CN113305674A - Wear-resisting anti-skidding semiconductor new material preparation equipment - Google Patents
Wear-resisting anti-skidding semiconductor new material preparation equipment Download PDFInfo
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- CN113305674A CN113305674A CN202110457885.8A CN202110457885A CN113305674A CN 113305674 A CN113305674 A CN 113305674A CN 202110457885 A CN202110457885 A CN 202110457885A CN 113305674 A CN113305674 A CN 113305674A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/06—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving conveyor belts, a sequence of travelling work-tables or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The invention discloses a device for preparing a wear-resistant anti-slip new semiconductor material, which structurally comprises a bracket, a control console, a conveying platform and a brush, wherein the bottom of the control console is welded at the top position of the bracket close to the back surface, the conveying platform is arranged in front of the control console, burrs on the surface of a silicon crystal plate fall on the surface of a rotating rod, a small part of the burrs remain on the outer wall of the rotating rod, the burrs on the outer wall of the rotating rod are removed by a removing block and are collected in a collecting block through the movable fit of the removing mechanism and the rotating rod, the burrs remaining on the outer wall of the rotating rod can be reduced, the friction force between the rotating rod and the bottom surface of the silicon crystal plate is reduced, scratches on the bottom surface of the silicon crystal plate are reduced, the normal use of the silicon crystal plate is facilitated, the burrs are fluffy and are accumulated in the collecting block to reduce the volume in the collecting block, and the burrs in the collecting block are impacted and compacted through the vertical swinging of the pushing plate, the volume inside the collection block can be increased, and the amount of burr collection by the collection block is increased.
Description
Technical Field
The invention belongs to the field of new semiconductor material preparation, and particularly relates to equipment for preparing a wear-resistant anti-skidding new semiconductor material.
Background
Because the conductivity of the semiconductor material is controllable and the semiconductor material is various, the silicon material is usually processed and prepared into the silicon crystal plate for use, burrs exist on the surface of the silicon crystal plate after the silicon crystal plate with larger volume is cut, the burrs on the surface of the silicon crystal plate are polished by a polishing machine, the silicon crystal plate is conveyed forwards by continuously rotating a rotating rod, and a brush is continuously contacted with the surface of the silicon crystal plate to remove the burrs; adopt the burnishing machine to the silicon crystal board polishing among the prior art and handle, because the burr on silicon crystal board surface drops on the rotating rod surface, a small part remains in the dwang outer wall, and when the bottom surface of silicon crystal board was smooth surface, silicon crystal board bottom surface and dwang cooperation friction lead to the phenomenon of mar to appear in the silicon crystal board bottom surface, and the bottom surface is incomplete, influences the normal use of silicon crystal board.
Disclosure of Invention
In order to solve the problem that when the technology adopts a polishing machine to polish the silicon crystal plate, because burrs on the surface of the silicon crystal plate fall on the surface of the rotating rod and a small part of burrs remain on the outer wall of the rotating rod, when the bottom surface of the silicon crystal plate is a smooth surface, the bottom surface of the silicon crystal plate is matched and rubbed with the rotating rod, the bottom surface of the silicon crystal plate is scratched, the bottom surface is incomplete, and the normal use of the silicon crystal plate is influenced, the invention provides equipment for preparing a novel wear-resistant and anti-skid semiconductor material.
In order to achieve the purpose, the invention is realized by the following technical scheme: the utility model provides a wear-resisting anti-skidding new semiconductor material preparation equipment, its structure includes support, control cabinet, carries platform, brush, the welding of control cabinet bottom is in the top position that the support is close to the back, carry the platform to establish in control cabinet the place ahead, brush back end and the positive middle part clearance fit of control cabinet.
Carry the platform to include curb plate, dwang, clearance mechanism, dwang both ends and curb plate inside surface hinged joint, clearance mechanism is located the dwang below.
As a further improvement of the invention, the clearing mechanism comprises a collecting block, a contact plate, a connecting shaft and a support strip, wherein the bottom end of the contact plate is hinged with the top parts of the collecting block close to the left side and the right side through the connecting shaft, the support strip is arranged on the surface of the outer side of the contact plate, and the upper surface of the collecting block is a concave smooth cambered surface.
As a further improvement of the cleaning device, the contact plate comprises three cleaning blocks, a support plate and three movable cavities, the top end of the support plate is connected with the bottom surface of the cleaning block, the movable cavities are formed in the left side surface of the support plate from outside to inside, the cleaning blocks are made of sponge materials, and the number of the movable cavities is three.
