CN113296592A - Mainboard heat dissipation system based on temperature sensing control and control method - Google Patents
Mainboard heat dissipation system based on temperature sensing control and control method Download PDFInfo
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- CN113296592A CN113296592A CN202110657424.5A CN202110657424A CN113296592A CN 113296592 A CN113296592 A CN 113296592A CN 202110657424 A CN202110657424 A CN 202110657424A CN 113296592 A CN113296592 A CN 113296592A
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- heat dissipation
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/184—Mounting of motherboards
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- Human Computer Interaction (AREA)
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- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本发明公开了一种基于温度传感控制的主板散热系统和控制方法，主板散热系统包括主板架，主板架通过支杆连接有风扇架，风扇架上设置有安装孔，安装孔内固定有散热风扇，风扇架中靠近主板架的一面固定有框体，安装孔位于框体内，框体内插接有多个散热片，使得相邻的两个散热片之间形成有间隙，每个散热片的表面固定有散热支管，主板架和风扇架之间还设置有相互连通的进液管和出液管，每个散热支管的一端与进液管相连通，另一端与出液管相连通；解决了现有的计算机主板的散热性能不足，使得计算机在长时间工作后，主板因散热效果较差而导致计算机卡顿，大大降低了计算机主板的使用寿命的问题。
The invention discloses a mainboard heat dissipation system and control method based on temperature sensing control. The mainboard heat dissipation system includes a mainboard frame, the mainboard frame is connected with a fan frame through a support rod, the fan frame is provided with a mounting hole, and the heat dissipation is fixed in the mounting hole Fan, the side of the fan frame close to the main frame is fixed with a frame, the mounting holes are located in the frame, and a plurality of heat sinks are inserted into the frame, so that a gap is formed between two adjacent heat sinks. A cooling branch pipe is fixed on the surface, and a liquid inlet pipe and a liquid outlet pipe that communicate with each other are also arranged between the main frame and the fan frame, one end of each cooling branch pipe is connected with the liquid inlet pipe, and the other end is connected with the liquid outlet pipe; The heat dissipation performance of the existing computer motherboard is insufficient, so that after the computer works for a long time, the motherboard is stuck due to poor heat dissipation effect, which greatly reduces the service life of the computer motherboard.
Description
Technical Field
The invention relates to the field of computer equipment, in particular to a mainboard cooling system based on temperature sensing control and a control method.
Background
The computer mainboard is connected by hundreds of microcircuits, and is small in size, and the microcircuits generating pulse current are distributed on the mainboard, so that a large amount of heat can be generated due to continuous high-load operation calculation processing in the use process. However, the heat dissipation performance of the existing computer motherboard is insufficient, so that after the computer works for a long time, the motherboard is blocked due to poor heat dissipation effect, and the service life of the computer motherboard is greatly reduced.
Disclosure of Invention
The invention aims to provide a mainboard heat dissipation system based on temperature sensing control and a control method, which solve the problems that the heat dissipation performance of the traditional computer mainboard is insufficient, so that after a computer works for a long time, the mainboard is blocked due to poor heat dissipation effect, and the service life of the computer mainboard is greatly shortened.
In order to achieve the purpose, the invention provides a mainboard heat dissipation system based on temperature sensing control, which comprises a mainboard frame, wherein the mainboard frame is connected with a fan frame through a support rod, a mounting hole is formed in the fan frame, a heat dissipation fan is fixed in the mounting hole, a frame body is fixed on one surface, close to the mainboard frame, of the fan frame, the mounting hole is formed in the frame body, a plurality of heat dissipation fins are inserted in the frame body, a gap is formed between every two adjacent heat dissipation fins, a heat dissipation branch pipe is fixed on the surface of each heat dissipation fin, a liquid inlet pipe and a liquid outlet pipe which are mutually communicated are further arranged between the mainboard frame and the fan frame, one end of each heat dissipation branch pipe is communicated with the liquid inlet pipe, and the other end of each heat dissipation branch pipe is communicated with the liquid outlet pipe.
