CN113431294A - Novel wooden composite floor - Google Patents
Novel wooden composite floor Download PDFInfo
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- CN113431294A CN113431294A CN202110834137.7A CN202110834137A CN113431294A CN 113431294 A CN113431294 A CN 113431294A CN 202110834137 A CN202110834137 A CN 202110834137A CN 113431294 A CN113431294 A CN 113431294A
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- layer
- wood
- paper layer
- paper
- density fiberboard
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- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
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- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
- E04F15/10—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials
- E04F15/107—Flooring or floor layers composed of a number of similar elements of other materials, e.g. fibrous or chipped materials, organic plastics, magnesite tiles, hardboard, or with a top layer of other materials composed of several layers, e.g. sandwich panels
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- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/18—Separately-laid insulating layers; Other additional insulating measures; Floating floors
- E04F15/181—Insulating layers integrally formed with the flooring or the flooring elements
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- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Floor Finish (AREA)
- Laminated Bodies (AREA)
Abstract
The embodiment of the application discloses novel wooden composite floor, include wooden substrate layer, glue cover in wood grain paper layer on the wooden substrate layer, wooden substrate layer glue between the wood grain paper layer and be lined with the fiber paper layer. The wood-grain paper layer on the surface layer has relatively good crack resistance and toughness, so that the quality problem of cracking of the wood-grain paper layer caused by the change of the shrinkage and expansion sizes of the wood base material can be effectively avoided.
Description
Technical Field
The invention relates to the technical field of ground paving materials, in particular to a novel wood composite floor.
Background
Avoiding the use of precious hard broad-leaved wood is a major issue in the green building material manufacturing industry. In order to save the use of precious hard broad-leaved wood and improve the solid wood characteristics of the wood floor, wood grain paper is usually adhered on the wood base material to replace the precious hard broad-leaved wood so as to achieve the decorative effect. However, the wood-grain paper has relatively poor crack resistance and toughness, while the wood substrate has the characteristics of dry shrinkage and wet swelling and relatively good toughness, so when the wood-grain paper and the wood substrate are bonded and compounded, the surface of the wood-grain paper is more prone to cracking.
The prior art does not have a technical scheme capable of better solving the problems.
Disclosure of Invention
The present invention is directed to overcome the above-mentioned problems, and therefore, to provide a novel wood composite floor, wherein the wood grain paper layer on the surface layer has relatively good crack resistance and toughness, and the quality problem of cracking of the wood grain paper layer caused by the dimensional change of shrinkage and expansion of the wood base material can be effectively avoided.
In order to achieve the above object, an embodiment of the present invention provides a novel wood composite floor, which includes a wood substrate layer, and a wood-grain paper layer adhered on the wood substrate layer, wherein a fiber paper layer is adhered between the wood substrate layer and the wood-grain paper layer.
The cellulose content of the fiber paper is relatively high, the fiber is relatively long, and the fiber paper has the advantages of good impregnability, high tear strength, good toughness and the like. By means of the structure, the advantages of the fiber paper can be effectively utilized by adhering and lining the fiber paper layer between the wood substrate layer and the wood grain paper layer, and therefore the defects of poor crack resistance and poor toughness of the wood grain paper are overcome. The surface wood-grain paper layer of the novel composite floor board has relatively good crack resistance and toughness, and the quality problem of cracking of the wood-grain paper layer caused by the shrinkage and expansion size change of the wood base material can be effectively avoided.
Preferably, the fiber paper used for the fiber paper layer is melamine-impregnated fiber paper.
Preferably, a high-density fiberboard layer is adhered and lined between the fiber paper layer and the wood substrate layer.
Preferably, the high-density fiberboard layer has a thickness of 0.8mm to 1.2mm, and the density of the high-density fiberboard used in the high-density fiberboard layer is 0.9kg/m3～1.2kg/m3。
Preferably, the high-density fiberboard layer is provided with a plurality of micropores.
Preferably, the aperture of the micropores is 0.05 mm-0.10 mm; the micro-holes are arranged in an array, the transverse distance between every two adjacent micro-holes is 0.05-0.20 mm, and the longitudinal distance is 0.05-0.10 mm.
Preferably, a first balance paper layer is adhered and lined between the high-density fiberboard layer and the wood base material layer.
Preferably, the first balance paper layer is melamine-impregnated paper.
Preferably, a second balance paper layer is adhered to the back surface of the wood base material layer.