As a further improvement of the invention, the movable cavity comprises a sleeve, a limiting block, a movable ball and a connecting strip, the limiting block is respectively connected with the upper inner wall and the lower inner wall of the left end of the sleeve into a whole, the movable ball is positioned on the right side of the limiting block, the left end of the connecting strip is arranged in the middle of the movable ball, the right end of the connecting strip is connected with the inner wall of the right side of the sleeve, and the connecting strip is made of rubber.
As a further improvement of the invention, the movable ball comprises a ball body, a rebound rod and a rotating ring, wherein the inner end of the rebound rod is fixed on the outer wall of the ball body, the middle part of the rotating ring is hinged with the outer end of the rebound rod, and the rebound rod is made of rubber.
As a further improvement of the invention, the collecting block comprises a frame, an opening, a push plate and a push strip, wherein the opening penetrates through the middle position of the upper surface of the frame and between the inner walls, the outer end of the push plate is respectively connected with the inner walls of two sides of the frame close to the top, the bottom end of the push strip is connected with the upper surface of the push plate, the frame is internally of a hollow structure, and the inner bottom of the frame is a concave semicircular groove.
As a further improvement of the invention, the push plate comprises a plate body, an inner cavity, three bouncing balls and three pressing blocks, wherein the inner cavity is formed in the plate body, the bouncing balls are arranged in the inner cavity, the pressing blocks are nested at the bottom surface of the plate body and are clamped between the inner cavities.
As a further improvement of the invention, the pressing block comprises a block body, an elastic block and an impact block, the elastic block is nested at the bottom surface of the block body, the top end of the impact block is connected with the bottom surface of the elastic block, and the impact block is a triangular block made of metal.
Advantageous effects
Compared with the prior art, the invention has the following beneficial effects:
1. because the burr on silicon crystal plate surface drops on the rotating rod surface, a small part of burr is remained on the rotating rod outer wall, through clearance mechanism and rotating rod clearance fit, the piece is clear away the burr of rotating rod outer wall to collect in the inside of collection piece, can reduce the burr and remain on the rotating rod outer wall, reduce the frictional force of dwang and silicon crystal plate bottom surface, reduce the mar in the silicon crystal plate bottom surface, be favorable to silicon crystal plate normal use.
2. Because the burr is fluffy form, piles up when collecting the piece, leads to collecting the inside volume of piece and reduce, through be equipped with the push pedal in the inside of collecting the piece, through the inside burr striking compaction that will collect the piece of push pedal luffing motion, can increase the inside volume of collection piece, increase the volume of collecting the piece and collecting the burr collection.
Drawings
FIG. 1 is a schematic structural diagram of new wear-resistant and anti-slip semiconductor material preparation equipment.
FIG. 2 is a schematic top and side views of a conveying table according to the present invention.
Fig. 3 is a side sectional structural schematic view of a clearing mechanism of the present invention.
Fig. 4 is a schematic side sectional view of a contact plate according to the present invention.
FIG. 5 is a schematic diagram of a side view of the interior of an active cavity according to the present invention.
Fig. 6 is a schematic side sectional view of an active ball according to the present invention.
FIG. 7 is a side sectional view of a collection block according to the present invention.
FIG. 8 is a side sectional view of a push plate according to the present invention.
FIG. 9 is a schematic side view of a compact according to the present invention.
In the figure: the device comprises a support-1, a console-2, a conveying table-3, a brush-4, a side plate-31, a rotating rod-32, a clearing mechanism-33, a collecting block-331, a contact plate-332, a connecting shaft-333, a support bar-334, a clearing block-33 a, a support plate-33 b, a movable cavity-33 c, a sleeve-c 1, a limiting block-c 2, a movable ball-c 3, a connecting bar-c 4, a ball-c 31, a rebounding rod-c 32, a rotating ring-c 33, a frame-31 a, an opening-31 b, a push plate-31 c, a push bar-31 d, a plate body-r 1, an inner cavity-r 2, a rebounding ball-r 3, a pressing block-r 4, a block-r 41, a rebounding block-r 42 and an impacting block-r 43.
Detailed Description
The invention is further described below with reference to the accompanying drawings:
example 1:
as shown in figures 1 to 6:
the invention provides wear-resistant anti-skidding new semiconductor material preparation equipment which structurally comprises a support 1, a control platform 2, a conveying platform 3 and a brush 4, wherein the bottom of the control platform 2 is welded at the top position, close to the back face, of the support 1, the conveying platform 3 is arranged in front of the control platform 2, and the back end of the brush 4 is movably matched with the middle of the front face of the control platform 2.
