assembly 10, a lifting assembly 20, a horizontal adjustment assembly 30, a mounting table 2, a rotating table 3, a rotating disc 4 and a laser cutting head 5;
sliding component 10 with 1 fixed connection of workstation, lifting component 20 with sliding component 10 rotates and connects, horizontal adjustment subassembly 30 with lifting component 20 fixed connection, mount table 2 with horizontal adjustment subassembly 30 fixed connection, swivel table 3 with mount table 2 rotates and connects, and is located mount table 2 is close to one side of workstation 1, rolling disc 4 with swivel table 3 rotates and connects, and is located swivel table 3 keeps away from one side of mount table 2, laser cutting head 5 with 4 fixed connection of rolling disc, and is located rolling disc 4 keeps away from one side of swivel table 3.
In the embodiment, the worktable 1 performs laser cutting and plays a supporting role, the sliding assembly 10 is installed above the worktable 1 to drive the lifting assembly 20 to move, the lifting assembly 20 is installed above the sliding assembly 10 to support the horizontal adjusting assembly 30, the horizontal adjusting assembly 30 is installed on the mounting table 2 and drives the mounting table 2 to move in the XY axis direction, the rotating table 3 is arranged in cooperation with the mounting table 2 and can rotate on the mounting table 2, driving devices such as a motor and the like are arranged in the mounting table 2 to drive the rotating table 3 to rotate, the rotating disc 4 can rotate on the rotating table 3, driving devices such as a motor and the like are arranged in the rotating table 3 to drive the rotating disc 4 to rotate, the laser cutting head 5 is installed on the rotating disc 4 to further enable the laser cutting head 5 to realize height adjustment, position control and angle modulation conveniently carry out laser beam machining to panel, make machining efficiency higher.
Further, referring to fig. 1, fig. 3 and fig. 5, the sliding assembly 10 includes a guide rail 11, a pulley 12 and a power member 13, wherein the guide rail 11 is fixedly connected to the working platform 1 and is located above the working platform 1; the pulley 12 is connected with the guide rail 11 in a sliding manner and is positioned on one side of the guide rail 11 far away from the workbench 1; the output end of the power part 13 is fixedly connected with the lifting assembly 20.
In this embodiment, guide rail 11 is installed workstation 1's top, pulley 12 with guide rail 11 cooperatees and sets up, can slide on the guide rail 11, pulley 12 still through the round pin axle with lifting unit 20 rotates and connects, power component 13 adopts the cylinder that the model is 100SC32, the output with lifting unit 20 fixed connection, and then drive lifting unit 20 slides on the guide rail 11, and power component 13 is connected with computer end electricity, by computer end control automatically regulated, and then automatically regulated the position of surely light cutting head, the convenience is carried out laser beam machining to panel, improves production efficiency.
Further, referring to fig. 1, fig. 2, fig. 3 and fig. 5, the lifting assembly 20 includes a base 21 and a lifting member 22, wherein the base 21 is fixedly connected to the power element 13 and is located above the guide rail 11; the lifting member 22 is fixedly connected to the base 21.
Further, referring to fig. 1, fig. 2, fig. 3 and fig. 5, the lifting member 22 includes a telescopic cylinder 221 and a telescopic rod 222, the telescopic cylinder 221 is fixedly connected to the base 21 and is located on a side of the base 21 away from the guide rail 11; the telescopic rod 222 is fixedly connected to the output end of the telescopic cylinder 221, and is located on a side of the telescopic cylinder 221 away from the base 21.
In this embodiment, the base 21 is connected to the pulley 12 through a pin shaft, can slide on the guide rail 11, and supports the telescopic cylinder 221, the model of the telescopic cylinder 221 is SC120, and is electrically connected to the computer terminal, and the output end is fixedly connected to the telescopic rod 222 to drive the telescopic rod 222 to move up and down, the number of the telescopic rods 222 is two, and the two telescopic rods are respectively and horizontally distributed on two sides of the workbench 1 to support the horizontal adjusting assembly 30, so as to drive the horizontal adjusting assembly 30 to move up and down, thereby facilitating the adjustment of the processing height of the plate, being simple in operation and beneficial to improving the working efficiency.
Further, referring to fig. 1 to 4, the horizontal adjustment assembly 30 includes a supporting plate 31, a first screw rod 32 and a first sliding block 33, wherein the supporting plate 31 is fixedly connected to the telescopic rod 222 and is located on a side of the telescopic rod 222 away from the telescopic cylinder 221; the first screw rod 32 is rotatably connected with the support plate 31 and is positioned on one side of the support plate 31 far away from the telescopic rod 222; the first sliding block 33 is rotatably connected to the first lead screw 32 and is located on one side of the first lead screw 32 close to the supporting plate 31.
