CN113363195B - Adsorption type chip transfer device and chip repairing equipment - Google Patents
Adsorption type chip transfer device and chip repairing equipment Download PDFInfo
- Publication number
- CN113363195B CN113363195B CN202110685825.1A CN202110685825A CN113363195B CN 113363195 B CN113363195 B CN 113363195B CN 202110685825 A CN202110685825 A CN 202110685825A CN 113363195 B CN113363195 B CN 113363195B
- Authority
- CN
- China
- Prior art keywords
- chip
- seat
- transfer device
- movable seat
- adsorption
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H10P72/78—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/018—Unsoldering; Removal of melted solder or other residues
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- H10P72/3302—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
本发明公开一种吸附式芯片转移装置，其包括基板、滑板、驱动组件、活动座、吸杆、吸咀及弹性件，滑板沿纵向可滑动地设于基板上，驱动组件驱动滑板移动，活动座沿纵向可滑动地设于滑板上，吸杆安装在活动座上，吸杆与真空发生器连接，吸咀连接在吸杆的下端，弹性件沿活动座的滑动方向可伸缩地设于滑板与活动座之间，活动座搭抵在弹性件的上端，从而使得活动座悬浮在滑板上。本发明的吸附式芯片转移装置，吸附芯片时对芯片起到了缓冲作用，有效克服了吸取芯片过程中，芯片因受到过大压力而发生损坏的情况，实现了芯片的无损转移。本发明还公开了一种带有该吸附式芯片转移装置的芯片返修设备。
The present invention discloses an adsorption-type chip transfer device, which includes a substrate, a slide plate, a driving assembly, a movable seat, a suction rod, a suction nozzle and an elastic member. The slide plate is slidably disposed on the substrate along the longitudinal direction. The driving assembly drives the slide plate to move. The movable seat is slidably disposed on the slide plate along the longitudinal direction. The suction rod is installed on the movable seat. The suction rod is connected to a vacuum generator. The suction nozzle is connected to the lower end of the suction rod. The elastic member is telescopically disposed between the slide plate and the movable seat along the sliding direction of the movable seat. The movable seat rests on the upper end of the elastic member, so that the movable seat is suspended on the slide plate. The adsorption-type chip transfer device of the present invention has a buffering effect on the chip when adsorbing the chip, effectively overcoming the situation in which the chip is damaged due to excessive pressure during the process of adsorbing the chip, and realizing the lossless transfer of the chip. The present invention also discloses a chip repair device with the adsorption-type chip transfer device.
Description
Technical Field
The invention relates to the technical field of chip transfer, in particular to an adsorption type chip transfer device and chip repairing equipment.
Background
In the GBA chip repair process, chip repair equipment is generally used for operation, which is mainly responsible for detaching, mounting and welding the chip. When the chip is attached, the suction nozzle moves downwards and contacts with the chip, then the chip is adsorbed and transferred to a position to be welded on the circuit board through the suction nozzle, and in the process, if the stroke control of the suction nozzle in the descending direction is improper, the suction nozzle can apply larger pressure to the chip, so that the chip is easily damaged due to overlarge pressure.
Therefore, in the technical field of chip repair, how to realize the lossless transfer of chips is a problem to be solved in the field.
Disclosure of Invention
Based on this, it is necessary to provide an adsorption type chip transfer device that can buffer the chip;
It is also necessary to provide a chip repair apparatus with the adsorption type chip transfer device.
The invention solves the technical problems by adopting the technical scheme that the adsorption type chip transfer device comprises a base plate, a sliding plate, a driving assembly, a movable seat, a suction rod, a suction nozzle and an elastic piece, wherein the sliding plate is longitudinally and slidably arranged on the base plate, the driving assembly drives the sliding plate to move, the movable seat is longitudinally and relatively and slidably arranged on the sliding plate, the suction rod is arranged on the movable seat, the suction rod is connected with a vacuum generator, the suction nozzle is connected to the lower end of the suction rod, the elastic piece is telescopically arranged between the sliding plate and the movable seat along the sliding direction of the movable seat, and the movable seat is abutted against the upper end of the elastic piece, so that the movable seat is suspended on the sliding plate.
Further, a supporting block is connected to the sliding plate, a propping block is connected to the movable seat corresponding to the supporting block, the lower end of the elastic piece is propped against the supporting block, and the propping block is propped against the upper end of the elastic piece.
Further, a guide post is fixedly connected to the upper end face of the supporting block, the guide post slidably penetrates through the abutting block, and the elastic piece is a spring sleeved outside the guide post.
Further, a double-shaft motor is mounted on the movable seat, an output shaft of the double-shaft motor is of a hollow tubular structure, the lower end of the output shaft of the double-shaft motor is connected with the upper end of the suction rod through a coupler, and the upper end of the output shaft of the double-shaft motor is connected with the vacuum generator through an adapter. The precise suction rod is directly connected with the hollow motor, so that the verticality of the suction rod is improved, the suction force is enhanced, and the suction and mounting of the large-size BGA chip are met.
Further, the movable seat comprises a connecting seat, a first fixed seat and a second fixed seat which are oppositely arranged on the connecting seat, the connecting seat is connected with the sliding plate in a relatively slidable manner, the first fixed seat and the second fixed seat are mutually perpendicular to the connecting seat, and the suction rod penetrates through the first fixed seat and the second fixed seat in a rotatable manner.
Further, the drive assembly comprises a drive motor, a drive pulley, a driven pulley and a transmission belt, wherein the drive motor is fixedly arranged on one side of the base plate opposite to the sliding plate, the drive pulley and the driven pulley are both rotatably connected with the base plate, an output shaft of the drive motor is connected with the drive pulley, the transmission belt is sleeved on the drive pulley and the driven pulley at the same time, and one side of the transmission belt is fixedly connected with the sliding plate.
Further, the adsorption chip transfer device further comprises a photoelectric switch and a controller, wherein the photoelectric switch comprises a transmitter arranged on the sliding plate and a receiver arranged on the movable seat, and the receiver and the vacuum generator are electrically connected with the controller.
A chip repair apparatus comprising the adsorption type chip transfer device of any one of the preceding claims.
Further, the chip repairing device further comprises a carrying platform mechanism for placing chips, and the adsorption type chip transferring device is movably arranged above the carrying platform mechanism.
Further, the chip repairing device further comprises a machine table, the carrying table mechanism is arranged on the machine table, a longitudinal beam is fixedly arranged on the machine table, a cross beam is slidably arranged on the longitudinal beam, the cross beam is perpendicular to the longitudinal beam, a movable plate is slidably arranged on the cross beam, and the base plate is fixedly connected with the movable plate.
