CN113518547A - Liquid cooling heat dissipation system and method for load board card - Google Patents
Liquid cooling heat dissipation system and method for load board card Download PDFInfo
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- CN113518547A CN113518547A CN202110990856.8A CN202110990856A CN113518547A CN 113518547 A CN113518547 A CN 113518547A CN 202110990856 A CN202110990856 A CN 202110990856A CN 113518547 A CN113518547 A CN 113518547A
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- liquid cooling
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20281—Thermal management, e.g. liquid flow control
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
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- Microelectronics & Electronic Packaging (AREA)
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- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本发明公开了一种负载板卡液冷散热系统及方法，属于散热技术控制领域，用于解决液冷服务器设计中将液冷控制模块与机箱健康状态管理模块分开设计的问题；本发明的液冷散热系统，将液冷控制模块与机箱健康状态管理模块结合设计统一设计，简化了服务器的设计，并可根据负载板卡模块的发热情况，及时调整液冷散热情况，有利于提高液冷散热的利用效率，延长使用寿命，有利于发挥各功能板卡模块的性能及提高工作稳定性；当液冷控制模块与机箱健康状态管理模块结合设计统一设计，并引出对外管理接口，有利于简化服务器的设计，方便远端或运维保障人员获取完整的健康管理信息，大大方便了对服务器的维护与保障。
The invention discloses a liquid-cooled heat dissipation system and method for a load board card, belonging to the field of heat dissipation technology control and used for solving the problem of separate design of a liquid-cooled control module and a chassis health state management module in the design of a liquid-cooled server; The cooling and cooling system combines the liquid cooling control module and the chassis health status management module to design a unified design, which simplifies the design of the server, and can adjust the liquid cooling cooling situation in time according to the heating situation of the load board module, which is beneficial to improve the liquid cooling cooling It can improve the utilization efficiency and prolong the service life, which is conducive to exerting the performance of each functional board module and improving the working stability; when the liquid cooling control module is combined with the chassis health status management module, the design is unified, and the external management interface is introduced, which is conducive to simplifying the server. It is designed to facilitate remote or operation and maintenance personnel to obtain complete health management information, which greatly facilitates the maintenance and protection of the server.
Description
Technical Field
The invention belongs to the field of heat dissipation technology control, and particularly relates to a liquid cooling heat dissipation system and method for a load board card.
Background
At present, most data centers and computing center servers need to carry out high-performance and high-density loading, and components of a board card module with high performance and high density, such as a CPU chip, an FPGA chip, an AI chip and the like, have huge heat productivity, and if temperature reduction is not carried out in time, performance reduction, service life reduction, shutdown can be caused, and even the chip or a circuit is damaged due to overheating. Therefore, most of the current data centers and computing center servers adopt liquid cooling to realize cooling treatment.
Meanwhile, in order to facilitate maintenance, most of the data center and the computing center server introduce a monitoring management unit to monitor and manage the health state of the data center and the computing center server.
In the current scheme, the liquid cooling control module and the case health state management module are often designed separately, and the far end cannot detect the liquid cooling running state, so that the monitoring information of the server is incomplete, and the design complexity is increased.
Therefore, a liquid cooling heat dissipation system and method for the load board card are provided.
Disclosure of Invention
The invention provides a liquid cooling heat dissipation system and method for a load board card, which are used for solving the problem that a liquid cooling control module and a case health state management module are separately designed in the design of a liquid cooling server. According to the liquid cooling heat dissipation system, the liquid cooling control module and the case health state management module are designed in a combined and unified manner, the design of a server is simplified, the liquid cooling heat dissipation condition can be adjusted in time according to the heating condition of the load board card module, the utilization efficiency of liquid cooling heat dissipation is improved, the service life is prolonged, the performance of each functional board card module is favorably exerted, and the working stability is improved;
when the liquid cooling control module and the case health state management module are designed in a unified way and an external management interface is led out, the design of the server is simplified, a remote end or operation and maintenance support personnel can obtain complete health management information conveniently, and the maintenance and the guarantee of the server are greatly facilitated.