Preferably, the radiating branch pipe is composed of a plurality of U-shaped pipes communicated end to end.
Preferably, a clamping groove matched with the heat dissipation branch pipe is formed on the heat dissipation sheet, and at least part of the heat dissipation branch pipe is clamped in the clamping groove.
Preferably, the liquid inlet pipe and the liquid outlet pipe are respectively and at least partially fixed at the lower ends of the radiating fins.
Preferably, the motherboard frame is connected with the lower end of the radiating fin through a silica gel pad.
Preferably, a plurality of inserting grooves are formed in the frame body at intervals, and at least part of the radiating fins are inserted into the inserting grooves.
Preferably, a plurality of heat dissipation holes are formed in the surface of the mainboard frame.
Preferably, the mainboard cooling system further comprises a cooling liquid tank, one end of the cooling liquid tank is communicated with the liquid outlet pipe through a first pipe, and the other end of the cooling liquid tank is communicated with the liquid inlet pipe through an absorption pump and a second pipe.
Preferably, a first electromagnetic valve and a first temperature sensor are respectively arranged in the second pipe and close to the liquid inlet pipe; a second electromagnetic valve and a second temperature sensor are respectively arranged in the first pipe and close to the liquid outlet pipe; and a PLC plate is fixed on the cooling liquid tank.
The invention also provides a control method of the mainboard heat dissipation system, which comprises the following steps:
when the temperature signal acquired by the first temperature sensor or the second temperature sensor is greater than a first threshold value, the first electromagnetic valve, the second electromagnetic valve and the suction pump are controlled to be opened simultaneously through the PLC board;
when the temperature signal collected by the first temperature sensor or the second temperature sensor is smaller than a second threshold value, the first electromagnetic valve, the second electromagnetic valve and the suction pump are controlled to be closed simultaneously through the PLC board.
According to the technical scheme, the invention provides a mainboard heat dissipation system based on temperature sensing control, which comprises a mainboard frame, wherein the mainboard frame is connected with a fan frame through a support rod, a mounting hole is formed in the fan frame, a heat dissipation fan is fixed in the mounting hole, a frame body is fixed on one surface, close to the mainboard frame, of the fan frame, the mounting hole is formed in the frame body, a plurality of heat dissipation fins are inserted in the frame body, a gap is formed between every two adjacent heat dissipation fins, a heat dissipation branch pipe is fixed on the surface of each heat dissipation fin, a liquid inlet pipe and a liquid outlet pipe which are mutually communicated are further arranged between the mainboard frame and the fan frame, one end of each heat dissipation branch pipe is communicated with the liquid inlet pipe, and the other end of each heat dissipation branch pipe is communicated with the liquid outlet pipe; the main board is arranged on the main board frame, heat emitted by the main board is absorbed and discharged through the cooling fan, the contact area between the cooling fins and the heat can be increased, the absorption effect is improved, meanwhile, the cooling branch pipes are arranged on each cooling fin, so that when cooling liquid circulates in the liquid inlet pipe and the liquid outlet pipe, one part of the cooling liquid enters the cooling branch pipes, part of the heat on the cooling fins is taken away, and the cooling fins can be rapidly cooled; the mainboard heat dissipation system solves the problems that the heat dissipation performance of the existing computer mainboard is insufficient, so that after the computer works for a long time, the mainboard is blocked due to poor heat dissipation effect, and the service life of the computer mainboard is greatly shortened.
Additional features and advantages of the invention will be set forth in the detailed description which follows.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a block diagram of a motherboard heat dissipation system provided by the present invention;
FIG. 2 is a disassembled view of the heat dissipation system of the motherboard provided by the invention;
fig. 3 is a side view of the motherboard heat dissipation system provided by the present invention.
Description of the reference numerals
1-motherboard rack 2-heat dissipation holes
3-silica gel pad 4-liquid inlet pipe
5-liquid outlet pipe 6-radiating fin
7-radiating branch pipe 8-frame body
9-plug groove 10-support rod
11-Fan case 12-radiator Fan
13-first tube 14-second tube
15-cooling liquid tank 16-suction pump
17-second electromagnetic valve 18-second temperature sensor
19-first temperature sensor 20-first solenoid valve
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.