Carry platform 3 to include curb plate 31, dwang 32, clearance mechanism 33, dwang 32 both ends and curb plate 31 inside surface hinged joint, clearance mechanism 33 is located dwang 32 below.
Wherein, clear away mechanism 33 includes collection piece 331, contact plate 332, links up axle 333, support bar 334, the contact plate 332 bottom is close to left and right sides position top hinged joint through linking up axle 333 and collection piece 331, support bar 334 installs the surface in the contact plate 332 outside, collect the smooth cambered surface of piece 331 upper surface for sunken, can reduce the resistance of collecting the piece 331 upper surface to the burr, be favorable to the burr to flow to the inside collection of collection piece 331 along the cambered surface of collecting the piece 331 upper surface.
Wherein, the contact plate 332 is including cleaing away piece 33a, extension board 33b, activity chamber 33c, extension board 33b top is connected with cleaing away the piece 33a bottom surface, activity chamber 33c is by outer inside offering at extension board 33b left surface, it is the sponge material to clear away piece 33a, has clean nature and resiliency, can fully clear away the burr of dwang 32 outer wall, can reduce the impact of contact plate 332 to the dwang 32 outer wall simultaneously, reduces the dwang 32 outer wall and appears deformation, activity chamber 33c is equipped with threely, is favorable to increasing the inside air current diffusion's of activity chamber 33c area, blows the burr that will collect the piece 331 upper surface through the air current and flows to inside collecting the piece 331.
The movable cavity 33c comprises a sleeve c1, a limit block c2, a movable ball c3 and a connecting strip c4, the limit block c2 is connected with the upper and lower inner walls of the left end of the sleeve c1 into a whole, the movable ball c3 is located on the right side of the limit block c2, the left end of the connecting strip c4 is installed in the middle of the movable ball c3, the right end of the connecting strip c1 is connected with the inner wall of the right side of the sleeve c1, the connecting strip c4 is made of rubber and has elasticity, expansion of the connecting strip c4 along with movement of the movable ball c3 is facilitated, the connecting strip c4 is expanded by a certain length and then quickly reset to generate tensile force, the movable ball c3 is reset through the connecting strip c4, the movable ball c3 can move back and forth in the movable cavity 33c, and back, and forth of the air flow is facilitated, and back diffusion speed of air flow is accelerated.
The movable ball c3 comprises a ball body c31, a rebound rod c32 and a rotating ring c33, the inner end of the rebound rod c32 is fixed on the outer wall of the ball body c31, the middle of the rotating ring c33 is hinged with the outer end of the rebound rod c32, the rebound rod c32 is made of rubber and has elasticity, deformation along with movement of the movable ball c3 is facilitated, elasticity is generated after resetting, the movable ball c3 rebounds, and the moving speed of the movable ball c3 is accelerated.
The specific use mode and function of the embodiment are as follows:
in the invention, a silicon crystal plate is horizontally placed on the upper surface of a rotating rod 32 of a conveying table 3, a motor of a control console 2 is started to drive the rotating rod 32 and a brush 4 to rotate, the rotating rod 32 pushes the silicon crystal plate forward to be movably matched with the brush 4, burrs on the surface of the silicon crystal plate are removed through the brush 4, when the rotating rod 32 rotates, a removing block 33a at the top end of a contact plate 332 in the removing mechanism 33 is movably matched with the outer wall of the rotating rod 32, the burrs on the outer wall of the rotating rod 32 are removed through the removing block 33a, the contact plate 332 slightly swings with a connecting shaft 333 and a collecting block 331 as a fulcrum under the thrust of the rotating rod 32, the contact plate 332 is reset through a supporting strip 334, when the contact plate 332 swings, the burrs on the surface of the removing block 33a fall to flow along the upper surface of the collecting block 331 to be collected inside, and when the contact plate 332 swings, a movable ball c3 in a movable cavity 33c of the supporting strip 33b moves back and forth in the sleeve c1, the connecting bar c4 is pulled to expand, the connecting bar c4 is quickly reset to generate pulling force to pull the movable ball c3 to reset, when the movable ball c3 moves, air flow is generated and then is discharged, so that the burrs on the upper surface of the collection block 331 are accelerated to flow inwards and fall under the action of the air flow, and when the movable ball c3 moves, the rotating ring c33 rotates with the inner wall of the sleeve c1 by the movable fit with the rebounding rod c32 as the fulcrum, the moving speed of the movable ball c3 is increased, and the rebound rod c32 is deformed to generate elasticity to rebound the movable ball c3 and accelerate the moving speed of the movable ball c3, through the movable fit of the cleaning mechanism 33 and the rotating rod 32, the cleaning block 33a cleans burrs on the outer wall of the rotating rod 32, and collect inside collection piece 331, can reduce the burr and remain at dwang 32 outer wall, reduce the frictional force of dwang 32 and silicon crystal board bottom surface, reduce the mar appears in silicon crystal board bottom surface, be favorable to silicon crystal board normal use.