The purpose of the invention can be realized by the following technical scheme:
as shown in fig. 1-2, a liquid-cooled heat dissipation system for a load board card includes a control module, a liquid-cooled circulation module, a liquid-cooled chassis, and a load board card module;
the control module acquires the temperature information and the state information of the load board card module, collects the working condition information of the liquid cooling circulation module, and controls the circulation of the liquid cooling working medium in the liquid cooling circulation module according to a preset temperature control strategy, so that the heat dissipation of the load board card module is realized.
Furthermore, the liquid cooling circulation module comprises a liquid cooling working medium, a circulation driving unit, a pressure sensor and a temperature sensor for collecting the liquid cooling working medium, and a liquid cooling heat dissipation exchange unit;
the circulation driving unit receives the command of the control module to drive the liquid cooling working medium to circulate and returns the state parameters of the liquid cooling working medium to the control module, and the pressure sensor and the temperature sensor which collect the liquid cooling working medium transmit the collected liquid cooling working medium data to the control module.
Furthermore, a plurality of load board card modules are arranged in the liquid cooling case, and the load board card modules are cooled by liquid cooling.
Furthermore, the load board card module is provided with a liquid inlet flow channel and a liquid outlet flow channel, and the liquid cooling connector is respectively connected with the liquid inlet flow channel and the liquid outlet flow channel of the liquid cooling pipeline water separator of the liquid cooling case.
Furthermore, an external interface is led out from the control module, and the control module reports the state information of the whole machine through the external interface, including but not limited to the number of the monitored external load board card modules, the state information and the running condition of the liquid cooling circulation module and the like.
Furthermore, the control module adopts a single chip microcomputer or an FPGA main control chip.
Furthermore, the liquid cooling case sequentially loads the control module, the liquid cooling circulation module and the load board card module.
Further, the liquid cooling control flow is as follows:
s1, powering on the server, and acquiring the in-place condition of the load board card module in the chassis and the working condition of the liquid cooling working medium by the control module to finish self-checking;
s2, the in-place load board card module reports temperature information to the control module, and the control module controls the liquid cooling circulation module according to a preset temperature control strategy and starts the liquid cooling circulation, so that the self-adaptive control of the temperature of the load board card module is realized;
and S3, the control module collects the running state information of the on-site load board card module and the running state information of the liquid cooling circulation module, and the running state information can be reported through an external interface after being processed, so that the management and the report of the health state of the whole machine are realized.
Compared with the prior art, the invention has the beneficial effects that:
according to the liquid cooling heat dissipation system, the liquid cooling control module and the case health state management module are designed in a combined and unified manner, the design of a server is simplified, the liquid cooling heat dissipation condition can be adjusted in time according to the heating condition of the load board card module, the utilization efficiency of liquid cooling heat dissipation is improved, the service life is prolonged, the performance of each functional board card module is favorably exerted, and the working stability is improved;
when the liquid cooling control module and the case health state management module are designed in a unified way and an external management interface is led out, the design of the server is simplified, a remote end or operation and maintenance support personnel can obtain complete health management information conveniently, and the maintenance and the guarantee of the server are greatly facilitated.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a first schematic diagram of a liquid-cooled heat dissipation system of a load board card according to the present invention;
fig. 2 is a schematic diagram of a liquid cooling heat dissipation system of a load board card according to a second embodiment of the present invention;
fig. 3 is a flowchart of a liquid cooling heat dissipation method for a load board card according to the present invention.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1-2, a liquid-cooled heat dissipation system for a load board card includes a control module, a liquid-cooled circulation module, a liquid-cooled chassis, and a load board card module;
the control module acquires the temperature information and the state information of the load board card module, collects the working condition information of the liquid cooling circulation module, and controls the circulation of the liquid cooling working medium in the liquid cooling circulation module according to a preset temperature control strategy, so that the heat dissipation of the load board card module is realized.
The liquid cooling circulating module comprises a liquid cooling working medium, a circulating driving unit, a pressure sensor and a temperature sensor for collecting the liquid cooling working medium, and a liquid cooling heat dissipation exchange unit;
the circulation driving unit receives the command of the control module to drive the liquid cooling working medium to circulate and returns the state parameters of the liquid cooling working medium to the control module, and the pressure sensor and the temperature sensor which collect the liquid cooling working medium transmit the collected liquid cooling working medium data to the control module.