Preferably, the wood-grain paper layer is provided with a wear-resistant layer, the back surface of the wood base material layer is adhered with a back surface decoration layer, and the back surface of the back surface decoration layer is adhered with a transparent moisture-proof layer.
In summary, compared with the prior art, the invention has the beneficial effects that:
1. the fiber paper layer is adhered and lined between the wood base material layer and the wood-grain paper layer, so that the wood-grain paper layer on the surface layer has relatively good crack resistance and toughness, and the quality problem of cracking of the wood-grain paper layer caused by the size change of shrinkage and expansion of the wood base material is avoided to a certain extent;
2. through the arrangement of the high-density fiber board layer, the wood-grain paper layer and the fiber paper layer have relatively flat sticking planes, so that the formation of fine wrinkles on the wood-grain paper layer and the fiber paper layer due to the uneven surface (originally provided or caused by deformation) of the wood base material is avoided to a certain extent;
3. through set up a plurality of micropores on high density fiberboard layer, or set up first balanced ply between high density fiberboard layer, wooden substrate layer to improve the bonding strength between high density fiberboard layer and the wooden substrate layer to a certain extent.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without inventive exercise.
Fig. 1 is a schematic structural diagram of the novel wood composite floor according to embodiment 1 of the present invention;
fig. 2 is a schematic structural diagram of the novel wood composite floor according to embodiment 2 of the present invention;
FIG. 3 is a schematic structural view of a high density fiberboard layer in example 2 of the present invention;
fig. 4 is a schematic structural diagram of the novel wood composite floor according to embodiment 3 of the present invention.
In the figure: 100-wood substrate layer, 200-wood-grain paper layer, 300-fiber paper layer, 400-high-density fiber board layer, 410-micropore, 500-first balance paper layer, 600-second balance paper layer, 700-wear-resistant layer, 800-back decorative layer and 900-transparent moisture-proof layer.
Detailed Description
In order to make those skilled in the art better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Example 1: referring to fig. 1, the novel wood composite floor sequentially comprises a wear-resistant layer 700, a wood-grain paper layer 200, a fiber paper layer 300, a wood substrate layer 100, a back decorative layer 800 and a transparent moisture-proof layer 900 from top to bottom. Wherein, the wear-resistant layer 700 is any wear-resistant paper in the prior art, such as alumina impregnated paper; the wood-grain paper layer 200 is any decorative paper in the prior art; the fiber paper used in the fiber paper layer 300 is melamine-impregnated fiber paper; the wood substrate layer 100 may be any wood composite substrate, such as a multi-layer solid wood composite substrate; the back decorative layer 800 may be any one, such as a decorative paper or a fast-growing wood veneer; the transparent moisture-proof layer 900 may be any one, for example, a pvc film.
By adhering the fiber paper layer 300 between the wood substrate layer 100 and the wood-grain paper layer 200, the wood-grain paper layer 200 has relatively good crack resistance and toughness by dragging the wood-grain paper layer 300 through the fiber paper layer 300, so as to avoid the quality problem of cracking of the wood-grain paper layer 200 caused by the shrinkage and expansion size change of the wood substrate layer 100 to a certain extent.
When the novel wood composite floor of the embodiment is manufactured, the fiber paper used by the fiber paper layer 300 is impregnated with the melamine adhesive, so that the six material layers can be sequentially stacked and then sent into the hot press machine for hot-press bonding, and two or three material layers can be hot-press bonded through any other process in the prior art and then are hot-press bonded with other material layers one by one or simultaneously.
Example 2: the difference between the embodiment 2 and the embodiment 1 is that, referring to fig. 2 and 3, a high-density fiberboard layer 400 is adhered and lined between the fiber paper layer 300 and the wood substrate layer 100. In the present embodiment, the high-density fiberboard layer 400 has a thickness of 0.8 to 1.2mm and a density of 0.9kg/m3～1.2kg/m3Preferably 1.0mm in thickness and preferably 1.0kg/m in density3。
Through the arrangement of the high-density fiberboard layer 400, the wood-grain paper layer 200 and the fiber paper layer 300 have relatively flat bonding planes, so that the influence on the quality of the surface flatness of the product due to the formation of fine wrinkles on the wood-grain paper layer 200 and the fiber paper layer 300 caused by the surface unevenness (particularly the multi-layer solid wood composite substrate) of the wood substrate layer 100 (originally having or caused by deformation) is avoided to a certain extent.