Example 2:
as shown in fig. 7 to 9:
wherein, collection piece 331 includes frame 31a, opening 31b, push pedal 31c, pushes away strip 31d, opening 31b runs through between frame 31a upper surface middle part position and the inner wall, push pedal 31c outer end is close to the both sides inner wall linking connection at top with frame 31a respectively, it is connected with push pedal 31c upper surface to push away strip 31d bottom, frame 31a is inside to be hollow structure, and interior bottom is sunken half slot, is favorable to the burr to drop to the inside collection of frame 31a along opening 31b, can increase the inside volume of frame 31a simultaneously, is favorable to collecting the burr inside frame 31 a.
Wherein, the push pedal 31c includes plate body r1, inner chamber r2, bounce ball r3, briquetting r4, inner chamber r2 is seted up inside plate body r1, bounce ball r3 sets up inside inner chamber r2, briquetting r4 nestification is in plate body r1 bottom surface position, and presss from both sides between inner chamber r2, bounce ball r3 is equipped with threely, can increase the power that bounce ball r3 produced, is favorable to increasing the frequency of push pedal 31c luffing motion for the burr of piling up at the push pedal 31c upper surface flows to frame 31a internal collection along push pedal 31c upper surface.
Wherein, briquetting r4 includes block r41, bullet piece r42, striking piece r43, bullet piece r42 nestification is in block r41 bottom surface position, striking piece r43 top is connected with bullet piece r42 bottom surface, striking piece r43 is the triangle block of metal material, can increase the impact of striking piece r43 to the burr, can smash the burr striking for the burr is gradually compacted, further increases the volume of the inside burr of frame 31 a.
The specific use mode and function of the embodiment are as follows:
in the invention, burrs remained on the upper surface of the collecting block 331 are introduced into the opening 31b of the frame 31a by the action of air flow, the burrs stay on the upper surface of the push plate 31c, when the device is operated, the bouncing ball r3 bounces up and down in the inner cavity r2 of the plate body r1 to generate power, so that the push plate 31c swings up and down with the frame 31a as a fulcrum and pulls and expands the push strip 31d, the push plate 31c swings to make the burrs staying on the upper surface fall into the frame 31a for collection, when the push plate 31c swings, the impact block r43 in the pressing block r4 contacts with the burrs on the inner bottom of the frame 31a, the elastic block r42 pushes the impact block r43 to impact the burrs with the block r41 as a fulcrum, so that the burrs are crushed and compacted by the impact force of the impact block r43, the burrs inside the collecting block 331 are impacted and compacted by the push plate 31c provided inside the collecting block 331 swinging up and down, the volume inside the collection block 331 can be increased, and the amount of burr collection by the collection block 331 can be increased.
The technical solutions of the present invention or similar technical solutions designed by those skilled in the art based on the teachings of the technical solutions of the present invention are all within the scope of the present invention to achieve the above technical effects.
Claims (8)
1. The utility model provides a wear-resisting anti-skidding new semiconductor material preparation equipment, its structure includes support (1), control cabinet (2), carries platform (3), brush (4), the top position at the back is close to in support (1) welding control cabinet (2) bottom, carry platform (3) to establish in control cabinet (2) the place ahead, brush (4) back end and control cabinet (2) front middle part clearance fit, its characterized in that:
carry platform (3) to include curb plate (31), dwang (32), clearance mechanism (33), dwang (32) both ends and curb plate (31) inside surface hinged joint, clearance mechanism (33) are located dwang (32) below.
2. The new wear-resistant and anti-skid semiconductor material preparation device according to claim 1, wherein: clear away mechanism (33) including collecting piece (331), contact plate (332), linking axle (333), support bar (334), contact plate (332) bottom is close to left and right sides position top hinged joint through linking axle (333) and collection piece (331), the surface in the contact plate (332) outside is installed in support bar (334).