Further, referring to fig. 1, fig. 2 and fig. 4, the horizontal adjustment assembly 30 further includes a moving plate 34, a second lead screw 35 and a second slider 36, wherein the moving plate 34 is fixedly connected to the first slider 33 and is located on a side of the first slider 33 away from the first lead screw 32; the second screw 35 is rotatably connected with the moving plate 34 and is positioned on one side of the moving plate 34 far away from the first slider 33; the second slider 36 is rotatably connected to the second lead screw 35 and is located on one side of the second lead screw 35 close to the moving plate 34, and the second slider 36 is further fixedly connected to the mounting table 2.
In this embodiment, the supporting plate 31 is fixed above the telescopic rod 222, the first lead screw 32 is connected to the supporting plate 31 through a bearing and is driven to rotate by a driving device such as a motor, the first slider 33 is sleeved outside the first lead screw 32, and has an end portion in relative sliding connection with the supporting plate 31 and in relative threaded fit with the first lead screw 32, so as to move left and right on the supporting plate 31 according to the positive rotation and the negative rotation of the first lead screw 32; the moving plate 34 is fixed on the first slide block 33 and moves left and right along with the first slide block 33, the second screw rod 35 is mounted on the moving plate 34 through a bearing and is driven to rotate by a driving device such as a motor, the second slide block 36 is sleeved on the second screw rod 35, the end part of the second slide block is in relative sliding connection with the moving plate 34 and is in relative threaded fit with the second screw rod 35, and the second slide block moves back and forth on the moving plate 34 according to the positive rotation and the reverse rotation of the second screw rod 35; the second sliding block 36 is fixedly arranged on the mounting table 2, so that the laser cutting head 5 can move in the XY axis direction, the processing is more convenient, and the processing efficiency is improved.
Further, referring to fig. 1 to 3, the apparatus for processing laser beam of a case for an instrument and meter 100 further includes a clamping assembly 40, where the clamping assembly 40 includes an electric push rod 41 and a stabilizing member 42, the electric push rod 41 is fixedly connected to the workbench 1 and is located on one side of the workbench 1 close to the guide rail 11; the stabilizing member 42 is detachably connected to the output end of the electric push rod 41.
Further, referring to fig. 1 to 3, the fixing member 42 includes a hard board 421 and a soft board 422, the hard board 421 is detachably connected to the output end of the electric push rod 41 and is located on a side of the electric push rod 41 away from the workbench 1; the soft board 422 is fixedly connected with the hard board 421 and is located on one side of the hard board 421 away from the electric push rod 41.
In this embodiment, electric putter 41 model is XC758, installs workstation 1 is last to quantity is a plurality of, and relative distribution is in respectively around workstation 1, hardboard 421 with electric putter 41's output fixed connection, by electric putter 41 drives and removes to panel, and hardboard 421 cooperation panel shape sets up, softboard 422 adopts soft sizing material to support, laminates hardboard 421 sets up, hardboard 421 is right softboard 422 plays the supporting role, softboard 422 is used for contacting panel, utilizes electric putter 41's thrust laminating panel appearance utilizes a plurality of relative settings electric putter 41 is fixed with the panel centre gripping, and then conveniently carries out laser beam machining to panel, need not artifical fixed, and it is more convenient to use, improves machining efficiency.
Referring to fig. 6, a laser processing method for a case of an instrument includes the following steps:
s101: drawing a structural drawing of a case to be processed, and transmitting the structural drawing to laser cutting equipment.
S102: a plate to be processed is placed on the worktable 1 and fixed by a clamping assembly 40.
S103: and the laser cutting equipment adjusts the cutting angle of the laser cutting head 5 according to the structure diagram, and cuts the plate into a designed size.
In this embodiment, first, drawing a structure diagram of a case to be processed, then transmitting the structure diagram to a computer of a laser cutting device, automatically generating an operation flow by the computer, then manually placing a plate to be processed on the worktable 1, driving the clamping assembly 40 to operate, clamping and fixing the plate, finally, determining the specific location and shape of the plate by a scanning instrument provided on the laser cutting device, determining an operation command by combining the operation flow generated by the structure diagram, driving the power member 13 to adjust the position of the lifting assembly 20, driving the lifting assembly 20 to adjust the height of the horizontal adjustment assembly 30, driving the horizontal adjustment assembly 30 to move the position of the mounting table 2, and simultaneously driving the rotating table 3 and the rotating disc 4 to rotate respectively, so that the laser cutting head 5 reaches a set angle, then, laser processing is carried out, manual adjustment is not needed, and the processing efficiency is favorably improved.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (7)
1. A case laser processing device for instruments and meters is characterized by comprising a workbench, a sliding assembly, a lifting assembly, a horizontal adjusting assembly, a mounting table, a rotating disc and a laser cutting head;
the utility model discloses a laser cutting machine, including workstation, slip subassembly, elevating system, horizontal adjustment subassembly, mount table, laser cutting head, and the laser cutting head is connected, and is located the carousel is kept away from one side of workstation, slip subassembly with slip subassembly rotates to be connected, horizontal adjustment subassembly with elevating system fixed connection, the mount table with horizontal adjustment subassembly fixed connection, the swivel table with the mount table rotates to be connected, and is located the mount table is close to one side of workstation, the carousel with the swivel table rotates to be connected, and is located the swivel table is kept away from one side of swivel table.