As shown in fig. 1-3: the invention provides a mainboard heat dissipation system based on temperature sensing control, which comprises a mainboard frame 1, wherein the mainboard frame 1 is connected with a fan frame 11 through a support rod 10, a mounting hole is formed in the fan frame 11, a heat dissipation fan 12 is fixed in the mounting hole, a frame body 8 is fixed on one surface, close to the mainboard frame 1, of the fan frame 11, the mounting hole is positioned in the frame body 8, a plurality of heat dissipation fins 6 are inserted in the frame body 8, a gap is formed between every two adjacent heat dissipation fins 6, a heat dissipation branch pipe 7 is fixed on the surface of each heat dissipation fin 6, a liquid inlet pipe 4 and a liquid outlet pipe 5 which are mutually communicated are further arranged between the mainboard frame 1 and the fan frame 11, one end of each heat dissipation branch pipe 7 is communicated with the liquid inlet pipe 4, and the other end of each heat dissipation branch pipe 7 is communicated with the liquid outlet pipe 5. The main board is arranged on the main board frame, heat emitted by the main board is absorbed and discharged through the cooling fan, the contact area between the cooling fins and the heat can be increased, the absorption effect is improved, meanwhile, the cooling branch pipes are arranged on each cooling fin, so that when cooling liquid circulates in the liquid inlet pipe and the liquid outlet pipe, one part of the cooling liquid enters the cooling branch pipes, part of the heat on the cooling fins is taken away, and the cooling fins can be rapidly cooled; the mainboard heat dissipation system solves the problems that the heat dissipation performance of the existing computer mainboard is insufficient, so that after the computer works for a long time, the mainboard is blocked due to poor heat dissipation effect, and the service life of the computer mainboard is greatly shortened.
In a preferred embodiment of the present invention, in order to increase the contact area between the radiating branch pipes 7 and the radiating fins 6 and improve the radiating effect, the radiating branch pipes 7 are composed of a plurality of U-shaped pipes which are communicated end to end.
In a preferred embodiment of the present invention, in order to enable the heat dissipating branch pipes 7 to effectively remove heat from the heat dissipating fins 6, the heat dissipating fins 6 are formed with clamping grooves which are matched with the heat dissipating branch pipes 7, and the heat dissipating branch pipes 7 are at least partially clamped in the clamping grooves.
In a preferred embodiment of the present invention, for convenience of fixing, the liquid inlet pipe 4 and the liquid outlet pipe 5 are respectively fixed at least partially at the lower end of the heat sink 6.
In a preferred embodiment of the present invention, in order to effectively conduct the heat of the motherboard rack 1 to the heat sink 6, the motherboard rack 1 is connected to the lower end of the heat sink 6 through the silicone pad 3.
In a preferred embodiment of the present invention, in order to facilitate the insertion and installation of the heat sink 6, a plurality of insertion grooves 9 are provided at intervals on the frame body 8, and the heat sink 6 is at least partially inserted into the insertion grooves 9.
In a preferred embodiment of the present invention, in order to improve the heat dissipation performance of the motherboard rack 1, a plurality of heat dissipation holes 2 are formed on the surface of the motherboard rack 1.
In a preferred embodiment of the present invention, the motherboard heat dissipation system further includes a cooling liquid tank 15, one end of the cooling liquid tank 15 is communicated with the liquid outlet pipe 5 through a first pipe 13, and the other end is communicated with the liquid inlet pipe 4 through a suction pump 16 and a second pipe 14. The coolant in the coolant tank 15 can be pumped into the radiating branch pipes 7 by the suction pump 16.
In a preferred embodiment of the present invention, in order to control the circulation of the cooling liquid, a first electromagnetic valve 20 and a first temperature sensor 19 are respectively arranged in the second pipe 14 close to the liquid inlet pipe 4; a second electromagnetic valve 17 and a second temperature sensor 18 are respectively arranged in the first pipe 13 and close to the liquid outlet pipe 5; and a PLC plate is fixed on the cooling liquid tank 15.