3. The new wear-resistant and anti-skid semiconductor material preparation device according to claim 2, wherein: the contact plate (332) comprises a clearing block (33a), a support plate (33b) and a movable cavity (33c), the top end of the support plate (33b) is connected with the bottom surface of the clearing block (33a), and the movable cavity (33c) is formed in the left side surface of the support plate (33b) from outside to inside.
4. The new wear-resistant and anti-skid semiconductor material preparation device according to claim 3, wherein: activity chamber (33c) include sleeve pipe (c1), stopper (c2), activity ball (c3), connecting strip (c4), stopper (c2) are even as an organic whole with sleeve pipe (c1) left end upper and lower side inner wall respectively, activity ball (c3) are located stopper (c2) right side, connecting strip (c4) left end is installed at activity ball (c3) middle part, and the right-hand member is connected with sleeve pipe (c1) right side inner wall.
5. The new wear-resistant and anti-skid semiconductor material preparation device according to claim 4, wherein: the movable ball (c3) comprises a ball body (c31), a rebounding rod (c32) and a rotating ring (c33), wherein the inner end of the rebounding rod (c32) is fixed on the outer wall of the ball body (c31), and the middle part of the rotating ring (c33) is hinged with the outer end of the rebounding rod (c 32).
6. The new wear-resistant and anti-skid semiconductor material preparation device according to claim 2, wherein: the collecting block (331) comprises a frame (31a), an opening (31b), a push plate (31c) and a push strip (31d), wherein the opening (31b) penetrates through the middle position of the upper surface of the frame (31a) and the inner wall of the upper surface of the frame, the outer end of the push plate (31c) is connected with the inner walls of the two sides of the frame (31a) close to the top in a linked mode, and the bottom end of the push strip (31d) is connected with the upper surface of the push plate (31 c).
7. The new wear-resistant and anti-skid semiconductor material preparation device according to claim 6, wherein: push pedal (31c) are including plate body (r1), inner chamber (r2), bounce ball (r3), briquetting (r4), inside plate body (r1) was seted up in inner chamber (r2), bounce ball (r3) sets up inside inner chamber (r2), briquetting (r4) nestification is in plate body (r1) bottom surface position, and presss from both sides between inner chamber (r 2).
8. The new wear-resistant and anti-skid semiconductor material preparation device according to claim 7, wherein: the pressing block (r4) comprises a block body (r41), a spring block (r42) and an impact block (r43), wherein the spring block (r42) is nested at the bottom surface of the block body (r41), and the top end of the impact block (r43) is connected with the bottom surface of the spring block (r 42).
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110457885.8A CN113305674A (en) | 2021-04-27 | 2021-04-27 | Wear-resisting anti-skidding semiconductor new material preparation equipment |
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| CN202110457885.8A CN113305674A (en) | 2021-04-27 | 2021-04-27 | Wear-resisting anti-skidding semiconductor new material preparation equipment |
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| CN112264910A (en) * | 2020-11-16 | 2021-01-26 | 苏州市贵泰钢材贸易有限公司 | Burnishing device is used in steel production and processing |
| CN112372503A (en) * | 2020-11-25 | 2021-02-19 | 台州市凯规机械科技有限公司 | Polishing device with jet power capable of working on inner walls of different steel pipes |
| CN112518558A (en) * | 2020-11-19 | 2021-03-19 | 广州城齐商贸有限公司 | Polishing equipment for ceramic equipment |
| CN112658552A (en) * | 2021-01-07 | 2021-04-16 | 操盛继 | Electric welding machine for single chip microcomputer processing |
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2021
- 2021-04-27 CN CN202110457885.8A patent/CN113305674A/en not_active Withdrawn
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09283475A (en) * | 1996-04-16 | 1997-10-31 | Rap Master S F T Kk | Carrier and washing machine of semiconductor wafer |
| JP2011093057A (en) * | 2009-10-30 | 2011-05-12 | Tokyo Seimitsu Co Ltd | Wafer edge polishing apparatus and edge polishing method used therein |
| CN112264910A (en) * | 2020-11-16 | 2021-01-26 | 苏州市贵泰钢材贸易有限公司 | Burnishing device is used in steel production and processing |
| CN112518558A (en) * | 2020-11-19 | 2021-03-19 | 广州城齐商贸有限公司 | Polishing equipment for ceramic equipment |
| CN112372503A (en) * | 2020-11-25 | 2021-02-19 | 台州市凯规机械科技有限公司 | Polishing device with jet power capable of working on inner walls of different steel pipes |
| CN112658552A (en) * | 2021-01-07 | 2021-04-16 | 操盛继 | Electric welding machine for single chip microcomputer processing |
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Application publication date: 20210827 |