CN113473698B - 一种可剥离线路板及其制造方法 - Google Patents
一种可剥离线路板及其制造方法 Download PDFInfo
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- CN113473698B CN113473698B CN202110801965.0A CN202110801965A CN113473698B CN 113473698 B CN113473698 B CN 113473698B CN 202110801965 A CN202110801965 A CN 202110801965A CN 113473698 B CN113473698 B CN 113473698B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
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Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202110801965.0A CN113473698B (zh) | 2021-07-15 | 2021-07-15 | 一种可剥离线路板及其制造方法 |
Applications Claiming Priority (1)
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CN202110801965.0A CN113473698B (zh) | 2021-07-15 | 2021-07-15 | 一种可剥离线路板及其制造方法 |
Publications (2)
Publication Number | Publication Date |
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CN113473698A CN113473698A (zh) | 2021-10-01 |
CN113473698B true CN113473698B (zh) | 2022-10-28 |
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CN202110801965.0A Active CN113473698B (zh) | 2021-07-15 | 2021-07-15 | 一种可剥离线路板及其制造方法 |
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CN (1) | CN113473698B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114286513B (zh) * | 2021-11-30 | 2024-02-06 | 通元科技(惠州)有限公司 | 一种非对称预应力消除型led背板及其制作方法 |
Citations (9)
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JPH0992939A (ja) * | 1995-09-27 | 1997-04-04 | Hitachi Chem Co Ltd | 電流保護素子モジュールおよびその製造法 |
EP0618619B1 (en) * | 1993-03-29 | 2001-08-29 | Delphi Technologies, Inc. | Method of manufacturing ultra-thick thick films for thermal management and current-carrying capabilities in hybrid circuits |
JP2007042765A (ja) * | 2005-08-02 | 2007-02-15 | Cmk Corp | 多層プリント配線板及びその製造方法 |
CN101198216A (zh) * | 2008-01-07 | 2008-06-11 | 史杰 | Led照明阵列的柔性线路板 |
CN102209429A (zh) * | 2010-10-29 | 2011-10-05 | 博罗县精汇电子科技有限公司 | 散热型柔性线路板 |
WO2011155340A1 (ja) * | 2010-06-10 | 2011-12-15 | 住友電気工業株式会社 | フレキシブルプリント配線板 |
CN104185361A (zh) * | 2014-08-19 | 2014-12-03 | 曹欣纪 | 一种铝基板及其制备方法 |
JP2015050369A (ja) * | 2013-09-03 | 2015-03-16 | 京セラサーキットソリューションズ株式会社 | 印刷配線板及びその製造方法 |
CN213462466U (zh) * | 2020-12-07 | 2021-06-15 | 中电保力(北京)科技有限公司 | 一种带有可剥离导热胶的线路板 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4135839A1 (de) * | 1991-10-31 | 1993-05-06 | Huels Troisdorf Ag, 5210 Troisdorf, De | Verfahren zur herstellung einer mehrlagigen gedruckten schaltung sowie mehrlagige gedruckte schaltung |
US6569712B2 (en) * | 2001-10-19 | 2003-05-27 | Via Technologies, Inc. | Structure of a ball-grid array package substrate and processes for producing thereof |
JP2014135389A (ja) * | 2013-01-10 | 2014-07-24 | Canon Components Inc | 金属基材フィルムを用いたフレキシブルプリント配線基板、及びそれを用いた非接触型icカード。 |
CN203136323U (zh) * | 2013-03-06 | 2013-08-14 | 乐健科技(珠海)有限公司 | 一种用于led安装的金属基印刷电路板 |
CN103702515A (zh) * | 2013-12-26 | 2014-04-02 | 广州市德晟照明实业有限公司 | 一种大功率led灯珠金属基板结构及其制作方法 |
CN203645917U (zh) * | 2013-12-31 | 2014-06-11 | 广东生益科技股份有限公司 | 一种高导热金属基板 |
CN105407638A (zh) * | 2015-12-01 | 2016-03-16 | 杨小荣 | 一种高导热低成本柔性线路板及其生产方法 |
CN206575661U (zh) * | 2017-02-16 | 2017-10-20 | 江西省航宇新材料股份有限公司 | 一种低热膨胀系数覆铜板 |
CN209355206U (zh) * | 2018-10-16 | 2019-09-06 | 广东翔思新材料有限公司 | 一种led照明用铝基板 |
CN109327957B (zh) * | 2018-12-05 | 2021-03-12 | 景旺电子科技(龙川)有限公司 | 一种导热铜基板及其制作方法 |
CN210617507U (zh) * | 2019-09-03 | 2020-05-26 | 广东翔思新材料有限公司 | 一种高透导热式铝基覆铜板 |
CN210469869U (zh) * | 2019-09-26 | 2020-05-05 | 杨小荣 | 一种低成本铝制作线路的电路板 |
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2021
- 2021-07-15 CN CN202110801965.0A patent/CN113473698B/zh active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0618619B1 (en) * | 1993-03-29 | 2001-08-29 | Delphi Technologies, Inc. | Method of manufacturing ultra-thick thick films for thermal management and current-carrying capabilities in hybrid circuits |
JPH0992939A (ja) * | 1995-09-27 | 1997-04-04 | Hitachi Chem Co Ltd | 電流保護素子モジュールおよびその製造法 |
JP2007042765A (ja) * | 2005-08-02 | 2007-02-15 | Cmk Corp | 多層プリント配線板及びその製造方法 |
CN101198216A (zh) * | 2008-01-07 | 2008-06-11 | 史杰 | Led照明阵列的柔性线路板 |
WO2011155340A1 (ja) * | 2010-06-10 | 2011-12-15 | 住友電気工業株式会社 | フレキシブルプリント配線板 |
CN102209429A (zh) * | 2010-10-29 | 2011-10-05 | 博罗县精汇电子科技有限公司 | 散热型柔性线路板 |
JP2015050369A (ja) * | 2013-09-03 | 2015-03-16 | 京セラサーキットソリューションズ株式会社 | 印刷配線板及びその製造方法 |
CN104185361A (zh) * | 2014-08-19 | 2014-12-03 | 曹欣纪 | 一种铝基板及其制备方法 |
CN213462466U (zh) * | 2020-12-07 | 2021-06-15 | 中电保力(北京)科技有限公司 | 一种带有可剥离导热胶的线路板 |
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Effective date of registration: 20230913 Address after: 518000 Smart Home Phase II, No. 76 Baohe Avenue, Baolong Community, Baolong Street, Longgang District, Shenzhen City, Guangdong Province, 3A3101-3104 (with business premises located on the east side of the 1st floor of Building 2 and Building 3, Building 202, Huaqiang Industrial Park, No. 43 Qingfeng Avenue, Baolong Community, Baolong Street, Longgang District, Shenzhen City) Patentee after: YVGUANG TECHNOLOGY (SHENZHEN) Co.,Ltd. Address before: 404500 Huangling group, Yunyang Industrial Park, Chongqing Patentee before: Chongqing Yuguang New Material Co.,Ltd. |