The adsorption type chip transfer device or chip repairing equipment has the beneficial effects that the adsorption type chip transfer device or chip repairing equipment is compact in structure and ingenious in design, the suction nozzle can be suspended at a certain height, and when the movable seat moves downwards and the suction nozzle is pressed against the chip, the elastic piece is gradually reset, so that a good buffer effect is achieved, the acting force of the movable seat on the chip is greatly reduced, the damage condition of the chip caused by overlarge pressure in the chip sucking process is effectively overcome, and the nondestructive transfer of the chip is realized. Especially for the mounting of small-size chips, the pressure generated on the surfaces of the chips is larger, hidden danger exists larger, and the adsorption type chip transfer device or chip repairing equipment can improve the reliability in the use process.
The invention also provides a disassembling and heating mechanism which has high disassembling and welding efficiency and can timely absorb the chip, a heating device with the disassembling and welding heating mechanism and chip repairing equipment with the heating device.
The technical scheme includes that the disassembling and welding heating mechanism comprises a fixed plate, a sliding plate driving piece, a heating module, a suction rod and a suction rod driving piece, wherein the sliding plate is longitudinally and slidably arranged on the fixed plate, the driving plate driving piece drives the sliding plate to move, the heating module is fixedly arranged on the sliding plate, the suction rod is connected with a vacuum generator and longitudinally and slidably arranged on the sliding plate, the heating module comprises a shell arranged on the sliding plate, a fan arranged at the top of the shell and a heater arranged in the shell, an opening is formed in the bottom of the shell, and the suction rod is driven by the suction rod driving piece to movably penetrate through the opening.
Further, the shell is of a box-packed structure, the fans are multiple, the fans are uniformly distributed on two opposite sides of the suction rod, the top of the shell is provided with a plurality of air inlets, and one fan is correspondingly connected with one air inlet.
Further, a heat insulation plate is arranged above the heater in the shell, and a plurality of evenly distributed air guide grooves are formed in the heat insulation plate.
Further, the heater is a ceramic heater.
Further, the suction rod driving piece comprises a suction rod motor fixedly connected to the sliding plate and a sliding block longitudinally and slidably arranged on the sliding plate, an output shaft of the suction rod motor is a screw rod and is in threaded connection with the sliding block, and the suction rod is connected to the sliding block.
The heating device comprises any one of the above-mentioned disassembling and heating mechanisms, the heating device further comprises a bottom heating mechanism and a local heating mechanism, the disassembling and heating mechanism, the local heating mechanism and the bottom heating mechanism are sequentially arranged from top to bottom, a circuit board to be heated is located between the disassembling and heating mechanism and the local heating mechanism, and the local heating mechanism and the disassembling and heating mechanism synchronously move.
Chip repair equipment, chip repair equipment includes aforementioned heating device, chip repair equipment still includes the board, bottom heating mechanism fixed mounting is in on the board, the dismantlement welding heating mechanism with local heating mechanism relatively movable locates the top of board, fixed mounting has the longeron on the board, slidable installs the crossbeam on the longeron, the crossbeam with longeron mutually perpendicular, slidable installs the fly leaf on the crossbeam, fixed plate fixed mounting is in on the fly leaf.
Further, the local heating mechanism comprises an air outlet cavity, a connecting pipe and a barrel heater communicated between the air outlet cavity and the connecting pipe, wherein a plurality of air outlet holes are formed in the top of the air outlet cavity, the air outlet cavity corresponds to the shell, the connecting pipe is connected with the movable plate through the connecting arm, and the connecting pipe is communicated with an air source.
Further, the chip repairing device further comprises a carrying platform mechanism for placing chips and an adsorption type chip transferring device, wherein the carrying platform mechanism is installed on the machine platform, and the adsorption type chip transferring device is movably arranged above the carrying platform mechanism.
The disassembling and heating mechanism or the heating device or the chip repairing equipment has the beneficial effects that the independent sucking rod is arranged to suck the disassembled chip during disassembling, and after the disassembling work of the heating module is completed, the sucking rod can timely descend and suck the chip, so that the disassembling and welding process is accelerated, the disassembling and welding efficiency is improved, and the effect of sucking the chip is ensured.
The invention also provides a carrier mechanism capable of preventing the collapse deformation of the PCB and convenient to install and operate and chip repairing equipment with the carrier mechanism.
The technical scheme includes that the carrying platform mechanism is arranged on a machine platform and comprises a sliding seat, a frame, a supporting plate and a supporting rod, wherein the sliding seat is slidably arranged on the machine platform, the frame is rotatably arranged on the sliding seat, the supporting plate and the supporting rod are slidably arranged on the frame, a side pressing piece is arranged on the supporting plate, a supporting piece is arranged on the supporting rod, the side pressing piece abuts against the upper end face of a circuit board, the supporting piece abuts against the lower end face of the circuit board, a telescopic piece is arranged between the sliding seat and the frame, one end of the telescopic piece is hinged with the sliding seat, the other end of the telescopic piece is hinged with the frame, a positioning seat is arranged on a sliding path of the sliding seat on the machine platform, and the frame is detachably connected with the positioning seat.
Further, a positioning hole is formed in the top of the positioning seat, a positioning column is arranged on the bottom of the frame in a protruding mode, and the positioning column is detachably inserted into the positioning hole.
Further, the two support plates are arranged oppositely, strip-shaped notch grooves are formed in the opposite side walls of the two support plates, and the two notch grooves jointly form a mounting groove for placing the circuit board.
Further, the side pressure piece includes side pressure board and side pressure bolt, the side pressure board with the backup pad is connected, the side pressure bolt runs through the side pressure board and with side pressure board threaded connection, the lower extreme of side pressure bolt with the up end of circuit board supports.
Further, install a plurality of auxiliary stay spare in the backup pad, auxiliary stay spare includes bent pole and positioning disk, the positioning disk is connected bent the one end of pole, the waist type groove has been seted up on the bent pole, be connected with the lock bolt in the backup pad, the lock bolt passes waist type groove and can follow waist type groove slides.
Further, the support piece comprises a sliding block, a thimble and an elastic component, wherein the sliding block is slidably arranged on the support rod, the thimble is longitudinally slidably arranged on the sliding block, and the elastic component is telescopically arranged between the sliding block and the thimble.
Further, a containing groove is formed in the sliding block, the ejector pin is slidably arranged in the containing groove, a step surface is arranged on the outer side wall of the ejector pin, the upper end of the elastic component is elastically abutted to the step surface, and the lower end of the elastic component is elastically abutted to the bottom wall of the containing groove.