The liquid cooling machine case is internally provided with a plurality of load board card modules, and the load board card modules are cooled by liquid cooling.
The load board clamping module is provided with a liquid inlet flow channel and a liquid outlet flow channel, and the liquid inlet flow channel and the liquid outlet flow channel of the liquid cooling pipeline water separator of the liquid cooling case are respectively connected with a liquid cooling joint.
The control module also leads out an external interface, and reports the state information of the whole machine through the external interface, including but not limited to the number of the monitored external load board card modules, the state information and the running state of the load board card modules, the state information and the running condition of the liquid cooling circulation module and the like.
The control module adopts a single chip microcomputer or an FPGA main control chip.
The liquid cooling case sequentially loads the control module, the liquid cooling circulation module and the load board card module. The liquid cooling heat dissipation condition is adjusted in time according to the heating condition of the load board card module, so that the utilization efficiency of liquid cooling heat dissipation is improved, the service life is prolonged, the performance of each functional board card module is exerted, and the working stability is improved;
when the liquid cooling control module and the case health state management module are designed in a unified way and an external management interface is led out, the design of the server is simplified, a remote end or operation and maintenance support personnel can obtain complete health management information conveniently, and the maintenance and the guarantee of the server are greatly facilitated.
As shown in fig. 3, the liquid cooling control flow is as follows:
s1, powering on the server, and acquiring the in-place condition of the load board card module in the chassis and the working condition of the liquid cooling working medium by the control module to finish self-checking;
s2, the in-place load board card module reports temperature information to the control module, and the control module controls the liquid cooling circulation module according to a preset temperature control strategy and starts the liquid cooling circulation, so that the self-adaptive control of the temperature of the load board card module is realized;
and S3, the control module collects the running state information of the on-site load board card module and the running state information of the liquid cooling circulation module, and the running state information can be reported through an external interface after being processed, so that the management and the report of the health state of the whole machine are realized.
The working principle of the invention is as follows: the server is powered on, the control module acquires the on-site condition of the load board card module in the case and the working condition of the liquid cooling working medium, and self-checking is completed; the on-site load board card module reports temperature information to the control module, and the control module controls the liquid cooling circulation module according to a preset temperature control strategy and starts liquid cooling circulation, so that the self-adaptive control of the temperature of the load board card module is realized; the control module collects the running state information of the on-site load board card module and the running state information of the liquid cooling circulation module, and the running state information can be reported through an external interface after being processed, so that the health state management and the report of the whole machine are realized.
The liquid cooling control module and the case health state management module are designed in a unified way, so that the design of the server is simplified, the liquid cooling heat dissipation condition can be adjusted in time according to the heating condition of the load board card module, the utilization efficiency of liquid cooling heat dissipation is improved, the service life is prolonged, the performance of each functional board card module is favorably exerted, and the working stability is improved; when the liquid cooling control module and the case health state management module are designed in a unified way and an external management interface is led out, the design of the server is simplified, a remote end or operation and maintenance support personnel can obtain complete health management information conveniently, and the maintenance and the guarantee of the server are greatly facilitated.
In the embodiments provided by the present invention, it should be understood that the disclosed apparatus, device and method can be implemented in other ways. For example, the above-described apparatus embodiments are merely illustrative, and for example, the division of the modules is only one logical functional division, and there may be other divisions when the actual implementation is performed; the modules described as separate parts may or may not be physically separate, and parts displayed as modules may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the method of the embodiment.
It will also be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof.
The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference signs in the claims shall not be construed as limiting the claim concerned.
Furthermore, it is obvious that the word "comprising" does not exclude other elements or steps, and the singular does not exclude the plural. A plurality of units or means recited in the system claims may also be implemented by one unit or means in software or hardware. The terms second, etc. are used to denote names, but not any particular order.
Finally, it should be noted that the above examples are only intended to illustrate the technical process of the present invention and not to limit the same, and although the present invention has been described in detail with reference to the preferred embodiments, it will be understood by those skilled in the art that modifications or equivalent substitutions may be made to the technical process of the present invention without departing from the spirit and scope of the technical process of the present invention.