The invention also provides a control method of the mainboard heat dissipation system, which comprises the following steps: when the temperature signal acquired by the first temperature sensor 19 or the second temperature sensor 18 is greater than a first threshold value, the first electromagnetic valve 20 and the second electromagnetic valve 17 are controlled to be opened simultaneously through the PLC board; when the temperature signal collected by the first temperature sensor 19 or the second temperature sensor 18 is smaller than the second threshold value, the first electromagnetic valve 20 and the second electromagnetic valve 17 are controlled to be closed simultaneously by the PLC board. For example, the first threshold value may be set to 60 ℃, the second threshold value may be set to 30 ℃, the heat dissipation branch pipes 7, the liquid inlet pipe 4 and the liquid outlet pipe 5 are filled with cooling liquid all the time, when the temperature signal detected by the temperature sensor is greater than 60 ℃, it is proved that certain auxiliary heat dissipation needs to be performed, at this time, the PLC board controls the electromagnetic valve and the suction pump to be opened, circulation of the cooling liquid is performed, heat is effectively taken away, and when the temperature is reduced to below 30 ℃, the PLC board controls the electromagnetic valve and the suction pump to be closed, and the circulation is stopped.
The preferred embodiments of the present invention have been described in detail with reference to the accompanying drawings, however, the present invention is not limited to the specific details of the above embodiments, and various simple modifications can be made to the technical solution of the present invention within the technical idea of the present invention, and these simple modifications are within the protective scope of the present invention.
It should be noted that the various technical features described in the above embodiments can be combined in any suitable manner without contradiction, and the invention is not described in any way for the possible combinations in order to avoid unnecessary repetition.
In addition, any combination of the various embodiments of the present invention is also possible, and the same should be considered as the disclosure of the present invention as long as it does not depart from the spirit of the present invention.
Claims (10)
1. The utility model provides a mainboard cooling system based on temperature sensing control, a serial communication port, mainboard cooling system includes mainboard frame (1), mainboard frame (1) is connected with fan bracket (11) through branch (10), be provided with the mounting hole on fan bracket (11), the mounting hole internal fixation has radiator fan (12), the one side that is close to in fan bracket (11) mainboard frame (1) is fixed with framework (8), the mounting hole is located in framework (8), it has a plurality of fin (6) to peg graft in framework (8), makes two adjacent fin (6) between be formed with the clearance, every the fixed surface of fin (6) has heat dissipation branch pipe (7), still be provided with feed liquor pipe (4) and drain pipe (5) that communicate each other between mainboard frame (1) and fan bracket (11), one end of each heat dissipation branch pipe (7) is communicated with the liquid inlet pipe (4), and the other end of each heat dissipation branch pipe is communicated with the liquid outlet pipe (5).
2. Mainboard cooling system according to claim 1, characterised in that the cooling branch (7) consists of a number of U-tubes communicating end to end.
3. The heat dissipation system for main boards according to claim 2, wherein the heat dissipation fins (6) are formed with slots for engaging with the heat dissipation branch pipes (7), and the heat dissipation branch pipes (7) are at least partially engaged in the slots.
4. Motherboard cooling system according to claim 1, characterised in that the inlet pipe (4) and the outlet pipe (5) are each at least partially fixed to the lower end of the cooling fins (6).
5. Motherboard cooling system according to claim 1, characterised in that the motherboard frame (1) is connected to the lower end of the cooling fins (6) by means of silicone pads (3).
6. The heat dissipation system for main boards of claim 1, wherein the frame body (8) is provided with a plurality of insertion grooves (9) at intervals, and the heat dissipation fins (6) are at least partially inserted into the insertion grooves (9).
7. The heat dissipation system for main boards of claim 1, wherein the surface of the main board frame (1) is formed with a plurality of heat dissipation holes (2).