Further, a locking bolt is arranged on the side wall of the sliding block, one end of the locking bolt can extrude and fix the thimble, a fixing bolt is also arranged on the side wall of the sliding block, and one end of the fixing bolt can extrude the side wall of the supporting rod.
A chip repair apparatus comprising a stage mechanism as claimed in any one of the preceding claims.
Further, the chip repairing device further comprises an adsorption type chip transferring device, and the adsorption type chip transferring device is movably arranged above the carrying platform mechanism.
The carrying platform mechanism or the chip repairing equipment has the beneficial effects that the circuit board is extruded between the side pressing piece and the supporting piece, so that the loading and fixing effects on the circuit board are realized, meanwhile, collapse deformation of the circuit board in the heating process can be effectively avoided, in addition, the angle and the position of the circuit board can be adjusted when the circuit board is installed, the installation operation is convenient, and the loading efficiency and the loading quality of the circuit board are greatly improved.
Drawings
The invention is further described below with reference to the drawings and examples.
FIG. 1 is a perspective view of a chip repair apparatus according to a first embodiment of the present invention;
FIG. 2 is another perspective view of the chip repair apparatus of FIG. 1 (with the control cabinet, protective housing and shield omitted);
FIG. 3 is a perspective view of the other view of FIG. 2;
FIG. 4 is a perspective view of a stage mechanism in the chip repair apparatus of FIG. 1;
FIG. 5 is a perspective view (with portions of the auxiliary supports omitted) of the stage mechanism shown in FIG. 4 from another perspective;
FIG. 6 is an enlarged view of a portion of the stage mechanism shown in FIG. 5 at A;
FIG. 7 is a top view of the stage mechanism shown in FIG. 5;
FIG. 8 is an enlarged view of a portion of the stage mechanism shown in FIG. 7 at B;
FIG. 9 is a cross-sectional view taken along line C-C of FIG. 8;
FIG. 10 is a cross-sectional view taken along line D-D of FIG. 8;
FIG. 11 is a perspective view of another state of the stage mechanism shown in FIG. 4;
FIG. 12 is a perspective view of an adsorption type chip transfer device in the chip repairing apparatus shown in FIG. 2;
FIG. 13 is a perspective view of the suction-type chip transfer apparatus of FIG. 12 from another perspective;
FIG. 14 is a partially exploded view of the bottom heating mechanism of the chip repair apparatus of FIG. 2;
FIG. 15 is a perspective view of a desoldering heating mechanism in the chip repair apparatus of FIG. 2;
FIG. 16 is a perspective view of the alternative view of the desoldering heating mechanism of FIG. 15;
FIG. 17 is a perspective view of a localized heating mechanism in the chip repair apparatus of FIG. 2;
Fig. 18 is a schematic view of a part of the structure of a disassembling and heating mechanism in a chip repairing apparatus according to the second embodiment of the present invention.
The names and the numbers of the parts in the figure are respectively as follows:
longitudinal beam 12 of machine table 10 slide seat guide rail 11
Protective housing 15 for movable plate 14 of cross beam 13
Guide bar 161 guide block 162 of bracket 16
Carriage mechanism 20 slide 21 frame 22
Positioning column 221 supports rail 222 support handle 223
Supporting plate 23 side press 231 side press 2311
Side pressure bolt 2312 assists support 232 in bending bar 2321
Positioning disk 2322 waist-shaped groove 2323 locking bolt 2324
Notch 233 support bar 24 support 241
Elastic component 2413 of ejector pin 2412 of slider 2411
Locking bolt 2416 with clamping spring 2415 in receiving groove 2414
Positioning seat 26 of telescopic piece 25 of fixing bolt 2417
Positioning hole 261 adsorbs formula chip transfer device 30 base plate 31
Slide 32 support block 321 drive assembly 33
Driving motor 331 driving pulley 332 driven pulley 333
Connecting seat 341 of movable seat 34 of driving belt 334
The first fixing base 342 and the second fixing base 343 abut against the block 344
Suction nozzle 36 elastic piece 37 of suction rod 35
Adapter 382 of coupler 381 of double-shaft motor 38
Photoelectric sensor 391 baffle 392 heating device 40
The bottom heating mechanism 41 heats the heating member 412 of the housing 411
Protective screening 413 detaching and welding heating mechanism 42 fixing plate 421
Sliding plate 422 sliding plate drive 423 heats module 424
Housing 4241 blower 4242 Heater 4243
Opening 4244 air inlet 4245 heat insulating plate 4246
Suction bar 425 of air guide groove 4247 suction bar driving member 426
Suction bar motor 4261 sliding block 4262 local heating mechanism 43
Air outlet hole 4311 connecting pipe 432 of air outlet cavity 431
Cartridge heater 433,4249 shield 50 cooling module 60
Control cabinet 70 display panel 80 hot air mixing chamber 4248
Temperature sensor 4252 of air pipe joint 4251 of hot air nozzle 4250
Detailed Description
The present invention will now be described in detail with reference to the accompanying drawings. The figure is a simplified schematic diagram illustrating the basic structure of the invention only by way of illustration, and therefore it shows only the constitution related to the invention.
Example 1
Referring to fig. 1 and 2, the present invention provides a chip repairing apparatus for disassembling, transferring and welding a chip, the chip repairing apparatus includes a machine table 10, a carrier table mechanism 20 disposed on the machine table 10 and used for placing the chip, an adsorption type chip transferring device 30 movably disposed above the carrier table mechanism 20, and a heating device 40 mounted on the machine table 10, wherein the carrier table mechanism 20 is used for loading and fixing a circuit board, the adsorption type chip transferring device 30 is used for transferring the chip to a mounting portion of the circuit board, and the heating device 40 is used for heating the circuit board to facilitate disassembling and welding.
Referring to fig. 4, the stage mechanism 20 includes a sliding seat 21 slidably disposed on the machine 10, a frame 22 rotatably mounted on the sliding seat 21, a support plate 23 and a support rod 24 slidably disposed on the frame 22, a side pressing member 231 mounted on the support plate 23, a support member 241 mounted on the support rod 24, the side pressing member 231 being used for abutting against an upper end surface of the circuit board, the support member 241 being used for abutting against a lower end surface of the circuit board, a telescopic member 25 being disposed between the sliding seat 21 and the frame 22, one end of the telescopic member 25 being hinged to the sliding seat 21, the other end of the telescopic member 25 being hinged to the frame 22, a positioning seat 26 being disposed on a sliding path of the sliding seat 21 on the machine 10, the frame 22 being detachably connected to the positioning seat 26.