Claims (8)
1. A liquid cooling heat dissipation system of a load board card is characterized by comprising a control module, a liquid cooling circulation module, a liquid cooling case and a load board card module;
the control module acquires the temperature information and the state information of the load board card module, collects the working condition information of the liquid cooling circulation module, and controls the circulation of the liquid cooling working medium in the liquid cooling circulation module according to a preset temperature control strategy, so that the heat dissipation of the load board card module is realized.
2. The load board liquid cooling heat dissipation system of claim 1, wherein the liquid cooling circulation module comprises a liquid cooling working medium, a circulation driving unit, a pressure sensor and a temperature sensor for collecting the liquid cooling working medium, and a liquid cooling heat dissipation exchange unit;
the circulation driving unit receives the command of the control module to drive the liquid cooling working medium to circulate and returns the state parameters of the liquid cooling working medium to the control module, and the pressure sensor and the temperature sensor which collect the liquid cooling working medium transmit the collected liquid cooling working medium data to the control module.
3. The system of claim 1, wherein the liquid-cooled heat dissipation system further comprises a plurality of load board card modules disposed in the liquid-cooled enclosure, wherein the load board card modules are liquid-cooled for heat dissipation.
4. The system of claim 3, wherein the load board card module is provided with an inlet channel and an outlet channel, and the inlet channel and the outlet channel of the water separator of the liquid cooling pipeline of the liquid cooling chassis are connected with the liquid inlet connector and the liquid outlet connector respectively by using a liquid cooling connector.
5. The system of claim 1, wherein the control module further comprises an external interface, and the control module reports the state information of the whole system through the external interface, wherein the state information and the operating condition of the load board card module, and the state information and the operating condition of the liquid cooling circulation module are included.
6. The liquid-cooled heat dissipation system for load board cards of claim 5, wherein the control module is a single chip or an FPGA main control chip.
7. The load board liquid-cooled heat dissipation system of claim 1, wherein the liquid-cooled chassis sequentially loads the control module, the liquid-cooled circulation module, and the load board card module.
8. The method of claim 1, further comprising:
s1, powering on the server, and acquiring the in-place condition of the load board card module in the chassis and the working condition of the liquid cooling working medium by the control module to finish self-checking;
s2, the in-place load board card module reports temperature information to the control module, and the control module controls the liquid cooling circulation module according to a preset temperature control strategy and starts the liquid cooling circulation, so that the self-adaptive control of the temperature of the load board card module is realized;
and S3, the control module collects the running state information of the on-site load board card module and the running state information of the liquid cooling circulation module, and the running state information is reported through an external interface after being processed, so that the management and the report of the health state of the whole machine are realized.
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| CN202110990856.8A CN113518547A (en) | 2021-08-26 | 2021-08-26 | Liquid cooling heat dissipation system and method for load board card |
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| CN202110990856.8A CN113518547A (en) | 2021-08-26 | 2021-08-26 | Liquid cooling heat dissipation system and method for load board card |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113534934A (en) * | 2021-08-26 | 2021-10-22 | 中科长城海洋信息系统有限公司长沙分公司 | A single liquid cooling intelligent control system, method and server |
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| CN109388210A (en) * | 2018-12-06 | 2019-02-26 | 京信通信系统（中国）有限公司 | The management method and device of distributed cabinet, distributed cabinet |
| CN113015417A (en) * | 2021-03-12 | 2021-06-22 | 长城超云(北京)科技有限公司 | Novel liquid cooling modularization frame power |
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- 2021-08-26 CN CN202110990856.8A patent/CN113518547A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108235655A (en) * | 2017-12-29 | 2018-06-29 | 华南理工大学 | A kind of server cabinet easy to plug using liquid-cooling heat radiation |
| CN109388210A (en) * | 2018-12-06 | 2019-02-26 | 京信通信系统（中国）有限公司 | The management method and device of distributed cabinet, distributed cabinet |
| CN113015417A (en) * | 2021-03-12 | 2021-06-22 | 长城超云(北京)科技有限公司 | Novel liquid cooling modularization frame power |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113534934A (en) * | 2021-08-26 | 2021-10-22 | 中科长城海洋信息系统有限公司长沙分公司 | A single liquid cooling intelligent control system, method and server |
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Application publication date: 20211019 |