8. The motherboard cooling system as claimed in any one of claims 1-7, further comprising a coolant tank (15), wherein one end of the coolant tank (15) is connected to the outlet pipe (5) via a first pipe (13), and the other end is connected to the inlet pipe (4) via a suction pump (16) and a second pipe (14).
9. The motherboard cooling system as recited in claim 8, characterized in that a first electromagnetic valve (20) and a first temperature sensor (19) are respectively disposed in the second pipe (14) near the liquid inlet pipe (4); a second electromagnetic valve (17) and a second temperature sensor (18) are respectively arranged in the first pipe (13) and close to the liquid outlet pipe (5); and a PLC (programmable logic controller) plate is fixed on the cooling liquid tank (15).
10. A control method of a motherboard heat dissipation system as recited in any one of claims 1 to 9, wherein the control method comprises:
when the temperature signal acquired by the first temperature sensor (19) or the second temperature sensor (18) is greater than a first threshold value, the first electromagnetic valve (20), the second electromagnetic valve (17) and the suction pump (16) are controlled to be opened simultaneously through the PLC board;
when the temperature signal acquired by the first temperature sensor (19) or the second temperature sensor (18) is smaller than a second threshold value, the first electromagnetic valve (20), the second electromagnetic valve (17) and the suction pump (16) are controlled to be closed simultaneously through the PLC board.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110657424.5A CN113296592A (en) | 2021-06-12 | 2021-06-12 | Mainboard heat dissipation system based on temperature sensing control and control method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110657424.5A CN113296592A (en) | 2021-06-12 | 2021-06-12 | Mainboard heat dissipation system based on temperature sensing control and control method |
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| CN113296592A true CN113296592A (en) | 2021-08-24 |
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| CN202110657424.5A Pending CN113296592A (en) | 2021-06-12 | 2021-06-12 | Mainboard heat dissipation system based on temperature sensing control and control method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN120085729A (en) * | 2025-02-12 | 2025-06-03 | 深圳市英德斯电子有限公司 | An industrial computer with fast heat dissipation |
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| CN101609358A (en) * | 2008-06-17 | 2009-12-23 | 联想(北京)有限公司 | A kind of heat radiation module, fan and computing machine |
| CN204331597U (en) * | 2015-01-09 | 2015-05-13 | 赵群 | A kind of high-efficient heat-dissipating computer host box |
| CN207937956U (en) * | 2018-04-04 | 2018-10-02 | 姜小艳 | A kind of computer CPU acceleration radiator |
| CN110865700A (en) * | 2019-12-21 | 2020-03-06 | 李建春 | Temperature-adjustable heat dissipation equipment |
| CN210742807U (en) * | 2019-08-20 | 2020-06-12 | 重庆青年职业技术学院 | Self-cooling type computer mainframe |
| CN211319170U (en) * | 2020-02-25 | 2020-08-21 | 新沂市锡沂高新材料产业技术研究院有限公司 | Efficient heat dissipation device for computer |
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2021
- 2021-06-12 CN CN202110657424.5A patent/CN113296592A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101609358A (en) * | 2008-06-17 | 2009-12-23 | 联想(北京)有限公司 | A kind of heat radiation module, fan and computing machine |
| CN204331597U (en) * | 2015-01-09 | 2015-05-13 | 赵群 | A kind of high-efficient heat-dissipating computer host box |
| CN207937956U (en) * | 2018-04-04 | 2018-10-02 | 姜小艳 | A kind of computer CPU acceleration radiator |
| CN210742807U (en) * | 2019-08-20 | 2020-06-12 | 重庆青年职业技术学院 | Self-cooling type computer mainframe |
| CN110865700A (en) * | 2019-12-21 | 2020-03-06 | 李建春 | Temperature-adjustable heat dissipation equipment |
| CN211319170U (en) * | 2020-02-25 | 2020-08-21 | 新沂市锡沂高新材料产业技术研究院有限公司 | Efficient heat dissipation device for computer |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN120085729A (en) * | 2025-02-12 | 2025-06-03 | 深圳市英德斯电子有限公司 | An industrial computer with fast heat dissipation |
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