When the circuit board to be reworked is mounted on the frame 22, the circuit board is pressed between the side press 231 and the support 241, thereby realizing loading and fixing of the circuit board, and simultaneously, effectively avoiding collapse and deformation of the circuit board during heating. When the frame 22 is turned over relative to the slide 21, the telescopic piece 25 is stretched, so that one side of the frame 22 is lifted and locked at a certain angle, and meanwhile, the slide 21 drives the frame 22 and the circuit board thereon to be pulled out to one side of the machine 10, thereby being convenient for a user to adjust the installation position of the circuit board. After the position of the circuit board is adjusted, the sliding seat 21 and the frame 22 are reset, and the frame 22 is locked on the positioning seat 26, so that the condition that the circuit board moves in the repairing process can be effectively avoided. The operation is simple and convenient, and the loading efficiency and the loading quality of the circuit board are greatly improved.
Referring to fig. 1 and 4, in the present embodiment, a carriage rail 11 is mounted on a machine 10, and a carriage 21 is slidably connected to the carriage rail 11 to achieve a slidable connection between the carriage 21 and the machine 10. In addition, the two slide rails 11 and 21 are respectively provided, and one slide 21 corresponds to one slide rail 11, and two opposite sides of the frame 22 are respectively rotatably connected with the two slide rails 21, so that the sliding stability of the slide rails 21 and the overturning stability of the frame 22 are improved.
Referring to fig. 11, in order to realize connection between the frame 22 and the positioning seat 26, a positioning hole 261 is formed at the top of the positioning seat 26, a positioning post 221 is protruding from the bottom of the frame 22, and the positioning post 221 is detachably inserted into the positioning hole 261. When the positioning column 221 is inserted into the positioning hole 261, the frame 22 and the positioning seat 26 are in a locking state, the sliding seat 21 cannot slide relative to the machine 10, when the sliding seat 21 turns over the frame 22 upwards, the positioning column 221 is separated from the positioning hole 261, and the locking state between the frame 22 and the positioning seat 26 is released, at this time, a user can slide the sliding seat 21 relative to the machine 10 to drive the frame 22 to move together. It will be appreciated that in other embodiments not shown, the frame 22 and the positioning seat 26 may be detachably connected by a clamping connection, a magnetic connection, or the like, which is not limited herein.
In this embodiment, the expansion member 25 is a gas spring, and after the frame 22 is turned over, the gas spring can support the frame 22 by means of its damping effect, so that the operation of a user is facilitated. In other embodiments, not shown, the telescopic member 25 may also be of an inner and outer sleeve structure, i.e. the outer sleeve is slidably sleeved on the outer part of the inner sleeve, and the damping effect of the telescopic member is achieved by controlling the friction between the outer sleeve and the inner sleeve. Here, the specific structure of the expansion member 25 is not limited.
Referring to fig. 4, 5 and 7, two support plates 23 are provided, the two support plates 23 are disposed opposite to each other, and each of opposite side walls of the two support plates 23 is provided with a strip-shaped slot 233, and the two slots 233 together form a placement slot (not shown) for placing a circuit board. When the circuit board mounting device is used, the distance between the two support plates 23 can be changed through the sliding support plates 23, and then the width of the mounting groove is adjusted, so that the circuit board mounting device is suitable for mounting requirements of circuit boards with different widths, and the universality is strong.
Referring to fig. 6, the side pressing member 231 includes a side pressing plate 2311 and a side pressing bolt 2312, the side pressing plate 2311 is connected with the supporting plate 23, the side pressing bolt 2312 penetrates the side pressing plate 2311 and is in threaded connection with the side pressing plate 2311, and the lower end of the side pressing bolt 2312 abuts against the upper end face of the circuit board. In use, the circuit board is placed in the seating groove, and then the side pressure bolt 2312 is rotated such that the lower end of the side pressure bolt 2312 is pressed against the upper end surface of the circuit board, thereby pressing and fixing the circuit board in the seating groove.
In addition, in order to adapt to the loading and fixing of the circuit board of irregular shape, install a plurality of auxiliary stay pieces 232 on the backup pad 23, auxiliary stay pieces 232 include bent rod 2321 and positioning disk 2322, and positioning disk 2322 connects in the one end of bent rod 2321, has seted up waist type groove 2323 on the bent rod 2321, is connected with lock bolt 2324 on the backup pad 23, and lock bolt 2324 passes waist type groove 2323 and can follow waist type groove 2323 and slide. When the circuit board fixing device is used, the locking bolt 2324 is unscrewed, the position and the angle of the bending rod 2321 are adjusted until the bottom of the edge of the circuit board is overlapped on the positioning disk 2322, and the circuit board can be extruded and fixed between the side pressure bolt 2312 and the positioning disk 2322 by rotating the side pressure bolt 2312. The irregular circuit board refers to a circuit board whose edge cannot be lapped on the notch 233, so that the edge portion of the circuit board which cannot be lapped on the notch 233 can be lapped on the positioning disk 2322 by adjusting the position and the angle of the auxiliary supporting piece 232, so as to facilitate loading and fixing of the circuit board.
In this embodiment, the supporting element 241 includes a sliding block 2411, a thimble 2412 and an elastic component 2413, the sliding block 2411 is slidably disposed on the supporting rod 24, the thimble 2412 is longitudinally slidably disposed on the sliding block 2411, and the elastic component 2413 is telescopically disposed between the sliding block 2411 and the thimble 2412, when in use, the sliding block 2411 drives the thimble 2412 to move to a required position, and the thimble 2412 abuts against the lower end surface of the circuit board under the action of the elastic force of the elastic component 2413, so as to support the circuit board, thereby preventing the circuit board from deforming and collapsing. Meanwhile, the protruding amount of the thimble 2412 can be changed, so that the supporting requirement of circuit boards with different thicknesses can be met.
Specifically, referring to fig. 6 and 9, a receiving groove 2414 is formed on the slider 2411, a thimble 2412 is slidably disposed in the receiving groove 2414, a step surface (not shown) is disposed on an outer sidewall of the thimble 2412, an upper end of the elastic member 2413 elastically abuts against the step surface, and a lower end of the elastic member 2413 elastically abuts against a bottom wall of the receiving groove 2414.
In the present embodiment, the elastic member 2413 is a spring that is fitted around the outside of the ejector pin 2412. It will be appreciated that in other embodiments not shown, the resilient member 2413 may also be a rigid and resilient element such as a stainless steel spring sheet or a copper spring sheet, without limitation.