2. The apparatus according to claim 1, wherein the laser processing device is a laser processing device for a cabinet for an instrument,
the lifting assembly comprises a base and a lifting component, wherein the base is fixedly connected with the power part and is positioned above the guide rail; the lifting member is fixedly connected with the base.
3. The apparatus according to claim 2, wherein the laser processing device is a laser processing device for a cabinet for an instrument,
the lifting component comprises a telescopic cylinder and a telescopic rod, and the telescopic cylinder is fixedly connected with the base and is positioned on one side of the base, which is far away from the guide rail; the telescopic rod is fixedly connected with the output end of the telescopic cylinder and is positioned on one side, far away from the base, of the telescopic cylinder.
4. The apparatus according to claim 3, wherein the laser processing device is a laser processing device for a cabinet for an instrument,
the horizontal adjusting assembly comprises a supporting plate, a first screw rod and a first sliding block, wherein the supporting plate is fixedly connected with the telescopic rod and is positioned on one side of the telescopic rod, which is far away from the telescopic cylinder; the first screw rod is rotatably connected with the supporting plate and is positioned on one side of the supporting plate, which is far away from the telescopic rod; the first sliding block is rotatably connected with the first screw rod and is positioned on one side of the first screw rod, which is close to the supporting plate.
5. The apparatus according to claim 4, wherein the laser processing device is a laser processing device for a cabinet for an instrument,
the horizontal adjusting assembly further comprises a moving plate, a second screw rod and a second sliding block, wherein the moving plate is fixedly connected with the first sliding block and is positioned on one side, far away from the first screw rod, of the first sliding block; the second screw rod is rotatably connected with the moving plate and is positioned on one side of the moving plate, which is far away from the first sliding block; the second sliding block is rotatably connected with the second screw rod and is positioned on one side, close to the moving plate, of the second screw rod, and the second sliding block is fixedly connected with the mounting table.
6. The apparatus according to claim 1, wherein the laser processing device is a laser processing device for a cabinet for an instrument,
the laser processing device for the case for the instrument and meter further comprises a clamping assembly, wherein the clamping assembly comprises an electric push rod and a stabilizing member, and the electric push rod is fixedly connected with the workbench and is positioned on one side, close to the guide rail, of the workbench; the stabilizing member is detachably connected with the output end of the electric push rod.
7. A laser processing method for a case for instruments and meters, the laser processing device for a case for instruments and meters according to claim 1, comprising the steps of:
drawing a structure diagram of a case to be processed, and transmitting the structure diagram to laser cutting equipment;
placing a plate to be processed on the workbench, and fixing the plate by using a clamping assembly;
and the laser cutting equipment adjusts the cutting angle of the laser cutting head according to the structure diagram, and cuts the plate into a designed size.
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| CN202110755762.2A CN113523593A (en) | 2021-07-05 | 2021-07-05 | Laser processing method and device for case of instrument |
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| CN202110755762.2A CN113523593A (en) | 2021-07-05 | 2021-07-05 | Laser processing method and device for case of instrument |
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| CN113843530A (en) * | 2021-10-28 | 2021-12-28 | 大冶宇诚机械制造有限公司 | Panel laser cutting device |
| CN114054919A (en) * | 2022-01-17 | 2022-02-18 | 江苏立迅盈制造有限公司 | Electronic material spot welding device with antistatic performance |
| CN115194336A (en) * | 2022-09-15 | 2022-10-18 | 西安睿智水射流科技有限公司 | Laser stripping recovery device and method for noble metal coating of anode plate |
| CN115319314A (en) * | 2022-10-17 | 2022-11-11 | 新纶电子材料(常州)有限公司 | Multi-axial cutting device applied to double faced adhesive tape processing |
| CN115502567A (en) * | 2022-10-31 | 2022-12-23 | 摩泰金属科技(常州)有限公司 | Multi-angle photoetching machine |
| CN116174954A (en) * | 2022-12-15 | 2023-05-30 | 国宏激光科技(江苏)有限公司 | Laser cutting machine capable of automatically positioning workpiece for precision machining |
| CN116890262A (en) * | 2023-07-11 | 2023-10-17 | 中哲创建科技股份有限公司 | Curtain wall cutting device for building curtain wall construction and application method thereof |
| CN117600675A (en) * | 2023-11-30 | 2024-02-27 | 东莞市欣莹机械有限公司 | Profile processing equipment and processing technology |
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