As will be appreciated by those skilled in the art, high density fiberboard, particularly with a density greater than 0.9kg/m3In the process, the contact angle of the surface is very small, the adhesive property is relatively poor, and the bonding strength of the wood substrate layer 100 after the wood substrate layer is compounded is relatively poor. To further improve and optimize this technical problem, in this embodiment, the high-density fiberboard layer 400 is provided with a plurality of micropores 410. Specifically, the pore diameter of the micropores 410 is 0.05mm to 0.10mm (e.g., 0.08 mm); the micro-holes 410 are arranged in an array, the distance between every two adjacent micro-holes 410 in the transverse direction (the width direction of the novel wood floor) is 0.05 mm-0.20 mm (for example, 0.12mm), and the distance between every two adjacent micro-holes 410 in the longitudinal direction (the length direction of the novel wood floor) is 0.05 mm-0.10 mm (for example, 0.08 mm). Through the arrangement of the micropores 410, glue nails can be artificially formed between the high-density fiberboard layer 400 and the wood substrate layer 100 to improve the bonding strength of the two. Further, when the material used by the wood substrate layer 100 does not have anisotropy, for example, the wood substrate layer 100 is a multilayer composite board, a medium/high density fiberboard, etc., under the same temperature and humidity change, the dimension variation of the length direction thereof is much larger than the width direction thereof, the difference between the dimension variation of the high density fiberboard layer 400 and the wood substrate layer 100 is relatively larger, and the length direction of the high density fiberboard layer 400 has more micropores 410, so as to form more glue nails and provide relatively stronger bonding and dragging force between the high density fiberboard layer 400 and the wood substrate layer 100, thereby effectively increasing the mutual dragging of the length direction between the two, and further alleviating, even avoiding the degumming phenomenon of the length direction.
When the novel wood composite floor of the embodiment is manufactured, the high-density fiberboard with relatively high water content is used as the high-density fiberboard layer 400, for example, the water content is 12% -25%, the high-density fiberboard roller is heated to 100 ℃ -140 ℃, and mechanical punching is performed on the high-density fiberboard layer 400 with relatively high temperature by using any one of the prior art forms, so as to form the micropores 410 shown in fig. 3. When the temperature of the high-density fiberboard layer 400 is reduced to 60 ℃ -85 ℃ (preferably 75 ℃ -80 ℃), sizing is applied to both surfaces of the high-density fiberboard layer 400, and the adhesive used can be any one of thermosetting adhesives in the prior art. So as to ensure that the adhesive is sucked into the micro holes 410 under negative pressure to form effective adhesive nails.
Example 3: the embodiment 3 is different from the embodiment 1 in that, referring to fig. 4, a first balance paper layer 500 is adhered between the high-density fiberboard layer 400 and the wood substrate layer 100, and a second balance paper layer 600 is adhered on the back surface of the wood substrate layer 100. The first balance paper layer 500 is 60g of melamine impregnated paper and the second balance paper layer 600 is 120g of melamine impregnated paper.
The foregoing description is for the purpose of illustration and is not for the purpose of limitation. Many embodiments and many applications other than the examples provided will be apparent to those of skill in the art upon reading the above description. The scope of the present teachings should, therefore, be determined not with reference to the above description, but should instead be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. The disclosures of all articles and references, including patent applications and publications, are hereby incorporated by reference for all purposes. The omission in the foregoing claims of any aspect of subject matter that is disclosed herein is not intended to forego the subject matter and should not be construed as an admission that the applicant does not consider such subject matter to be part of the disclosed subject matter.
Claims (10)
1. The novel wood composite floor comprises a wood base material layer (100) and a wood-grain paper layer (200) adhered on the wood base material layer (100), and is characterized in that a fiber paper layer (300) is adhered and lined between the wood base material layer (100) and the wood-grain paper layer (200).
2. The wood composite flooring according to claim 1, wherein the fiber paper used for the fiber paper layer (300) is melamine impregnated fiber paper.
3. The wood composite floor according to claim 1, wherein a high-density fiberboard layer (400) is adhered between the fiber paper layer (300) and the wood substrate layer (100).
4. The wood composite flooring as claimed in claim 3, wherein the high-density fiberboard layer (400) has a thickness of 0.8mm to 1.2mm, and the high-density fiberboard used in the high-density fiberboard layer (400) has a density of 0.9kg/m3～1.2kg/m3。
5. The wood composite flooring as claimed in claim 3, wherein the high density fiberboard layer (400) is provided with a plurality of micropores (410).