In addition, in order to prevent the ejector pin 2412 from moving upwards under the elastic force of the elastic member 2413 and being separated from the accommodating groove 2414 of the slider 2411, the lower end of the ejector pin 2412 extends downwards to the outside of the slider 2411, and the lower end of the ejector pin 2412 is provided with a clamp spring 2415, and the clamp spring 2415 abuts against the bottom of the slider 2411, thereby preventing the ejector pin 2412 from being separated from the slider 2411.
Meanwhile, referring to fig. 8-10, in order to lock the thimble 2412 to a lower position before loading the fixed circuit board, a locking bolt 2416 is mounted on a side wall of the slider 2411, and tightening the locking bolt 2416 can make one end of the locking bolt 2416 press and fix the thimble 2412, and when the locking bolt 2416 is unscrewed, the locking state of the thimble 2412 is released, and the thimble 2412 automatically moves upwards under the elastic force of the elastic member 2413 and then abuts against the lower end surface of the circuit board.
In addition, a fixing bolt 2417 is further installed on the side wall of the slider 2411, and tightening the fixing bolt 2417 can make one end of the fixing bolt 2417 press the side wall of the support rod 24, so, when the slider 2411 drives the thimble 2412 to slide to a required position, the slider 2411 can be fixed on the support rod 24 by tightening the fixing bolt 2417.
In other embodiments, not shown, the elastic member 2413 may be omitted, where the supporting member 241 includes a slider 2411 slidably disposed on the supporting rod 24 and a thimble 2412 fixedly connected to the slider 2411, where the thimble 2412 is made of a resilient deformable material, and the thimble 2412 may abut against the lower end surface of the circuit board by virtue of an elastic force generated after self-deformation. It will be appreciated that the spike 2412 is made of silicone or rubber material.
Referring to fig. 4, in the present embodiment, the opposite sides of the frame 22 are respectively provided with a support rail 222, the support rails 222 are perpendicular to the slide rail 11, and two ends of the support plate 23 and two ends of the support bar 24 are slidably connected with the support rails 222 to achieve the functions of adjusting the side pressing member 231 and the support member 241. A bolt (not shown) is installed at one side of the support plate 23, and one end of the bolt is abutted against the frame 22 to lock and fix the support plate 23 after the position is adjusted. In addition, a stand handle 223 is installed at one side of the frame 22, so that a user can conveniently hold the stand handle 223 to perform a tilting operation on the frame 22.
Referring to fig. 12 and 13, in the present embodiment, the suction type chip transferring apparatus 30 includes a base 31, a slide plate 32, a driving assembly 33, a movable seat 34, a suction rod 35, a suction nozzle 36 and an elastic member 37, wherein the slide plate 32 is longitudinally slidably disposed on the base 31, the driving assembly 33 drives the slide plate 32 to move, the movable seat 34 is longitudinally relatively slidably disposed on the slide plate 32, the suction rod 35 is mounted on the movable seat 34, the suction rod 35 is connected to a vacuum generator (not shown), the suction nozzle 36 is connected to a lower end of the suction rod 35, the elastic member 37 is telescopically disposed between the slide plate 32 and the movable seat 34 along a sliding direction of the movable seat 34, and the movable seat 34 is abutted against an upper end of the elastic member 37, so that the movable seat 34 is suspended on the slide plate 32.
When the chip transferring device is used, the adsorption type chip transferring device 30 is moved to the upper side of the storage box which is placed on the machine table 10 and is used for storing chips, the driving assembly 33 drives the sliding plate 32 to move downwards relative to the base plate 31, so that the movable seat 34 is driven to move downwards together with the suction rod 35 and the suction nozzle 36, when the suction nozzle 36 is pressed against the chips, the vacuum generator works, negative pressure is formed in the suction rod 35, the chips are adsorbed on the suction nozzle 36, and at the moment, the sliding plate 32 moves upwards to lift the chips. The integrated mobile suction type chip transfer device 30 is then moved to above the position to be soldered on the circuit board, and the movable base 34 is put down again, so that the chip is placed at the mounting position of the circuit board, and the vacuum generator is turned off.
In the above process, in the initial state, the elastic member 37 is compressed under the gravity of the movable seat 34, and the elastic force generated by the elastic member 37 after being compressed and positioned is used for suspending the movable seat 34, the suction rod 35 and the suction nozzle 36 at a certain height. When the movable seat 34 moves downwards and the suction nozzle 36 is pressed against the chip, the movable seat 34 moves upwards, and the elastic piece 37 is gradually reset, so that the movement of the movable seat 34 conforms to the reset trend of the elastic piece 37, the elastic piece 37 plays a good buffering role, the acting force of the movable seat 34 on the chip is greatly reduced, and the problem that the chip is damaged due to overlarge pressure in the process of sucking the chip is effectively solved.
In the present embodiment, the slide plate 32 is vertically connected with a support block 321, the movable seat 34 is connected with a supporting block 344 corresponding to the support block 321, the lower end of the elastic member 37 is abutted against the support block 321, and the supporting block 344 is abutted against the upper end of the elastic member 37.
In addition, a guide post 3211 is fixedly connected to an upper end surface of the support block 321, the guide post 3211 slidably penetrates the abutment block 344, and the elastic member 37 is a spring, and the spring is sleeved outside the guide post 3211. By providing the guide post 3211, the spring is effectively prevented from being bent to the side during compression, and the elastic member 37 is ensured to work stably. It will be appreciated that in other embodiments not shown, the guide post 3211 may be omitted, and the elastic member 37 may be a rigid and elastic member such as a stainless steel spring sheet or a copper spring sheet, which is not limited herein.
In this embodiment, the driving assembly 33 includes a driving motor 331, a driving pulley 332, a driven pulley 333 and a driving belt 334, the driving motor 331 is fixedly mounted on one side of the substrate 31 opposite to the sliding plate 32, the driving pulley 332 and the driven pulley 333 are rotatably connected with the substrate 31, an output shaft of the driving motor 331 is connected with the driving pulley 332, the driving belt 334 is sleeved outside the driving pulley 332 and the driven pulley 333, and one side of the driving belt 334 is fixedly connected with the sliding plate 32. Thus, when the driving motor 331 is started, the driving belt 334 can be driven to rotate, and the sliding plate 32 is driven to move. In addition, the driving motor 331 is a forward and reverse rotation motor, thereby realizing the reciprocating movement of the slide plate 32 in the longitudinal direction.
It will be appreciated that in other embodiments not shown, the drive assembly 33 may also be constituted by a compression cylinder or a screw drive, without limitation. The sliding plate 32 and the base plate 31 and the movable seat 34 and the sliding plate 32 are all realized by guide rails, and the structure of the guide rails is not repeated here.
In this embodiment, the movable seat 34 is mounted with a double-shaft motor 38, the output shaft of the double-shaft motor 38 has a hollow tubular structure, the lower end of the output shaft of the double-shaft motor 38 is connected with the upper end of the suction rod 35 through a coupling 381, and the upper end of the output shaft of the double-shaft motor 38 is connected with the vacuum generator through an adapter 382. When the chip is adsorbed by the suction nozzle 36, the double-shaft motor 38 is driven to rotate so as to drive the suction rod 35 to rotate together with the suction nozzle 36, thereby realizing the adjustment of the angle of the chip and being beneficial to accurate mounting.
The movable seat 34 comprises a connecting seat 341, a first fixing seat 342 and a second fixing seat 343 which are oppositely arranged on the connecting seat 341, the connecting seat 341 is connected with the sliding plate 32 in a relatively slidable manner, the first fixing seat 342 and the second fixing seat 343 are mutually perpendicular to the connecting seat 341, and the suction rod 35 penetrates through the first fixing seat 342 and the second fixing seat 343 in a rotatable manner. When in use, the first fixing seat 342 and the second fixing seat 343 can play a supporting role on the suction rod 35, prevent the suction rod 35 from being bent due to overlong suction rod 35 in the process of adsorbing the chip, and ensure the stable work of the suction rod 35. In addition, bearings (not shown) are disposed between the suction rod 35 and the first fixing base 342 and between the suction rod 35 and the second fixing base 343, so as to ensure smooth rotation of the suction rod 35.
In this embodiment, the adsorption chip transferring device 30 further includes a photoelectric switch and a controller (not shown), the photoelectric switch includes a photoelectric sensor 391 mounted on the sliding plate 32 and a blocking piece 392 mounted on the movable seat 34, and the photoelectric sensor 391 and the vacuum generator are electrically connected to the controller. Wherein the controller is used for controlling the start/stop of the vacuum generator according to the signal received by the photoelectric sensor 391.
In a specific working process, in an initial state when a chip is not adsorbed, the movable seat 34 is in a hovering state, the baffle 392 and the photoelectric sensor 391 are in relative positions, light is blocked, the controller cannot receive signals of the photoelectric sensor 392, and correspondingly, the controller controls the vacuum generator to not work; when the driving motor 331 drives the slide plate 32, the photoelectric sensor 391 and the movable seat 34 (the movable seat 34 and the slide plate 32 are connected into a whole through a line rail, the slide plate 32 moves longitudinally, the movable seat 34 is correspondingly driven to move longitudinally) and simultaneously moves downwards until the suction nozzle 36 contacts the chip, the movable seat 34 is driven to move upwards relative to the slide plate when the movable seat 34 is connected with the slide plate 32 through the line rail in a sliding manner, the suction nozzle 36 contacts the chip, the baffle plate 392 and the photoelectric sensor 391 are staggered mutually, no light signal is shielded in the photoelectric sensor 391, the controller receives an electric signal converted by the photoelectric sensor 391, the vacuum generator is controlled to start to absorb the chip, meanwhile, the driving motor 331 starts to reverse after stopping to drive the slide plate 32 to move upwards, and when the chip is sucked and lifted, the baffle plate 392 and the photoelectric sensor 391 are in relative positions again, at this moment, the vacuum generator continues to keep working until the coordinates to be pasted, the driving motor 331 drives the slide plate 32 and the photoelectric sensor 391 and the movable seat 34 to move downwards, the chip and the substrate pad are completely staggered, and the vacuum generator is controlled to stop moving upwards when the chip and the movable seat 391 is completely staggered. Thus, the automatic control of the vacuum generator in the sucking, transferring and mounting processes of the chip is realized.
Referring to fig. 2 again, in order to realize the transfer of chips by the suction type chip transfer device 30, a longitudinal beam 12 is fixedly mounted on the machine table 10, a cross beam 13 is slidably mounted on the longitudinal beam 12, the cross beam 13 and the longitudinal beam 12 are perpendicular to each other, a movable plate 14 is slidably mounted on the cross beam 13, and the suction type chip transfer device 30 is mounted on the movable plate 14. When the suction nozzle 36 is in operation, the cross beam 13 moves along the extending direction of the longitudinal beam 12, the suction type chip transferring device 30 can be driven to synchronously move, the movable plate 14 moves along the extending direction of the cross beam 13, and the suction type chip transferring device 30 can be driven to synchronously move, so that the suction type chip transferring device 30 moves transversely and longitudinally, and the suction nozzle 36 is accurate in position. In the present embodiment, the base plate 31 is fixedly connected to the movable plate 14.
In a specific embodiment, the driving manner of driving the beam 13 to move longitudinally and driving the movable plate 14 to move laterally is a screw transmission, and it is understood that in other embodiments not shown, the beam 13 and the movable plate 14 may be driven by a cylinder, which is not limited herein.
In addition, referring again to fig. 1, the outer cover of the stringers 12 is provided with a protective shell 15 for aesthetic purposes and to prevent false touches by the user.
Referring to fig. 1 and 2 again, in the present embodiment, the heating device 40 includes a bottom heating mechanism 41, a disassembling and heating mechanism 42 and a local heating mechanism 43, the bottom heating mechanism 41 is fixedly mounted on the machine 10, the disassembling and heating mechanism 42 and the local heating mechanism 43 are relatively movably disposed above the machine 10, and the disassembling and heating mechanism 42, the local heating mechanism 43 and the bottom heating mechanism 41 are sequentially disposed from top to bottom, and when in use, the circuit board is located between the disassembling and heating mechanism 42 and the local heating mechanism 43. The bottom heating mechanism 41 is used for integrally heating the circuit board, and the disassembling and heating mechanism 42 and the local heating mechanism 43 synchronously move and are used for carrying out concentrated fixed-point heating on the position of the chip to be disassembled of the circuit board.
Referring to fig. 14, the bottom heating mechanism 41 includes a heating housing 411, heating members 412 mounted at the bottom of the heating housing 411, and a protection net 413 mounted at the top of the heating housing 411, where the heating members 412 have a plurality of heating members 412 uniformly distributed. In the present embodiment, the heating element 412 is a ceramic infrared heater. It is understood that the heating element 412 may also be a heating plate, a heating rod, or the like, which generates heat when energized, and is not limited herein.