6. The wood composite flooring according to claim 5, wherein the pores (410) have a diameter of 0.05mm to 0.10 mm; the micropores (410) are arranged in an array, the transverse distance between every two adjacent micropores (410) is 0.05-0.20 mm, and the longitudinal distance is 0.05-0.10 mm.
7. The wood composite flooring according to claim 3, wherein the high-density fiberboard layer (400) and the wood substrate layer (100) are lined with a first balance paper layer (500) therebetween.
8. The new wood composite flooring according to claim 3 or 4 or 5 or 6 or 7, characterised in that the first balancing paper layer (500) is melamine impregnated paper.
9. The wood composite floor according to claim 8, wherein a second balancing paper layer (600) is glued to the back side of the wood substrate layer (100).
10. The novel wood composite floor according to claim 9, wherein the wood-grain paper layer (200) is provided with a wear layer (700), the back surface of the wood substrate layer (100) is adhered with a back surface decoration layer (800), and the back surface of the back surface decoration layer (800) is adhered with a transparent moisture-proof layer (900).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110834137.7A CN113431294A (en) | 2021-07-20 | 2021-07-20 | Novel wooden composite floor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110834137.7A CN113431294A (en) | 2021-07-20 | 2021-07-20 | Novel wooden composite floor |
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| Publication Number | Publication Date |
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| CN113431294A true CN113431294A (en) | 2021-09-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110834137.7A Pending CN113431294A (en) | 2021-07-20 | 2021-07-20 | Novel wooden composite floor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115059261A (en) * | 2022-06-27 | 2022-09-16 | 浙江菱格木业有限公司 | A kind of HDF composite board |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040095136A (en) * | 2003-06-05 | 2004-11-12 | 주식회사 엘지화학 | Wood flooring composed of WPL, base and soundproof layer |
| CN101229702A (en) * | 2008-02-22 | 2008-07-30 | 卢红伟 | Method of manufacturing ultra thin stone cellular board |
| JP2011226198A (en) * | 2010-04-22 | 2011-11-10 | Panasonic Electric Works Co Ltd | Wood floor material |
| CN204401967U (en) * | 2014-12-30 | 2015-06-17 | 苏州市红枋家居有限公司 | high stable multi-layer solid wood floor |
| CN107866889A (en) * | 2017-09-27 | 2018-04-03 | 胡征远 | A kind of preparation method of compound door plant |
| CN112917630A (en) * | 2021-04-08 | 2021-06-08 | 浙江菱格木业有限公司 | Novel wood floor and manufacturing method thereof |
-
2021
- 2021-07-20 CN CN202110834137.7A patent/CN113431294A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040095136A (en) * | 2003-06-05 | 2004-11-12 | 주식회사 엘지화학 | Wood flooring composed of WPL, base and soundproof layer |
| CN101229702A (en) * | 2008-02-22 | 2008-07-30 | 卢红伟 | Method of manufacturing ultra thin stone cellular board |
| JP2011226198A (en) * | 2010-04-22 | 2011-11-10 | Panasonic Electric Works Co Ltd | Wood floor material |
| CN204401967U (en) * | 2014-12-30 | 2015-06-17 | 苏州市红枋家居有限公司 | high stable multi-layer solid wood floor |
| CN107866889A (en) * | 2017-09-27 | 2018-04-03 | 胡征远 | A kind of preparation method of compound door plant |
| CN112917630A (en) * | 2021-04-08 | 2021-06-08 | 浙江菱格木业有限公司 | Novel wood floor and manufacturing method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 吉林农业机械化学院修理教研室: "农机旧件修复工艺", 30 June 1981, 吉林人民出版社, pages: 361 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115059261A (en) * | 2022-06-27 | 2022-09-16 | 浙江菱格木业有限公司 | A kind of HDF composite board |
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Address after: No. 158, Hengsan Road, Nanxun, Nanxun District, Huzhou, Zhejiang Province, 313029 Applicant after: Hongmufang home technology (Huzhou) Co.,Ltd. Address before: 313009 No. 2229-1 xunlian Road, Nanxun Town, Nanxun District, Huzhou City, Zhejiang Province Applicant before: Hongmufang home technology (Huzhou) Co.,Ltd. |
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