Referring to fig. 15 and 16, the disassembling and heating mechanism 42 includes a fixed plate 421, a sliding plate 422, a sliding plate driving member 423, a heating module 424, a suction rod 425 and a suction rod driving member 426, wherein the sliding plate 422 is longitudinally slidably disposed on the fixed plate 421, the driving plate driving member 423 drives the sliding plate 422 to move, the heating module 424 is fixedly mounted on the sliding plate 422, the suction rod 425 is connected with a vacuum generator and longitudinally slidably disposed on the sliding plate 422, the heating module 424 includes a housing 4241 mounted on the sliding plate 422, a fan 4242 disposed on the top of the housing 4241, and a heater 4243 disposed inside the housing 4241, an opening 4244 is provided at the bottom of the housing 4241, and the suction rod 425 is driven by the suction rod driving member 426 to movably penetrate the opening 4244.
During disassembly, the disassembly heating mechanism 42 is moved to the position of the chip to be disassembled, the sliding plate driving piece 423 drives the sliding plate 422 to move downwards and approach the chip to be disassembled, the fan 4242 is started, the heat generated by the heater 4243 is blown to the position to be disassembled by wind generated by the fan through the opening 4244, when a certain temperature is reached, the solder balls at the disassembly position are melted, the suction rod driving piece 426 drives the suction rod 425 to move downwards and then penetrate out from the bottom of the shell 4241, and the chip is further sucked. The separate sucking rod 425 is provided in the structure of the disassembling and heating mechanism 42 to suck the disassembled chip, when the heating module 424 finishes the disassembling and welding work, the sucking rod 425 can descend at a time and suck the chip, so that the disassembling and welding process is accelerated, and the working efficiency is improved.
The casing 4241 is box-shaped structure, and fan 4242 has a plurality ofly, and a plurality of fans 4242 evenly distributed is in the both sides that draw the pole 425 to be opposite, and a plurality of air intakes 4245 have been seted up at the top of casing 4241, and a fan 4242 corresponds with an air intake 4245 and is connected. By arranging the two fans 4242, the uniformity of air flow heat at the opening 4244 is improved, and the position of the chip to be detached and welded on the circuit board is ensured to be uniformly heated. In this embodiment, two fans 4242 are provided.
Further, a heat insulation plate 4246 is arranged above the heater 4243 in the shell 4241, a plurality of evenly distributed air guide grooves 4247 are formed in the heat insulation plate 4246, and air blown into the shell 4241 can be blown out of the openings 4244 evenly as much as possible under the action of the air guide grooves 4247 through the arrangement of the heat insulation plate 4246, so that the detaching and welding effect is further improved.
In addition, in this embodiment, the heater 4243 is a ceramic heater, and hot air is uniformly distributed when the ceramic heater works, so that the heat conduction performance is good, and the temperature of the surface to be disassembled can be ensured to be uniform.
In this embodiment, the sliding connection between the sliding plate 422 and the fixed plate 421 is realized by a guide rail structure, and the sliding plate driving member 423 adopts the structure of the driving assembly 33 mentioned above, that is, the motor drives the conveyor belt to move, so as to drive the sliding plate 422 fixed on the conveyor belt to move. In other embodiments, the sliding plate 422 may be driven to move by using a cylinder driving method.
The suction rod driving member 426 adopts a screw transmission structure, specifically, the suction rod driving member 426 includes a suction rod motor 4261 fixedly connected to the sliding plate 422 and a sliding block 4262 slidably disposed on the sliding plate 422 in a longitudinal direction, an output shaft of the suction rod motor 4261 is a screw and is in threaded connection with the sliding block 4262, and the suction rod 425 is connected to the sliding block 4262. In use, the suction rod motor 4261 rotates to drive the output shaft thereof to rotate, and since the sliding block 4262 can only move longitudinally and cannot rotate relative to the sliding plate 422, the sliding block 4262 is forced to slide longitudinally, thereby driving the suction rod 425 to move vertically. In the present embodiment, the sliding block 4262 and the sliding plate 422 are connected by a rail structure, so that the sliding block 4246 can only slide relative to the sliding plate 422 and cannot rotate. In addition, the suction bar motor 4261 is a forward and reverse rotation motor so that the suction bar 425 can be moved up and down in the longitudinal direction.
Referring to fig. 2 again, in the present embodiment, the fixed plate 421 is fixedly mounted on the movable plate 14, so that the suction rod 425 moves to the position of the chip to be soldered accurately.
Referring to fig. 3 and 17, the local heating mechanism 43 includes an air outlet cavity 431, a connecting pipe 432, and a cartridge heater 433 connected between the air outlet cavity 431 and the connecting pipe 432, wherein a plurality of air outlet holes 4311 are formed in the top of the air outlet cavity 431, the air outlet cavity 431 is always corresponding to the housing 4241 of the heating module 424, the connecting pipe 432 is connected to the movable plate 14 through a connecting arm 434, the connecting pipe 432 is connected to an air source, and the cartridge heater 433 can generate heat after being electrified. When the device is used, the air outlet cavity 431 moves to the bottom of the chip to be disassembled, and heat generated by the barrel heater 433 is blown out through the air outlet hole 4311 and acts on the chip to be disassembled under the action of an air source, so that the fixed-point heating function is realized.
Further, referring to fig. 3 again, in order to improve the movement stability of the local heating mechanism 43, the upper end surface of the machine 10 is connected with a bracket 16, a guide rod 161 is mounted on the bracket 16, a guide block 162 is slidably connected to the guide rod 161, and the connection pipe 432 slidably penetrates the guide block 162, and in operation, the guide block 162 can support the connection pipe 432 to prevent the connection pipe 432 from being easily deformed.
Referring again to fig. 1, the exterior of the suction die transfer device 30 and the desoldering heating mechanism 42 are covered with a protective cover 50 for aesthetic purposes and to prevent false touches by the user.
Referring to fig. 2 again, the chip repairing apparatus of the present invention further includes a cooling module 60 disposed at a side portion of the stage mechanism 20, where the cooling module 60 is configured to provide a large amount of cold air to cool down the circuit board rapidly. In this embodiment, the cooling module 60 is a cross flow fan, which belongs to the prior art, and the structure thereof will not be described here.
Referring to fig. 2 again, the chip repairing apparatus of the present invention further includes a control cabinet 70 and a display panel 80, wherein the control cabinet 70 is disposed at the bottom of the machine 10, the display panel 80 is disposed at one side of the machine 10, and the display panel 80 is used for displaying operation status information of the chip repairing apparatus.
According to the chip repairing equipment, the carrying platform mechanism 20 is arranged, the circuit board is extruded between the side pressing piece 231 and the supporting piece 241, so that the loading and fixing effects on the circuit board are achieved, meanwhile, collapse deformation of the circuit board in the heating process can be effectively avoided, in addition, when the circuit board is installed, the angle and the position of the circuit board can be adjusted, installation and operation are convenient, the loading efficiency and the loading quality of the circuit board are greatly improved, the suction nozzle 36 can be hovered at a certain height through the arrangement of the suction type chip transferring device 30, when the movable seat 34 moves downwards and the suction nozzle 36 is enabled to be abutted against a chip, the elastic piece 37 is gradually reset, a good buffer effect is achieved, the acting force of the movable seat 34 on the chip is greatly reduced, the situation that the chip is damaged due to overlarge pressure in the chip sucking process is effectively overcome, the fact that the chip is damaged is achieved, in the chip disassembling and welding heating mechanism 42 is provided with a separate suction rod 425 to suck the chip, after the welding work of the heating module is completed, the suction rod 425 can be enabled to be parallel, the chip disassembling work is accelerated, and the disassembling work is improved.
Example two
Referring to fig. 18, a second embodiment of the present invention provides a chip repairing apparatus, which is different from the first embodiment in that the structure of the disassembling and heating mechanism 42, specifically, the structure of the heating module 424 is different.
Specifically, the heating module 424 in the second embodiment includes a hot air mixing chamber 4248 mounted on the sliding plate 422, a cartridge heater 4249 mounted on the top of the hot air mixing chamber 4248, and a hot air nozzle 4250 mounted on the bottom of the hot air mixing chamber 4248, where the cartridge heater 4249 is connected to a fan through an air pipe joint 4251, and when the fan is started, the generated air is heated through the cartridge heater 4249 and enters the hot air mixing chamber 4248, and then flows to the chip to be detached through the hot air nozzle 4250.
In addition, in order to realize real-time monitoring of the temperature during disassembly, a temperature sensor 4252 is mounted on the side wall of the hot air mixing chamber 4248. In the present embodiment, the temperature sensor 4252 is a type K thermocouple.
Other parts and connection structures not mentioned in the chip repairing apparatus of the second embodiment are the same as those of the first embodiment, and are not described here again.
While the foregoing is directed to the preferred embodiment of the present invention, other and further embodiments of the invention may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow. The technical scope of the present invention is not limited to the description, but must be determined according to the scope of claims.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110685825.1A CN113363195B (en) | 2021-06-21 | 2021-06-21 | Adsorption type chip transfer device and chip repairing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110685825.1A CN113363195B (en) | 2021-06-21 | 2021-06-21 | Adsorption type chip transfer device and chip repairing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113363195A CN113363195A (en) | 2021-09-07 |
| CN113363195B true CN113363195B (en) | 2025-06-10 |
Family
ID=77535333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110685825.1A Active CN113363195B (en) | 2021-06-21 | 2021-06-21 | Adsorption type chip transfer device and chip repairing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113363195B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113808986B (en) * | 2021-09-10 | 2025-05-23 | 迈为技术(珠海)有限公司 | Transfer alignment system and transfer alignment method |
| CN116313986B (en) * | 2023-05-12 | 2023-09-01 | 季华实验室 | Semiconductor component transfer device |
| CN117182234A (en) * | 2023-09-26 | 2023-12-08 | 伟翔环保科技发展(上海)有限公司 | A waste circuit board IC device recycling device and recycling method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10284521A (en) * | 1997-04-08 | 1998-10-23 | Matsushita Electric Ind Co Ltd | Bonding head in chip bonding equipment |
| CN108257897A (en) * | 2018-04-03 | 2018-07-06 | 浙江辛帝亚自动化科技有限公司 | A kind of eutectic machine |
| CN215069911U (en) * | 2021-06-21 | 2021-12-07 | 快克智能装备股份有限公司 | Adsorption type chip transfer device and chip repair equipment |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5702157B2 (en) * | 2011-01-11 | 2015-04-15 | Juki株式会社 | Electronic component mounting equipment |
| CN104241169B (en) * | 2014-07-23 | 2016-09-28 | 太原风华信息装备股份有限公司 | Small-medium size crystal liquid substrate absorption and turnover device |
| CN107068582A (en) * | 2017-01-25 | 2017-08-18 | 天津大学 | A kind of QFP chip appearance sampling systems controlled based on PC |
| CN108946135B (en) * | 2018-06-14 | 2024-02-09 | 广州明森科技股份有限公司 | Rotary chip suction device |
-
2021
- 2021-06-21 CN CN202110685825.1A patent/CN113363195B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10284521A (en) * | 1997-04-08 | 1998-10-23 | Matsushita Electric Ind Co Ltd | Bonding head in chip bonding equipment |
| CN108257897A (en) * | 2018-04-03 | 2018-07-06 | 浙江辛帝亚自动化科技有限公司 | A kind of eutectic machine |
| CN215069911U (en) * | 2021-06-21 | 2021-12-07 | 快克智能装备股份有限公司 | Adsorption type chip transfer device and chip repair equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113363195A (en) | 2021-09-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN113363195B (en) | Adsorption type chip transfer device and chip repairing equipment | |
| CN107498301B (en) | Automatic lock screw machine | |
| CN108284312B (en) | Screen separation device | |
| CN112775656B (en) | Disassembling jig | |
| CN104409578B (en) | An automatic LED lamp bead repair device | |
| CN215069911U (en) | Adsorption type chip transfer device and chip repair equipment | |
| CN111372438A (en) | An electronic component mounting device | |
| CN211802782U (en) | A kind of air knife tin removal machine | |
| CN208070785U (en) | A kind of suction pushes away integral type upper trigger | |
| CN215746929U (en) | Unsolder heating mechanism, heating device and chip repair equipment | |
| CN215187613U (en) | Loading platform mechanism and chip repair equipment | |
| CN108243601B (en) | Desktop type semi-automatic repair station | |
| TWI566655B (en) | Automatic mounting device and electronic device with the same | |
| CN216326238U (en) | Automatic assembly device for semiconductor module | |
| JP3076488U (en) | Circuit board fixing device | |
| CN112338876B (en) | Watchcase disassembling jig and disassembling method | |
| CN209858181U (en) | OLED screen optical detection equipment | |
| CN211297579U (en) | Large-temperature-area multifunctional automatic BGA repair table | |
| CN213764380U (en) | Automatic tin suction equipment | |
| CN219926003U (en) | Electronic product detection operation panel | |
| CN223777843U (en) | A dual-station welding device | |
| CN218163101U (en) | Full-automatic vision alignment repair machine capable of preventing BGA chip from falling | |
| CN223506354U (en) | Auxiliary welding device for remote controller circuit board | |
| CN223611729U (en) | Screw missing detection device | |
| CN221484713U (en) | Stress testing device for glass detection |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |